JP2000293652A - Antenna circuit for ic card - Google Patents

Antenna circuit for ic card

Info

Publication number
JP2000293652A
JP2000293652A JP11134640A JP13464099A JP2000293652A JP 2000293652 A JP2000293652 A JP 2000293652A JP 11134640 A JP11134640 A JP 11134640A JP 13464099 A JP13464099 A JP 13464099A JP 2000293652 A JP2000293652 A JP 2000293652A
Authority
JP
Japan
Prior art keywords
antenna circuit
width
antenna
card
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11134640A
Other languages
Japanese (ja)
Inventor
Yasuo Iijima
康男 飯島
Teruhiro Shinomiya
暉博 四宮
Junichi Nishigata
純一 西潟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOKYO FILM KAKO KK
Original Assignee
TOKYO FILM KAKO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOKYO FILM KAKO KK filed Critical TOKYO FILM KAKO KK
Priority to JP11134640A priority Critical patent/JP2000293652A/en
Publication of JP2000293652A publication Critical patent/JP2000293652A/en
Pending legal-status Critical Current

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  • Details Of Aerials (AREA)

Abstract

PROBLEM TO BE SOLVED: To improve the yields of an antenna circuit and IC mounting by wiring the line width of an antenna wire passing through an IC mounting part with wire with fixed width being equal to and less than a specified value. SOLUTION: After a vacuum evaporated film of a conductive metal is formed on a base film having prescribed ruggedness on the surface, and an antenna circuit is formed by printing adhesive on a base material surface forming the antenna circuit and continuously copying a vacuum evaporated film into the part. The line width of the periphery 3 of an IC chip attached to the antenna circuit and the antenna circuit passing between IC connection bumps 2 is thinner than that of an antenna main body 1 and also formed with fixed width <=0.3 mm. In a normal case, the line width of the body 1 is made thin gradually to be a fixed thin width between the bumps 2. The formation of a pattern whose width gets small gradually is difficult to control the peel state of the vacuum evaporated film in a copying mode, and copying can be performed with higher accuracy when the width is a fixed thin line.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、非接触ICカードで使
用される電波信号を検知するアンテナ回路に関する。非
接触ICカードは放射された電波を介して情報を交換す
るもので、カードの中に装着されるアンテナ回路は、そ
のICカードの性能を左右する重要な要素である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antenna circuit for detecting a radio signal used in a non-contact IC card. A non-contact IC card exchanges information via radiated radio waves, and an antenna circuit mounted in the card is an important factor that affects the performance of the IC card.

【0002】[0002]

【従来の技術】従来、アンテナ回路には、細い銅線を
巻いたもの、銅箔やアルミ箔等をエッチングにより形
成したもの、導電性塗料を所定の形状に印刷したもの
等があった。の銅線を巻いたものは、形状の薄化、均
一化に難点があり又巻取り工数の低減にも難点があっ
た。の銅箔、アルミニウム箔等をエッチングしたもの
は、薄化に難点があるのと同時にエッチング時の廃液処
理等に難点があった。の導電性塗料を印刷したもの
は、電気抵抗が高く又塗料の価格の面でも改善が必要と
言われていた。
2. Description of the Related Art Heretofore, there have been antenna circuits in which a thin copper wire is wound, copper foil or aluminum foil is formed by etching, or a conductive paint is printed in a predetermined shape. The copper wire wound has a difficulty in thinning and uniforming the shape and a difficulty in reducing the number of winding steps. Those obtained by etching copper foil, aluminum foil, etc., had problems in thinning as well as in waste liquid treatment during etching. It has been said that those printed with the conductive paint have high electric resistance and need to be improved in terms of the price of the paint.

【0003】[0003]

【発明が解決しようとする課題】ICカードは大量に普
及する必要がありできるだけ厚さの薄いカードが要望さ
れているが、前記のアンテナではそれぞれ厚さの薄化が
課題となっていた。薄くて、生産性が高く、しかも電波
信号を検知する能力が高く、またICを装着した場合の
ICと配線との相互干渉が少なくICの装着歩留りが高
いICカード用アンテナを供給することを課題とする。
The IC cards need to be widely spread and there is a demand for a card as thin as possible. However, in the above-mentioned antennas, it has been a problem to reduce the thickness of each antenna. It is an object to provide an IC card antenna which is thin, has high productivity, has a high ability to detect a radio signal, has low mutual interference between an IC and wiring when the IC is mounted, and has a high IC mounting yield. And

【0004】[0004]

