JP2000265151A - Temporary liquid adhesive - Google Patents
Temporary liquid adhesiveInfo
- Publication number
- JP2000265151A JP2000265151A JP11071263A JP7126399A JP2000265151A JP 2000265151 A JP2000265151 A JP 2000265151A JP 11071263 A JP11071263 A JP 11071263A JP 7126399 A JP7126399 A JP 7126399A JP 2000265151 A JP2000265151 A JP 2000265151A
- Authority
- JP
- Japan
- Prior art keywords
- acid value
- weight
- alkali
- wafer
- softening point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【発明の属する技術分野】本発明は、半導体ウエハ、化
合物半導体ウエハ等の鏡面研磨加工に際し、研磨定盤と
ウエハを仮着固定する液状仮着接着剤に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid temporary adhesive for temporarily fixing a polishing platen and a wafer in mirror polishing of a semiconductor wafer, a compound semiconductor wafer or the like.
【０００１】[0001]
【従来の技術】最近の高密度化された半導体ウエハ、化
合物半導体ウエハ等における鏡面研磨加工にあっては、
ウエハ面或いは研磨用定盤に液状仮着接着剤を塗工・乾
燥後、熱圧でウエハと研磨用定盤を接着固定し、ポリシ
ング工程によりウエハの鏡面研磨し、次いでウエハ剥離
−アルカリ洗浄−純水洗浄−乾燥工程を経る。2. Description of the Related Art Mirror polishing of recent high-density semiconductor wafers, compound semiconductor wafers, etc.
After applying and drying the liquid temporary adhesive on the wafer surface or the polishing surface plate, the wafer and the polishing surface plate are bonded and fixed by heat and pressure, and the wafer is mirror-polished by a polishing process, and then the wafer peeling-alkali cleaning- Through pure water washing and drying process.
【０００２】しかしながら、ポリシング工程におけるウ
エハの鏡面研磨に際して、研磨液としてアルカリ研磨液
が使用されるが、仮着接着剤のアルカリ溶解性が強すぎ
ると鏡面加工時にウエハの外周部より研磨液が侵食し、
ウエハの浮きが生じ、場合によっては研磨作業が続行不
可能となる等の問題がある。However, when polishing the mirror surface of the wafer in the polishing step, an alkaline polishing solution is used as a polishing solution. If the alkali solubility of the temporary adhesive is too strong, the polishing solution erodes from the outer peripheral portion of the wafer during mirror polishing. And
There is a problem that the wafer is lifted, and in some cases, the polishing operation cannot be continued.
【０００３】[0003]
【発明が解決しようとする課題】本発明の目的は、ポリ
シング工程におけるウエハの鏡面研磨に際して、アルカ
リ洗浄性を維持しつつもウエハの浮きを生じることな
く、また、接着強度も優れた液状仮着接着剤の提供にあ
る。SUMMARY OF THE INVENTION It is an object of the present invention to provide a liquid temporary deposition which maintains the alkaline cleaning property without causing the wafer to float, and has an excellent adhesive strength when the wafer is mirror-polished in a polishing step. In providing adhesives.
【０００４】[0004]
【課題を解決するための手段】本発明の液状仮着接着剤
は、酸価が６０ｍｇＫＯＨ／ｇ以上のアルカリ可溶性樹
脂と、該アルカリ可溶性樹脂に対して３０重量％未満の
割合の酸価が６０ｍｇＫＯＨ／ｇ未満のアルカリ難溶性
樹脂とからなることを特徴とする。The liquid temporary adhesive of the present invention comprises an alkali-soluble resin having an acid value of 60 mg KOH / g or more, and an acid value of less than 30% by weight based on the alkali-soluble resin. / G of less-soluble alkali-soluble resin.
【０００５】[0005]
【発明の実施の形態】以下、本発明の液状仮着接着剤に
ついて説明する。本発明におけるアルカリ可溶性樹脂
は、酸価が６０ｍｇＫＯＨ／ｇ以上、好ましくは１２０
ｍｇＫＯＨ／ｇ以上であり、例えば荒川化学工業（株）
製白菊ロジン（軟化点７８℃、酸価１６５ｍｇＫＯＨ／
ｇ）、ハーキュレス（株）製「ウッドロジンＷＧ」（軟
化点７８℃、酸価１６５ｍｇＫＯＨ／ｇ）等のロジン
類、東都化成（株）製ＡＸ３１１Ｍ（軟化点９０℃、酸
価１２０ｍｇＫＯＨ／ｇ）等のノボラック型エポキシ樹
脂、荒川化学工業（株）製（軟化点１２５℃、酸価２４
０ｍｇＫＯＨ／ｇ）のアクリル酸変性ロジン、ジョンソ
ンポリマー（株）製（軟化点１０５℃、酸価２３８ｍｇ
ＫＯＨ／ｇ）のスチレン−マレイン酸樹脂、日立化成
（株）製「テスポール１１５５」軟化点１３０℃、酸価
１８０ｍｇＫＯＨ／ｇ）等のロジン変性マレイン酸樹
脂、岐阜シエラック（株）製「商品名、セラックＧＳ」
（軟化点７６℃、接着力６２ｋｇ／ｃｍ2 ）、興洋化学
（株）製「商品名、セラックＨＫ」（軟化点７５℃、接
着力６４．５ｋｇ／ｃｍ2 ）等の酸価６５〜８０ｍｇＫ
ＯＨ／ｇの天然シェラック樹脂、合成シェラック樹脂等
が挙げられる。DESCRIPTION OF THE PREFERRED EMBODIMENTS The liquid temporary adhesive of the present invention will be described below. The alkali-soluble resin in the present invention has an acid value of 60 mgKOH / g or more, preferably 120 mgKOH / g or more.
mgKOH / g or more, for example, Arakawa Chemical Industry Co., Ltd.
