JP2001110480A - Conductive material - Google Patents
Conductive materialInfo
- Publication number
- JP2001110480A JP2001110480A JP28833399A JP28833399A JP2001110480A JP 2001110480 A JP2001110480 A JP 2001110480A JP 28833399 A JP28833399 A JP 28833399A JP 28833399 A JP28833399 A JP 28833399A JP 2001110480 A JP2001110480 A JP 2001110480A
- Authority
- JP
- Japan
- Prior art keywords
- conductive member
- contact
- contact portion
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は導電部材に係り、詳
しくは、配線板上に形成された配線を接地導体に接地す
る導電部材に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive member, and more particularly, to a conductive member for grounding a wiring formed on a wiring board to a ground conductor.
【０００２】[0002]
【従来の技術および発明が解決しようとする課題】従来
より、プリント配線板（基板）上に形成されたプリント
配線（導電パターン）を接地導体に接地する際に、プリ
ント配線に対して電気的に接続されたアースピンやアー
ス用ネジを使用する技術が広く利用されている。2. Description of the Related Art Conventionally, when a printed wiring (conductive pattern) formed on a printed wiring board (substrate) is grounded to a ground conductor, the printed wiring is electrically connected to the printed wiring. 2. Description of the Related Art Techniques using connected ground pins and ground screws are widely used.
【０００３】しかし、アースピンやアース用ネジは、各
種コネクタ（例えば、ＤＩＮ、ＵＳＢなど）の近傍には
取り付け難く、当該コネクタから離れた箇所にしか取り
付けられないため、ノイズ耐性および静電破壊耐性が低
下するという問題があった。そのため、各種コネクタの
近傍でプリント配線を接地導体に接地することが求めら
れている。However, ground pins and ground screws are difficult to install near various connectors (for example, DIN, USB, etc.), and can only be installed at locations distant from the connectors. There was a problem of lowering. Therefore, it is required that the printed wiring be grounded to a ground conductor near various connectors.
【０００４】また、近年、プリント配線を接地導体に接
地する際に、ノイズ耐性および静電破壊耐性を向上させ
るため、プリント配線板の側方から接地することが求め
られている。本発明は上記要求を満足するためになされ
たものであって、その目的は、配線板上に形成された配
線を当該配線板の側方から接地導体に対して確実に接地
することが可能で且つ小型な導電部材を提供することに
ある。In recent years, when a printed wiring is grounded to a ground conductor, it is required to ground the printed wiring board from the side to improve noise resistance and electrostatic breakdown resistance. The present invention has been made in order to satisfy the above-mentioned requirements, and an object of the present invention is to be able to reliably ground a wiring formed on a wiring board to a ground conductor from a side of the wiring board. Another object of the present invention is to provide a small conductive member.
【０００５】[0005]
【課題を解決するための手段および発明の効果】かかる
目的を達成するためになされた請求項１に記載の発明
は、可撓性を有すると共に、少なくとも接触面が導電性
を有する接触部と、当該接触部に取付固定されると共
に、少なくとも接合面が前記接触面と電気的に接続され
た接合部とを備えた導電部材であって、前記接触部が弾
性変形して前記接触面が配線板上に形成された配線に圧
接されると共に前記接合部の前記接合面が接地導体と電
気的に接続されるか、または、前記接触部が弾性変形し
て前記接触面が接地導体に圧接されると共に前記接合部
の前記接合面が配線板上に形成された配線と電気的に接
続されることをその要旨とする。Means for Solving the Problems and Effects of the Invention According to the first aspect of the present invention, there is provided a contact portion having flexibility and at least a contact surface having conductivity. A conductive member fixed to the contact portion and having at least a joint surface having a joint portion electrically connected to the contact surface, wherein the contact portion is elastically deformed and the contact surface is a wiring board. The connection surface of the connection portion is electrically connected to a ground conductor while the connection portion is pressed against the wiring formed thereon, or the contact portion is elastically deformed and the contact surface is pressed against the ground conductor. In addition, the gist is that the bonding surface of the bonding portion is electrically connected to a wiring formed on a wiring board.
【０００６】請求項１に記載の発明による導電部材を使
用する第１の方法は、まず、接合部の接合面を接地導体
に取付固定して電気的に接続し、次に、接触部の下側か
ら接触部を弾性変形させた状態で配線板の側端部を挿入
し、配線板に形成された配線と接触部の接触面とを当接
させる。すると、弾性変形した接触部が元の形状に戻ろ
うとする弾性復元力により、接触面が配線に圧接され
る。According to a first method using the conductive member according to the first aspect of the present invention, first, the joining surface of the joining portion is attached and fixed to the ground conductor to make an electrical connection, and then the lower portion of the contact portion is provided. With the contact portion elastically deformed from the side, the side end of the wiring board is inserted, and the wiring formed on the wiring board is brought into contact with the contact surface of the contact portion. Then, the contact surface is pressed against the wiring by the elastic restoring force of the elastically deformed contact portion to return to the original shape.
