JP2000344862A - Flame-retardant resin composition, prepreg using same, and laminate - Google Patents
Flame-retardant resin composition, prepreg using same, and laminateInfo
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- JP2000344862A JP2000344862A JP11156623A JP15662399A JP2000344862A JP 2000344862 A JP2000344862 A JP 2000344862A JP 11156623 A JP11156623 A JP 11156623A JP 15662399 A JP15662399 A JP 15662399A JP 2000344862 A JP2000344862 A JP 2000344862A
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- flame
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ハロゲン系難燃剤
を使用しなくても優れた難燃性を有する樹脂組成物、プ
リプレグ、及び積層板に関するものである。TECHNICAL FIELD The present invention relates to a resin composition, a prepreg, and a laminate having excellent flame retardancy without using a halogen-based flame retardant.
【０００２】エポキシ樹脂等に代表される熱硬化性樹脂
はその優れた特性から電気及び電子機器部品等に広く使
用されており、火災に対する安全性を確保するため難燃
性が付与されている場合が多い。これらの樹脂の難燃化
は従来臭素化エポキシ樹脂等のハロゲン含有化合物を用
いることが一般的であった。これらのハロゲン含有化合
物は高度な難燃性を有するが、芳香族臭素化合物は熱分
解で腐食性の臭素、臭化水素を分離するだけでなく、酸
素存在下で分解した場合に毒性の高いポリブロムジベン
ゾフラン、及びポリジブロモベンゾオキシンを形成する
可能性がある。また、臭素を含有する老朽廃材の処分は
極めて困難である。このような理由から臭素含有難燃剤
に代わる難燃剤としてリン化合物が検討されている。[0002] Thermosetting resins represented by epoxy resins are widely used for electric and electronic equipment parts due to their excellent characteristics, and are provided with flame retardancy to ensure fire safety. There are many. Conventionally, these resins have generally used a halogen-containing compound such as a brominated epoxy resin. Although these halogen-containing compounds have high flame retardancy, aromatic bromine compounds not only separate corrosive bromine and hydrogen bromide by thermal decomposition, but also have high toxicity when decomposed in the presence of oxygen. May form bromodibenzofuran and polydibromobenzooxin. Further, disposal of aging waste material containing bromine is extremely difficult. For these reasons, phosphorus compounds have been studied as flame retardants in place of bromine-containing flame retardants.
【０００３】前述のように、リン化合物によって難燃化
を実現できる。その機構は、リン化合物の分解及び熱縮
合によってポリリン酸が生成し、そのポリリン酸がエポ
キシ樹脂の表面に被膜を生成し、断熱効果、酸素遮断効
果を生じ、その結果、燃焼を防ぐというものである。[0003] As described above, flame retardancy can be realized by a phosphorus compound. The mechanism is that polyphosphoric acid is generated by the decomposition and thermal condensation of the phosphorus compound, and the polyphosphoric acid forms a film on the surface of the epoxy resin, resulting in a heat insulating effect and an oxygen blocking effect, thereby preventing combustion. is there.
【０００４】しかしながらリン化合物は吸水しやすい欠
点があり、難燃化を発現させるために熱硬化性樹脂に多
量に添加すると、樹脂の特性を著しく悪化させる欠点が
あった。[0004] However, the phosphorus compound has a drawback that it easily absorbs water, and when added in a large amount to a thermosetting resin for exhibiting flame retardancy, there is a drawback that the properties of the resin are remarkably deteriorated.
