JP2001028355A - Polishing apparatus - Google Patents
Polishing apparatusInfo
- Publication number
- JP2001028355A JP2001028355A JP20061099A JP20061099A JP2001028355A JP 2001028355 A JP2001028355 A JP 2001028355A JP 20061099 A JP20061099 A JP 20061099A JP 20061099 A JP20061099 A JP 20061099A JP 2001028355 A JP2001028355 A JP 2001028355A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- chuck table
- grinding
- cassette
- detecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 claims abstract description 91
- 230000001681 protective effect Effects 0.000 claims abstract description 32
- 238000001514 detection method Methods 0.000 claims description 32
- 238000004140 cleaning Methods 0.000 claims description 9
- 235000012431 wafers Nutrition 0.000 description 82
- 230000002159 abnormal effect Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、半導体ウエーハ等
の被加工物を研削する研削装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grinding device for grinding a workpiece such as a semiconductor wafer.
【0002】[0002]
【従来の技術】表面にIC等の回路が複数形成された半
導体ウエーハは、放熱性を良くするために又はカード、
携帯電話等の軽量化、小型化のために所定の厚さに研削
される。この研削は、半導体ウエーハの表面に保護テー
プを貼着し、研削装置のチャックテーブルに保護テープ
側が下面となるようにして吸着保持し、表出した半導体
ウエーハの裏面を研削ホイールで研削することにより遂
行される。2. Description of the Related Art A semiconductor wafer having a plurality of circuits such as ICs formed on a surface thereof is used to improve heat dissipation or to use a card,
It is ground to a predetermined thickness to reduce the weight and size of a mobile phone or the like. This grinding is performed by attaching a protective tape to the surface of the semiconductor wafer, holding the protective tape on the chuck table of the grinding device by suction so that the protective tape side faces the lower surface, and grinding the exposed back surface of the semiconductor wafer with a grinding wheel. Will be performed.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、特にカ
セットから半導体ウエーハを自動的に搬出し、自動的に
チャックテーブルに載置する研削装置においては、間違
って半導体ウエーハの表裏が反転してカセット内に収容
されていることがある。つまり、通常は保護テープ側が
下面となるようにしてカセットに収容されているが、中
には間違って保護テープ側が上面となって収容されてい
るものがある。このような場合には、保護テープ側を研
削ホイールによって研削してしまい、その下の回路が破
壊されて高価な半導体ウエーハを不良品にしてしまうと
いう重大な問題が指摘されている。However, especially in a grinding apparatus that automatically unloads a semiconductor wafer from a cassette and automatically mounts the semiconductor wafer on a chuck table, the front and back of the semiconductor wafer are erroneously inverted and the semiconductor wafer is inserted into the cassette. May be contained. That is, normally, the protective tape side is housed in the cassette with the lower surface facing down, but some of them are erroneously housed with the protective tape side facing up. In such a case, a serious problem has been pointed out that the protective tape side is ground by a grinding wheel, and a circuit below the protective tape is broken, and an expensive semiconductor wafer becomes defective.
【0004】本発明は、このような従来の問題を解決す
るためになされ、カセット内に表裏反転した被加工物が
間違って収容されていても、その表裏面をチャックテー
ブルに載置される前の段階で検出して研削ミスを未然に
防止できるようにした、研削装置を提供することを目的
とする。SUMMARY OF THE INVENTION The present invention has been made to solve such a conventional problem, and even if a reversed work piece is erroneously stored in a cassette, the work piece is placed on the chuck table before the work piece is placed on the chuck table. It is an object of the present invention to provide a grinding apparatus capable of detecting at the stage of the above and preventing a grinding error from occurring.
