JP2000507750A - Method for reflow soldering a printed wiring board on which SMD components are mounted - Google Patents

Method for reflow soldering a printed wiring board on which SMD components are mounted

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Publication number
JP2000507750A
JP2000507750A JP10526067A JP52606798A JP2000507750A JP 2000507750 A JP2000507750 A JP 2000507750A JP 10526067 A JP10526067 A JP 10526067A JP 52606798 A JP52606798 A JP 52606798A JP 2000507750 A JP2000507750 A JP 2000507750A
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JP
Japan
Prior art keywords
wiring board
printed wiring
smd
soldering
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10526067A
Other languages
Japanese (ja)
Inventor
ノイテル アンドレアス
シュミット ヨアヒム
ザボトケ イェンス
ハウシルト フランク―ディーター
グレーン アンスガー
バラン カローラ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
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Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JP2000507750A publication Critical patent/JP2000507750A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10628—Leaded surface mounted device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

(57)【要約】 本発明は、ＳＭＤ部品を装着したプリント配線板をリフローはんだ付けするための方法であって、ＳＭＤ部品を、プリント配線板の第１の面のはんだ付け面上に載せ、第１のリフローはんだ付け段階でプリント配線板にはんだ付けし、次いでプリント配線板をその第１の面が下になるようにひっくり返し、こうして上に位置する第２の面のはんだ付け面にＳＭＤ部品を載せ、次いでこのＳＭＤ部品を第２のリフローはんだ付け段階でプリント配線板にはんだ付けし、この際に第２のリフローはんだ付け段階の前に、第１の面上で、ＳＭＤ部品をプリント配線板の第１の面に固着させる方法に関する。本発明によれば、第１のリフローはんだ付け段階後に接着剤を、プリント配線板の第２の面から、第１の面にはんだ付けされた部品にその場で設けられてプリント配線板の第１の面から第２の面に延びるそれぞれ１つの開口を通して、第１の面と部品との間の室内に注入することが提案されている。   (57) [Summary] The present invention is a method for reflow soldering a printed wiring board on which an SMD component is mounted. Soldering to the printed wiring board in a step, then turning the printed wiring board upside down with the first side down, thus placing the SMD component on the soldering side of the second upper side, and then The SMD component is soldered to the printed wiring board in a second reflow soldering step, wherein the SMD component is mounted on the first surface of the printed wiring board on the first surface prior to the second reflow soldering step. The present invention relates to a method of fixing the surface. According to the present invention, after the first reflow soldering step, the adhesive is applied in-situ from the second side of the printed wiring board to the component soldered to the first side so that the adhesive can be applied to the first part of the printed wiring board. It is proposed to inject into the chamber between the first surface and the component through a respective opening extending from the first surface to the second surface.