【課題を解決するための手段】前記の課題を解決する手
段として印刷転写方式を採用した。表面に所定の凹凸を
持つベースフィルムに導電性金属の真空蒸着膜を形成し
た後、アンテナ回路を形成する基材表面に接着剤の印刷
とその部分に真空蒸着膜を連続的に転写することによっ
てアンテナ回路を形成する手段と、そのアンテナ回路に
装着されるICチップの周辺及びチップのバンプ間を通
過するアンテナ回路の線巾をアンテナ本体部の線巾に比
べて細くしかも一定の巾で形成する手段。
As a means for solving the above-mentioned problems, a printing transfer system is employed. After forming a vacuum-deposited film of conductive metal on a base film with predetermined irregularities on the surface, printing the adhesive on the substrate surface forming the antenna circuit and continuously transferring the vacuum-deposited film to that part Means for forming an antenna circuit, and the line width of the antenna circuit passing around the IC chip mounted between the antenna circuit and the bumps of the chip is formed to be narrower and more constant than the line width of the antenna body. means.

【0005】[0005]

【作用】印刷転写方式によって形成されるアンテナ回路
は、電気抵抗が低くしかも薄くできることが特徴である
が、ICバンプ間を通るアンテナ線は限られた間隔の間
にアンテナのターン数に応じた本数の線が配置されなけ
ればならない。通常の場合アンテナ本体の線巾を徐々に
細くしてICバンプ間で一定の細巾にすることが行われ
ている。(図1参考)本発明が採用した印刷転写方式の
場合、巾が徐々に細くなるパターンの形成は転写時の真
空蒸着膜の剥離の状態をコントロールし難く、巾が一定
の細い線のほうがより高精度に転写できることがわかっ
た。本発明の場合図1に示されるようなICの周辺及び
バンプ間の配線よりも、図2に示される本発明の一定巾
の細い線のほうが精度よく形成できた。本発明の方法を
採ることによってICカード内のアンテナの位置的バラ
ンスが採りやすく実使用状態での耐久性等にも効果があ
る。また、接着剤の印刷は、カード基板あるいは蒸着基
板それぞれにした場合いずれも効果が確認された。
The feature of the antenna circuit formed by the print transfer method is that it has a low electric resistance and can be made thin. However, the number of antenna lines passing between IC bumps is limited to the number corresponding to the number of turns of the antenna. Lines must be placed. Normally, the line width of the antenna body is gradually reduced to a constant width between the IC bumps. (See FIG. 1) In the case of the printing transfer method adopted by the present invention, it is difficult to control the peeling state of the vacuum deposited film at the time of transfer in the formation of a pattern having a gradually narrowing width. It was found that transfer was possible with high precision. In the case of the present invention, the thin line of a certain width of the present invention shown in FIG. 2 could be formed more accurately than the wiring around the IC and between the bumps as shown in FIG. By employing the method of the present invention, it is easy to balance the position of the antenna in the IC card, and it is effective for durability in actual use. The effect of printing the adhesive on the card substrate or the vapor deposition substrate was confirmed.

【実施例】【Example】

【0006】第1例 厚さ50μmのポリエチレンテレフタレートフィルムの
表面に厚さ0.5μmの銅の蒸着膜を用い印刷転写法に
よってアンテナ回路を形成した。アンテナ本体の線巾は
1mmでターン数は4ターン、IC近辺ならびにバンプ
間の線巾は0.2mmでバンプ間を3本の配線をとうし
た(図2参考)このアンテナ回路にICを装着後測定し
たところ、13.56MHzの周波数において約100
mmの通信距離を得た。
First Example An antenna circuit was formed on a surface of a 50 μm thick polyethylene terephthalate film by a print transfer method using a 0.5 μm thick copper vapor deposition film. The line width of the antenna body is 1 mm, the number of turns is 4 turns, the line width around the IC and between the bumps is 0.2 mm, and three wires are connected between the bumps (see FIG. 2). After mounting the IC on this antenna circuit As a result of measurement, at a frequency of 13.56 MHz, about 100
mm was obtained.

【0007】第2例 厚さ100μmのポリエチレンテレフタレートフィルム
に印刷転写法によってアンテナ回路を形成した。アンテ
ナ本体の線巾は1mm、IC部の線巾は0.1mmと
0.2mmとを作った。アンテナ全抵抗値のうちIC部
の抵抗値は0.1mmの場合19%、0.2mmの場合
15%を占めていた。アンテナ全抵抗値は所定の通信距
離を得るのに充分であった。またIC部の線巾は0.3
mmまで効果が認められた。
Second Example An antenna circuit was formed on a 100 μm-thick polyethylene terephthalate film by a print transfer method. The antenna body had a line width of 1 mm, and the IC section had a line width of 0.1 mm and 0.2 mm. Of the total resistance value of the antenna, the resistance value of the IC part occupies 19% in the case of 0.1 mm and 15% in the case of 0.2 mm. The total antenna resistance was sufficient to achieve the required communication distance. The line width of the IC part is 0.3
The effect was recognized up to mm.