【0005】[0005]
【課題を解決するための手段】この目的を達成するため
の技術的手段として、本発明は、半導体ウエーハを保持
するチャックテーブルと、このチャックテーブルに保持
された半導体ウエーハを研削する研削手段と、を少なく
とも含む研削装置であって、この研削装置には、前記半
導体ウエーハの表裏を検出する表裏検出手段が配設され
ており、半導体ウエーハが前記チャックテーブルに載置
される前に表裏が検出される研削装置を要旨とする。こ
の研削装置において、半導体ウエーハの回路が形成され
ている面を表面とすると、その表面には保護テープが貼
着されていて前記チャックテーブルに接触する側とな
り、前記表裏検出手段は保護テープの有無を検出するこ
とによって表裏を検出すること、前記表裏検出手段には
色検出センサが配設されており、前記保護テープの色又
は半導体ウエーハの色を検出して保護テープの有無を検
出すること、前記表裏検出手段には硬度検出センサが配
設されており、前記保護テープの硬度又は半導体ウエー
ハの硬度を検出して保護テープの有無を検出すること、
研削装置は、半導体ウエーハを収容したカセットが載置
されるカセット載置領域と、このカセット載置領域にあ
るカセットから半導体ウエーハを搬出する第1の搬送手
段と、この第1の搬送手段によって搬送された半導体ウ
エーハの中心を合わせる中心合わせ手段と、この中心合
わせ手段にある半導体ウエーハを搬出しチャックテーブ
ルに搬送する第2の搬送手段と、チャックテーブルにあ
る研削済みの半導体ウエーハを搬出し洗浄手段まで搬送
する第3の搬送手段と、洗浄手段にある洗浄済みの半導
体ウエーハを搬出する第4の搬送手段とを含み、前記第
1の搬送手段、中心合わせ手段、第2の搬送手段のいず
れかに表裏検出手段が配設されるか又はいずれかの中間
に配設され、カセットから半導体ウエーハを搬出しチャ
ックテーブルに載置する間に半導体ウエーハの表裏を検
出すること、更に、前記表裏検出手段による検出結果が
不適正であればエラー表示をすること、を要旨とするも
のである。As technical means for achieving this object, the present invention provides a chuck table for holding a semiconductor wafer, grinding means for grinding the semiconductor wafer held on the chuck table, The grinding device includes at least front and back detection means for detecting the front and back of the semiconductor wafer, and the front and back are detected before the semiconductor wafer is placed on the chuck table. The outline of the grinding device is as follows. In this grinding apparatus, when the surface of the semiconductor wafer on which the circuit is formed is defined as the front surface, a protective tape is adhered to the surface and the surface comes into contact with the chuck table. Detecting the front and back, by detecting the front and back, a color detection sensor is provided in the front and back detection means, to detect the color of the protective tape or the color of the semiconductor wafer to detect the presence or absence of the protective tape, A hardness detection sensor is provided in the front and back detection means, and the presence or absence of the protection tape is detected by detecting the hardness of the protection tape or the hardness of the semiconductor wafer,
The grinding device includes a cassette mounting area on which a cassette containing a semiconductor wafer is mounted, a first transfer unit that unloads the semiconductor wafer from the cassette in the cassette mounting area, and a transfer unit that transfers the semiconductor wafer by the first transfer unit. Centering means for centering the center of the obtained semiconductor wafer, second carrying means for carrying out the semiconductor wafer in the centering means and carrying it to the chuck table, and carrying out cleaning means for carrying out the ground semiconductor wafer in the chuck table A third transfer means for transferring the semiconductor wafer having been cleaned in the cleaning means, and a fourth transfer means for unloading the cleaned semiconductor wafer in the cleaning means, wherein any one of the first transfer means, the centering means, and the second transfer means The front and back detection means is provided at the middle or at any intermediate position, and the semiconductor wafer is unloaded from the cassette and placed on the chuck table. Detecting the front and back of the semiconductor wafer during the further the detection result of the front and rear detection means and error display if incorrect, it is an gist.
【0006】[0006]
【発明の実施の形態】以下、本発明に係る研削装置の実
施形態を添付図面に基づいて詳説する。図1において、
1A、1Bは研削装置Mのカセット載置領域上に載置さ
れたカセットであり、被加工物である半導体ウエーハW
が複数枚収容されている。カセット1Aには未研削の半
導体ウエーハが、カセット1Bには研削済みの半導体ウ
エーハがそれぞれ収容される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a grinding apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. In FIG.