Description

【発明の詳細な説明】 ＳＭＤ部品を装着したプリント配線板をリフローはんだ付けするための方法 本発明は、請求項１の上位概念に記載した方法に関する。 このような方法は従来公知であって、プリント配線板の両面にＳＭＤ部品（Ｓ ＭＤ＝Surface Mounted Device；表面実装部品）をリフローはんだ付け法ではん だ付けするために、プリント配線板製造時に利用される。例えばヨーロッパ特許 公開第４１９０６５号明細書によれば、まずプリント配線板の第１の面上で、は んだペーストプリントステーションにおいて、ＳＭＤ部品を取り付けるために設 けられた箇所にはんだ付け面をプリントする方法が公知である。次いで接着剤ス テーションで、プリント配線板の、はんだ付け箇所間に、ＳＭＤ部品を固定する ための接着剤滴を施し、次いで装着機によって、はんだ付け面及び接着剤上に載 せられるＳＭＤ部品を装着する。部品を接着剤に押しつけなければならないので 、部品を正確に載置することは接着剤によって妨げられる。装着後に接着剤は硬 化し、プリント配線板はリフローステーションに供給され、このリフローステー ションで、プリント配線板の第１の面に施されたはんだが溶融せしめられ、部品 はプリント配線板にはんだ付けされる。第１のリフロー段階後に、プリント配線 板はその第２の面が上に向けられて、新たにはんだ付け面がプリントされ、次い でＳＭＤ部品が装着される。第２の面で装着が終了すると、プリント配線板は新 たにリフローステーションに供給される。第２のリフローはんだ付け段階中に、 第２の面のはんだも、下側に位置する第１の面のはんだも溶融される。この際に 、第１の面に存在するＳＭＤ部品とプリント配線板との間の接着剤は、第１の面 に既にはんだ付けされているＳＭＤ部品がその重さによって、はんだ結合部の新 たな溶融時にプリント配線板からはがれることを阻止する。このヨーロッパ特許 公開第４１９０６５号明細書により公知の方法においては、接着剤が、第１のリ フローはんだ付け段階の前にプリント配線板に施される点が欠点である。何故な らば、このようにすれば、溶融したはんだペーストが、接着剤によって固定され た部品の下側で収縮するか、若しくは部品が接着剤によって、溶融されたはんだ ペーストから押し出されるからである。このような「沈降“settling”」として 知られている作用によって、プリント配線板上に、ＳＭＤ部品とはんだ付けされ た接続面との間の電気接続されない箇所若しくは電気接続の不十分な箇所が生じ る。 そこで、従来技術により公知な別の方法によれば、接着剤をまず、ＳＭＤ部品 の第１のリフローはんだ付 け後に部品とプリント配線板との間に施すようになっている。この方法によれば 、接着剤は部品のサイドエッジの領域で***部状に施されるので、接着剤はＳＭ Ｄ部品のエッジをプリント配線板の表面に結合する。この場合、接着剤はこれを 施す際に、はんだ付け面上に達し、これによってはんだ付け面が汚され、不純に されるという欠点がある。次いで行われる第２のリフローはんだ付け段階で、Ｓ ＭＤ部品とプリント配線板との間の電気的な接続の品質が前記汚れによって低下 せしめられる。 発明の利点 これに対して、ＳＭＤ部品を装着したプリント配線板をリフロー溶接するため の、請求項１の特徴を備えた本発明の方法は、リフローはんだ付け段階後に初め て接着剤が施され、それと同時に、接着剤を備えたプリント配線板の第１の面上 の汚れが避けられるという利点を有している。これは簡単な形式で、接着剤が、 第１のリフロー溶接後に、まだ自由にアクセス可能なプリント配線板の第２の面 から、このために設けられた開口を通って、部品とプリント配線板との間の狭い 中間室内に注入されることによって、達成される。これによって、有利な形式で 、ＳＭＤ部品の沈降も、また部品とプリント配線板との間のはんだ付け箇所の、 接着剤による導電能力の不都合な影響も避けられる。本発明による方法のために は、製造機械及びプロセス 順番を大きく変える必要がないので、このために付加的なコストはかからない。 さらに、プリント配線板の第１の面へのＳＭＤ部品の装着は、接着剤によって妨 げられることはなく、ＳＭＤ部品ははんだ付け面上に問題なく載せることができ る。 接着剤を最適に調量するために、接着剤を、プリント配線板をひっくり返し（ 裏返し）てから、開口内に導入された注入針によって、ＳＭＤ部品の接続面とプ リント配線板の第１の面との間の室内に直接注入するようにすれば、特に有利で ある。 実施例の説明 本発明による方法は例えば、プリント配線板がコンベヤベルト上で相次いで各 ステーションを通過する自動製造ラインで行うことができる。プリント配線板は 、第１の面と、この第１の面とは反対側の第２の面とを有しており、これらの２ つの面にＳＭＤ部品が装着されるようになっている。ＳＭＤ部品を装着するため に規定された、プリント配線板の第１の面の箇所には、それぞれ１つの開口が設 けられており、この開口は、第１の面から、プリント配線板の第２の面まで延び ている。開口は例えば、約１ｍｍの直径を有する孔として構成することができる 。この方法は、ＳＭＤ部品のための接続面及び前記開口を両面に備えたプリント 配線板をはんだペーストプリントステーションに供給することから始まる。この はんだペーストプリントス テーションで、はんだペーストがプリント配線板の第１の面の接続面に施される 。次いで、プリント配線板がＳＭＤ装着機に供給され、この装着機が吸着ピペッ トによってＳＭＤ部品を第１の面のはんだ付け面に載せる。装着後に、プリント 配線板はリフローはんだステーションに供給され、ここで第１の面に施された部 品が接続面にはんだ付けされる。次いで、プリント配線板は裏返されて接着剤ス テーションに供給される。この接着剤ステーションで、注入針が、プリント配線 板の、上側に位置する第２の面から部品上に位置する開口内に導入され、この注 入針によって接着剤が、プリント配線板の第１の面とＳＭＤ部品の接続面との間 の室内に注入される。このようにして行われる方法においては、接着剤は正確に 調量されるので、部品とプリント配線板との間の室から流れ出すことはない。部 品が、接続面の中央に個別に施された滴状接着剤によってプリント配線板に固く 接着されることによって、サイドエッジに配置されたはんだ付け面の汚れは避け られる。必要であれば、接着剤は接着剤ステーションの後ろの硬化ステーション で硬化される。しかしながらまた、リフローステーションで硬化される接着剤を 使用してもよい。プリント配線板は、新たにはんだペーストステーションに供給 され、上側に向けられた第２のプリント配線板而の接続面上にはんだペーストが プリントされる。次いで、プリント配線板の第２の面 に、装着機によってＳＭＤ部品が装着され、新たにリフローステーションに供給 される。こうして行われる第２のリフローはんだ付け段階中に、第２の面に取付 けられた部品がプリント配線板にはんだ付けされる。この時に、第１の面の接続 面に既にはんだ付けされている部品のはんだが新たに溶融され、この際に、部品 とプリント配線板との間の接着剤滴によって、ＳＭＤ部品がその重さによってプ リント配線板からはがれることは阻止される。第２のリフロー段階の終了後に、 部品が、プリント配線板の両面で接続面とはんだ付けされる。DETAILED DESCRIPTION OF THE INVENTION   Method for reflow soldering a printed wiring board on which SMD components are mounted   The invention relates to a method according to the preamble of claim 1.   Such a method is conventionally known, and SMD parts (SMD parts) are provided on both sides of a printed wiring board. MD = Surface Mounted Device (Surface Mounted Device) It is used in manufacturing printed wiring boards for mounting. E.g. European patent According to Japanese Patent Publication No. 419065, first, on a first surface of a printed wiring board, At the solder paste print station to install SMD parts. A method of printing a soldering surface at a scribed portion is known. Then glue Fix the SMD parts between the soldering points on the printed wiring board And then place it on the soldering surface and the adhesive with a placement machine. Attach