【０００５】[0005]
【発明が解決しようとする課題】本発明は、このような
問題を解決すべく検討結果なされたものであり、ビフェ
ニル変性ノボラックエポキシ樹脂、と硬化剤としてフェ
ノールアラルキル樹脂、ナフタレンアラルキル樹脂。、
又はトルエン，キシレン又はメシチレンで変性したノボ
ラック樹脂を用い、さらにリン含有化合物を併用するこ
とによって、ハロゲンを使用せず、かつリン含有化合物
の配合量が少量でも十分な難燃性を発現させることを目
的とするもので、高度な難燃性を有する樹脂組成物、プ
リプレグ及びプリプレグから得られた積層板を提供する
ものである。DISCLOSURE OF THE INVENTION The present invention has been made in order to solve such a problem, and has been made by a biphenyl-modified novolak epoxy resin, and a phenol aralkyl resin and a naphthalene aralkyl resin as curing agents. ,
Alternatively, by using a novolak resin modified with toluene, xylene or mesitylene and further using a phosphorus-containing compound in combination, it is possible to achieve sufficient flame retardancy without using halogen and using a small amount of the phosphorus-containing compound. An object of the present invention is to provide a resin composition having high flame retardancy, a prepreg, and a laminate obtained from the prepreg.
【０００６】[0006]
【課題を解決するための手段】本発明は、（Ａ）下記一
般式（１）で表されるビフェニル変性ノボラックエポキ
シ樹脂、The present invention provides (A) a biphenyl-modified novolak epoxy resin represented by the following general formula (1):
【化１】 （Ｂ）下記一般式（２）で表されるフェノールアラルキ
ル樹脂、下記一般式（３）で表されるナフタレンアラル
キル樹脂、又は下記一般式（４）で表されるトルエン，
キシレン又はメシチレンで変性したノボラック樹脂から
なる硬化剤、Embedded image (B) a phenol aralkyl resin represented by the following general formula (2), a naphthalene aralkyl resin represented by the following general formula (3), or toluene represented by the following general formula (4):
A curing agent comprising a novolak resin modified with xylene or mesitylene,
【化２】 及び（Ｃ）分子内にハロゲン分子を含まないリン含有化
合物を必須成分としてなることを特徴とする難燃性樹脂
組成物である。そして、本発明は、前記難燃性樹脂組成
物を基材に含浸させてなることを特徴とするプリプレグ
であり、さらに前記プリプレグを１枚以上重ね合わせ加
熱加圧してなることを特徴とする難燃性積層板又は金属
箔張積層板である。Embedded image And (C) a flame-retardant resin composition comprising, as an essential component, a phosphorus-containing compound containing no halogen molecule in the molecule. The present invention provides a prepreg obtained by impregnating a base material with the flame-retardant resin composition, and further comprising heating and pressing one or more of the prepregs. It is a flammable laminate or a metal foil-clad laminate.
【０００７】前述のように、エポキシ樹脂は燃焼しやす
い樹脂であり、難燃化のためにリン含有化合物を使用す
ると、リン含有化合物を多量に配合しなければ十分な難
燃性は得られない。しかし、リン含有化合物を多量に配
合しリン含有量を上げると吸湿しやすくなるため吸湿半
田耐熱性が低下するという欠点がある。またリン含有化
合物は耐熱性を低下させる欠点がある。[0007] As described above, epoxy resins are easily combustible resins. When a phosphorus-containing compound is used for flame retardancy, sufficient flame retardancy cannot be obtained unless a large amount of the phosphorus-containing compound is blended. . However, when the phosphorus content is increased by blending a large amount of the phosphorus-containing compound, it becomes easy to absorb moisture, so that there is a disadvantage that the heat resistance to moisture absorption solder decreases. Further, the phosphorus-containing compound has a disadvantage of lowering heat resistance.
【０００８】リン含有量を減少させ、かつ十分な難燃性
を得るためには、エポキシ樹脂が燃焼しにくい構造をも
つ必要がある。エポキシ樹脂で燃焼しやすい部位はグリ
シジル基が開環した構造部位であり、燃焼しにくい部位
はベンゼン環部分である。またアルキル基は燃焼しやす
い構造部位である。In order to reduce the phosphorus content and obtain sufficient flame retardancy, it is necessary to have a structure in which the epoxy resin does not easily burn. The part which is easily burned by the epoxy resin is a structural part in which a glycidyl group is opened, and the part which is hardly burned is a benzene ring part. In addition, the alkyl group is a structural portion that is easily combustible.
