JP2000322989A - Photoelectric sensor and its manufacture - Google Patents

Photoelectric sensor and its manufacture

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Publication number
JP2000322989A
JP2000322989A JP13458499A JP13458499A JP2000322989A JP 2000322989 A JP2000322989 A JP 2000322989A JP 13458499 A JP13458499 A JP 13458499A JP 13458499 A JP13458499 A JP 13458499A JP 2000322989 A JP2000322989 A JP 2000322989A
Authority
JP
Japan
Prior art keywords
mid
photoelectric
light
optical
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13458499A
Other languages
Japanese (ja)
Inventor
Motohiro Kita
源弘 喜多
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Priority to JP13458499A priority Critical patent/JP2000322989A/en
Publication of JP2000322989A publication Critical patent/JP2000322989A/en
Pending legal-status Critical Current

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  • Geophysics And Detection Of Objects (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Switches Operated By Changes In Physical Conditions (AREA)

Abstract

PROBLEM TO BE SOLVED: To suppress error between the optical axis of a photoelectric element and the center of the optical axis of an optical lens within tolerance, by providing a case for holding a MID package and the optical lens at a position where the optical axis of the photoelectric element is matched to the optical axis of the optical lens provided at a position facing to the photoelectric element. SOLUTION: A photoelectric function module 40 in a photoelectric sensor 10 rigidly fixes a MID package 44 to an optical lens 45 via a case 20, in a state such that the optical axis of an LED chip 42 and a photo IC 43 in a photoelectric element is matched to the optical axis of the optical lens 45. Especially, the photoelectric function module 40 is inserted into a die required for molding the case 20 in a matching state of the optical axes and is molded with injection, the MID package 44 and the optical lens 45 are inter-joined and fixed at a normal position. The optical axis of the LED chip 42 and the photo IC 43 in the photoelectric element is substantially matched with the optical axis of the optical lens 45, and for example, displacement between the optical axes can be suppressed to about 5/100-9/100 mm in relation to the center of a designed optical axis.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】この発明は、ＦＡにおける物
品の搬送、検査、組み立て工程等で物体の位置決めを行
なうのに好適な光電センサに係り、特に、光電レンズの
光軸と光学素子の光軸の光軸ズレを許容範囲内に抑え、
面倒な光軸調整等の作業を廃止できる光電センサ並びに
その製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photoelectric sensor suitable for positioning an object in a process of transferring, inspecting, assembling an article in an FA, and more particularly to an optical axis of a photoelectric lens and an optical axis of an optical element. Optical axis deviation within an acceptable range,
The present invention relates to a photoelectric sensor and a method of manufacturing the photoelectric sensor, which can eliminate troublesome operations such as optical axis adjustment.

【０００２】[0002]

【従来の技術】通常、ＦＡの搬送工程等では、コンベア
により搬送される物体の位置決めを行なうために、光電
センサが使用されることが多く、この光電センサとして
は、反射型と透過型とがある。2. Description of the Related Art Usually, in the FA transporting process or the like, a photoelectric sensor is often used to position an object to be transported by a conveyor, and the photoelectric sensor is classified into a reflection type and a transmission type. is there.

【０００３】従来の反射型の光電センサとしては、図８
に示す構成のものが従来から知られている。この光電セ
ンサ１は、ケース２内部に複数の配線パターンを印刷し
たプリント配線基板３が収容されており、このプリント
配線基板３には受光素子４並びに投光素子５が実装さ
れ、かつ受光素子４に対する外部からの電磁ノイズの悪
影響を排除するためにシールド機能をもつ金属カバー６
が受光素子４、投光素子５を覆うように取り付けられて
いる。また、ケース２には投光素子５からの光信号を受
光素子４が受け取るために光学レンズ７が取り付けられ
ているとともに、受光素子の受光視野を制御するアパー
チャ８が金属カバー６に設けられている。FIG. 8 shows a conventional reflection type photoelectric sensor.
The configuration shown in FIG. The photoelectric sensor 1 has a case 2 in which a printed wiring board 3 on which a plurality of wiring patterns are printed is housed, and a light receiving element 4 and a light projecting element 5 are mounted on the printed wiring board 3. Metal cover 6 with a shielding function to eliminate the adverse effects of external electromagnetic noise on
Are mounted so as to cover the light receiving element 4 and the light projecting element 5. An optical lens 7 is attached to the case 2 so that the light receiving element 4 receives an optical signal from the light projecting element 5, and an aperture 8 for controlling a light receiving field of the light receiving element is provided on the metal cover 6. I have.

【０００４】同様に、図９に示すように、透過型の光電
センサ１について、投光部１ａ、受光部１ｂの構成を説
明すると、投光部１ａは、プリント配線基板３ａにＬＥ
Ｄチップ等の投光素子５を半田付け等により実装したも
のを投光用レンズ７ａを組み込んだケース２ａに固定し
て構成されており、同様に受光部１ｂについても、プリ
ント配線基板３ｂにフォトＩＣ等の受光素子４をＣＯＢ
実装したものを受光レンズ７ｂを組み込んだケース２ｂ
により固定して構成されている。[0004] Similarly, as shown in FIG. 9, the configuration of the light transmitting section 1a and the light receiving section 1b of the transmission type photoelectric sensor 1 will be described.
A light emitting element 5 such as a D chip is mounted on a case 2a incorporating a light emitting lens 7a by soldering or the like, and the light receiving portion 1b is similarly mounted on a printed wiring board 3b by a photo COB light receiving element 4 such as IC
Case 2b incorporating light receiving lens 7b with mounting
Is fixed.

【０００５】このように、従来の反射型光電センサ、透
過型光電センサは、基本的にプリント配線基板３（３
ａ、３ｂ）にＬＥＤチップ等の投光素子５を半田付け、
フォトＩＣ等の受光素子４をＣＯＢにより実装した後、
光学レンズ７（７ａ、７ｂ）を組み込んだケース２（２
ａ、２ｂ）により、光電素子４、５と光学レンズ７が対
応する位置にくるように固定されている。[0005] As described above, the conventional reflection-type photoelectric sensor and transmission-type photoelectric sensor basically include the printed wiring board 3 (3).
a, 3b) soldering a light emitting element 5 such as an LED chip,
After mounting the light receiving element 4 such as a photo IC by COB,
Case 2 (2) incorporating the optical lens 7 (7a, 7b)
a, 2b), the photoelectric elements 4, 5 and the optical lens 7 are fixed so as to be at corresponding positions.