Shiragiku Rosin (softening point 78 ° C, acid value 165mgKOH /
g), rosins such as “Wood Rosin WG” (softening point 78 ° C., acid value 165 mg KOH / g) manufactured by Hercules Co., Ltd .; AX311M (softening point 90 ° C., acid value 120 mg KOH / g) manufactured by Toto Kasei Co., Ltd. Novolak type epoxy resin, manufactured by Arakawa Chemical Industry Co., Ltd. (softening point 125 ° C, acid value 24
0 mgKOH / g) acrylic acid-modified rosin (manufactured by Johnson Polymer Co., Ltd. (softening point 105 ° C., acid value 238 mg)
Styrene-maleic resin such as KOH / g), rosin-modified maleic resin such as "Tespol 1155" manufactured by Hitachi Chemical Co., Ltd., having a softening point of 130 ° C and an acid value of 180 mgKOH / g); Shellac GS "
(Softening point of 76 ℃, the adhesive strength 62kg / cm 2), Kyoyo Chemical Co., Ltd. "product name, shellac HK" (softening point of 75 ℃, the adhesive force 64.5kg / cm 2) acid value of such 65~80mgK
OH / g natural shellac resin, synthetic shellac resin and the like.
【０００６】アルカリ可溶性樹脂における軟化点は、基
材の材質やユーザー要望等により適宜調整されるが、４
０℃〜１００℃、好ましくは５０℃〜９０℃である。ア
ルカリ可溶性樹脂における酸価が６０ｍｇＫＯＨ／ｇよ
り低いと、アルカリ洗浄性に劣るものとなる。[0006] The softening point of the alkali-soluble resin is appropriately adjusted according to the material of the base material and the user's demand.
0 ° C to 100 ° C, preferably 50 ° C to 90 ° C. If the acid value of the alkali-soluble resin is lower than 60 mgKOH / g, the alkali-cleaning properties will be poor.
【０００７】また、アルカリ難溶性樹脂としては、酸価
が６０ｍｇＫＯＨ／ｇ未満、好ましくは５０ｍｇＫＯＨ
／ｇ以下であり、例えば荒川化学工業（株）製「エステ
ルガムＫＥ３１１」（軟化点９５℃、酸価１０ｍｇＫＯ
Ｈ／ｇ）、ハーキュレス（株）製「エステルガムＲＥ」
（軟化点９０℃、酸価７ｍｇＫＯＨ／ｇ）等のロジンエ
ステル類、ジョンソンポリマー（株）製「ジョンクリル
６１１」（軟化点１１２℃、酸価５３ｍｇＫＯＨ／
ｇ）、野田ワックス（株）製「キャンデリラワックス」
（軟化点７０℃、酸価２０ｍｇＫＯＨ／ｇ）、ヘキスト
ジャパン（株）製ヘキストワックスＥ（軟化点８０℃、
酸価２０ｍｇＫＯＨ／ｇ）等の天然または合成ワック
ス、野田ワックス（株）製「脱臭精密蜜蝋（高酸）」
（軟化点６７℃、酸価２０ｍｇＫＯＨ／ｇ）、三木化学
工業（株）製「脱臭赤印晒密蝋」（軟化点６４℃、酸価
７ｍｇＫＯＨ／ｇ）等の蜜蝋、昭和高分子工業（株）製
「ＰＲ３００」（軟化点６０℃、酸価５０ｍｇＫＯＨ／
ｇ）等のノボラックエポキシアクリレートが例示され
る。また、酸価が６０ｍｇＫＯＨ／ｇ未満の酢酸ビニル
マレイン酸樹脂を使用してもよい。アルカリ難溶性樹脂
における酸価が６０ｍｇＫＯＨ／ｇ以上であると、アル
カリ研磨に際してウエハ端面からの侵食性に劣るものと
なる。また、アルカリ難溶性樹脂における軟化点は４０
℃〜１１０℃、好ましくは５０℃〜８０℃である。[0007] The hardly soluble alkali resin has an acid value of less than 60 mgKOH / g, preferably 50 mgKOH / g.
/ G or less, for example, “Ester Gum KE311” manufactured by Arakawa Chemical Industry Co., Ltd. (softening point 95 ° C., acid value 10 mg KO
H / g), Hercules Co., Ltd. “Ester gum RE”
Rosin esters such as (softening point 90 ° C., acid value 7 mg KOH / g) and “Johncryl 611” manufactured by Johnson Polymer Co. (softening point 112 ° C., acid value 53 mg KOH / g)
g), "Candelilla wax" manufactured by Noda Wax Co., Ltd.
(Softening point 70 ° C, acid value 20 mg KOH / g), Hoechst Wax E manufactured by Hoechst Japan Co., Ltd. (softening point 80 ° C,
Natural or synthetic wax with an acid value of 20 mg KOH / g, etc., "Deodorized precision beeswax (high acid)" manufactured by Noda Wax Co., Ltd.
(Softening point 67 ° C., acid value 20 mg KOH / g), beeswax such as “Deodorized red seal bleached wax” (softening point 64 ° C., acid value 7 mg KOH / g) manufactured by Miki Chemical Industry Co., Ltd., Showa Kogyo Kogyo Co., Ltd. "PR300" (softening point 60 ° C, acid value 50mgKOH /
g) and the like. Further, a vinyl maleate resin having an acid value of less than 60 mgKOH / g may be used. If the acid value of the poorly alkali-soluble resin is 60 mgKOH / g or more, the erosion from the wafer end surface during alkali polishing is poor. The softening point of the hardly soluble alkali resin is 40.
C. to 110C, preferably 50C to 80C.
【０００８】アルカリ難溶性樹脂は、アルカリ可溶性樹
脂に対して、３０重量％未満、好ましくは１０重量％〜
２５重量％の割合で混合されるとよい。３０重量％以上
の含有量であると、アルカリ洗浄性に劣るものとなる。[0008] The alkali-soluble resin is less than 30% by weight, preferably 10% by weight, based on the alkali-soluble resin.