【０００７】また、請求項１の発明による導電部材を使
用する第２の方法は、まず、接合部の接合面を配線板上
に形成された配線と電気的に接続して導電部材を配線板
に表面実装し、次に、接触部を弾性変形させた状態で接
触面を接地導体に当接させる。すると、弾性変形した接
触部が元の形状に戻ろうとする弾性復元力により、接触
面が接地導体に圧接される。According to a second method of using the conductive member according to the first aspect of the present invention, the conductive member is first electrically connected to a wiring formed on the wiring board to connect the conductive member to the wiring board. Then, the contact surface is brought into contact with the ground conductor with the contact portion elastically deformed. Then, the contact surface is pressed against the ground conductor by the elastic restoring force of the elastically deformed contact portion to return to the original shape.
【０００８】このように、第１または第２の方法によ
り、導電部材を介して、接地導体と配線とが導通され、
配線は接地導体に対して確実に接地される。従って、請
求項１の発明によれば、導電部材を介して配線板の側方
から配線を接地することが可能になり、ノイズ耐性およ
び静電破壊耐性を向上させることができる。また、導電
部材は接合部および接触部から構成され、全体の寸法形
状を小型にできるため、各種コネクタ（例えば、ＤＩ
Ｎ、ＵＳＢなど）の近傍に取り付けることが容易であ
り、当該コネクタの近傍で当該コネクタに接続された配
線を接地することが可能になることから、ノイズ耐性お
よび静電破壊耐性を向上させることもできる。そして、
導電部材と配線板との位置関係を調節することにより、
接地導体または配線に対する接触部の圧接力（接触圧）
を適宜設定することが可能になり、導電部材を介した配
線の接地をより確実に行うことができる。As described above, according to the first or second method, the ground conductor and the wiring are conducted through the conductive member,
The wiring is reliably grounded to the ground conductor. Therefore, according to the first aspect of the invention, it is possible to ground the wiring from the side of the wiring board via the conductive member, and it is possible to improve noise resistance and electrostatic breakdown resistance. In addition, since the conductive member is composed of a joint portion and a contact portion, and can reduce the overall size and shape, various connectors (for example, DI
N, USB, etc.), and the wiring connected to the connector can be grounded in the vicinity of the connector, so that noise resistance and electrostatic breakdown resistance can be improved. it can. And
By adjusting the positional relationship between the conductive member and the wiring board,
Pressing force (contact pressure) of the contact part against the ground conductor or wiring
Can be appropriately set, and the grounding of the wiring via the conductive member can be performed more reliably.
【０００９】ところで、請求項２に記載の発明のよう
に、請求項１に記載の導電部材において、前記接触部
は、可撓性を有する基材と、当該基材の表面の少なくと
も前記接触面に対応する部分を覆設する導電性を有した
被覆材とから成るようにしてもよい。In the conductive member according to the first aspect of the present invention, the contact portion includes a flexible base material and at least the contact surface on the surface of the base material. And a covering material having conductivity that covers the portion corresponding to.
【００１０】また、請求項３に記載の発明のように、請
求項１に記載の導電部材において、前記接触部は、導電
性および可撓性を備えた薄板材により形成されたバネ材
から成るようにしてもよい。According to a third aspect of the present invention, in the conductive member according to the first aspect, the contact portion is made of a spring material formed of a conductive and flexible thin plate. You may do so.
【００１１】[0011]
【発明の実施の形態】以下、本発明を具体化した一実施
形態を図面と共に説明する。図１は、本実施形態の導電
部材１の使用状態を示す正面図である。図２は、導電部
材１の使用状態を示す平面図である。図３は、図２にお
けるＡ−Ａ線断面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a front view showing a use state of the conductive member 1 of the present embodiment. FIG. 2 is a plan view showing a use state of the conductive member 1. FIG. 3 is a sectional view taken along line AA in FIG.