SMD parts to be attached. You have to press the parts against the adhesive The mounting of the components, hindered by adhesive, is hindered. Adhesive is hard after installation And the printed wiring board is supplied to the reflow station. The solder applied to the first surface of the printed wiring board is melted by the Is soldered to the printed wiring board. After the first reflow stage, the printed wiring The board is printed with a new solder side, with its second side facing up, Then, the SMD component is mounted. When installation is completed on the second side, the printed wiring board is In addition, it is supplied to a reflow station. During the second reflow soldering phase, Both the solder on the second side and the solder on the lower first side are melted. At this time , The adhesive between the SMD component and the printed wiring board present on the first surface is applied to the first surface. SMD parts that have already been soldered to Prevents peeling from the printed wiring board during melting. This european patent In a method known from WO-A-419065, the adhesive is applied to a first resin. A disadvantage is that it is applied to the printed wiring board before the flow soldering step. Why According to this, the molten solder paste is fixed by the adhesive. Solder that has shrunk under the Because it is extruded from the paste. Such as "settling" It is soldered with SMD parts on a printed wiring board by a known action. May not be electrically connected to the connection surface, or may be insufficiently connected. You.   Thus, according to another method known from the prior art, the adhesive is first applied to the SMD part. First reflow soldering After the application, it is applied between the component and the printed wiring board. According to this method Since the adhesive is applied in the form of a ridge in the region of the side edges of the component, the adhesive is SM The edge of the D component is connected to the surface of the printed wiring board. In this case, the adhesive uses this During application, it reaches over the soldering surface, which contaminates and impures the soldering surface There is a disadvantage that it is done. In the subsequent second reflow soldering step, S The quality of the electrical connection between the MD component and the printed wiring board is deteriorated by the dirt. I'm sullen.   Advantages of the invention   On the other hand, in order to reflow weld a printed wiring board with SMD parts The method according to the invention with the features of claim 1 initially comprises the steps of: And at the same time, on the first side of the printed wiring board provided with the adhesive This has the advantage that dirt can be avoided. This is a simple form where the glue is After the first reflow welding, the second side of the printed wiring board which is still freely accessible From, through the opening provided for this, between the component and the printed wiring board This is achieved by being injected into the intermediate chamber. This allows for , Settling of the SMD parts, and also of the soldering point between the parts and the printed wiring board. The adverse effect of the adhesive on the conductive capacity is also avoided. For the method according to the invention Is a manufacturing machine and process There is no additional cost because there is no need to change the order significantly. Further, the mounting of the SMD component on the first surface of the printed wiring board is prevented by the adhesive. SMD parts can be mounted on the soldering surface without any problems. You.   To optimally meter the adhesive, apply the adhesive over the printed circuit board ( After turning it over), the connection surface of the SMD component is pushed by the injection needle introduced into the opening. It is particularly advantageous to inject directly into the room between the first surface of the lint wiring board and the first surface. is there.   