【0008】[0008]

【発明の効果】導電性金属の真空蒸着膜を印刷転写法に
よってカード基材に転写する非接触ICカード用のアン
テナ回路で、IC周辺とバンプ間の配線を一定巾の細線
で配線することによって、アンテナ回路の歩留りが向上
ししかもIC装着歩留りも向上した。生産性の高い印刷
転写法によって得られたアンテナ用コイルは、特に非接
触ICカードの性能向上とコストダウンに貢献できるも
のである。また、本発明の印刷転写アンテナ回路は厚さ
が接着剤の厚さを含めて2μm以下であり、薄化の要望
の強いICカード用アンテナ回路には最適と考えられ
る。
According to the present invention, an antenna circuit for a non-contact IC card for transferring a vacuum deposited film of a conductive metal to a card substrate by a print transfer method. As a result, the yield of the antenna circuit was improved, and the yield of mounting the IC was also improved. The antenna coil obtained by the print transfer method with high productivity can contribute to improvement of performance and cost reduction of a non-contact IC card. Further, the thickness of the printed transfer antenna circuit of the present invention is 2 μm or less including the thickness of the adhesive, and is considered to be most suitable for an antenna circuit for an IC card for which a demand for thinning is strong.

【図面の簡単な説明】[Brief description of the drawings]

【図1】従来のアンテナ回路のIC周辺パターンの拡大
FIG. 1 is an enlarged view of an IC peripheral pattern of a conventional antenna circuit.

【図2】本発明の印刷転写法によるアンテナ回路のIC
周辺パターン拡大図
FIG. 2 is an IC of an antenna circuit formed by the print transfer method of the present invention.
Enlarged view of peripheral pattern

【図3】本発明のアンテナ回路全体図FIG. 3 is an overall view of an antenna circuit according to the present invention.

【符号の説明】[Explanation of symbols]

1はアンテナ本体部の配線 2はIC接続バンプ 3はIC周辺配線部 4はIC位置決めマーカー 1 is the wiring of the antenna body 2 is the IC connection bump 3 is the IC peripheral wiring 4 is the IC positioning marker

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 真空蒸着による導電性金属膜をカード基
材に転写してなる非接触ICカード用アンテナ回路にお
いて、IC装着部を通るアンテナ線の線巾を0.3mm
以下の一定した巾の線で配線されたことを特徴としたI
Cカード用アンテナ回路。
In a non-contact IC card antenna circuit in which a conductive metal film formed by vacuum deposition is transferred to a card substrate, the line width of an antenna line passing through an IC mounting portion is 0.3 mm.
I characterized by being wired with the following fixed width lines
Antenna circuit for C card.
JP11134640A 1999-04-06 1999-04-06 Antenna circuit for ic card Pending JP2000293652A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11134640A JP2000293652A (en) 1999-04-06 1999-04-06 Antenna circuit for ic card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11134640A JP2000293652A (en) 1999-04-06 1999-04-06 Antenna circuit for ic card

Publications (1)

Publication Number Publication Date
JP2000293652A true JP2000293652A (en) 2000-10-20

Family

ID=15133101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11134640A Pending JP2000293652A (en) 1999-04-06 1999-04-06 Antenna circuit for ic card

Country Status (1)

Country Link
JP (1) JP2000293652A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006528803A (en) * 2003-08-01 2006-12-21 エム・アー・エヌ・ローラント・ドルックマシーネン・アクチエンゲゼルシャフト Method for manufacturing an RFID label
JP2007151068A (en) * 2005-10-27 2007-06-14 Sumitomo Metal Mining Co Ltd Film antenna wiring base material, its manufacturing method, film antenna using the same and film antenna for automobile
JP2007194778A (en) * 2006-01-18 2007-08-02 Sumitomo Metal Mining Co Ltd Film-shape antenna wiring base, manufacturing method therefor, and film shape antenna using film-shape antenna wiring base

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006528803A (en) * 2003-08-01 2006-12-21 エム・アー・エヌ・ローラント・ドルックマシーネン・アクチエンゲゼルシャフト Method for manufacturing an RFID label
JP2007151068A (en) * 2005-10-27 2007-06-14 Sumitomo Metal Mining Co Ltd Film antenna wiring base material, its manufacturing method, film antenna using the same and film antenna for automobile
JP2007194778A (en) * 2006-01-18 2007-08-02 Sumitomo Metal Mining Co Ltd Film-shape antenna wiring base, manufacturing method therefor, and film shape antenna using film-shape antenna wiring base

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