【００１２】導電部材１は、接合部２および接触部３か
ら構成されている。接合部２は、導電材料により四角筒
状に形成されている。尚、接合部２の製造方法として
は、例えば、導電性合成樹脂材料により接合部２を形成
する場合は射出成形を用いればよく、各種金属材料によ
り接合部２を形成する場合は薄板状の金属材料のプレス
成形を用いればよい。The conductive member 1 comprises a joint 2 and a contact 3. The joining portion 2 is formed in a rectangular tube shape from a conductive material. In addition, as a method for manufacturing the joint 2, for example, when the joint 2 is formed of a conductive synthetic resin material, injection molding may be used, and when the joint 2 is formed of various metal materials, a thin plate-shaped metal may be used. Press molding of a material may be used.
【００１３】接触部３は、可撓性に優れた材料（例え
ば、合成樹脂材料やゴム材料など、または、これら材料
を発泡させた発泡材など）により先端部がアールを成し
た縦断面Ｕ字状の略四角柱状に形成された基材３ａと、
当該基材３ａの上下面および図示右側方の外周面を覆設
する可撓性を有した導電材料（例えば、各種金属（アル
ミニウム、銅など）の箔材、導電性繊維（例えば、金属
繊維、カーボン繊維など）の織布など）から成る被覆材
３ｂとから構成されている。The contact portion 3 is made of a material having excellent flexibility (for example, a synthetic resin material or a rubber material, or a foamed material obtained by foaming such a material). A base material 3a formed in a substantially quadrangular prism shape,
A flexible conductive material (for example, a foil material of various metals (aluminum, copper, etc.), a conductive fiber (for example, metal fiber, etc.) that covers the upper and lower surfaces of the substrate 3a and the outer peripheral surface on the right side in the drawing. And a covering material 3b made of a woven fabric of carbon fiber.
【００１４】接触部３の基端側は接合部２に嵌合され、
接合部２に設けられたカシメ部２ａを介したカシメ固定
により、接合部２と被覆材３ｂとが取付固定されて電気
的に接続されている。そして、接触部３の先端側は接合
部２から突出している。尚、接合部２と被覆材３ｂとを
取付固定するには、導電性接着剤を用いてもよく、カシ
メ部２ａを介したカシメ固定と導電性接着剤とを併用し
てもよい。The base end side of the contact portion 3 is fitted to the joint portion 2,
By caulking and fixing via the caulking portion 2a provided at the bonding portion 2, the bonding portion 2 and the coating material 3b are attached and fixed and are electrically connected. The distal end side of the contact portion 3 protrudes from the joint portion 2. Note that a conductive adhesive may be used to attach and fix the joint portion 2 and the covering material 3b, or the conductive adhesive may be used in combination with the caulking fixing via the caulking portion 2a.
【００１５】次に、導電部材１の使用方法について説明
する。まず、導電部材１の接合部２の下面（接合面）２
ｂを接地導体１１に取付固定して電気的に接続する。こ
こで、接合部２を接地導体１１に取付固定するにはどの
ような方法を用いてもよいが、例えば、導電性接着剤を
用いた接着固定、接合部２に形成したネジ孔（図示略）
に挿入したネジ（図示略）を用いた締結固定、半田付け
などを用いればよい。Next, a method of using the conductive member 1 will be described. First, the lower surface (joining surface) 2 of the joining portion 2 of the conductive member 1
b is attached and fixed to the ground conductor 11 to be electrically connected. Here, any method may be used to attach and fix the joint 2 to the ground conductor 11. For example, an adhesive fixing using a conductive adhesive, a screw hole formed in the joint 2 (not shown) )
Fastening and fixing using screws (not shown) inserted into the holes may be used.
【００１６】尚、接地導体１１は、例えば、プリント配
線板１２を覆うシールドケースや、プリント配線板１２
が収容された電子機器の筺体などから構成される。そし
て、接触部３の下側から接触部３の基材３ａを弾性変形
させた状態でプリント配線板（基板）１２の側端部を挿
入し、プリント配線板１２上に形成されたプリント配線
（導電パターン）１３と接触部３の被覆材３ｂの下面
（接触面）３ｃとを当接させる。すると、弾性変形した
基材３ａが元の形状に戻ろうとする弾性復元力により、
被覆材３ｂの接触面３ｃがプリント配線１３に圧接され
る。その結果、導電部材１を介して、接地導体１１とプ
リント配線１３とが導通され、プリント配線１３は接地
導体１１に対して確実に接地される。The ground conductor 11 may be, for example, a shield case for covering the printed wiring board 12 or a printed wiring board 12.