Description of the embodiment   The method according to the invention is, for example, a method in which printed wiring boards are successively placed on a conveyor belt. This can be done on an automated manufacturing line passing through a station. Printed wiring board , A first surface and a second surface opposite to the first surface. SMD components are mounted on one surface. For mounting SMD parts Each opening on the first surface of the printed wiring board specified in And the opening extends from the first surface to a second surface of the printed wiring board. ing. The opening can be configured, for example, as a hole having a diameter of about 1 mm. . The method comprises the steps of providing a connection surface for SMD parts and a print with said openings on both sides. It begins with supplying the wiring board to the solder paste print station. this Solder paste prints A solder paste is applied to the connection surface of the first surface of the printed wiring board. . Next, the printed wiring board is supplied to the SMD mounting machine, and this mounting machine Then, the SMD component is placed on the soldering surface of the first surface. After installation, print The wiring board is supplied to a reflow soldering station, where a part applied to the first surface is applied. The product is soldered to the connection surface. Next, the printed wiring board is turned over and the adhesive Will be supplied to the station. At this glue station, the injection needle is The plate is introduced into the opening located on the part from the second upper surface, Adhesive causes the adhesive to flow between the first surface of the printed wiring board and the connection surface of the SMD component. Is injected into the room. In the method performed in this way, the adhesive is precisely Because it is metered, it does not flow out of the chamber between the component and the printed wiring board. Department The product is firmly attached to the printed wiring board by the drop adhesive individually applied to the center of the connection surface. By being adhered, the soldered surface located on the side edge is prevented from becoming dirty. Can be If necessary, glue is placed in the curing station behind the glue station Cured. However, the adhesive cured at the reflow station May be used. Printed wiring boards are newly supplied to the solder paste station And solder paste is applied on the connection surface of the second printed wiring board facing upward. Printed. Next, the second surface of the printed wiring board , SMD parts are mounted by the mounting machine and newly supplied to the reflow station Is done. During the second reflow soldering step performed in this manner, The soldered parts are soldered to the printed wiring board. At this time, the connection of the first side The solder of the component already soldered to the surface is newly melted, The adhesive drops between the SMD part and the printed wiring board cause the SMD part to Peeling from the lint wiring board is prevented. After the end of the second reflow phase, The component is soldered to the connection surface on both sides of the printed wiring board.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 イェンス ザボトケ ドイツ連邦共和国 Ｄ―31139 ヒルデス ハイム リントホルツ 14 (72)発明者 フランク―ディーター ハウシルト ドイツ連邦共和国 Ｄ―31135 ヒルデス ハイム ヴァッケンシュテッター シュト ラーセ 35 (72)発明者 アンスガー グレーン ドイツ連邦共和国 Ｄ―31199 ディーク ホルツェン シュッツェンシュトラーセ 37 (72)発明者 カローラ バラン ドイツ連邦共和国 Ｄ―31199 ディーク ホルツェン ヴァールハウゼンヴェーク ７────────────────────────────────────────────────── ─── Continuation of front page    (72) Inventor Jens Zabotke             Germany D-31139 Hildes             Heim Lindholtz 14 (72) Inventor Frank-Dieter Hauschild             Federal Republic of Germany D-31135 Hildes             Heim Wackenstetter St             Larce 35 (72) Inventor Ansgar Grain             Federal Republic of Germany D-31199 Deek             Holzen Schutzenstrasse             37 (72) Inventor Corolla Balun             Federal Republic of Germany D-31199 Deek             Holzen-Warhausenweg             7