【０００６】[0006]

【発明が解決しようとする課題】ところで、光電センサ
の検知効率を高め、また、遠くの小物対象物を検知する
場合などでは、投光・受光素子の光軸と光学レンズの光
軸が限りなく合致することが望ましく、光学レンズ光軸
中心と投光・受光素子光軸の誤差は１／１０ｍｍ以下が
許容範囲とされていた。By the way, in the case where the detection efficiency of the photoelectric sensor is increased, and when a small small object is detected, the optical axis of the light projecting / receiving element and the optical axis of the optical lens are infinite. It is desirable that they coincide with each other, and an error between the center of the optical axis of the optical lens and the optical axis of the light projecting / receiving element is 1/10 mm or less.

【０００７】しかしながら、上述した通り、投光・受光
素子を実装するプリント配線基板は、加工精度が悪く、
かつ回路のパターン精度にバラツキが生じやすいため、
投光・受光素子の実装位置での位置精度を管理するのが
難しく、かつ投光・受光素子をプリント配線基板に半田
付け或いはＣＯＢ実装する加熱溶融過程でセルフ・アラ
イメント作用で所定位置からずれた位置で固定される傾
向にある。However, as described above, the printed wiring board on which the light emitting / receiving elements are mounted has poor processing accuracy,
And because the pattern accuracy of the circuit tends to vary,
It is difficult to control the position accuracy of the light emitting / receiving element at the mounting position, and the light emitting / receiving element is shifted from a predetermined position by a self-alignment action in a heating and melting process of soldering or COB mounting the light emitting / receiving element to a printed wiring board. Tends to be fixed in position.

【０００８】このように、投光・受光素子を一旦平面で
何等規制のないプリント配線基板上にセルフアライメン
ト誤差を内在した実装を施し、かつ基板の加工精度やパ
ターン精度における誤差を含むプリント配線基板を光学
レンズを取り付けたケースに若干の隙間をもって組み付
けて構成されるため、「光軸ずれ」が生じる原因となっ
ている。As described above, the light emitting / receiving element is mounted on the printed wiring board once on a plane without any restrictions, and the printed wiring board includes an error in the processing accuracy and pattern accuracy of the substrate. Is assembled with a slight gap to the case to which the optical lens is attached, which causes "optical axis deviation".

【０００９】従って、実際の光電センサの使用に際して
は、アタッチメントやチェッカー等を使用して入念な光
軸合わせを行なう必要があり、上述した光学レンズ光軸
中心と投光・受光素子の光軸との誤差を１／１０ｍｍ以
下に抑えるために必要であった。Therefore, in actual use of the photoelectric sensor, it is necessary to perform careful optical axis alignment using an attachment, a checker, etc., and the optical axis center of the optical lens and the optical axis of the light projecting / receiving element are required. Was required to keep the error of 1/10 mm or less.

【００１０】この発明は、このような問題点を解決する
ためになされたもので、三次元射出成形回路部品（Ｍｏ
ｌｄｉｎｇ Ｉｎｔｅｒｃｏｎｎｅｃｔ Ｄｅｖｉｃｅ
（以下ＭＩＤという））に受光素子を実装してなるＭＩ
Ｄパッケージを使用することにより、光電素子と光学レ
ンズとの光軸の整合性を確保した光電センサ並びにその
製造方法を提供することを目的としている。The present invention has been made to solve such a problem, and has been made in consideration of the above circumstances.
lding Interconnect Device
(Hereinafter referred to as MID)) with a light receiving element mounted thereon.
An object of the present invention is to provide a photoelectric sensor and a method of manufacturing the photoelectric sensor, which ensure the alignment of the optical axis between the photoelectric element and the optical lens by using the D package.

【００１１】[0011]

【課題を解決するための手段】上記目的を達成するため
に、本願の請求項１に記載の発明は、ＭＩＤに光電素子
を実装してなるＭＩＤパッケージと、上記光電素子と対
向する位置に設けられる光学レンズと、光電素子の光軸
と光学レンズの光軸とを整合させた位置でＭＩＤパッケ
ージと光学レンズとを保持するケースと、ケース内に収
容され、ＭＩＤパッケージの導通部分と導通する回路部
分を有するプリント配線基板とからなることを特徴とす
る。According to a first aspect of the present invention, there is provided an MID package comprising a photoelectric element mounted on a MID and a MID package provided at a position facing the photoelectric element. Optical lens, a case for holding the MID package and the optical lens at a position where the optical axis of the photoelectric element and the optical axis of the optical lens are aligned, and a circuit housed in the case and conducting to the conductive portion of the MID package And a printed wiring board having a portion.

【００１２】従って、請求項１に記載の発明によれば、
光電素子は、従来のプリント配線基板に実装されるので
はなく、ＭＩＤに実装され、光電素子を実装したＭＩＤ
パッケージと光学レンズが正規位置に対峙した状態でケ
ースにより両者が一体化されるという構成であるため、
プリント配線基板の加工精度やパターン精度のバラツキ
に影響されることなく、光電素子の光軸と光学レンズの
光軸中心との誤差を許容範囲内に抑えることが可能とな
る。Therefore, according to the first aspect of the present invention,
The photoelectric element is not mounted on a conventional printed wiring board, but is mounted on the MID, and the MID on which the photoelectric element is mounted is mounted.
Since the package and the optical lens are integrated by the case with the optical lens facing the normal position,
An error between the optical axis of the photoelectric element and the optical axis center of the optical lens can be suppressed to an allowable range without being affected by variations in processing accuracy or pattern accuracy of the printed wiring board.

【００１３】請求項２に記載の発明は、投光素子と受光
素子が異なるＭＩＤパッケージにそれぞれ実装され、投
光素子及び受光素子がそれぞれ対応する投光用レンズ、
受光用レンズとの光軸を整合させた状態で投光用ＭＩＤ
パッケージが対応する光学レンズと投光ケース、受光ケ
ースにより保持されることを特徴とする。According to a second aspect of the present invention, there is provided a light projecting lens in which the light projecting element and the light receiving element are respectively mounted on different MID packages, and the light projecting element and the light receiving element correspond to each other.
Light emitting MID with the optical axis aligned with the light receiving lens
The package is held by a corresponding optical lens, a light projecting case, and a light receiving case.