It may be mixed at a ratio of 25% by weight. When the content is 30% by weight or more, the alkali cleaning property is poor.
【０００９】また、本発明の液状仮着接着剤には、トル
エンスルホン酸エチルアミド、フタル酸エステル系化合
物、オキシ酸エステル系化合物およびマレイン酸樹脂等
の脂肪族二塩基酸エステル系化合物、オレイン酸、レシ
チン、脂肪酸アミド、流動性パラフィン等の軟化点調整
剤や溶融粘度調整剤、弗素系界面活性剤等のレベリング
剤、酸化防止剤を添加してもよく、いずれも、アルカリ
可溶性樹脂１００重量部に対して２０重量部以下、好ま
しくは３重量部〜１５重量部の割合でそれぞれ添加され
る。[0009] The liquid temporary adhesive of the present invention includes an aliphatic dibasic acid ester compound such as toluenesulfonic acid ethylamide, phthalic acid ester compound, oxyacid ester compound and maleic acid resin, oleic acid, Lecithin, fatty acid amide, softening point regulators such as liquid paraffin, melt viscosity regulators, leveling agents such as fluorine-based surfactants, and antioxidants may be added, and all are added to 100 parts by weight of the alkali-soluble resin. 20 parts by weight or less, preferably 3 parts by weight to 15 parts by weight, respectively.
【００１０】上記の各成分は、溶媒に溶解されて液状仮
着接着剤とされるが、溶媒としては、各成分に対して溶
解性を有するものであれば使用できるが、ｎ−プロピル
アルコール／トルエン（重量比、３／７）混合溶媒等の
共沸系溶剤を使用するとよい。共沸溶媒系は塗膜中より
スムーズな溶剤脱離性があり、残留溶剤量を著しく少な
くできるので、研磨定盤とウエハ熱貼りに際して残留溶
剤の発泡によるウエハ研磨面の歪みを防止でき、かつ接
着安定性を保持することを可能とする。液状仮着接着剤
は、固型分濃度１５％〜５０％、好ましくは２０％〜４
０％の溶液とされる。Each of the above components is dissolved in a solvent to form a liquid temporary adhesive. As the solvent, any solvent can be used as long as it has solubility for each component. It is preferable to use an azeotropic solvent such as a mixed solvent of toluene (weight ratio: 3/7). The azeotropic solvent system has a smoother solvent desorption property than in the coating film and can significantly reduce the amount of the residual solvent, so that it is possible to prevent distortion of the polished surface of the wafer due to foaming of the residual solvent when the polishing platen and the wafer are thermally bonded, and Adhesive stability can be maintained. The liquid temporary adhesive has a solid content of 15% to 50%, preferably 20% to 4%.
0% solution.
【００１１】本発明の液状仮着接着剤は、ウエハまたは
研磨用定盤上に、スピンコータ、ディップコーター等を
使用して塗布され、溶媒が除去された後、ウエハと研磨
用定盤とが熱圧着されることにより、ウエハは定盤上等
に確実に固定され、次いで、アルカリ研磨液による研磨
加工等が施され、加工後にはスクレバー、ナイフ等を利
用して定盤上等から剥離される。The liquid temporary adhesive of the present invention is applied on a wafer or a polishing plate using a spin coater, a dip coater or the like, and after the solvent is removed, the wafer and the polishing plate are heated. By being press-bonded, the wafer is securely fixed on the surface plate or the like, and then subjected to a polishing process or the like with an alkaline polishing solution, and after processing, is separated from the surface plate or the like using a screver, a knife, or the like. .
【００１２】本発明の液状仮着接着剤を使用して定盤上
に固定されたウエハは、アルカリ研磨液として、通常の
研磨液、例えばローデル・ニッタ（株）製研磨剤「ナル
コ２３６０」等を使用して研磨される。The wafer fixed on the surface plate using the liquid temporary adhesive of the present invention can be used as an alkaline polishing liquid, for example, a normal polishing liquid, for example, a polishing agent "Narco 2360" manufactured by Rodel Nitta Co., Ltd. Polished using
【００１３】本発明の液状仮着接着剤は、ウエハと定盤
等との接着固定を図り、研磨時における４０℃〜５０℃
の昇温やアルカリ研磨液に耐え、鏡面研磨に適するもの
であり、研磨加工後には、例えばカミソリの刃先をウエ
ハの接着面に挿入し、一挙に剥離できる。また、剥離さ
れたウエハに付着している接着剤は、一次洗浄をアルカ
リ性の洗浄剤で、次いで仕上げリンスを純水で行うこと
により除去される。The liquid temporary adhesive of the present invention is used for bonding and fixing a wafer to a surface plate and the like, and is used at 40 ° C. to 50 ° C. during polishing.
It is resistant to temperature rise and alkali polishing liquid, and is suitable for mirror polishing. After polishing, for example, a razor blade can be inserted into the bonding surface of the wafer and can be peeled off at once. Further, the adhesive adhering to the peeled wafer is removed by performing primary cleaning with an alkaline cleaning agent and then performing final rinsing with pure water.
【００１４】ウエハに残留した接着剤は、テトラメチル
アンモニウムオキサイド、アルカノールアミン、アミノ
アルコール、水溶性アミン類等の有機アミン、無機アル
カリ、またはこれらの塩の水溶液を使用して洗浄除去さ
れる。次に、本発明を実施例および比較例により具体的
に説明する。The adhesive remaining on the wafer is washed and removed using an aqueous solution of an organic amine such as tetramethylammonium oxide, alkanolamine, amino alcohol, or water-soluble amine, an inorganic alkali, or a salt thereof. Next, the present invention will be specifically described with reference to Examples and Comparative Examples.