Is constituted by a housing of an electronic device in which is stored. Then, the side end of the printed wiring board (substrate) 12 is inserted from the lower side of the contact portion 3 while the base material 3a of the contact portion 3 is elastically deformed, and the printed wiring formed on the printed wiring board 12 ( The conductive pattern 13 is brought into contact with the lower surface (contact surface) 3c of the covering material 3b of the contact portion 3. Then, due to the elastic restoring force of the elastically deformed base material 3a trying to return to the original shape,
The contact surface 3c of the covering material 3b is pressed against the printed wiring 13. As a result, the ground conductor 11 and the printed wiring 13 are conducted through the conductive member 1, and the printed wiring 13 is reliably grounded to the ground conductor 11.
【００１７】尚、図１においては、導電部材１がプリン
ト配線１３に圧接されておらず弾性変形していない状態
（元の形状）を二点鎖線にて図示してある。このよう
に、本実施形態の導電部材１によれば、プリント配線板
１２の側方からプリント配線１３を接地することが可能
になり、ノイズ耐性および静電破壊耐性を向上させるこ
とができる。In FIG. 1, the state where the conductive member 1 is not pressed against the printed wiring 13 and is not elastically deformed (original shape) is shown by a two-dot chain line. As described above, according to the conductive member 1 of the present embodiment, the printed wiring 13 can be grounded from the side of the printed wiring board 12, and the noise resistance and the electrostatic breakdown resistance can be improved.
【００１８】また、導電部材１は接合部２および接触部
３から構成され、全体の寸法形状を小型にできるため、
各種コネクタ（例えば、ＤＩＮ、ＵＳＢなど）の近傍に
取り付けることが容易であり、当該コネクタの近傍で当
該コネクタに接続されたプリント配線１３を接地するこ
とが可能になることから、ノイズ耐性および静電破壊耐
性を向上させることもできる。The conductive member 1 is composed of a joint 2 and a contact 3 so that the overall size and shape can be reduced.
Since it is easy to attach to the vicinity of various connectors (for example, DIN, USB, etc.) and it is possible to ground the printed wiring 13 connected to the connector in the vicinity of the connector, noise resistance and static electricity It can also improve fracture resistance.
【００１９】そして、導電部材１とプリント配線板１２
との位置関係を調節することにより、前記した接地導体
１１に対する接触部３の圧接力（接触圧）を適宜設定す
ることが可能になり、導電部材１を介したプリント配線
１３の接地をより確実に行うことができる。例えば、図
１に示すように、プリント配線板１２の側端部と接合部
２との距離Ｌを長く設定した場合は、接触部３の基材３
ａの弾性変形量が小さくなるため、接地導体１１に対す
る接触部３の圧接力が小さくなる。反対に、距離Ｌを短
く設定した場合は、接触部３の基材３ａの弾性変形量が
大きくなるため、接地導体１１に対する接触部３の圧接
力が大きくなる。そのため、距離Ｌを適宜設定すること
により、前記圧接力を容易に最適化することができる。The conductive member 1 and the printed wiring board 12
By adjusting the positional relationship with the ground conductor 11, it is possible to appropriately set the pressure contact force (contact pressure) of the contact portion 3 against the ground conductor 11, and the grounding of the printed wiring 13 via the conductive member 1 can be more reliably performed. Can be done. For example, as shown in FIG. 1, when the distance L between the side end portion of the printed wiring board 12 and the joint portion 2 is set to be long, the base material 3 of the contact portion 3
Since the amount of elastic deformation of “a” becomes small, the pressure contact force of the contact portion 3 to the ground conductor 11 becomes small. Conversely, when the distance L is set to be short, the elastic deformation of the base member 3a of the contact portion 3 increases, so that the pressing force of the contact portion 3 against the ground conductor 11 increases. Therefore, the pressing force can be easily optimized by appropriately setting the distance L.
【００２０】尚、図２においては、プリント基板１２の
側端部に対してプリント配線１３が平行に配置されると
共に、プリント基板１２の側端部に対して接触部３が直
交するように配置されているが、これに限定されるもの
ではない。つまり、プリント基板１２上においてプリン
ト配線１３はどのように配置されていてもよい。また、
プリント基板１２の側端部に対して接触部３が所定の角
度を成して配置されるようにしてもよく、当該所定角度
を調節することにより、前記した接地導体１１に対する
接触部３の圧接力（接触圧）を適宜設定することが可能
になる。In FIG. 2, the printed wiring 13 is arranged in parallel with the side edge of the printed circuit board 12, and the contact portion 3 is arranged so as to be perpendicular to the side edge of the printed circuit board 12. However, the present invention is not limited to this. That is, the printed wiring 13 may be arranged on the printed board 12 in any manner. Also,
The contact portion 3 may be arranged at a predetermined angle with respect to the side end portion of the printed circuit board 12. By adjusting the predetermined angle, the contact portion 3 is pressed against the ground conductor 11. Force (contact pressure) can be set appropriately.