【０００９】一般式（１）で表されるビフェニル変性ノ
ボラックエポキシ樹脂はエポキシ当量が大きく、硬化物
中にグリシジル基開環部分が少なく、ベンゼン環含有率
が高いため燃焼しにくいという特徴をもつ。そこでリン
含有量が少量でも十分な耐燃性が得られる。またビフェ
ニル基は極めて疎水性が強く、吸水しにくいという特長
をもつ。また一般的にエポキシ当量の大きいエポキシ樹
脂は架橋密度が低下するため耐熱性が低下するが、ビフ
ェニル基は回転が阻害されるため極めて剛直な構造であ
り、耐熱性が低下しない。すなわち十分な耐熱性と耐湿
性が得られる。The biphenyl-modified novolak epoxy resin represented by the general formula (1) is characterized in that it has a large epoxy equivalent, a small number of glycidyl group-opening portions in the cured product, and a high benzene ring content, so that it is difficult to burn. Therefore, even if the phosphorus content is small, sufficient flame resistance can be obtained. Further, the biphenyl group has an extremely strong hydrophobic property and is hard to absorb water. In general, an epoxy resin having a large epoxy equivalent has a reduced crosslink density and thus reduced heat resistance. However, the biphenyl group has a very rigid structure because rotation is inhibited and the heat resistance does not decrease. That is, sufficient heat resistance and moisture resistance can be obtained.
【００１０】一般式（２）で表されるフェノールアラル
キル樹脂、一般式（３）で表されるナフタレンアラルキ
ル樹脂、又は一般式（４）で表されるトルエン，キシレ
ン又はメシチレンで変性したノボラック樹脂は、水酸基
当量が大きいため、エポキシ樹脂の硬化剤として使用し
たとき、硬化物中にグリシジル基開環部分が少なく、ベ
ンゼン環含有率が高いため燃焼しにくいという特長をも
つ。そこで、リン含有量が少量でも十分な耐燃性が得ら
れる。本発明においてはビフェニル変性ノボラックエポ
キシ樹脂と、フェノールアラルキル樹脂、ナフタレンア
ラルキル樹脂又はトルエン，キシレン又はメシチレンで
変性したノボラック樹脂と、リン含有化合物を併用する
ことによってハロゲンを使用しないで難燃性を発現さ
せ、かつリン含有化合物が少量でも十分な難燃性を発現
させることを技術骨子とするものである。A phenol aralkyl resin represented by the general formula (2), a naphthalene aralkyl resin represented by the general formula (3), or a novolak resin modified with toluene, xylene or mesitylene represented by the general formula (4) In addition, when used as a curing agent for an epoxy resin, the cured product has a small number of ring-opening glycidyl groups when used as a curing agent for an epoxy resin. Thus, sufficient flame resistance can be obtained even with a small phosphorus content. In the present invention, a biphenyl-modified novolak epoxy resin, a phenol aralkyl resin, a naphthalene aralkyl resin or a novolak resin modified with toluene, xylene or mesitylene, and a phosphorus-containing compound are used in combination to develop flame retardancy without using halogen. The main point of the technology is to exhibit sufficient flame retardancy even with a small amount of a phosphorus-containing compound.
【００１１】本発明で用いる（Ｂ）成分はフェノールア
ラルキル樹脂、ナフタレンアラルキル樹脂又はトルエ
ン，キシレン又はメシチレンで変性したノボラック樹脂
であるが、水酸基当量が１２０以下では、硬化物中のグ
リシジル基開環部分が多くなり、難燃性が向上しないた
め好ましくない。また水酸基当量が２５０以上では、耐
熱性が低下し好ましくない。The component (B) used in the present invention is a phenol aralkyl resin, a naphthalene aralkyl resin or a novolak resin modified with toluene, xylene or mesitylene. And the flame retardancy is not improved. If the hydroxyl equivalent is 250 or more, heat resistance is undesirably reduced.