【００１５】[0015]
【実施例１】下記の組成 ・ ロジン（荒川化学工業（株）製「白菊ロジン」軟化点７８℃、酸価１６５ｍ ｇＫＯＨ／ｇ） ・・・・・ ８０重量部 ・ 野田ワックス（株）製「脱臭精密蜜蝋（高酸）」（軟化点６７℃、酸価２０ ｍｇＫＯＨ／ｇ） ・・・・・ １０重量部 ・ 荒川化学工業（株）製「エステルガムＫＥ３１１」（軟化点９５℃、酸価１ ０ｍｇＫＯＨ／ｇ） ・・・・・ １０重量部 からなる組成を、ｎ−プロピルアルコール／トルエン＝
３／７（重量比）の混合溶媒に３０％固形分濃度で溶解
させ、本発明の液状仮着接着剤を調製した。Example 1 The following composition: Rosin ("Shiragiku Rosin" manufactured by Arakawa Chemical Industry Co., Ltd., softening point 78 ° C, acid value 165 mg KOH / g) 80 parts by weight Noda Wax Co., Ltd. "Deodorized precision beeswax (high acid)" (softening point 67 ° C, acid value 20 mgKOH / g) 10 parts by weight "Arakawa Chemical Industry Co., Ltd.""Ester gum KE311" (softening point 95 ° C, acid value 10 mg KOH / g) A composition consisting of 10 parts by weight was converted into n-propyl alcohol / toluene =
It was dissolved at a solid content of 30% in a 3/7 (weight ratio) mixed solvent to prepare a liquid temporary adhesive of the present invention.
【００１６】[0016]
【実施例２】下記の組成 ・ ハーキュレス（株）製「ウッドロジン」（軟化点７８℃、酸価１６５ｍｇＫ ＯＨ／ｇ） ・・・・・ ８０重量部 ・ ハーキュレス（株）製「エステルガムＲＥ」（軟化点９０℃、酸価７ｍｇＫ ＯＨ／ｇ） ・・・・・ １０重量部 ・ 野田ワックス（株）製「脱臭精密蜜蝋（高酸）」（軟化点６７℃、酸価２０ ｍｇＫＯＨ／ｇ） ・・・・・ １０重量部 からなる組成を、ｎ−プロピルアルコール／トルエン＝
３／７（重量比）の混合溶媒に３０％固形分濃度で溶解
させ、本発明の液状仮着接着剤を調製した。Example 2 The following composition: "Wood Rosin" manufactured by Hercules Co., Ltd. (softening point: 78 ° C., acid value: 165 mgK OH / g) ... 80 parts by weight "Ester Gum RE" manufactured by Hercules Co., Ltd. Softening point 90 ° C, acid value 7 mgK OH / g) 10 parts by weight Noda Wax Co., Ltd. “Deodorized precision beeswax (high acid)” (softening point 67 ° C, acid value 20 mgKOH / g) ... A composition consisting of 10 parts by weight is converted into n-propyl alcohol / toluene =
It was dissolved at a solid content of 30% in a 3/7 (weight ratio) mixed solvent to prepare a liquid temporary adhesive of the present invention.
【００１７】[0017]
【実施例３】下記の組成 ・ ハーキュレス（株）製「ウッドロジン」（軟化点７８℃、酸価１６５ｍｇＫ ＯＨ／ｇ） ・・・・・ ４０重量部 ・ 日立化成（株）製「テスポール１１５５」軟化点１３０℃、酸価１８０ｍｇ ＫＯＨ／ｇ） ・・・・・ ４０重量部 ・ 荒川化学工業（株）製「エステルガムＲＥ」（軟化点９０℃、酸価７ｍｇＫ ＯＨ／ｇ） ・・・・・ １０重量部 ・ 荒川化学工業（株）製「エステルガムＫＥ３１１」（軟化点９５℃、酸価１ ０ｍｇＫＯＨ／ｇ） ・・・・・ １０重量部 からなる組成を、ｎ−プロピルアルコール／トルエン＝
３／７（重量比）の混合溶媒に３０％固形分濃度で溶解
させ、本発明の液状仮着接着剤を調製した。Example 3 The following composition: "Wood Rosin" manufactured by Hercules Co., Ltd. (softening point: 78 DEG C., acid value: 165 mgK OH / g) ... 40 parts by weight-"Tespol 1155" manufactured by Hitachi Chemical Co., Ltd. Point 130 ° C, acid value 180 mg KOH / g) 40 parts by weight Arakawa Chemical Industries, Ltd. “Ester gum RE” (softening point 90 ° C, acid value 7 mgKOH / g) 10 parts by weight-"Ester gum KE311" manufactured by Arakawa Chemical Industry Co., Ltd. (softening point: 95 ° C, acid value: 10 mgKOH / g) ... 10 parts by weight of n-propyl alcohol / toluene =
It was dissolved at a solid content of 30% in a 3/7 (weight ratio) mixed solvent to prepare a liquid temporary adhesive of the present invention.
【００１８】[0018]
【比較例１】下記の組成 ・ ロジン（荒川化学工業（株）製「白菊ロジン」軟化点７８℃、酸価１６５ｍ ｇＫＯＨ／ｇ） ・・・・・ ６０重量部 ・ ハーキュレス（株）製「エステルガムＲＥ」（軟化点９０℃、酸価７ｍｇＫ ＯＨ／ｇ） ・・・・・ ２０重量部 ・ 荒川化学工業（株）製「エステルガムＫＥ３１１」（軟化点９５℃、酸価１ ０ｍｇＫＯＨ／ｇ） ・・・・・ ２０重量部 ・ オレイン酸（試薬、和光純薬、液状） ・・ ３重量部 からなる組成を、ｎ−プロピルアルコール／トルエン＝
３／７（重量比）の混合溶媒に３０％固形分濃度で溶解
させ、液状仮着接着剤を調製した。[Comparative Example 1] The following composition: Rosin ("Shiragiku Rosin" manufactured by Arakawa Chemical Industries, Ltd., softening point 78 ° C, acid value 165 mg KOH / g) ... 60 parts by weight-Hercules "Ester" Gum RE "(softening point 90 ° C, acid value 7mgK OH / g) 20 parts by weight" Arakawa Chemical Industries Co., Ltd. "" Ester gum KE311 "(softening point 95 ° C, acid value 10mgKOH / g) 20 parts by weight Oleic acid (reagent, Wako Pure Chemicals, liquid) 3 parts by weight of n-propyl alcohol / toluene =
It was dissolved in a 3/7 (weight ratio) mixed solvent at a solid content of 30% to prepare a liquid temporary adhesive.