【００１４】従って、請求項２に記載の発明によれば、
ＬＥＤチップ等の投光素子を実装した投光用ＭＩＤパッ
ケージと投光用レンズとを正規位置に対峙させた状態で
ケースにより一体化し、投光部ユニットを形成するとと
もに、フォトＩＣ等の受光素子を実装した受光用ＭＩＤ
パッケージと受光用レンズとを正規位置に対峙させた状
態でケースにより一体化して、受光部ユニットを形成す
るというものであるため、透過型光電センサにおける光
軸ズレを最小限に抑えることができる。Therefore, according to the second aspect of the present invention,
A light-emitting MID package on which a light-emitting element such as an LED chip is mounted and a light-emitting lens are integrated by a case in a state where they face each other at a regular position to form a light-emitting unit and a light-receiving element such as a photo IC. Light receiving MID equipped with
Since the light receiving unit is formed by integrating the package and the light receiving lens with the case in a state where the package and the light receiving lens face each other, the optical axis deviation in the transmission type photoelectric sensor can be minimized.

【００１５】請求項３に記載の発明は、ＭＩＤに投光素
子と受光素子が実装されて、ＭＩＤパッケージが形成さ
れ、投光・受光素子に対向する光学レンズの光軸と整合
させてケースに保持されることを特徴とする。According to a third aspect of the present invention, a light emitting element and a light receiving element are mounted on the MID to form an MID package, and the MID package is aligned with the optical axis of an optical lens facing the light emitting / receiving element. It is characterized by being retained.

【００１６】従って、請求項３に記載の発明によれば、
ＭＩＤにＬＥＤチップ等の投光素子とフォトＩＣ等の受
光素子とを実装したＭＩＤパッケージを形成する一方、
ＭＩＤパッケージと光学レンズとを対峙させた状態で双
方の光軸を一致させてケースにより一体化するという構
成であるため。反射型光電センサにおける光軸ズレを最
小限に抑えることができる。Therefore, according to the third aspect of the present invention,
While forming an MID package in which a light emitting element such as an LED chip and a light receiving element such as a photo IC are mounted on the MID,
This is because the MID package and the optical lens are opposed to each other and the optical axes of both are matched to be integrated by the case. Optical axis deviation in the reflection type photoelectric sensor can be minimized.

【００１７】請求項４に記載の発明は、ＭＩＤパッケー
ジの裏面には、ＬＥＤ駆動回路、あるいは光学信号等の
処理回路が実装されていることを特徴とする。According to a fourth aspect of the present invention, an LED driving circuit or a processing circuit for processing an optical signal or the like is mounted on the back surface of the MID package.

【００１８】従って、請求項４に記載の発明によれば、
ＬＥＤ駆動回路や受光信号処理回路等をＭＩＤ裏面に実
装すれば、光電センサの小型化が可能となる。Therefore, according to the invention described in claim 4,
If an LED drive circuit, a light reception signal processing circuit, and the like are mounted on the back surface of the MID, the size of the photoelectric sensor can be reduced.

【００１９】請求項５に記載の発明は、光電素子を実装
するＭＩＤの実装面には、光電素子の寸法に応じた凹面
が形成され、凹面部で光電素子が位置決め実装されるこ
とを特徴とする。The invention according to claim 5 is characterized in that a concave surface corresponding to the dimensions of the photoelectric element is formed on the mounting surface of the MID on which the photoelectric element is mounted, and the photoelectric element is positioned and mounted at the concave portion. I do.

【００２０】従って、請求項５に記載の発明によれば、
ＭＩＤの光電素子を実装する箇所に光電素子を収容でき
る寸法の凹面が形成されているため、光電素子をＭＩＤ
に半田付けあるいはＣＯＢ実装する際に、セルフアライ
メントにより移動することがなく、ＭＩＤに光電素子を
正確に位置決めできることから、光軸ズレをより有効に
防止できる。Therefore, according to the fifth aspect of the present invention,
Since a concave surface large enough to accommodate the photoelectric element is formed at the location where the MID photoelectric element is mounted, the photoelectric element
When soldering or COB mounting on a semiconductor device, since the photoelectric element can be accurately positioned on the MID without moving due to self-alignment, optical axis deviation can be more effectively prevented.

【００２１】請求項６に記載の発明は、ＭＩＤに光電素
子を実装してなるＭＩＤパッケージと光学レンズとを両
者の光軸を整合させて、ケースを成形する射出成形金型
内にインサートし、ＭＩＤパッケージと光学レンズとか
らなる光電機能モジュールをケースと複合接合成形する
ことを特徴とする。According to a sixth aspect of the present invention, an MID package having a photoelectric element mounted on an MID and an optical lens are inserted into an injection molding die for molding a case by aligning the optical axes of both. It is characterized in that the photoelectric function module including the MID package and the optical lens is composite-joined to the case.

【００２２】従って、請求項６に記載の発明によれば、
ＭＩＤの所定箇所に光電素子を半田付けあるいはＣＯＢ
実装により実装してＭＩＤパッケージを作製した後、光
電素子と光軸が一致するように光学レンズをＭＩＤパッ
ケージに接合した状態で射出成形金型にセットし、射出
成形によりケースを成形する際、ＭＩＤパッケージと光
学レンズとからなる光電機能モジュールを複合接合成形
するというものであるから、インサートインジェクショ
ン工法を使用して、光軸調整作業の不要な検知性能に優
れた光電センサを簡単に製作できる。Therefore, according to the invention described in claim 6,
Solder or COB the photoelectric element to the specified part of the MID
After the MID package is manufactured by mounting, the optical lens is set in an injection molding die in a state where the optical lens is joined to the MID package so that the optical axis coincides with the optical axis. Since the photoelectric function module including the package and the optical lens is formed by composite bonding, a photoelectric sensor excellent in detection performance that does not require an optical axis adjustment operation can be easily manufactured by using the insert injection method.

【００２３】本願の請求項７に記載の発明は、ＭＩＤの
光電素子の実装部位に設けられた凹面部で導電性ペース
トを充填して、ダイボンダーにて光電素子を位置決め実
装することを特徴とする。The invention according to claim 7 of the present application is characterized in that a conductive paste is filled in a concave portion provided at a mounting portion of a MID photoelectric element, and the photoelectric element is positioned and mounted by a die bonder. .

【００２４】従って、請求項７に記載の発明によれば、
ＭＩＤの光電素子実装面に設けた凹面部で導電性ペース
トを供給した上にダイボンダーにより光電素子を位置決
め実装するというものであるから、導電ペーストを硬化
反応させて固化する際、ペーストの特殊成分が液状化し
ても、素子がセルフアライメントにより浮き上がって移
動することが凹面部の内壁がストッパーとして機能する
ため、前後左右方向の位置ズレが規制でき、正規位置に
光電素子を精度良く装着できる。Therefore, according to the seventh aspect of the present invention,
Since the conductive element is positioned and mounted by a die bonder after supplying the conductive paste at the concave portion provided on the photoelectric element mounting surface of the MID, when the conductive paste is cured by a curing reaction, the special component of the paste is Even when the element is liquefied, the element is lifted and moved by self-alignment, so that the inner wall of the concave portion functions as a stopper, so that positional deviation in the front-rear and left-right directions can be regulated, and the photoelectric element can be accurately mounted at a proper position.