【００１２】本発明で用いる（Ｃ）成分のリン含有化合
物としては、トリメチルホスフェート、トリエチルホス
フェート、トリブチルホスフェート、トリ−２−エチル
ヘキシルホスフェート、トリブトキシエチルホスフェー
ト、トリフェニルホスフェート、トリクレジルホスフェ
ート、トリキシレニルホスフェート、クレジルジフェニ
ルホスフェート、キシレニルジフェニルホスフェート、
２−エチルヘキシルジフェニルホスフェート、トリス
（２、６−ジメチルフェニル）ホスフェート、レゾルシ
ンジフェニルホスフェート等のリン酸エステル、ジアル
キルヒドロキシメチルホスホネート等の縮合リン酸エス
テル等が例示されるが、特にこれらに限定されるもので
はない。エポキシ樹脂の優れた特性を損なわないために
は、エポキシ樹脂と反応するものが望ましく、特に、
９，１０−ジヒドロ−９−オキサ−１０−ホスファフェ
ナントレン−１０−オキシドが望ましい。The phosphorus-containing compound (C) used in the present invention includes trimethyl phosphate, triethyl phosphate, tributyl phosphate, tri-2-ethylhexyl phosphate, tributoxyethyl phosphate, triphenyl phosphate, tricresyl phosphate, and trixyl phosphate. Nyl phosphate, cresyl diphenyl phosphate, xylenyl diphenyl phosphate,
Phosphoric acid esters such as 2-ethylhexyldiphenyl phosphate, tris (2,6-dimethylphenyl) phosphate and resorcinol diphenyl phosphate, and condensed phosphoric acid esters such as dialkylhydroxymethylphosphonate are exemplified, but are not particularly limited thereto. is not. In order not to impair the excellent properties of the epoxy resin, those that react with the epoxy resin are desirable, especially,
9,10-Dihydro-9-oxa-10-phosphaphenanthrene-10-oxide is preferred.
【００１３】本発明の難燃性樹脂組成物は、ビフェニル
変性ノボラックエポキシ樹脂と、フェノールアラルキル
樹脂、ナフタレンアラルキル樹脂又はトルエン，キシレ
ン又はメシチレンで変性したノボラック樹脂からなる硬
化剤と、分子内にハロゲン分子を含まないリン含有化合
物を必須成分とするが、本発明の目的に反しない範囲に
おいて、その他の硬化剤、硬化促進剤、カップリング
剤、その他の成分を添加することは差し支えない。The flame-retardant resin composition of the present invention comprises a biphenyl-modified novolak epoxy resin, a curing agent comprising a phenol aralkyl resin, a naphthalene aralkyl resin or a novolak resin modified with toluene, xylene or mesitylene, and a halogen molecule in the molecule. Is an essential component, but other curing agents, curing accelerators, coupling agents, and other components may be added without departing from the object of the present invention.
【００１４】本発明の難燃性樹脂組成物は種々の形態で
利用されるが、基材に含浸する際には通常溶剤が使用さ
れる。用いられる溶剤は組成の一部に対して良好な溶解
性を示すことが必要であるが、悪影響を及ぼさない範囲
で貧溶媒を使用しても構わない。Although the flame-retardant resin composition of the present invention is used in various forms, a solvent is usually used when impregnating the substrate. The solvent used must have good solubility for a part of the composition, but a poor solvent may be used as long as it does not adversely affect the composition.
【００１５】本発明の難燃性樹脂組成物を溶剤に溶解し
て得られるワニスはガラスクロス、ガラス不織布、ある
いはガラス以外を成分とする布等の基材に塗布、含浸さ
せ、８０〜２００℃で乾燥させることによりプリント配
線板用プリプレグを得ることが出来る。プリプレグは加
熱加圧してプリント配線板を製造することに用いられる
が、本発明の難燃性樹脂組成物はハロゲン化合物を添加
することなく高度な難燃性を有する熱硬化性樹脂組成物
であり、積層板等に好適に使用されるものである。The varnish obtained by dissolving the flame-retardant resin composition of the present invention in a solvent is coated and impregnated on a substrate such as glass cloth, glass non-woven fabric, or a cloth containing a component other than glass, and is subjected to 80 to 200 ° C. Thus, a prepreg for a printed wiring board can be obtained. The prepreg is used for manufacturing a printed wiring board by heating and pressing, and the flame-retardant resin composition of the present invention is a thermosetting resin composition having a high flame retardancy without adding a halogen compound. And a laminate plate.