Reference numerals 1A and 1B denote cassettes mounted on the cassette mounting area of the grinding apparatus M, and the semiconductor wafer W as a workpiece.
Are stored. An unground semiconductor wafer is stored in the cassette 1A, and a ground semiconductor wafer is stored in the cassette 1B.
【0007】半導体ウエーハWは、図2のようにIC等
の回路(図示せず)が複数形成された表面に保護テープ
2が貼着され、この保護テープ2側が下面となるように
して前記カセット1A内(1B内も同様)に収容されて
いる。As shown in FIG. 2, a protective tape 2 is attached to a surface of a semiconductor wafer W on which a plurality of circuits such as ICs (not shown) are formed, and the protective tape 2 side is a lower surface. It is housed in 1A (same in 1B).
【0008】3は研削装置Mの凹部内に配設された第1
の搬送手段であり、図3のように上下動手段3aと旋回
手段3bを備え、旋回手段3bの上端部には二つ折りで
屈伸自在の進退アーム3cが取り付けられ、この進退ア
ーム3cの先端部にはウエーハ保持部4が配設されてい
る。[0008] Reference numeral 3 denotes a first device provided in the concave portion of the grinding device M.
As shown in FIG. 3, the transfer means includes a vertically moving means 3a and a turning means 3b, and a folding / retractable reciprocating arm 3c is attached to the upper end of the turning means 3b. Is provided with a wafer holding unit 4.
【0009】ウエーハ保持部4は、先端が二股に分かれ
たほぼU字型の板状体であり、進退アーム3cの先端部
に取り付けられた駆動部4aに対して水平軸回りに18
0度反転できるようにしてある。又、分岐部の両側には
半導体ウエーハWを吸着するための吸着部4bが対設さ
れ、先端部には表裏検出手段5が配設されている。この
場合、表裏検出手段5は色検出センサであり、前記保護
テープ2の色例えば青色を検出できるようにしてある。The wafer holding part 4 is a substantially U-shaped plate-like body having a bifurcated tip, and is rotated about a horizontal axis with respect to a driving part 4a attached to the tip of the reciprocating arm 3c.
It can be inverted by 0 degrees. Further, on both sides of the branch portion, suction portions 4b for sucking the semiconductor wafer W are provided opposite to each other, and front and back detection means 5 are provided at a tip portion. In this case, the front and back detection means 5 is a color detection sensor, and can detect the color of the protective tape 2, for example, blue.
【0010】前記第1の搬送手段3は、カセット1A内
に収容されている半導体ウエーハを1枚ずつ搬出して中
心合わせ手段6の中心テーブル6bに搬送する。即ち、
第1の搬送手段3を動かしてウエーハ保持部4をカセッ
ト1A内に挿入し、搬出すべき半導体ウエーハWの下面
側を前記吸着部4bにより吸着してカセット1Aから搬
出する。The first transfer means 3 unloads the semiconductor wafers contained in the cassette 1A one by one and transfers them to the center table 6b of the centering means 6. That is,
By moving the first transfer means 3, the wafer holding section 4 is inserted into the cassette 1A, and the lower surface side of the semiconductor wafer W to be carried out is sucked by the suction section 4b and carried out of the cassette 1A.
【0011】この際、半導体ウエーハWの下面側には前
記のように保護テープ2が貼着されているため、この保
護テープ2の色を表裏検出手段5(色検出センサ)で検
出することができ、これにより半導体ウエーハWの表裏
を検出する。即ち、保護テープ2の有無により半導体ウ
エーハWの表裏面を検出することができる。At this time, since the protective tape 2 is adhered to the lower surface of the semiconductor wafer W as described above, the color of the protective tape 2 can be detected by the front and back detection means 5 (color detection sensor). Thus, the front and back of the semiconductor wafer W are detected. That is, the front and back surfaces of the semiconductor wafer W can be detected based on the presence or absence of the protective tape 2.