【００２１】ところで、本発明は上記実施形態に限定さ
れるものではなく、以下のように具体化してもよく、そ
の場合でも、上記実施形態と同等もしくはそれ以上の作
用・効果を得ることができる。 （１）上記実施形態では、基材３ａと被覆材３ｂとから
接触部３を構成するようにしたが、可撓性に加えて導電
性を備えた材料（例えば、導電性エラストマーなど）を
用いて基材３ａを作成することにより、被覆材３ｂを省
くようにしてもよい。By the way, the present invention is not limited to the above-described embodiment, but may be embodied as follows. Even in such a case, the same operation or effect as that of the above-described embodiment can be obtained. . (1) In the above embodiment, the contact portion 3 is constituted by the base material 3a and the covering material 3b. However, a material having conductivity in addition to flexibility (for example, a conductive elastomer) is used. By forming the base material 3a by using the coating material 3b, the coating material 3b may be omitted.
【００２２】（２）上記実施形態では、被覆材３ｂおよ
び接合部２の全体が導電性を有するようにしたが、少な
くとも接触面３ｃと接合面２ｂのみが導電性を有し、接
触面３ｃと接合面２ｂとが電気的に接続されるようにし
てもよい。 （３）図４は、本発明を具体化した別の実施形態の導電
部材２１の使用状態を示す断面図であり、図２における
Ａ−Ａ線断面図に相当すると共に、上記実施形態の図３
に対応するものである。(2) In the above embodiment, the covering material 3b and the joint 2 are entirely electrically conductive, but at least only the contact surface 3c and the joint surface 2b are electrically conductive, and the contact surface 3c The bonding surface 2b may be electrically connected. (3) FIG. 4 is a cross-sectional view illustrating a use state of a conductive member 21 according to another embodiment of the present invention, which corresponds to a cross-sectional view taken along line AA in FIG. 3
It corresponds to.
【００２３】導電部材２１において、導電部材１と異な
るのは、接触部３から基材３ａが省かれ、導電性および
可撓性を備えた薄板材により接触部３が形成されている
点にある。接触部３を形成する薄板材は、その先端部に
アールを成して断面Ｕ字状に折り曲げ形成されており、
接触部３全体が薄板折り曲げ加工バネ材を構成してい
る。尚、接触部３を形成する薄板材としては、高いバネ
性を有する金属（例えば、ベリリウム銅、燐青銅、鋼な
ど）の薄板材に、接触導電性および耐錆性を高めるため
のメッキ処理（例えば、ニッケルメッキを下地とする金
メッキやロジウムメッキなど）を施したものを使用すれ
ばよい。The conductive member 21 is different from the conductive member 1 in that the base 3a is omitted from the contact portion 3 and the contact portion 3 is formed of a thin plate having conductivity and flexibility. . The thin plate material forming the contact portion 3 is formed to bend at a tip end thereof into a U-shaped cross section,
The entire contact portion 3 constitutes a thin plate bending spring material. In addition, as a thin plate material forming the contact portion 3, a thin plate material of a metal having a high spring property (for example, beryllium copper, phosphor bronze, steel, etc.) is plated by a plating treatment (for improving contact conductivity and rust resistance). For example, a metal plated with gold or rhodium plated with nickel as a base may be used.
【００２４】このように構成された導電部材２１を使用
するには、接触部３の下側から接触部３を弾性変形させ
た状態でプリント配線板１２の側端部を挿入し、プリン
ト配線板１２上に形成されたプリント配線１３と接触部
３とを当接させる。すると、弾性変形した接触部３の前
記薄板折り曲げ加工バネ材による反発力（バネ力）によ
り、接触部３がプリント配線１３に圧接される。その結
果、導電部材２１を介して、接地導体１１とプリント配
線１３とが導通され、プリント配線１３は接地導体１１
に対して確実に接地される。In order to use the conductive member 21 configured as described above, the side end of the printed wiring board 12 is inserted from the lower side of the contact portion 3 in a state where the contact portion 3 is elastically deformed. The printed wiring 13 formed on 12 and the contact portion 3 are brought into contact with each other. Then, the contact portion 3 is pressed against the printed wiring 13 by the repulsive force (spring force) of the elastically deformed contact portion 3 by the thin plate bending spring material. As a result, the ground conductor 11 is electrically connected to the printed wiring 13 via the conductive member 21, and the printed wiring 13 is connected to the ground conductor 11.