【００１９】[0019]
【比較例２】下記の組成 ・ ロジン（荒川化学工業（株）製「白菊ロジン」軟化点７８℃、酸価１６５ｍ ｇＫＯＨ／ｇ） ・・・・・ ７０重量部 ・ ハーキュレス（株）製「エステルガムＲＥ」（軟化点９０℃、酸価７ｍｇＫ ＯＨ／ｇ） ・・・・・ １５重量部 ・ 野田ワックス（株）製「脱臭精密蜜蝋（高酸）」（軟化点６７℃、酸価２０ ｍｇＫＯＨ／ｇ） ・・・・・ １５重量部 からなる組成を、メチルエチルケトン／トルエン＝２／
１（重量比）の混合溶媒に３０％固形分濃度で溶解さ
せ、液状仮着接着剤を調製した。[Comparative Example 2] The following composition: Rosin ("Shiragiku Rosin" manufactured by Arakawa Chemical Industries, Ltd., softening point 78 ° C, acid value 165 mg KOH / g) 70 parts by weight Hercules "Ester" Gum RE "(softening point 90 ° C, acid value 7 mgK OH / g) ... 15 parts by weight" No dewax Co., Ltd. deodorized precision beeswax (high acid) "(softening point 67 ° C, acid value 20 mgKOH) / G) ············· 15 parts by weight of methyl ethyl ketone / toluene = 2 /
It was dissolved in 1 (weight ratio) of the mixed solvent at a solid content of 30% to prepare a liquid temporary adhesive.
【００２０】[0020]
【比較例３】下記の組成 ・ ロジン（荒川化学工業（株）製「白菊ロジン」軟化点７８℃、酸価１６５ｍ ｇＫＯＨ／ｇ） ・・・・・ １００重量部 ・ オレイン酸（試薬、和光純薬製、液状）・・・ ５重量部 からなる組成を、メチルエチルケトン／トルエン＝２／
１（重量比）の混合溶媒に３０％固形分濃度で溶解さ
せ、液状仮着接着剤を調製した。 （アルカリ洗浄性についての評価）上記で得られた実施
例１〜３、比較例１〜３の各液状仮着接着剤に、ワック
ス１００ｇあたり１ｍｇの割合でセレスブルー染料
（Ｃ．Ｉ．Ｎｏ６１５２０）を添加し、評価用試料とし
た。[Comparative Example 3] Rosin ("Shiragiku Rosin" manufactured by Arakawa Chemical Industries, Ltd., softening point 78 ° C, acid value 165 mg KOH / g) 100 parts by weight Oleic acid (reagent, Wako Pure) 5 parts by weight of methyl ethyl ketone / toluene = 2 /
It was dissolved in 1 (weight ratio) of the mixed solvent at a solid content of 30% to prepare a liquid temporary adhesive. (Evaluation of Alkali Detergency) To each of the liquid temporary adhesives obtained in Examples 1 to 3 and Comparative Examples 1 to 3 obtained above, a Ceres blue dye (CI No. 61520) was added at a rate of 1 mg per 100 g of wax. Was added to obtain a sample for evaluation.
【００２１】ガラスウエハー上にスピンコーターで各評
価用試料を回転塗布した後、熱風乾燥し、乾燥膜厚３±
０．５μｍの着色接着剤層を形成し、八角形（対角長５
０ｍｍ）の評価用チップを切り出し、図１に示す洗浄装
置に装填した。Each sample for evaluation was spin-coated on a glass wafer with a spin coater, dried with hot air, and dried to a film thickness of 3 ± 10%.
A 0.5 μm colored adhesive layer is formed, and an octagon (5 mm diagonal)
(0 mm) was cut out and loaded into the cleaning device shown in FIG.
【００２２】図１に示す洗浄装置は、３００ｍｌビーカ
ー１、攪拌子２、ポリプロピレン製固定台３、評価用チ
ップ支持台４からなり、評価用チップ５を接着剤層７を
下向きにして評価用チップ支持台４に支持させる。ビー
カー内にテトラメチルアンモニウムハイドロオキサイド
２５％水溶液（東洋合成工業（株）製「ＴＭＡＨ−２５
Ｈ」を純水で希釈し、０．２％濃度液とした洗浄液を２
００ｍｌ入れ、マグネティックスターラー（Ｙａｍａｔ
ｏ Ｍａｇ−Ｍｉｘｅｒ ＭＤ２００）上に載置し、液
温４０℃において、攪拌速度を最低として洗浄液を攪拌
し、着色接着剤層が全て溶解する時間を測定した。その
結果を下記の表１に示す。表中、１分以内で溶解したも
のを良好、３分以上要したものを不良とした。 （接着強度の測定）２枚１組の測定用治具に試料を塗布
乾燥させ、貼り合わせる（ＳＵＳ／試料／ＳＵＳ）。１
００ｇの重りを乗せて接着させる。２５℃のウォーター
バスに１時間入れ、温度を安定させた後、ストログラフ
を使用して引っ張り剪断剥離強度を測定し、接着力（ｋ
ｇ／ｃｍ2 ）とした。 （端面侵食性の評価法）シリコウエハ（３吋φ、４５０
μｍ厚のラッピングウエハ）に、実施例１〜３、比較例
１〜３の各液状仮着接着剤をスピンコートし、乾燥膜厚
３±０．２μｍの接着剤層を形成した。この接着剤層側
を研磨用定盤上に合わせ、ホットプレート（１５０℃）
上で加圧接着させた。The cleaning device shown in FIG. 1 comprises a 300 ml beaker 1, a stirrer 2, a polypropylene fixing table 3, and an evaluation chip support 4, and the evaluation chip 5 is placed with the adhesive layer 7 facing downward. The support table 4 is supported. In a beaker, a 25% aqueous solution of tetramethylammonium hydroxide (“TMAH-25” manufactured by Toyo Gosei Co., Ltd.)