【0012】通常は保護テープ2側が下面となるように
してカセット1Aに収容するから、保護テープ2が検出
されなかった時は不適正(異常)であり、その半導体ウ
エーハは間違って表裏反転した状態でカセット1Aに収
容されている事が分かる。Normally, the protective tape 2 is housed in the cassette 1A so that the protective tape 2 side faces the lower side. Therefore, when the protective tape 2 is not detected, it is improper (abnormal), and the semiconductor wafer is erroneously turned upside down. It can be seen from FIG.
【0013】このように表裏検出手段5による検出結果
が不適正(異常)の場合は、警報音等によって制御盤7
にエラー表示をする。そして、カセット1Aから搬出し
た後に、半導体ウエーハWを吸着したまま前記ウエーハ
保持部4を180度反転させ、その反転状態を保持して
前記中心合わせ手段6の中心テーブル6bまで搬送す
る。これにより、半導体ウエーハWを正常状態に修正す
ることができる。When the detection result by the front and back detection means 5 is inappropriate (abnormal), the control panel 7 is activated by an alarm sound or the like.
Error display. Then, after being unloaded from the cassette 1A, the wafer holding unit 4 is turned 180 degrees while the semiconductor wafer W is being sucked, and the wafer holding unit 4 is transferred to the center table 6b of the centering means 6 while holding the inverted state. As a result, the semiconductor wafer W can be corrected to a normal state.
【0014】中心合わせ手段6に搬送された半導体ウエ
ーハWは、求心方向に移動する複数のピン6aにより外
周縁が押されて中心合わせが遂行される。この後、上下
動及び旋回自在に形成された第2の搬送手段8により吸
着され、受け取り位置Pに割り出されたチャックテーブ
ル9上に搬送される。The outer peripheral edge of the semiconductor wafer W conveyed to the centering means 6 is pushed by a plurality of pins 6a moving in the centripetal direction, thereby performing centering. Thereafter, the sheet is sucked by the second transfer means 8 which is formed so as to be vertically movable and pivotable, and is transferred onto the chuck table 9 indexed to the receiving position P.
【0015】チャックテーブル9上に吸着保持された半
導体ウエーハWは、保護テープ2側(表面側)がチャッ
クテーブル9に接触し裏面側が上となって表出してお
り、ターンテーブル10の回転によって研削手段11に
位置付けられる。The semiconductor wafer W sucked and held on the chuck table 9 is exposed with the protective tape 2 side (front side) contacting the chuck table 9 and the back side facing upward. It is located in the means 11.
【0016】研削手段11では、最初に第1の研削ホイ
ール11aに位置決めされて粗研削がなされる。この粗
研削では、第1の研削ホイール11a及びチャックテー
ブル9が回転され、第1の研削ホイール11aによって
表出している半導体ウエーハWの裏面が研削される。次
いで、半導体ウエーハWは、第2の研削ホイール11b
に位置決めされて仕上げ研削がなされる。この仕上げ研
削においても、第2の研削ホイール11b及びチャック
テーブル9が回転され、第2の研削ホイール11bによ
って半導体ウエーハWの裏面が研削される。In the grinding means 11, first, the first grinding wheel 11a is positioned and rough grinding is performed. In this rough grinding, the first grinding wheel 11a and the chuck table 9 are rotated, and the back surface of the semiconductor wafer W exposed by the first grinding wheel 11a is ground. Next, the semiconductor wafer W is moved to the second grinding wheel 11b.
And finish grinding is performed. Also in this finish grinding, the second grinding wheel 11b and the chuck table 9 are rotated, and the back surface of the semiconductor wafer W is ground by the second grinding wheel 11b.