【００２５】[0025]

【発明の実施の形態】以下、本発明に係る光電センサ並
びにその製造方法の実施形態について、添付図面を参照
しながら詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a photoelectric sensor according to the present invention and a method for manufacturing the same will be described in detail with reference to the accompanying drawings.

【００２６】図１は本発明に係る反射型の光電センサの
全体構成を示す断面図、図２は図１に示す光電センサに
おける投光・受光部拡大断面図、図３乃至図６は図１に
示す光電センサの製作工程を示す各説明図、図７は本発
明に係る透過型の光電センサの構成を示す説明図であ
る。FIG. 1 is a cross-sectional view showing the entire structure of a reflection type photoelectric sensor according to the present invention, FIG. 2 is an enlarged cross-sectional view of a light projecting / receiving section of the photoelectric sensor shown in FIG. 1, and FIGS. FIG. 7 is an explanatory view showing a configuration of a transmission type photoelectric sensor according to the present invention.

【００２７】図１、図２において、反射型の光電センサ
１０の構成及び図３乃至図６において光電センサ１０の
製造工程について説明する。1 and 2, the configuration of the reflection type photoelectric sensor 10 and the manufacturing process of the photoelectric sensor 10 will be described with reference to FIGS.

【００２８】図１において、反射型の光電センサ１０の
概要を説明すると、光電センサ１０は、ケース２０（表
面側ケース２１、裏面側ケース２２の分割体からなる）
と、このケース２０内に収容されるプリント配線基板３
０と、プリント配線基板３０と電気的に接合する光電機
能モジュール４０とから大略構成されている。Referring to FIG. 1, the outline of the reflection type photoelectric sensor 10 will be described. The photoelectric sensor 10 is composed of a case 20 (divided into a front case 21 and a back case 22).
And the printed wiring board 3 accommodated in the case 20
And a photoelectric function module 40 electrically connected to the printed wiring board 30.

【００２９】更に詳しくは、表面側ケース２１には、光
電センサ１０を所定のラインに取り付けるための取付孔
２３が開設されているとともに、プリント配線基板３０
の表裏面には、図示しない配線パターンが形成され、か
つプリント配線基板３０には、信号処理回路３１等の必
要な電子回路や動作表示用ＬＥＤ３２、外部電源と接続
している接続ケーブル３３及び感度調整用バリスタ３４
が設けられている。また、動作表示用ＬＥＤ３２には動
作表示用ライトガイド３５が裏面側ケース２２の開口を
通して外部に臨むように設置され、感度調整用バリスタ
３４を操作する感度調整摘み３６が外部に臨んで操作可
能に繋がっている。More specifically, a mounting hole 23 for mounting the photoelectric sensor 10 on a predetermined line is formed in the front side case 21 and a printed wiring board 30 is provided.
A wiring pattern (not shown) is formed on the front and back surfaces, and the printed circuit board 30 has necessary electronic circuits such as a signal processing circuit 31, an operation display LED 32, a connection cable 33 connected to an external power supply, and a sensitivity. Adjustment varistor 34
Is provided. An operation display light guide 35 is installed on the operation display LED 32 so as to face the outside through the opening of the back side case 22, and a sensitivity adjustment knob 36 for operating the sensitivity adjustment varistor 34 faces the outside and can be operated. It is connected.

【００３０】次に、光電機能モジュール４０は、ＭＩＤ
４１に投光素子であるＬＥＤチップ４２と受光素子であ
るフォトＩＣ４３とを実装してなるＭＩＤパッケージ４
４と光学レンズ４５とから構成される。Next, the photoelectric function module 40 is
MID package 4 in which LED chip 42 as a light emitting element and photo IC 43 as a light receiving element are mounted on 41
4 and an optical lens 45.

【００３１】すなわち、ＭＩＤ４１は、図２に示すよう
に、射出成形により所望の三次元形状に成形されてお
り、ＬＥＤチップ４２及びフォトＩＣ４３を実装する凹
部４６、４７が形成され、かつ凹部４６、４７の底面に
は、ＬＥＤチップ４２、フォトＩＣ４３に対する精度の
よい位置決めを達成するための凹面４８、４９が凹設さ
れている。That is, as shown in FIG. 2, the MID 41 is formed into a desired three-dimensional shape by injection molding, and recesses 46 and 47 for mounting the LED chip 42 and the photo IC 43 are formed. On the bottom surface of 47, concave surfaces 48 and 49 for achieving accurate positioning with respect to the LED chip 42 and the photo IC 43 are provided.

【００３２】従って、凹面４８、４９内にＬＥＤチップ
４２、フォトＩＣ４３を収容固定するため、半田付け、
あるいはＣＯＢ実装における加熱溶融時に、セルフアラ
イメントにより浮き上がっても、凹面４８、４９の側壁
に突き当たることにより、ＬＥＤチップ４２、フォトＩ
Ｃ４３が位置ズレするようなことがない。Therefore, in order to house and fix the LED chip 42 and the photo IC 43 in the concave surfaces 48 and 49,
Alternatively, even if it floats due to self-alignment during heating and melting in COB mounting, the LED chip 42 and the photo I
There is no displacement of C43.

【００３３】そして、この光電機能モジュール４０は、
ＭＩＤパッケージ４４と光学レンズ４５とが光電素子で
あるＬＥＤチップ４２とフォトＩＣ４３の光軸と光学レ
ンズ４５との光軸（投光側光軸Ｐ１、受光側光軸Ｐ２で
示す）とが整合した状態でＭＩＤパッケージ４４と光学
レンズ４５とが接合され、ケース２０（表面側ケース２
１）により、リジッドに固定されているため、光電素子
４２、４３と光学レンズ４５との光軸がほぼ一致してお
り、設計上の光軸中心に対して５／１００〜９／１００
ｍｍ程度の光軸ズレに抑制された光電センサ１０を提供
することができる。The photoelectric function module 40 is
The MID package 44 and the optical lens 45 are aligned with the optical axis of the LED chip 42, which is a photoelectric element, the photo IC 43, and the optical axis of the optical lens 45 (indicated by the light projecting side optical axis P1 and the light receiving side optical axis P2). In this state, the MID package 44 and the optical lens 45 are joined, and the case 20 (the front case 2) is joined.
1), the optical axes of the photoelectric elements 42 and 43 and the optical lens 45 substantially coincide with each other, and the center of the optical axis in design is 5/100 to 9/100.
It is possible to provide the photoelectric sensor 10 in which the optical axis shift is suppressed to about mm.