H "was diluted with pure water to obtain a 0.2% concentration washing solution.
00ml, magnetic stirrer (Yamat
o Mag-Mixer MD200), the washing liquid was stirred at a liquid temperature of 40 ° C. at a minimum stirring speed, and the time required for all the colored adhesive layer to dissolve was measured. The results are shown in Table 1 below. In the table, those dissolved within 1 minute were regarded as good, and those requiring 3 minutes or more as defective. (Measurement of Adhesive Strength) A sample is applied to a set of two measuring jigs, dried, and bonded (SUS / sample / SUS). 1
A weight of 00 g is placed and adhered. After placing in a water bath at 25 ° C. for 1 hour to stabilize the temperature, the tensile shearing peel strength was measured using a strograph, and the adhesive strength (k
g / cm 2 ). (Evaluation method for edge erosion) Silicon wafer (3 inchφ, 450
Each of the liquid temporary adhesives of Examples 1 to 3 and Comparative Examples 1 to 3 was spin-coated on a μm-thick lapping wafer) to form an adhesive layer having a dry film thickness of 3 ± 0.2 μm. Place the adhesive layer side on the polishing platen and hot plate (150 ° C)
The above was pressure-bonded.
【００２３】別途、研磨装置（ナノテックマシーンズ製
「 NANOTECH450-FODC 」）に研磨布（ＳＵＢＡ８００）
をセッティングした後、研磨剤（ナルコ２３６０）を研
磨定盤に接着したウエハ面に全面に吹付け、加圧２００
ｇ／ｃｍ2 、回転数４０ｒｐｍ、研磨時間２０分でポリ
ッシングした。なお、研磨剤の供給は５分間隔で実施し
た。鏡面研磨完了後、ウエハを剥離し、ウエハ端面の研
磨液侵食長（外周部から中心部までの研磨液侵食長）を
計測した。その結果を同じく、表１に示す。なお、表
中、７ｍｍ以上研磨剤に侵食されたもの×、３ｍｍ以内
を○とし、中程度を○〜△とした。 （残留溶剤量評価法）シリコンウエハ（３吋φ、４５０
μｍ厚のラッピングウエハ）に、実施例１〜３及び比較
例１〜３で試作した液状仮着接着剤をスピンコーターに
より３±０．２μｍの膜厚に塗工した後、ホットプレー
ト上で１００℃、６秒間熱乾し、試料とした。試料を細
片化し、大型試験管に一定量封入した後、１２０℃、１
０分間オーブン中で加熱して残留溶剤を追い出し、大型
試験管内における溶剤量をガスクロマトグラフィ法で定
量し、３吋φウエハ一枚当りに換算した値（ｍｇ／３吋
φ）を表１に示す。Separately, a polishing cloth (SUBA800) is mounted on a polishing apparatus ("NANOTECH450-FODC" manufactured by Nanotech Machines).
After setting, the abrasive (Narco 2360) is sprayed over the entire surface of the wafer adhered to the polishing platen,
Polishing was performed at g / cm 2 , rotation speed of 40 rpm, and polishing time of 20 minutes. The supply of the abrasive was performed at intervals of 5 minutes. After the mirror polishing was completed, the wafer was peeled off, and the polishing liquid erosion length (the polishing liquid erosion length from the outer peripheral portion to the center portion) of the wafer end surface was measured. Table 1 also shows the results. In the table, those eroded by the abrasives of 7 mm or more × were within 3 mm, and ○ were given, and the medium was given as △ to Δ. (Residual solvent amount evaluation method) Silicon wafer (3 inchφ, 450
The liquid temporary adhesive prepared in Examples 1 to 3 and Comparative Examples 1 to 3 was applied to a thickness of 3 ± 0.2 μm on a wrapping wafer having a thickness of 3 μm by a spin coater, and then 100 μm on a hot plate. The sample was dried by heating at 6 ° C. for 6 seconds. After shredding the sample into small pieces and enclosing a fixed amount in a large test tube,
The residual solvent was driven out by heating in an oven for 0 minutes, the amount of the solvent in the large test tube was quantified by gas chromatography, and the value (mg / 3 inch φ) converted per wafer of 3 inch φ is shown in Table 1. .
【００２４】[0024]
【表１】 [Table 1]
【００２５】[0025]
【実施例４】下記の組成 ・ シェラック樹脂（岐阜セラック（株）製「ＰＮ−Ｍ６０」、６０％メタノー ル液）（軟化点７５℃、酸価８０ｍｇＫＯＨ／ｇ） ・・・・・ ３０重量部 ・ 酢酸ビニル樹脂（積水化学（株）製「エスニールＣ−２」）（軟化点４２℃ 、酸価０ｍｇＫＯＨ／ｇ） ・・・・・ １０重量部 ・ オレイン酸（試薬、和光純薬製、液状）・・・ ２重量部 ・ 変性エタノール ・・・・・ ３０重量部 ・ 酢酸エチル ・・・・・ ２８重量部 からなる組成の本発明の液状仮着接着剤を調製した。Example 4 The following composition: Shellac resin ("PN-M60" manufactured by Gifu Shellac Co., Ltd., 60% methanol solution) (softening point: 75 ° C., acid value: 80 mg KOH / g) 30 parts by weight・ Vinyl acetate resin (“Sneil C-2” manufactured by Sekisui Chemical Co., Ltd.) (softening point: 42 ° C., acid value: 0 mg KOH / g) 10 parts by weight ・ Oleic acid (reagent, manufactured by Wako Pure Chemical, liquid) ) ... 2 parts by weight-denatured ethanol ... 30 parts by weight-ethyl acetate ... 28 parts by weight A liquid temporary adhesive of the present invention having a composition of 28 parts by weight was prepared.