【００１６】[0016]
【実施例】以下、本発明について実施例及び比較例によ
り具体的に説明する。ここで、「部」及び「％」は「重
量部」及び「重量％」を示す。The present invention will be specifically described below with reference to examples and comparative examples. Here, “parts” and “%” indicate “parts by weight” and “% by weight”.
【００１７】（実施例１）ビフェニル変性フェノールノ
ボラックエポキシ樹脂（日本化薬社製エピクロンＮＣ−
３０００Ｐ）を１００．０重量部、フェノールアラルキ
ル樹脂（三井化学社製ミレックスＸＬＣ−ＬＬ）を６
３．６重量部、９，１０−ジヒドロ−９−オキサ−１０
−ホスファフェナントレン−１０−オキシド１７．２重
量部にメチルセルソルブを加え、不揮発分濃度６０％と
なるようにワニスを調整した。このときエポキシ樹脂、
硬化剤の合計１００重量部に対し、リン成分が１．４％
となった。Example 1 Biphenyl-modified phenol novolak epoxy resin (Epiclon NC- manufactured by Nippon Kayaku Co., Ltd.)
3000P) and 100.0 parts by weight of phenol aralkyl resin (Mirex XLC-LL, manufactured by Mitsui Chemicals, Inc.).
3.6 parts by weight, 9,10-dihydro-9-oxa-10
Methylcellosolve was added to 17.2 parts by weight of -phosphaphenanthrene-10-oxide, and the varnish was adjusted so that the nonvolatile content concentration became 60%. At this time, epoxy resin,
The phosphorus component is 1.4% based on 100 parts by weight of the curing agent in total.
It became.
【００１８】このワニスを用いて、ガラスクロス（厚さ
０．１８ｍｍ、日東紡績（株）製）１００部にワニス固
形分で８０部含浸させて、１５０℃の乾燥機炉で５分乾
燥させ、樹脂含有量４４．４％のプリプレグを作成し
た。上記プリプレグを６枚を重ね、上下に厚さ３５μｍ
の電解銅箔を重ねて、圧力４０ｋｇｆ／ｃｍ2 、温度１
９０℃で１２０分加熱加圧成形を行い、厚さ１．２ｍｍ
の両面銅張積層板を得た。得られた積層板の難燃性は、
ＵＬ−９４規格に従い垂直方により評価した。半田耐熱
性、ピール強度についてはＪＩＳ Ｃ ６４８１に準じて
測定し、半田耐熱性は煮沸２時間の吸湿処理を行った
後、２６０℃の半田槽に１２０秒浸漬した後の外観の異
常の有無を調べた。配合処方及び結果を表１に示す。Using this varnish, 100 parts of a glass cloth (0.18 mm thick, manufactured by Nitto Boseki Co., Ltd.) is impregnated with 80 parts of a varnish solid and dried in a dryer oven at 150 ° C. for 5 minutes. A prepreg having a resin content of 44.4% was prepared. Six prepregs are stacked, and the thickness is 35 μm
Of electrolytic copper foil, pressure 40 kgf / cm 2 , temperature 1
Heat and pressure molding at 90 ° C for 120 minutes, thickness 1.2mm
Was obtained. The flame retardancy of the obtained laminate is
The evaluation was made vertically according to the UL-94 standard. Solder heat resistance and peel strength were measured in accordance with JIS C 6481. Solder heat resistance was measured for the appearance of abnormalities after immersion in a 260 ° C. solder bath for 120 seconds after performing a moisture absorption treatment for 2 hours after boiling. Examined. Table 1 shows the formulation and results.