Is reliably grounded.
【００２５】（４）上記各実施形態の使用方法において
は、接合部２を接地導体１１に取付固定すると共に、接
触部３をプリント配線１３に圧接させるようにしたが、
接合部２の接合面２ｂをプリント配線１３に半田付けし
て導電部材１をプリント配線板１２に表面実装し、接触
部３の接触面３ｃを接地導体１１に圧接させるようにし
てもよい。(4) In the method of use of each of the above embodiments, the joint 2 is fixed to the ground conductor 11 and the contact 3 is pressed against the printed wiring 13.
The conductive member 1 may be surface-mounted on the printed wiring board 12 by soldering the bonding surface 2b of the bonding portion 2 to the printed wiring 13, and the contact surface 3c of the contact portion 3 may be pressed against the ground conductor 11.
【００２６】図５は、このような使用方法による導電部
材１（２１）の使用状態を示す要部分解斜視図である。
図６は、図５におけるＢ−Ｂ線断面図である。導電部材
１（２１）は、プリント配線板１２上に形成されたプリ
ント配線１３に対して、半田３１によって接合部２の接
合面２ｂが半田付けされることにより表面実装され、プ
リント配線板１２の側端部から接触部３が突出されてい
る。FIG. 5 is an exploded perspective view of a main part showing a use state of the conductive member 1 (21) according to such a use method.
FIG. 6 is a sectional view taken along line BB in FIG. The conductive member 1 (21) is surface-mounted by soldering the bonding surface 2 b of the bonding portion 2 to the printed wiring 13 formed on the printed wiring board 12 by soldering 31. The contact portion 3 protrudes from the side end.
【００２７】プリント配線板１２における導電部材１
（２１）の近傍にはコネクタ３２が取り付けられてい
る。そして、プリント配線板１２は、接地導体１１であ
る電子機器の筺体３３の底板３３ａに対して、スペーサ
３４を介して取付固定されている。Conductive member 1 on printed wiring board 12
A connector 32 is attached near (21). The printed wiring board 12 is attached and fixed to the bottom plate 33 a of the housing 33 of the electronic device, which is the ground conductor 11, via a spacer 34.
【００２８】また、電子機器の筺体３３の側板３３ｂに
は、コネクタ３２を露出させるための孔３３ｃが開口さ
れている。図６に示すように、筺体３３の底板３３ａに
対して側板３３ｂを垂直に取り付け、底板３３ａと側板
３３ｂとを螺子３５を用いて螺着することにより、筺体
３３が組み立てられる。このとき、導電部材１（２１）
は、接触部３が弾性変形した状態で接触面３ｃが側板３
３ｂに当接される。すると、弾性変形した接触部３が元
の形状に戻ろうとする弾性復元力により、接触面３ｃが
側板３３ｂに圧接される。その結果、導電部材１（２
１）を介して、接地導体１１である電子機器の筺体３３
とプリント配線１３とが導通され、プリント配線１３は
筺体３３に対して確実に接地される。A hole 33c for exposing the connector 32 is formed in a side plate 33b of the housing 33 of the electronic device. As shown in FIG. 6, the housing 33 is assembled by vertically attaching the side plate 33b to the bottom plate 33a of the housing 33 and screwing the bottom plate 33a and the side plate 33b together with the screws 35. At this time, the conductive member 1 (21)
In the state where the contact portion 3 is elastically deformed, the contact surface 3c is
3b. Then, the contact surface 3c is pressed against the side plate 33b by the elastic restoring force of the elastically deformed contact portion 3 to return to the original shape. As a result, the conductive member 1 (2
1) through the housing 33 of the electronic device that is the ground conductor 11
Is electrically connected to the printed wiring 13, and the printed wiring 13 is reliably grounded to the housing 33.
【００２９】図７は、導電部材１（２１）の別の使用状
態を示す要部断面図である。導電部材１（２１）は、プ
リント配線板１２上に形成されたプリント配線１３に対
して、半田３１によって接合部２の接合面２ｂが半田付
けされることにより表面実装されている。FIG. 7 is a sectional view of a main part showing another state of use of the conductive member 1 (21). The conductive member 1 (21) is surface-mounted by soldering the bonding surface 2b of the bonding portion 2 to the printed wiring 13 formed on the printed wiring board 12 by the solder 31.