【0017】仕上げ研削の終了後、ターンテーブル10
の回転によってチャックテーブル9は受け渡し位置Qに
割り出される。そのチャックテーブル9上にある研削済
みの半導体ウエーハは、第3の搬送手段12(第2の搬
送手段8と同じ構成)の吸着パッド12aにより吸着さ
れて搬出され、洗浄手段13まで搬送される。After finishing grinding, the turntable 10
The chuck table 9 is indexed to the transfer position Q by the rotation of. The ground semiconductor wafer on the chuck table 9 is sucked by the suction pad 12a of the third transfer means 12 (the same configuration as the second transfer means 8), carried out, and transferred to the cleaning means 13.
【0018】洗浄手段13に搬送された研削済みの半導
体ウエーハは、スピン洗浄されると共にスピン乾燥され
る。洗浄後、第4の搬送手段14(第1の搬送手段3が
兼ねる)により洗浄済みの半導体ウエーハを搬出して前
記カセット1B内に収容する。このようにして一連の研
削工程は終了するが、この研削工程は引き続きタイミン
グをとりながら繰り返して連続的に遂行される。The ground semiconductor wafer conveyed to the cleaning means 13 is spin-cleaned and spin-dried. After the cleaning, the cleaned semiconductor wafer is carried out by the fourth transporting means 14 (also serving as the first transporting means 3) and stored in the cassette 1B. In this way, a series of grinding steps is completed, but this grinding step is repeatedly and continuously performed with a timing.
【0019】ここで、いくつかのバリエーションが考え
られるので以下に説明する。上記実施形態では、保護テ
ープ2側を下にして未研削の半導体ウエーハをカセット
1Aに収容したが、これとは逆に保護テープ2側を上に
してカセット1Aに収容して実施することも可能であ
る。Here, some variations are conceivable, which will be described below. In the above-described embodiment, the unground semiconductor wafer is housed in the cassette 1A with the protective tape 2 side down, but it is also possible to house the cassette wafer 1A with the protective tape 2 side up. It is.
【0020】この場合、表裏検出手段5は半導体ウエー
ハWの色を検出するセンサを用い、半導体ウエーハWを
検出した時には、カセット1Aから搬出した後にウエー
ハ保持部4を反転させ、その反転状態を保持してチャッ
クテーブル9に搬送する。これにより、保護テープ2側
がチャックテーブル9に接触し、半導体ウエーハWの裏
面側が上面となって表出する。In this case, the front / back detection means 5 uses a sensor for detecting the color of the semiconductor wafer W. When the semiconductor wafer W is detected, the wafer holding section 4 is inverted after being carried out of the cassette 1A and the inverted state is held. And transported to the chuck table 9. As a result, the protective tape 2 comes into contact with the chuck table 9, and the back surface of the semiconductor wafer W is exposed as the upper surface.
【0021】一方、間違って保護テープ2側が下になっ
ていて半導体ウエーハを検出できなかった時は不適正
(異常)となり、制御盤7に警報音等を伴うエラー表示
がなされる。この時はカセット1Aから搬出した後に、
ウエーハ保持部4を反転させないでそのままチャックテ
ーブル9に搬送する。On the other hand, when the semiconductor tape cannot be detected because the protective tape 2 side is erroneously turned down, it becomes improper (abnormal), and an error display accompanied by an alarm sound or the like is displayed on the control panel 7. At this time, after unloading from cassette 1A,
The wafer holding unit 4 is transported to the chuck table 9 without being inverted.
【0022】尚、この場合であっても、表裏検出手段5
が保護テープ2の色を検出するセンサで実施することも
できる。要するに、表裏検出手段5により半導体ウエー
ハWの表裏面を検出できるように構成すれば良い。Even in this case, the front and back detection means 5
Can be implemented by a sensor that detects the color of the protective tape 2. In short, the structure may be such that the front and back detection means 5 can detect the front and back surfaces of the semiconductor wafer W.