【００１９】（実施例２〜４、及び比較例１〜４）表１
（実施例）及び表２（比較例）に示した配合処方によ
り、これ以外は全て実施例１と同様の方法で両面銅張積
層板を作成した。評価結果を併せ表１及び表２に示す。
表１に示す実施例では、いずれもピール強度が強く、か
つ耐燃性に優れていることがわかる。(Examples 2 to 4 and Comparative Examples 1 to 4)
Except for this, the double-sided copper-clad laminate was prepared in the same manner as in Example 1 except for the formulation shown in (Example) and Table 2 (Comparative Example). The evaluation results are shown in Tables 1 and 2.
In the examples shown in Table 1, it can be seen that the peel strength is high and the flame resistance is excellent.
【００２０】[0020]
【表１】 [Table 1]
【００２１】[0021]
【表２】 [Table 2]
【００２２】表１及び表２の注 （１）日本化薬(株)製ＮＣ−３０００Ｐ、エポキシ当量
２７５ （２）三井化学(株)製ミレックスＸＬＣ−ＬＬ、水酸基
当量１７５ （３）新日鐵化学(株)製ＳＮ−１７０、水酸基当量１９
０ （４）住友デュレズ(株)製Ｒ−５４５３７、水酸基当量
１９４ （５）９，１０−ジヒドロ−９−オキサ−１０−ホスフ
ァフェナントレン−１０−オキシド （６）大日本インキ化学工業(株)製エピクロンＮ−７７
０、エポキシ当量１９０ （７）住友デュレズ(株)製ＰＲ−５１４７０、水酸基当
量１０５Notes to Tables 1 and 2 (1) NC-3000P manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 275 (2) Millex XLC-LL manufactured by Mitsui Chemicals, Inc., hydroxyl equivalent 175 (3) Nippon Steel Corporation Chemical Co., Ltd. SN-170, hydroxyl equivalent 19
0 (4) Sumitomo Durez R-54537, hydroxyl equivalent 194 (5) 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (6) Dainippon Ink and Chemicals, Inc. Epicron N-77
0, epoxy equivalent 190 (7) PR-51470, manufactured by Sumitomo Durez Co., Ltd., hydroxyl equivalent 105
【００２３】[0023]
【発明の効果】本発明の難燃性樹脂組成物はハロゲン化
合物を添加することなく高度な難燃性を有し、今後要求
されるノンハロゲン材料として新規な熱硬化性樹脂組成
物を提供するものである。The flame-retardant resin composition of the present invention has a high degree of flame retardancy without adding a halogen compound, and provides a novel thermosetting resin composition as a non-halogen material required in the future. It is.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｃ０８Ｋ 5/49 Ｃ０８Ｋ 5/49 Ｃ０８Ｌ 63/00 Ｃ０８Ｌ 63/00 Ｂ Ｃ Ｆターム(参考） 4F072 AB09 AB28 AD33 AE07 AF16 AG03 AG13 AG19 AH02 AH21 AJ04 AL11 AL12 4F100 AB17B AB33B AG00 AH02A AH02H AH10A AH10H AK02A AK02H AK53A AL05A AL06A BA02 BA03 CA02A CA08A DG12 DH01A EJ82A GB43 JJ07A JL00 4J002 CC05X CC07X CD05W CE00X EW046 EW126 GF00 GQ00 4J036 AF26 FA12 FB06 FB08 HA12 JA05 JA08 KA01 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification code FI Theme coat ゛ (Reference) C08K 5/49 C08K 5/49 C08L 63/00 C08L 63/00 BCF term (Reference) 4F072 AB09 AB28 AD33 AE07 AF16 AG03 AG13 AG19 AH02 AH21 AJ04 AL11 AL12 4F100 AB17B AB33B AG00 AH02A AH02H AH10A AH10H AK02A AK02H AK53A AL05A AL06A BA02 BA03 CA02A CA08A DG12 DH01A EJ82A05 CC04 J07X00 GB43 JJ07A00 KA01
Claims (4)
ェニル変性ノボラックエポキシ樹脂、 【化１】 （Ｂ）下記一般式（２）で表されるフェノールアラルキ
ル樹脂、下記一般式（３）で表されるナフタレンアラル
キル樹脂、又は下記一般式（４）で表されるトルエン，
キシレン又はメシチレンで変性したノボラック樹脂から
なる硬化剤、 【化２】 及び（Ｃ）分子内にハロゲン分子を含まないリン含有化
合物を必須成分としてなることを特徴とする難燃性樹脂
組成物。1. A biphenyl-modified novolak epoxy resin represented by the following general formula (1): (B) a phenol aralkyl resin represented by the following general formula (2), a naphthalene aralkyl resin represented by the following general formula (3), or toluene represented by the following general formula (4):
A curing agent comprising a novolak resin modified with xylene or mesitylene, And (C) a flame-retardant resin composition comprising, as an essential component, a phosphorus-containing compound containing no halogen molecule in the molecule.