【００３０】そして、プリント配線板１２の導電部材１
（２１）が表面実装された面を、接地導体１１である電
子機器の筺体４１のボス４２が突設された面に対向配置
し、プリント配線板１２を筺体４１に対して取付固定す
る。このとき、導電部材１（２１）は、接触部３がボス
４２の先端部に押圧されて弾性変形され、その状態で接
触面３ｃがボス４２に当接される。すると、弾性変形し
た接触部３が元の形状に戻ろうとする弾性復元力によ
り、接触面３ｃがボス４２の先端部に圧接される。その
結果、導電部材１（２１）を介して、接地導体１１であ
る電子機器の筺体４１とプリント配線１３とが導通さ
れ、プリント配線１３は筺体４１に対して確実に接地さ
れる。The conductive member 1 of the printed wiring board 12
The surface on which (21) is mounted is opposed to the surface on which the boss 42 of the housing 41 of the electronic device, which is the grounding conductor 11, is protruded, and the printed wiring board 12 is attached and fixed to the housing 41. At this time, the contact portion 3 of the conductive member 1 (21) is pressed by the tip of the boss 42 and is elastically deformed. In this state, the contact surface 3c contacts the boss 42. Then, the contact surface 3 c is pressed against the tip of the boss 42 by the elastic restoring force of the elastically deformed contact portion 3 to return to the original shape. As a result, the printed wiring 13 is electrically connected to the housing 41 of the electronic device, which is the ground conductor 11, via the conductive member 1 (21), and the printed wiring 13 is reliably grounded to the housing 41.
【図１】本発明を具体化した一実施形態の導電部材の使
用状態を示す正面図。FIG. 1 is a front view showing a use state of a conductive member according to an embodiment of the invention.
【図２】一実施形態の導電部材の使用状態を示す平面
図。FIG. 2 is a plan view showing a use state of the conductive member according to the embodiment.
【図３】図２におけるＡ−Ａ線断面図。FIG. 3 is a sectional view taken along line AA in FIG. 2;
【図４】本発明を具体化した別の実施形態の導電部材の
使用状態を示す断面図。FIG. 4 is a sectional view showing a use state of a conductive member according to another embodiment of the present invention.
【図５】各実施形態の導電部材の別の使用状態を示す要
部分解斜視図。FIG. 5 is an exploded perspective view of a main part showing another use state of the conductive member of each embodiment.
【図６】図５におけるＢ−Ｂ線断面図。FIG. 6 is a sectional view taken along line BB in FIG. 5;
【図７】各実施形態の導電部材の別の使用状態を示す要
部断面図。FIG. 7 is an essential part cross sectional view showing another state of use of the conductive member of each embodiment.
１，２１…導電部材 ２…接合部 ２ａ…カシメ部
２ｂ…接合面 ３…接触部 ３ａ…基材 ３ｂ…被覆材 ３ｃ…
接触面 １１…接地導体 １２…プリント配線板 １３…プ
リント配線1, 21 ... conductive member 2 ... joining part 2a ... caulking part 2b ... joining surface 3 ... contact part 3a ... base material 3b ... coating material 3c ...
Contact surface 11: ground conductor 12: printed wiring board 13: printed wiring
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成１２年８月３０日（２０００．８．３
０）[Submission date] August 30, 2000 (2008.3.
0)
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】請求項１[Correction target item name] Claim 1
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００５[Correction target item name] 0005
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００５】[0005]
【課題を解決するための手段および発明の効果】かかる
目的を達成するためになされた請求項１に記載の発明
は、可撓性を有すると共に、少なくとも接触面が導電性
を有する略四角柱状の接触部と、当該接触部に取付固定
されると共に、少なくとも接合面が前記接触面と電気的
に接続された接合部とを備えた導電部材であって、前記
接触部が弾性変形して前記接触面が配線板上に形成され
た配線に圧接されると共に前記接合部の前記接合面が接
地導体と電気的に接続されるか、または、前記接触部が
弾性変形して前記接触面が接地導体に圧接されると共に
前記接合部の前記接合面が配線板上に形成された配線と
電気的に接続されることをその要旨とする。Means for Solving the Problems and Effects of the Invention The invention according to the first aspect of the present invention, which has been made to achieve the above object, has a substantially quadrangular prism shape having flexibility and at least a contact surface having conductivity . A conductive member having a contact portion and a joint portion fixed to the contact portion and having at least a joint surface electrically connected to the contact surface, wherein the contact portion is elastically deformed to form the contact portion; The surface is pressed against the wiring formed on the wiring board, and the joint surface of the joint is electrically connected to a ground conductor, or the contact portion is elastically deformed and the contact surface is grounded. And that the joint surface of the joint portion is electrically connected to a wiring formed on a wiring board.