Claims (1)

【特許請求の範囲】 1. ＳＭＤ部品を装着したプリント配線板をリフローはんだ付けするための方法 であって、ＳＭＤ部品を、プリント配線板の第１の面のはんだ付け面上に載せ、 第１のリフローはんだ付け段階でプリント配線板にはんだ付けし、次いでプリン ト配線板をその第１の面が下になるようにひっくり返し、こうして上に位置する 第２の面のはんだ付け面にＳＭＤ部品を載せ、次いでこのＳＭＤ部品を第２のリ フローはんだ付け段階でプリント配線板にはんだ付けし、この際に第２のリフロ ーはんだ付け段階の前に、第１の面上で、ＳＭＤ部品をプリント配線板の第１の 面に固着させる方法において、 第１のリフローはんだ付け段階後に接着剤を、プリント配線板の第２の面か ら、第１の面にはんだ付けされた部品にその場で設けられてプリント配線板の第 １の面から第２の面に延びるそれぞれ１つの開口を通して、第１の面と部品との 間の室内に注入することを特徴とする、ＳＭＤ部品を装着したプリント配線板を リフローはんだ付けするための方法。 2. プリント配線板をひっくり返した後で、開口内に導入された注入針によって 接着剤を、ＳＭＤ部品の接続面とプリント配線板の第１の面との間の室内に直接 注入する、請求項１記載の方法。[Claims] 1. Method for reflow soldering a printed wiring board with SMD components And placing the SMD component on the soldering surface of the first surface of the printed wiring board, In the first reflow soldering stage, solder the printed wiring board and then The wiring board is turned over so that its first surface is down, and thus it is located on top The SMD component is placed on the soldering surface of the second surface, and the SMD component is then mounted on the second soldering surface. Solder to the printed wiring board at the flow soldering stage, -Before the soldering step, on the first side, the SMD component is placed on the first side of the printed wiring board. In the method of fixing to the surface,     After the first reflow soldering step, apply the adhesive to the second side of the printed wiring board. Et al., Provided on the part soldered to the first surface, on the spot, and The first surface and the component are connected to each other through one opening extending from the first surface to the second surface. A printed wiring board equipped with SMD parts, characterized by being injected into a room between Method for reflow soldering. 2. After the printed wiring board is turned over, the injection needle introduced into the opening The adhesive is applied directly into the room between the connection surface of the SMD component and the first surface of the printed wiring board. 2. The method of claim 1, wherein the injection is performed.
JP10526067A 1996-12-13 1997-09-09 Method for reflow soldering a printed wiring board on which SMD components are mounted Pending JP2000507750A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19651862A DE19651862A1 (en) 1996-12-13 1996-12-13 Process for reflow soldering of printed circuit boards with SMD components
DE19651862.8 1996-12-13
PCT/DE1997/001997 WO1998026638A1 (en) 1996-12-13 1997-09-09 Process for reflow soldering of circuit boards fitted with smd components

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JP2000507750A true JP2000507750A (en) 2000-06-20

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JP (1) JP2000507750A (en)
KR (1) KR19990082161A (en)
CN (1) CN1209942A (en)
CZ (1) CZ251398A3 (en)
DE (1) DE19651862A1 (en)
TW (1) TW383535B (en)
WO (1) WO1998026638A1 (en)

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US8508711B2 (en) 2008-08-22 2013-08-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

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DE19925961A1 (en) * 1999-05-31 2000-12-21 Siemens Ag Process for curing thermally curable underfill material
CN100455167C (en) * 2005-02-04 2009-01-21 厦门顶尖电子有限公司 Printing-head electromagnet fixing method and device
CN101827501B (en) * 2010-03-31 2012-01-04 伟创力电子科技（上海）有限公司 Through-hole backflow welding technology and relevant template and jig
DE102013002597B3 (en) * 2013-02-14 2014-07-31 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Method for two-sided assembly of a printed circuit board
AT515446B1 (en) * 2014-03-07 2019-12-15 Zkw Group Gmbh Structuring the solder mask of printed circuit boards to improve the soldering results
DE102018110752A1 (en) * 2018-05-04 2019-11-07 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Method for producing a connection contact

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US4573105A (en) * 1983-02-16 1986-02-25 Rca Corporation Printed circuit board assembly and method for the manufacture thereof
FR2613898A1 (en) * 1987-04-13 1988-10-14 Siame Electronique Sa Method of soldering surface-mounted components (SMC) on a printed circuit
DE3843984A1 (en) * 1988-12-27 1990-07-05 Asea Brown Boveri METHOD FOR SOLDERING A WIRELESS COMPONENT, AND CIRCUIT BOARD WITH SOLDERED, WIRELESS COMPONENT

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8508711B2 (en) 2008-08-22 2013-08-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

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WO1998026638A1 (en) 1998-06-18
EP0903061A1 (en) 1999-03-24
TW383535B (en) 2000-03-01
CN1209942A (en) 1999-03-03
DE19651862A1 (en) 1998-06-18
CZ251398A3 (en) 1999-02-17
KR19990082161A (en) 1999-11-25

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