【００３４】このことにより、ユーザーは、光電センサ
１０を設置した後、面倒な光軸合わせが不要となり、Ｍ
ＩＤパッケージ４４と光学レンズ４５との位置精度関係
が、全て成形金型によって加工された部品を更に成形金
型の中にインサートして位置決め規制して複合成形で
き、光軸合わせ精度を格段に向上させることが可能とな
るため、検知対象物が小型であっても遠距離から精度良
く検知できる。This eliminates the need for the user to perform troublesome optical axis alignment after the photoelectric sensor 10 is installed.
The positional accuracy relationship between the ID package 44 and the optical lens 45 can be combined with the components that are all processed by the molding die and inserted into the molding die to regulate the positioning, thus significantly improving the optical axis alignment accuracy. Therefore, even if the detection target is small, it can be accurately detected from a long distance.

【００３５】尚、光電機能モジュール４０とプリント配
線基板３０との接合は、ＭＩＤ４１の裏面に突設した導
電ピン５０をプリント配線基板３０のスルーホール３７
内に挿入し、半田付け等を行なうが、このとき、ピン５
１とスルーホール３７との間にクリアランスが設定され
ていても光電素子４２、４３と光学レンズ４５の双方の
光軸Ｐ１、Ｐ２の整合性については何ら影響がない。The photoelectric function module 40 and the printed wiring board 30 are joined by connecting the conductive pins 50 projecting from the back surface of the MID 41 to the through holes 37 of the printed wiring board 30.
And soldering, etc.
Even if the clearance is set between 1 and the through hole 37, there is no influence on the matching of the optical axes P1 and P2 of both the photoelectric elements 42 and 43 and the optical lens 45.

【００３６】尚、信号処理回路３１などのプリント配線
基板３０の電子回路は、ＭＩＤ４１の配線と導通接続さ
れるが、この信号処理回路３１等は、ＭＩＤ４１裏面に
実装すれば、より小型化を可能にできる。The electronic circuits of the printed wiring board 30 such as the signal processing circuit 31 are electrically connected to the wiring of the MID 41. If the signal processing circuit 31 and the like are mounted on the back of the MID 41, the size can be further reduced. Can be.

【００３７】次いで、上記反射型の光電センサ１０の製
造方法、特に光電機能モジュール４０の形成工程につい
て、図３乃至図６を参照しながら説明する。Next, a method of manufacturing the above-mentioned reflection type photoelectric sensor 10, in particular, a process of forming the photoelectric function module 40 will be described with reference to FIGS.

【００３８】まず、図３に示すように、ＭＩＤ４１にＬ
ＥＤチップ４２及びフォトＩＣ４３を実装するが、この
ＭＩＤ４１は、半導体素子の実装あるいは半田付けで他
の回路へ接続されることから、高耐熱性の液晶ポリマー
（ＬＣＰ）等が使用され、樹脂を流れ方向への寸法安定
性の特徴を使って形状寸法が安定するゲート位置を設定
して、射出成形で成形する。尚、ＭＩＤ４１に施される
配線パターンは、分類上ワンショット法で各種の公知の
方法で形成すれば良い。First, as shown in FIG.
The ED chip 42 and the photo IC 43 are mounted. Since the MID 41 is connected to another circuit by mounting a semiconductor element or soldering, a liquid crystal polymer (LCP) having high heat resistance is used, and the MID 41 flows through the resin. A gate position at which the shape and dimensions are stabilized is set using the feature of dimensional stability in the direction, and molding is performed by injection molding. The wiring pattern applied to the MID 41 may be formed by various known methods by a one-shot method in terms of classification.

【００３９】こうして、形成されたＭＩＤ４１の凹面４
８、４９に所定量の導電性ペースト５１（銀粉末入りエ
ポキシ樹脂）を転写にて供給した上にダイボンダーにて
ＬＥＤチップ４２、フォトＩＣ４３を正確に位置決めし
て装着する。The concave surface 4 of the MID 41 thus formed
A predetermined amount of conductive paste 51 (epoxy resin containing silver powder) is supplied by transfer to 8 and 49, and the LED chip 42 and the photo IC 43 are accurately positioned and mounted by a die bonder.

【００４０】そして、１３０〜１５０℃の加熱処理を行
ない、図４に示すように、導電性ペースト５１を硬化反
応させて、固化させるが、このとき、ペースト状のエポ
キシ成分が液状化して装着した光電素子４２、４３は、
セルフ・アライメントにより浮き上がって移動しようと
するが、上述した凹面４８、４９の内壁のストッパ機能
によりＬＥＤチップ４２、フォトＩＣ４３の位置規制が
可能であり、精度の良い光電素子４２、４３の装着が可
能となる。Then, a heat treatment at 130 to 150 ° C. is performed, and as shown in FIG. 4, the conductive paste 51 is cured and solidified. At this time, the paste-like epoxy component is liquefied and mounted. The photoelectric elements 42 and 43
The self-alignment tends to lift and move, but the position of the LED chip 42 and the photo IC 43 can be regulated by the stopper function of the inner walls of the concave surfaces 48 and 49 described above, so that the photoelectric elements 42 and 43 can be mounted with high accuracy. Becomes

【００４１】このようにして作製されたＭＩＤパッケー
ジ４４に対して、光学レンズ４５を装着して図５に示す
光電機能モジュール４０を作製するが、この光学レンズ
４５は、一定圧射出成形、あるいは圧縮成形等の加工法
で光学歪みを抑制するために、極力加工歪みが残存しな
い成形を行なうのが一般的であり、光学レンズ部の中心
と外形端面との位置精度は他の成形部品より格段に上位
のレベルにあり、成形材料は変性アクリレート樹脂が使
用される。An optical lens 45 is mounted on the MID package 44 manufactured as described above to manufacture the photoelectric function module 40 shown in FIG. 5, and the optical lens 45 is formed by constant pressure injection molding or compression. In order to suppress optical distortion by a processing method such as molding, it is common to perform molding with as little processing distortion as possible, and the positional accuracy between the center of the optical lens part and the outer end face is much higher than other molded parts. At a higher level, the molding material is a modified acrylate resin.