【0023】表裏検出手段5は、前記のようにウエーハ
保持部4に取り付けると、カセット1Aから搬出する際
に直ちに表裏面を検出できて好ましいが、とにかく未研
削の半導体ウエーハがチャックテーブル9に載置される
前に、表裏の検出ができれば良いわけであるから取付位
置はウエーハ保持部4に限定されない。例えば、中心合
わせ手段6、第2の搬送手段8のいずれかに表裏検出手
段5を配設し又はいずれかの中間に配設し、カセット1
Aから半導体ウエーハを搬出してチャックテーブル9に
載置するまでの間に半導体ウエーハの表裏を検出するよ
うに構成する。The front / back detection means 5 is preferably attached to the wafer holding section 4 as described above, so that the front and back faces can be detected immediately when the wafer is unloaded from the cassette 1A. However, the unground semiconductor wafer is mounted on the chuck table 9 anyway. The mounting position is not limited to the wafer holding unit 4 since it is only necessary to be able to detect the front and back before being placed. For example, the front and back detection means 5 is provided in one of the centering means 6 and the second transport means 8 or provided in the middle of either of them, and the cassette 1
The front and back sides of the semiconductor wafer are detected before the semiconductor wafer is unloaded from A and placed on the chuck table 9.
【0024】間違って半導体ウエーハWの表裏が反転し
てカセット1A内に収容されていても、一旦搬出した半
導体ウエーハをカセット1A内に適正な状態で戻し、再
度搬出すれば表裏面が適正な状態の半導体ウエーハを搬
送することができ、オペレータを介さないで自動修正が
可能となる。Even if the semiconductor wafer W is erroneously turned upside down and housed in the cassette 1A, the semiconductor wafer W once carried out is returned to the cassette 1A in a proper state, and if the semiconductor wafer W is carried out again, the front and back sides are in a proper state. Semiconductor wafer can be transferred, and automatic correction can be performed without the intervention of an operator.
【0025】又、表裏検出手段5は色検出センサに限定
されず、例えば硬度検出センサで実施することも可能で
ある。保護テープ2の硬度又は半導体ウエーハWの硬度
を検出して半導体ウエーハの表裏を検出するのである。
この他、色の濃度、光の反射率等を検出するセンサも適
用できる。更に、カセット1A、1Bの載置場所は、前
記の位置に限定されず図1に仮想線で示す位置に載置し
ても良く、これらは適宜選択することが可能である。Further, the front / back detection means 5 is not limited to a color detection sensor, but may be implemented by a hardness detection sensor, for example. The hardness of the protective tape 2 or the hardness of the semiconductor wafer W is detected to detect the front and back of the semiconductor wafer.
In addition, a sensor that detects color density, light reflectance, and the like can be applied. Further, the place where the cassettes 1A and 1B are placed is not limited to the above-mentioned position, and may be placed at a position indicated by a virtual line in FIG. 1, and these can be appropriately selected.
【0026】[0026]
【発明の効果】以上説明したように、本発明に係る研削
装置によれば、間違って半導体ウエーハの表裏面が反転
してカセット内に収容されている場合でも、半導体ウエ
ーハの表面(保護テープが貼られた回路面)を研削して
高価な半導体ウエーハを損傷させることがない。特に、
第1の搬送手段に表裏検出手段を配設すれば、カセット
から半導体ウエーハを搬出する際に表裏が適正か不適正
かが直ちに分かるので、対応が迅速となり生産性が向上
する。又、半導体ウエーハの表裏が反転してカセット内
に収容されていても、一旦搬出した半導体ウエーハをカ
セット内に適正な状態で戻し、再度搬出すれば表裏面が
適正な状態の半導体ウエーハを搬送することができ、オ
ペレータを介さないで自動修正が可能となり、生産性を
更に向上することができる。As described above, according to the grinding apparatus of the present invention, even if the front and back surfaces of the semiconductor wafer are erroneously inverted and housed in the cassette, the front surface of the semiconductor wafer (the protective tape is The expensive semiconductor wafer is not damaged by grinding the pasted circuit surface). In particular,
If the front and back detection means are provided in the first transport means, it is possible to immediately determine whether the front and back are proper or inappropriate when the semiconductor wafer is carried out of the cassette, so that the response is prompt and the productivity is improved. Also, even if the semiconductor wafer is turned upside down and housed in the cassette, the semiconductor wafer once carried out is returned to the cassette in a proper state, and when the semiconductor wafer is carried out again, the semiconductor wafer having the proper front and back sides is transported. Automatic correction can be performed without the intervention of an operator, and productivity can be further improved.