【００２６】[0026]
【実施例５】下記の組成 ・ シェラック樹脂（岐阜セラック（株）製「ＰＮ−Ｍ６０」、６０％メタノー ル液）（軟化点７５℃、酸価８０ｍｇＫＯＨ／ｇ） ・・・・・ ３５重量部 ・ 酢酸ビニルマレイン酸樹脂（興洋化学（株）製「ＴＨＲ」）（軟化点６０℃ 、酸価５０ｍｇＫＯＨ／ｇ） ・・・・・ ７重量部 ・ オレイン酸（試薬、和光純薬製、液状）・・・ ２重量部 ・ 変性エタノール ・・・・・ ３０重量部 ・ 酢酸エチル ・・・・・ ２６重量部 からなる組成の本発明の液状仮着接着剤を調製した。Example 5 The following composition: Shellac resin ("PN-M60" manufactured by Gifu Shellac Co., Ltd., 60% methanol solution) (softening point: 75 ° C., acid value: 80 mg KOH / g) 35 parts by weight・ Vinyl acetate maleate resin (“THR” manufactured by Koyo Chemical Co., Ltd.) (softening point 60 ° C., acid value 50 mg KOH / g) 7 parts by weight ・ Oleic acid (reagent, manufactured by Wako Pure Chemical, liquid ) ... 2 parts by weight-denatured ethanol ... 30 parts by weight-ethyl acetate ... 26 parts by weight A liquid temporary adhesive of the present invention having a composition of 26 parts by weight was prepared.
【００２７】[0027]
【実施例６】下記の組成 ・ シェラック樹脂（岐阜セラック（株）製「ＰＮ−Ｍ６０」、６０％メタノー ル液）（軟化点７５℃、酸価８０ｍｇＫＯＨ／ｇ） ・・・・・ ３５重量部 ・ スチレン−マレイン酸樹脂（ ＢＡＳＦ（株）製「スプラパールＡＰ」）（ 軟化点１６０℃、酸価１５５ｍｇＫＯＨ／ｇ）・・ ７重量部 ・ オレイン酸（試薬、和光純薬製、液状） ・・ ２重量部 ・ 変性エタノール ・・・・ ３５重量部 ・ 酢酸エチル ・・・・ ２１重量部 からなる組成の本発明の液状仮着接着剤を調製した。Example 6 The following composition: Shellac resin ("PN-M60", Gifu Shellac Co., Ltd., 60% methanol solution) (softening point 75 ° C, acid value 80 mg KOH / g) 35 parts by weight • Styrene-maleic acid resin (“Suprapearl AP” manufactured by BASF) (softening point 160 ° C, acid value 155 mgKOH / g) 7 parts by weight oleic acid (reagent, manufactured by Wako Pure Chemical, liquid) 2 35 parts by weight of denatured ethanol .... 21 parts by weight of ethyl acetate. A liquid temporary adhesive of the present invention having a composition of 21 parts by weight was prepared.
【００２８】上記実施例４〜実施例６の液状仮着接着剤
について、上記実施例１〜３と同様の評価を行った。そ
の結果を表２に示す。With respect to the liquid temporary adhesives of Examples 4 to 6, the same evaluations as in Examples 1 to 3 were performed. Table 2 shows the results.
【００２９】[0029]
【表２】 [Table 2]
【００３０】[0030]
【発明の効果】本発明の液状仮着接着剤は、ポリシング
工程におけるウエハの鏡面研磨に際して、アルカリ洗浄
性を維持しつつもウエハの浮きを生じることなく、ま
た、接着強度も優れるものである。The liquid temporary adhesive according to the present invention does not cause the wafer to float while maintaining the alkaline cleaning property during the mirror polishing of the wafer in the polishing step, and has excellent adhesive strength.
【図１】 液状仮着接着剤におけるアルカリ洗浄性評価
装置を説明するための図である。FIG. 1 is a diagram for explaining an apparatus for evaluating the alkali cleaning property of a liquid temporary adhesive.
１は３００ｍｌビーカー、２は攪拌子、３はポリプロピ
レン製固定台、４は評価用チップ支持台、５は評価用チ
ップ、６はマグネティックスターラー、７は接着剤層で
ある。1 is a 300 ml beaker, 2 is a stirrer, 3 is a polypropylene fixing table, 4 is an evaluation chip support, 5 is an evaluation chip, 6 is a magnetic stirrer, and 7 is an adhesive layer.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4J040 BA182 BA191 BA201 BA202 DB041 DE022 DG001 DG041 EC071 FA202 JA02 JB05 LA06 LA08 MA01 MA02 NA20 PA20 PA42 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4J040 BA182 BA191 BA201 BA202 DB041 DE022 DG001 DG041 EC071 FA202 JA02 JB05 LA06 LA08 MA01 MA02 NA20 PA20 PA42
Claims (2)
リ可溶性樹脂と、該アルカリ可溶性樹脂に対して３０重
量％未満の割合の酸価が６０ｍｇＫＯＨ／ｇ以下のアル
カリ難溶性樹脂とからなることを特徴とする液状仮着接
着剤。1. An alkali-soluble resin having an acid value of 60 mg KOH / g or more, and an alkali-soluble resin having an acid value of less than 30% by weight based on the alkali-soluble resin and having an acid value of 60 mg KOH / g or less. Liquid temporary adhesive.