【００４２】その後、ユーザーが取り付けるために必要
な取付孔２３を設けたケース２０に光電機能モジュール
４０を取り付けるには、ケース２０（実際には表面側ケ
ース２１）を成形するのに必要な金型の中に上記光電機
能モジュール４０を光軸Ｐ１、Ｐ２を整合させた状態で
インサートして射出成形加工することで、ＭＩＤパッケ
ージ４４、光学レンズ４５が正規位置で接合固定され、
ケース２０に設けた取付孔２３に対しても寸法精度が安
定した加工がなされたことになる。Thereafter, in order to attach the photoelectric function module 40 to the case 20 provided with the attachment holes 23 necessary for the user to attach, the mold necessary for molding the case 20 (actually, the front side case 21) is used. The MID package 44 and the optical lens 45 are bonded and fixed at regular positions by inserting the photoelectric function module 40 in the state where the optical axes P1 and P2 are aligned and performing injection molding.
This means that the mounting hole 23 provided in the case 20 is also processed with stable dimensional accuracy.

【００４３】その後、図６に示すように、必要な電子回
路が実装されたプリント配線基板３０をＭＩＤパッケー
ジ４４に組み付けるが、この際、プリント配線基板３０
とケース２０の合わせ部にクリアランスがあっても、ケ
ース２０の寸法基準でなく、ＭＩＤ４１の基準で対応で
き、かつこの間に寸法上の隙間があっても電気的に接合
可能な組み立て精度があれば十分である。Thereafter, as shown in FIG. 6, the printed wiring board 30 on which necessary electronic circuits are mounted is assembled to the MID package 44. At this time, the printed wiring board 30 is mounted.
Even if there is a clearance at the mating portion between the case 20 and the case 20, it is possible to cope with the MID 41 standard instead of the dimensional standard of the case 20, and if there is an assembling precision that can be electrically connected even if there is a dimensional gap therebetween. It is enough.

【００４４】その上で、ＭＩＤ４１とプリント配線基板
３０の間を電気的に半田付け等の手段で接続すれば,光
電センサの機能を果たす状態となる。Then, if the MID 41 and the printed wiring board 30 are electrically connected by means such as soldering, the state of fulfilling the function of the photoelectric sensor is obtained.

【００４５】従って、従来のように、プリント配線基板
３０の加工精度のバラツキ、パターン精度のバラツキ等
の悪影響を何等受けることがなく、光軸の整合精度や取
付位置精度に優れ、かつ検知効率を向上させた光電セン
サ１０を提供できる。Therefore, unlike the related art, there is no adverse effect such as a variation in the processing accuracy of the printed wiring board 30 and a variation in the pattern accuracy, and the alignment accuracy of the optical axis and the mounting position accuracy are excellent, and the detection efficiency is improved. An improved photoelectric sensor 10 can be provided.

【００４６】次いで、図７は透過型の光電センサ（投光
部ユニット６０、受光部ユニット７０）に適用した実施
形態を示すもので、投光部ユニット６０には、投光用Ｍ
ＩＤ６１に投光素子であるＬＥＤチップ６２が実装され
ており、この投光ＭＩＤパッケージ６３に投光レンズ６
４を重ねて、これをケース６５を加工する金型にインサ
ートし、射出成形することにより、ＭＩＤパッケージ６
３と光学レンズ６４とケース６５を複合接合成形で一体
化する。FIG. 7 shows an embodiment in which the present invention is applied to a transmission type photoelectric sensor (light emitting unit 60, light receiving unit 70).
An LED chip 62 serving as a light projecting element is mounted on the ID 61, and a light projecting lens 6 is mounted on the light projecting MID package 63.
4 are inserted into a mold for processing the case 65 and injection-molded to obtain the MID package 6.
3, the optical lens 64 and the case 65 are integrated by composite joining molding.

【００４７】その上で、ＬＥＤ駆動回路６６は、プリン
ト配線基板６７上に実装されたものを投光用ＭＩＤ６１
の配線パターンと半田付け等により接続する。また、よ
り小型化を達成したいならば、ＬＥＤ駆動回路６６を投
光用ＭＩＤ６１の裏面を使って実装することもできる。Then, the LED drive circuit 66 is mounted on the printed circuit board 67 and the light emitting MID 61
Is connected to the wiring pattern by soldering or the like. If it is desired to achieve further miniaturization, the LED drive circuit 66 can be mounted using the back surface of the light emitting MID 61.

【００４８】同様に、受光部ユニット７０の構成につい
ても同様であり、受光用ＭＩＤ７１にフォトＩＣ７２を
実装して、この受光用ＭＩＤパッケージ７３に受光レン
ズ７４を重ねて、これをケース７５を加工する金型にイ
ンサートし、射出成形によって受光用ＭＩＤパッケージ
７３と受光レンズ７４とケース７５を複合接合成形で一
体化する。Similarly, the configuration of the light receiving unit 70 is the same. The photo IC 72 is mounted on the light receiving MID 71, and the light receiving lens 74 is overlaid on the light receiving MID package 73, and the case 75 is processed. It is inserted into a mold, and the light receiving MID package 73, the light receiving lens 74, and the case 75 are integrated by injection molding.

【００４９】その上で、受光信号処理回路７６は、プリ
ント配線基板７７面上に実装されたものを、受光用ＭＩ
Ｄ７１の配線パターンと半田付け等により接続する。ま
た、より小型化を達成するならば、受光信号処理回路７
６を受光用ＭＩＤ７１の裏面に実装すれば良い。Then, the light receiving signal processing circuit 76 converts the circuit mounted on the surface of the printed circuit board 77 into a light receiving MI
It is connected to the wiring pattern of D71 by soldering or the like. Further, if the miniaturization is to be achieved, the light receiving signal processing circuit 7
6 may be mounted on the back surface of the light receiving MID 71.

【００５０】この透過型の光電センサ６０、７０につい
ても第１の実施形態と同様の作用効果を備えており、投
光・受光素子６２、７２を取り付けたＭＩＤパッケージ
６３、７３とレンズ６４、７４の対応位置関係が精度良
く制御される。すなわち、全て成形金型によって加工さ
れた部品を更に成形金型の中にインサートして位置決め
規制して複合接合成形できるため、光軸合わせ精度を格
段に向上させることができる。The transmissive photoelectric sensors 60 and 70 have the same functions and effects as those of the first embodiment. The MID packages 63 and 73 having the light emitting / receiving elements 62 and 72 attached thereto and the lenses 64 and 74 are provided. Is precisely controlled. That is, since all the components processed by the molding die can be further inserted into the molding die and the positioning can be regulated, and the composite joining can be performed, the optical axis alignment accuracy can be remarkably improved.