【図1】本発明に係る研削装置の実施形態を示す斜視図FIG. 1 is a perspective view showing an embodiment of a grinding device according to the present invention.
【図2】保護テープを貼着した半導体ウエーハの斜視図FIG. 2 is a perspective view of a semiconductor wafer to which a protective tape is attached.
【図3】第1の搬送手段を示す概略斜視図FIG. 3 is a schematic perspective view showing a first transport unit.
1A、1B…カセット 2…保護テープ 3…第1の搬送手段 4…ウエーハ保持部 5…表裏検出手段 6…中心合わせ手段 7…制御盤 8…第2の搬送手段 9…チャックテーブル 10…ターンテーブル 11…研削手段 12…第3の搬送手段 13…洗浄手段 14…第4の搬送手段 DESCRIPTION OF SYMBOLS 1A, 1B ... Cassette 2 ... Protective tape 3 ... First conveyance means 4 ... Wafer holding part 5 ... Front and back detection means 6 ... Centering means 7 ... Control panel 8 ... Second conveyance means 9 ... Chuck table 10 ... Turntable DESCRIPTION OF SYMBOLS 11 ... Grinding means 12 ... Third conveyance means 13 ... Cleaning means 14 ... Fourth conveyance means
Claims (6)
ルと、このチャックテーブルに保持された半導体ウエー
ハを研削する研削手段と、を少なくとも含む研削装置で
あって、 この研削装置には、前記半導体ウエーハの表裏を検出す
る表裏検出手段が配設されており、半導体ウエーハが前
記チャックテーブルに載置される前に表裏が検出される
研削装置。1. A grinding apparatus including at least a chuck table for holding a semiconductor wafer and grinding means for grinding the semiconductor wafer held on the chuck table, wherein the grinding apparatus includes front and back surfaces of the semiconductor wafer. And a front and back detecting means for detecting front and back, and detecting the front and back before the semiconductor wafer is placed on the chuck table.
を表面とすると、その表面には保護テープが貼着されて
いて前記チャックテーブルに接触する側となり、前記表
裏検出手段は保護テープの有無を検出することによって
表裏を検出する請求項1記載の研削装置。2. A surface on which a circuit of a semiconductor wafer is formed is defined as a front surface, and a protective tape is adhered to the surface so that the surface comes into contact with the chuck table. The grinding apparatus according to claim 1, wherein the front and back sides are detected by detecting 裏.
されており、前記保護テープの色又は半導体ウエーハの
色を検出して保護テープの有無を検出する請求項2記載
の研削装置。3. The grinding apparatus according to claim 2, wherein a color detection sensor is provided in the front and back detection means, and detects the presence or absence of the protection tape by detecting the color of the protection tape or the color of the semiconductor wafer.
設されており、前記保護テープの硬度又は半導体ウエー
ハの硬度を検出して保護テープの有無を検出する請求項
2記載の研削装置。4. The grinding apparatus according to claim 2, wherein a hardness detection sensor is provided in the front and back detection means, and detects the presence or absence of the protection tape by detecting the hardness of the protection tape or the hardness of the semiconductor wafer.