Claims (3)
面が導電性を有する接触部と、 当該接触部に取付固定されると共に、少なくとも接合面
が前記接触面と電気的に接続された接合部とを備えた導
電部材であって、 前記接触部が弾性変形して前記接触面が配線板上に形成
された配線に圧接されると共に前記接合部の前記接合面
が接地導体と電気的に接続されるか、または、前記接触
部が弾性変形して前記接触面が接地導体に圧接されると
共に前記接合部の前記接合面が配線板上に形成された配
線と電気的に接続されることを特徴とする導電部材。1. A contact portion having flexibility and at least a contact surface having conductivity, and a joint portion fixedly attached to the contact portion and having at least a joint surface electrically connected to the contact surface. Wherein the contact portion is elastically deformed, the contact surface is pressed against a wiring formed on a wiring board, and the joint surface of the joint portion is electrically connected to a ground conductor. Or that the contact portion is elastically deformed, the contact surface is pressed against the ground conductor, and the joint surface of the joint portion is electrically connected to the wiring formed on the wiring board. Characteristic conductive member.
の少なくとも前記接触面に対応する部分を覆設する導電
性を有した被覆材とから成ることを特徴とする導電部
材。2. The conductive member according to claim 1, wherein the contact portion has a flexible base material and a conductive material covering at least a portion of the surface of the base material corresponding to the contact surface. A conductive member comprising:
り形成されたバネ材から成ることを特徴とする導電部
材。3. The conductive member according to claim 1, wherein the contact portion is made of a spring material formed of a conductive and flexible thin plate material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28833399A JP3246904B2 (en) | 1999-10-08 | 1999-10-08 | Conductive material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28833399A JP3246904B2 (en) | 1999-10-08 | 1999-10-08 | Conductive material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001110480A true JP2001110480A (en) | 2001-04-20 |
| JP3246904B2 JP3246904B2 (en) | 2002-01-15 |
Family
ID=17728841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28833399A Expired - Fee Related JP3246904B2 (en) | 1999-10-08 | 1999-10-08 | Conductive material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3246904B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003521093A (en) * | 2000-01-25 | 2003-07-08 | ソシエタ イタリアーナ ベトロ − エスアイブイ − ソシエタ ペル アチオニ | Glazing with electrical terminals |
-
1999
- 1999-10-08 JP JP28833399A patent/JP3246904B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003521093A (en) * | 2000-01-25 | 2003-07-08 | ソシエタ イタリアーナ ベトロ − エスアイブイ − ソシエタ ペル アチオニ | Glazing with electrical terminals |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3246904B2 (en) | 2002-01-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7374430B2 (en) | Electrical connector for connecting a flat-type circuit board | |
| US7374429B2 (en) | Connector assembly | |
| US6908339B2 (en) | Connector having a simple structure assuring a stable mounting operation | |
| US20080180931A1 (en) | Structure of mounting shield cover and display device | |
| US20060252287A1 (en) | Connector | |
| US8550854B2 (en) | Edge connector | |
| JPH0579879U (en) | Shield type electrical connector and fixing metal fittings used for it | |
| TW200406954A (en) | Connection structure between printed circuit board and flexible circuit board | |
| US20040235349A1 (en) | Connector having a shell which can readily be fixed to a connector housing | |
| JP3246904B2 (en) | Conductive material | |
| JP2008084561A (en) | Connection structure of shield connector for base board | |
| US6940459B2 (en) | Antenna assembly with electrical connectors | |
| US20050287866A1 (en) | Connector for flexible board | |
| JP5239926B2 (en) | Electronic device and manufacturing method thereof | |
| CN111355030B (en) | Mobile terminal | |
| JP2970662B1 (en) | Board mounting connector components, board mounting connector pair and connector connection structure | |
| JP3167093B2 (en) | Electromagnetic sounding body | |
| JP2509656B2 (en) | Flexible printed wiring board connection structure | |
| US7222543B2 (en) | Modular encoder, method of producing a modular encoder, and system for measuring angular movement | |
| JP4290272B2 (en) | Card type peripheral device | |
| JP2003115679A (en) | Information equipment provided with ground structure and ground plate | |
| US11984689B2 (en) | Conductive housing for connector and connector comprising the same | |
| JP3435054B2 (en) | Press-fit connector fixing structure | |
| JP2018073758A (en) | Electric connector | |
| JPH0648930Y2 (en) | Printed board installation structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081102 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081102 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091102 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091102 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101102 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111102 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111102 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121102 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121102 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121102 Year of fee payment: 11 |
|
| LAPS | Cancellation because of no payment of annual fees |