−ジヒドロ−９−オキサ−１０−ホスファフェナントレ
ン−１０−オキシドである請求項１又は２記載の難燃性
樹脂組成物。2. The method according to claim 1, wherein the phosphorus-containing compound (C) is 9,10 or less.
The flame-retardant resin composition according to claim 1 or 2, which is -dihydro-9-oxa-10-phosphaphenanthrene-10-oxide.
成物を基材に含浸させてなることを特徴とするプリプレ
グ。3. A prepreg comprising a base material impregnated with the flame-retardant resin composition according to claim 1, 2 or 3.
ね合わせ加熱加圧してなることを特徴とする積層板又は
銅張積層板。4. A laminate or a copper-clad laminate, wherein one or more prepregs according to claim 4 are superposed and heated and pressed.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15662399A JP3877261B2 (en) | 1999-06-03 | 1999-06-03 | Flame retardant resin composition, prepreg and laminate using the same |
| US09/550,014 US6486242B1 (en) | 1999-04-20 | 2000-04-14 | Flame-retardant resin composition and prepreg and laminate using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15662399A JP3877261B2 (en) | 1999-06-03 | 1999-06-03 | Flame retardant resin composition, prepreg and laminate using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000344862A true JP2000344862A (en) | 2000-12-12 |
| JP3877261B2 JP3877261B2 (en) | 2007-02-07 |
Family
ID=15631762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15662399A Expired - Fee Related JP3877261B2 (en) | 1999-04-20 | 1999-06-03 | Flame retardant resin composition, prepreg and laminate using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3877261B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001049080A (en) * | 1999-08-09 | 2001-02-20 | Sumitomo Bakelite Co Ltd | Flame-retardant resin composition, prepreg and laminated board |
| WO2003018675A1 (en) * | 2001-08-31 | 2003-03-06 | Sumitomo Bakelite Company Limited | Resin composition, prepreg, laminated sheet and semiconductor package |
| JP2004067717A (en) * | 2002-08-01 | 2004-03-04 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
| JP2006176595A (en) * | 2004-12-21 | 2006-07-06 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing semiconductor and semiconductor apparatus |
| JP2010001487A (en) * | 2009-08-17 | 2010-01-07 | Japan Epoxy Resin Kk | Production method of epoxy resin |
-
1999
- 1999-06-03 JP JP15662399A patent/JP3877261B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001049080A (en) * | 1999-08-09 | 2001-02-20 | Sumitomo Bakelite Co Ltd | Flame-retardant resin composition, prepreg and laminated board |
| WO2003018675A1 (en) * | 2001-08-31 | 2003-03-06 | Sumitomo Bakelite Company Limited | Resin composition, prepreg, laminated sheet and semiconductor package |
| JP2004067717A (en) * | 2002-08-01 | 2004-03-04 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
| JP2006176595A (en) * | 2004-12-21 | 2006-07-06 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing semiconductor and semiconductor apparatus |
| JP2010001487A (en) * | 2009-08-17 | 2010-01-07 | Japan Epoxy Resin Kk | Production method of epoxy resin |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3877261B2 (en) | 2007-02-07 |
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