ＫＯＨ／ｇ以上のアルカリ可溶性樹脂であることを特徴
とする請求項１記載の液状仮着接着剤。2. An alkali-soluble resin having an acid value of 120 mg.
The liquid temporary adhesive according to claim 1, wherein the adhesive is a KOH / g or more alkali-soluble resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07126399A JP4492893B2 (en) | 1999-03-17 | 1999-03-17 | Liquid temporary adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07126399A JP4492893B2 (en) | 1999-03-17 | 1999-03-17 | Liquid temporary adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000265151A true JP2000265151A (en) | 2000-09-26 |
| JP4492893B2 JP4492893B2 (en) | 2010-06-30 |
Family
ID=13455675
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP07126399A Expired - Fee Related JP4492893B2 (en) | 1999-03-17 | 1999-03-17 | Liquid temporary adhesive |
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| Country | Link |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009197175A (en) * | 2008-02-25 | 2009-09-03 | The Inctec Inc | Cleaning agent stock liquid |
| JP2013014777A (en) * | 2008-10-31 | 2013-01-24 | Brewer Science Inc | Cyclic olefin compositions for temporary wafer bonding |
| JP2014036054A (en) * | 2012-08-07 | 2014-02-24 | Sumco Corp | Single side polishing method of wafer |
| WO2018101453A1 (en) * | 2016-12-01 | 2018-06-07 | 株式会社Ｄｎｐファインケミカル | Temporary adhesive and component manufacturing method |
| WO2020246470A1 (en) * | 2019-06-03 | 2020-12-10 | 株式会社Ｄｎｐファインケミカル | Water-based temporary fixing adhesive, and method for producing various members or parts using said water-based temporary fixing adhesive |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61181883A (en) * | 1985-02-05 | 1986-08-14 | Nippon Genma:Kk | Temporary adhesive for soldering |
| JPH01150493A (en) * | 1987-12-08 | 1989-06-13 | Asahi Chem Res Lab Ltd | Temporary adhesive for soldering |
| JPH03203981A (en) * | 1989-12-29 | 1991-09-05 | Nikka Seiko Kk | Adhesive agent, cleansing agent for wafer or the like and method and device for treating with the same |
| JPH06240224A (en) * | 1993-02-16 | 1994-08-30 | The Ink Tec Kk | Warm-water-washable liquid adhesive |
| JPH0726210A (en) * | 1993-07-12 | 1995-01-27 | Sekisui Chem Co Ltd | Surface protective film and its production |
| JPH0820756A (en) * | 1994-07-05 | 1996-01-23 | Furukawa Electric Co Ltd:The | Pressure-sensitive adhesive tape for surface protection of semiconductor wafer |
| JPH09157628A (en) * | 1995-12-05 | 1997-06-17 | Nikka Seiko Kk | Adhesive for temporarily bonding wafer |
| JPH115958A (en) * | 1997-06-18 | 1999-01-12 | Toagosei Co Ltd | Alkali-peelable pressure sensitive adhesive composition and alkali-peelable pressure sensitive adhesive sheet |
| JPH1161079A (en) * | 1997-08-21 | 1999-03-05 | The Inctec Inc | Temporary adhesive for precision processing |
| JPH11224052A (en) * | 1998-02-09 | 1999-08-17 | Toyo Ink Mfg Co Ltd | Thermal label for glass and hot-melt type adhesive composition used for same label |
| JPH11301149A (en) * | 1998-04-24 | 1999-11-02 | Daio Paper Corp | Pressure sensitive pseudo adhesive sheet |
-
1999
- 1999-03-17 JP JP07126399A patent/JP4492893B2/en not_active Expired - Fee Related
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61181883A (en) * | 1985-02-05 | 1986-08-14 | Nippon Genma:Kk | Temporary adhesive for soldering |
| JPH01150493A (en) * | 1987-12-08 | 1989-06-13 | Asahi Chem Res Lab Ltd | Temporary adhesive for soldering |
| JPH03203981A (en) * | 1989-12-29 | 1991-09-05 | Nikka Seiko Kk | Adhesive agent, cleansing agent for wafer or the like and method and device for treating with the same |
| JPH06240224A (en) * | 1993-02-16 | 1994-08-30 | The Ink Tec Kk | Warm-water-washable liquid adhesive |
| JPH0726210A (en) * | 1993-07-12 | 1995-01-27 | Sekisui Chem Co Ltd | Surface protective film and its production |
| JPH0820756A (en) * | 1994-07-05 | 1996-01-23 | Furukawa Electric Co Ltd:The | Pressure-sensitive adhesive tape for surface protection of semiconductor wafer |
| JPH09157628A (en) * | 1995-12-05 | 1997-06-17 | Nikka Seiko Kk | Adhesive for temporarily bonding wafer |
| JPH115958A (en) * | 1997-06-18 | 1999-01-12 | Toagosei Co Ltd | Alkali-peelable pressure sensitive adhesive composition and alkali-peelable pressure sensitive adhesive sheet |
| JPH1161079A (en) * | 1997-08-21 | 1999-03-05 | The Inctec Inc | Temporary adhesive for precision processing |
| JPH11224052A (en) * | 1998-02-09 | 1999-08-17 | Toyo Ink Mfg Co Ltd | Thermal label for glass and hot-melt type adhesive composition used for same label |
| JPH11301149A (en) * | 1998-04-24 | 1999-11-02 | Daio Paper Corp | Pressure sensitive pseudo adhesive sheet |
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| JP2013014777A (en) * | 2008-10-31 | 2013-01-24 | Brewer Science Inc | Cyclic olefin compositions for temporary wafer bonding |
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| JP6403935B1 (en) * | 2016-12-01 | 2018-10-10 | 株式会社Ｄｎｐファインケミカル | Temporary adhesive and component manufacturing method |
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