【００５１】[0051]

【発明の効果】以上説明した通り、本発明に係る光電セ
ンサは、光電素子を実装したＭＩＤパッケージと光学レ
ンズとを重ね合わせ、ケースを成形する射出成形金型内
にインサートして、光電素子と光学レンズとの光軸がほ
ぼ一致した状態で、ＭＩＤパッケージ、光学レンズ、ケ
ースを複合接合成形するというものであるから、光電セ
ンサの検知精度を高めることができるとともに、ユーザ
ーに対しても無駄な光軸調整の労力を強いることなく取
付作業の簡素化を図ることができるという効果を有す
る。As described above, in the photoelectric sensor according to the present invention, the MID package on which the photoelectric element is mounted and the optical lens are overlapped and inserted into an injection molding die for molding a case. Since the MID package, the optical lens, and the case are formed by composite bonding with the optical axis almost coincident with the optical lens, the detection accuracy of the photoelectric sensor can be improved and the user is useless. There is an effect that the mounting operation can be simplified without increasing the labor for optical axis adjustment.

【００５２】更に、光電素子を実装する箇所に光電素子
のチップサイズに合わせた凹面を形成しておけば、ＭＩ
Ｄに対する光電素子の実装作業時、セルフアライメント
に伴なう誤差が解消でき、光軸合わせ精度をより向上さ
せることができるという効果を有する。Further, if a concave surface corresponding to the chip size of the photoelectric element is formed at the position where the photoelectric element is mounted, MI
When mounting the photoelectric element on D, an error associated with self-alignment can be eliminated, and the optical axis alignment accuracy can be further improved.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の第１の実施形態を示す反射型の光電セ
ンサの全体構成を示す断面図である。FIG. 1 is a cross-sectional view illustrating an overall configuration of a reflective photoelectric sensor according to a first embodiment of the present invention.

【図２】図１に示す光電センサにおける投光・受光部を
拡大して示す断面図である。FIG. 2 is an enlarged sectional view showing a light projecting / receiving unit in the photoelectric sensor shown in FIG.

【図３】図１に示す光電センサの製造方法におけるＭＩ
Ｄに対する光電素子を装着する状態を示す説明図であ
る。FIG. 3 is a view illustrating a method of manufacturing the photoelectric sensor shown in FIG.
It is explanatory drawing which shows the state which mounts the photoelectric element with respect to D.

【図４】本発明に係る光電センサの製造方法におけるＭ
ＩＤパッケージの形成工程を示す説明図である。FIG. 4 is a diagram illustrating a method of manufacturing a photoelectric sensor according to the present invention;
FIG. 4 is an explanatory view showing a step of forming an ID package.

【図５】本発明に係る光電センサの製造方法におけるＭ
ＩＤパッケージと光学レンズとの接合状態を示す説明図
である。FIG. 5 is a diagram illustrating a method for manufacturing a photoelectric sensor according to the present invention;
FIG. 3 is an explanatory diagram showing a joint state between an ID package and an optical lens.

【図６】本発明に係る光電センサの製造方法におけるＭ
ＩＤパッケージとプリント配線基板との接合状態を示す
説明図である。FIG. 6 shows M in the method for manufacturing a photoelectric sensor according to the present invention.
FIG. 4 is an explanatory diagram showing a bonding state between an ID package and a printed wiring board.

【図７】本発明の第２実施形態を示す透過型の光電セン
サの構成を示す説明図である。FIG. 7 is an explanatory diagram illustrating a configuration of a transmission type photoelectric sensor according to a second embodiment of the present invention.

【図８】従来の反射型の光電センサの構成を示す説明図
である。FIG. 8 is an explanatory diagram showing a configuration of a conventional reflection-type photoelectric sensor.

【図９】従来の透過型の光電センサの構成を示す説明図
である。FIG. 9 is an explanatory diagram showing a configuration of a conventional transmission type photoelectric sensor.

【符号の説明】[Explanation of symbols]

１０ 光電センサ（反射型） ２０ ケース ２１ 表面側ケース ２２ 裏面側ケース ２３ 取付孔 ３０ プリント配線基板 ３１ 信号処理回路 ３２ 動作表示用ＬＥＤ ３３ 接続ケーブル ３４ 感度調整用バリスタ ４０ 光電機能モジュール ４１ ＭＩＤ ４２ ＬＥＤチップ ４３ フォトＩＣ ４４ ＭＩＤパッケージ ４５ 光学レンズ ４６、４７ 凹部 ４８、４９ 凹面 ５０ 導電ピン ５１ 導電性ペースト ６０ 投光部ユニット ６１ 投光用ＭＩＤ ６２ ＬＥＤチップ ６３ 投光用ＭＩＤパッケージ ６４ 投光レンズ ６５ 投光ケース ６６ ＬＥＤ駆動回路 ６７ プリント配線基板 ７０ 受光部ユニット ７１ 受光用ＭＩＤ ７２ フォトＩＣ ７３ 受光用ＭＩＤパッケージ ７４ 受光レンズ ７５ 受光ケース ７６ 受光信号処理回路 ７７ プリント配線基板 Reference Signs List 10 photoelectric sensor (reflection type) 20 case 21 front side case 22 back side case 23 mounting hole 30 printed wiring board 31 signal processing circuit 32 operation display LED 33 connection cable 34 sensitivity adjustment varistor 40 photoelectric function module 41 MID 42 LED chip 43 Photo IC 44 MID Package 45 Optical Lens 46, 47 Recess 48, 49 Concave Surface 50 Conductive Pin 51 Conductive Paste 60 Projector Unit 61 Projector MID 62 LED Chip 63 Projector MID Package 64 Projector Lens 65 Projector Case 66 LED drive circuit 67 Printed wiring board 70 Light receiving unit 71 Light receiving MID 72 Photo IC 73 Light receiving MID package 74 Light receiving lens 75 Light receiving case 76 Light receiving signal processing circuit 77 Printed wiring board

Claims (7)