セットが載置されるカセット載置領域と、このカセット
載置領域にあるカセットから半導体ウエーハを搬出する
第1の搬送手段と、この第1の搬送手段によって搬送さ
れた半導体ウエーハの中心を合わせる中心合わせ手段
と、この中心合わせ手段にある半導体ウエーハを搬出し
チャックテーブルに搬送する第2の搬送手段と、チャッ
クテーブルにある研削済みの半導体ウエーハを搬出し洗
浄手段まで搬送する第3の搬送手段と、洗浄手段にある
洗浄済みの半導体ウエーハを搬出する第4の搬送手段と
を含み、 前記第1の搬送手段、中心合わせ手段、第2の搬送手段
のいずれかに表裏検出手段が配設されるか又はいずれか
の中間に配設され、カセットから半導体ウエーハを搬出
しチャックテーブルに載置する間に半導体ウエーハの表
裏を検出する請求項1、2、3又は4記載の研削装置。5. A grinding apparatus, comprising: a cassette mounting area on which a cassette accommodating a semiconductor wafer is mounted; first transport means for unloading the semiconductor wafer from the cassette in the cassette mounting area; Centering means for aligning the center of the semiconductor wafer transferred by the transfer means, second transfer means for unloading the semiconductor wafer from the centering means and transferring it to the chuck table, and grinding the semiconductor wafer on the chuck table A third transporting means for transporting the semiconductor wafer to the cleaning means, and a fourth transporting means for transporting the cleaned semiconductor wafer in the cleaning means, wherein the first transporting means, the centering means, the second The front and back detection means is provided in any of the transfer means or provided in the middle of any one of them, and the semiconductor wafer is unloaded from the cassette and chucked. 5. The grinding apparatus according to claim 1, wherein the front and back of the semiconductor wafer are detected while being mounted on the table.
であればエラー表示をする請求項1、2、3、4又は5
記載の研削装置。6. An error display if the result of detection by said front and back detection means is incorrect.
The grinding device as described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20061099A JP4272757B2 (en) | 1999-07-14 | 1999-07-14 | Grinding equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20061099A JP4272757B2 (en) | 1999-07-14 | 1999-07-14 | Grinding equipment |
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JP2001028355A true JP2001028355A (en) | 2001-01-30 |
JP4272757B2 JP4272757B2 (en) | 2009-06-03 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002319559A (en) * | 2001-04-23 | 2002-10-31 | Disco Abrasive Syst Ltd | Grinding device |
JP2003007648A (en) * | 2001-06-18 | 2003-01-10 | Disco Abrasive Syst Ltd | Semiconductor wafer dividing system |
KR20030081800A (en) * | 2002-04-13 | 2003-10-22 | 삼성전자주식회사 | Wafer back-side grind apparatus comprising a wafer sensor |
JP2018049913A (en) * | 2016-09-21 | 2018-03-29 | 株式会社ディスコ | Wafer processing method |
JP2018187688A (en) * | 2017-04-28 | 2018-11-29 | 株式会社ディスコ | Processing device |
JP2019075494A (en) * | 2017-10-18 | 2019-05-16 | 株式会社ディスコ | Grinding method and grinding device of workpiece |
JP2019114684A (en) * | 2017-12-25 | 2019-07-11 | 東京エレクトロン株式会社 | Substrate processing system, substrate processing method, program, and computer storage medium |
-
1999
- 1999-07-14 JP JP20061099A patent/JP4272757B2/en not_active Expired - Lifetime
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002319559A (en) * | 2001-04-23 | 2002-10-31 | Disco Abrasive Syst Ltd | Grinding device |
JP2003007648A (en) * | 2001-06-18 | 2003-01-10 | Disco Abrasive Syst Ltd | Semiconductor wafer dividing system |
KR20030081800A (en) * | 2002-04-13 | 2003-10-22 | 삼성전자주식회사 | Wafer back-side grind apparatus comprising a wafer sensor |
JP2018049913A (en) * | 2016-09-21 | 2018-03-29 | 株式会社ディスコ | Wafer processing method |
JP2018187688A (en) * | 2017-04-28 | 2018-11-29 | 株式会社ディスコ | Processing device |
JP2019075494A (en) * | 2017-10-18 | 2019-05-16 | 株式会社ディスコ | Grinding method and grinding device of workpiece |
JP7015139B2 (en) | 2017-10-18 | 2022-02-02 | 株式会社ディスコ | Grinding method and grinding equipment for workpieces |
JP2019114684A (en) * | 2017-12-25 | 2019-07-11 | 東京エレクトロン株式会社 | Substrate processing system, substrate processing method, program, and computer storage medium |
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