【特許請求の範囲】[Claims] 【請求項１】 ＭＩＤに光電素子を実装してなるＭＩＤ
パッケージと、上記光電素子と対向する位置に設けられ
る光学レンズと、光電素子の光軸と光学レンズの光軸と
を整合させた位置でＭＩＤパッケージと光学レンズとを
保持するケースと、ケース内に収容され、ＭＩＤパッケ
ージの導通部分と導通する回路部分を有するプリント配
線基板とからなることを特徴とする光電センサ。1. An MID comprising a photoelectric element mounted on the MID.
A package, an optical lens provided at a position facing the photoelectric element, a case for holding the MID package and the optical lens at a position where the optical axis of the photoelectric element and the optical axis of the optical lens are aligned, and A photoelectric sensor, comprising: a printed wiring board accommodated and having a conductive portion of the MID package and a conductive portion. 【請求項２】 投光素子と受光素子が異なるＭＩＤパッ
ケージにそれぞれ実装され、投光素子及び受光素子がそ
れぞれ対応する投光用レンズ、受光用レンズとの光軸を
整合させた状態で投光用ＭＩＤパッケージが対応する光
学レンズと投光ケース、受光ケースにより保持されるこ
とを特徴とする請求項１に記載の光電センサ。2. A light-emitting element and a light-receiving element are mounted on different MID packages, respectively, and the light-emitting element and the light-receiving element emit light in a state where the optical axes of the corresponding light-emitting lens and light-receiving lens are aligned. The photoelectric sensor according to claim 1, wherein the MID package is held by a corresponding optical lens, a light projecting case, and a light receiving case. 【請求項３】 ＭＩＤに投光素子と受光素子が実装され
て、ＭＩＤパッケージが形成され、投光・受光素子に対
向する光学レンズの光軸と整合させてケースに保持され
ることを特徴とする請求項１に記載の光電センサ。3. A light emitting element and a light receiving element are mounted on the MID to form an MID package, which is held in a case in alignment with an optical axis of an optical lens facing the light emitting / receiving element. The photoelectric sensor according to claim 1. 【請求項４】 ＭＩＤパッケージの裏面には、ＬＥＤ駆
動回路、あるいは光学信号等の処理回路が実装されてい
ることを特徴とする請求項１乃至３のいずれかに記載の
光学センサ。4. The optical sensor according to claim 1, wherein an LED driving circuit or a processing circuit for processing an optical signal or the like is mounted on a back surface of the MID package. 【請求項５】 光電素子を実装するＭＩＤの実装面に
は、光電素子の寸法に応じた凹面が形成され、凹面部で
光電素子が位置決め実装されることを特徴とする請求項
１乃至４のいずれかに記載の光電センサ。5. The photoelectric conversion device according to claim 1, wherein a concave surface corresponding to the size of the photoelectric device is formed on the mounting surface of the MID on which the photoelectric device is mounted, and the photoelectric device is positioned and mounted on the concave surface portion. The photoelectric sensor according to any one of the above. 【請求項６】 ＭＩＤに光電素子を実装してなるＭＩＤ
パッケージと光学レンズとを両者の光軸を整合させて、
ケースを成形する射出成形金型内にインサートし、ＭＩ
Ｄパッケージと光学レンズとからなる光電機能モジュー
ルをケースと複合接合成形することを特徴とする光電セ
ンサの製造方法。6. An MID comprising a photoelectric element mounted on the MID.
By aligning the optical axis of both the package and the optical lens,
Insert into the injection mold to mold the case,
A method of manufacturing a photoelectric sensor, comprising: forming a photoelectric function module including a D package and an optical lens in a composite bonding with a case. 【請求項７】 ＭＩＤの光電素子の実装部位に設けられ
た凹面部で導電性ペーストを充填して、ダイボンダーに
て光電素子を位置決め実装することを特徴とする請求項
６に記載の光電センサの製造方法。7. The photoelectric sensor according to claim 6, wherein a conductive paste is filled in a concave portion provided in a mounting portion of the MID photoelectric element, and the photoelectric element is positioned and mounted by a die bonder. Production method.
JP13458499A 1999-05-14 1999-05-14 Photoelectric sensor and its manufacture Pending JP2000322989A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13458499A JP2000322989A (en) 1999-05-14 1999-05-14 Photoelectric sensor and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13458499A JP2000322989A (en) 1999-05-14 1999-05-14 Photoelectric sensor and its manufacture

Publications (1)

Publication Number Publication Date
JP2000322989A true JP2000322989A (en) 2000-11-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP2000322989A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005227121A (en) * 2004-02-13 2005-08-25 Omron Corp Countermeasures for preventing mutual interference in photoelectric switch
JP2009085625A (en) * 2007-09-27 2009-04-23 Anritsu Corp Displacement sensor
JP2013148393A (en) * 2012-01-17 2013-08-01 Sharp Corp Optical range-finding sensor and electronic apparatus
US9823115B2 (en) 2012-07-12 2017-11-21 Pixart Imaging Inc. Packaged optical device having a specular reflection configuration
WO2018012621A1 (en) * 2016-07-14 2018-01-18 京セラ株式会社 Package for photosensors, photosensor device and electronic module
CN113611753A (en) * 2021-07-20 2021-11-05 东莞先导先进科技有限公司 Infrared detector packaging structure and packaging method
CN113809060A (en) * 2021-08-17 2021-12-17 弘凯光电(江苏)有限公司 Distance sensor packaging structure
CN113611753B (en) * 2021-07-20 2024-05-28 东莞先导先进科技有限公司 Infrared detector packaging structure and packaging method

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005227121A (en) * 2004-02-13 2005-08-25 Omron Corp Countermeasures for preventing mutual interference in photoelectric switch
JP2009085625A (en) * 2007-09-27 2009-04-23 Anritsu Corp Displacement sensor
JP2013148393A (en) * 2012-01-17 2013-08-01 Sharp Corp Optical range-finding sensor and electronic apparatus
US9823115B2 (en) 2012-07-12 2017-11-21 Pixart Imaging Inc. Packaged optical device having a specular reflection configuration
WO2018012621A1 (en) * 2016-07-14 2018-01-18 京セラ株式会社 Package for photosensors, photosensor device and electronic module
JPWO2018012621A1 (en) * 2016-07-14 2019-04-11 京セラ株式会社 Optical sensor package, optical sensor device and electronic module
CN113611753A (en) * 2021-07-20 2021-11-05 东莞先导先进科技有限公司 Infrared detector packaging structure and packaging method
CN113611753B (en) * 2021-07-20 2024-05-28 东莞先导先进科技有限公司 Infrared detector packaging structure and packaging method
CN113809060A (en) * 2021-08-17 2021-12-17 弘凯光电(江苏)有限公司 Distance sensor packaging structure
CN113809060B (en) * 2021-08-17 2023-10-03 弘凯光电(江苏)有限公司 Distance sensor packaging structure

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