JP2000252242A5 - - Google Patents
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- Publication number
- JP2000252242A5 JP2000252242A5 JP1999352884A JP35288499A JP2000252242A5 JP 2000252242 A5 JP2000252242 A5 JP 2000252242A5 JP 1999352884 A JP1999352884 A JP 1999352884A JP 35288499 A JP35288499 A JP 35288499A JP 2000252242 A5 JP2000252242 A5 JP 2000252242A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- polishing
- component
- agent
- surfactant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 description 38
- 238000005498 polishing Methods 0.000 description 31
- 239000003795 chemical substances by application Substances 0.000 description 23
- 239000004094 surface-active agent Substances 0.000 description 14
- 230000001681 protective Effects 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 239000007864 aqueous solution Substances 0.000 description 10
- 229910044991 metal oxide Inorganic materials 0.000 description 10
- 150000004706 metal oxides Chemical class 0.000 description 10
- 239000007800 oxidant agent Substances 0.000 description 10
- 239000012141 concentrate Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 6
- 239000011780 sodium chloride Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- -1 amino acid salts Chemical class 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 150000004676 glycans Polymers 0.000 description 1
- 229920001282 polysaccharide Polymers 0.000 description 1
- 239000005017 polysaccharide Substances 0.000 description 1
- 150000004804 polysaccharides Polymers 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35288499A JP4816836B2 (ja) | 1998-12-28 | 1999-12-13 | 金属用研磨液及びそれを用いた研磨方法 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP37260598 | 1998-12-28 | ||
| JP1998372605 | 1998-12-28 | ||
| JP10-372605 | 1998-12-28 | ||
| JP35288499A JP4816836B2 (ja) | 1998-12-28 | 1999-12-13 | 金属用研磨液及びそれを用いた研磨方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010181851A Division JP5429104B2 (ja) | 1998-12-28 | 2010-08-16 | 金属用研磨液及びそれを用いた研磨方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000252242A JP2000252242A (ja) | 2000-09-14 |
| JP2000252242A5 true JP2000252242A5 (zh) | 2006-12-28 |
| JP4816836B2 JP4816836B2 (ja) | 2011-11-16 |
Family
ID=26579725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35288499A Expired - Lifetime JP4816836B2 (ja) | 1998-12-28 | 1999-12-13 | 金属用研磨液及びそれを用いた研磨方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4816836B2 (zh) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4866503B2 (ja) | 1998-12-28 | 2012-02-01 | 日立化成工業株式会社 | 金属用研磨液材料及び金属用研磨液 |
| TWI229123B (en) | 2000-03-03 | 2005-03-11 | Nec Electronics Corp | Anticorrosive treating concentrate |
| JP4951808B2 (ja) * | 2000-10-26 | 2012-06-13 | 日立化成工業株式会社 | 金属用研磨液及び研磨方法 |
| SG144688A1 (en) * | 2001-07-23 | 2008-08-28 | Fujimi Inc | Polishing composition and polishing method employing it |
| KR100432637B1 (ko) * | 2001-08-07 | 2004-05-22 | 제일모직주식회사 | 구리배선 연마용 ｃｍｐ 슬러리 |
| KR20030013146A (ko) * | 2001-08-07 | 2003-02-14 | 에이스하이텍 주식회사 | 실리콘 웨이퍼 연마제 조성물과 그 제조방법 |
| US6936543B2 (en) * | 2002-06-07 | 2005-08-30 | Cabot Microelectronics Corporation | CMP method utilizing amphiphilic nonionic surfactants |
| ATE463838T1 (de) * | 2003-09-30 | 2010-04-15 | Fujimi Inc | Polierzusammensetzung und polierverfahren |
| JP4608196B2 (ja) * | 2003-09-30 | 2011-01-05 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP2006121001A (ja) * | 2004-10-25 | 2006-05-11 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法および研磨剤 |
| US7348276B2 (en) | 2005-03-30 | 2008-03-25 | Fujitsu, Limited | Fabrication process of semiconductor device and polishing method |
| JP2007184395A (ja) * | 2006-01-06 | 2007-07-19 | Fujifilm Corp | 金属用研磨液 |
| JP5725145B2 (ja) * | 2006-10-11 | 2015-05-27 | 日立化成株式会社 | 金属用研磨液とその製造方法及び金属用研磨液を用いた被研磨膜の研磨方法 |
| JP2008124222A (ja) * | 2006-11-10 | 2008-05-29 | Fujifilm Corp | 研磨液 |
| JP5094112B2 (ja) * | 2006-12-28 | 2012-12-12 | 富士フイルム株式会社 | 研磨液 |
| JP5094139B2 (ja) * | 2007-01-23 | 2012-12-12 | 富士フイルム株式会社 | 研磨液 |
| JP5285866B2 (ja) * | 2007-03-26 | 2013-09-11 | 富士フイルム株式会社 | 研磨液 |
| JP5403922B2 (ja) | 2008-02-26 | 2014-01-29 | 富士フイルム株式会社 | 研磨液および研磨方法 |
| WO2015060610A1 (ko) * | 2013-10-23 | 2015-04-30 | 주식회사 동진쎄미켐 | 금속막 연마 슬러리 조성물 및 이를 이용한 금속막 연마 시 발생하는 스크래치의 감소 방법 |
| CN108581814A (zh) * | 2018-05-21 | 2018-09-28 | 浙江工业大学 | 用于医用钛合金螺钉的气囊液态金属抛光机 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3800834A1 (de) * | 1988-01-14 | 1989-07-27 | Henkel Kgaa | Verfahren und mittel zum gleichzeitigen gleitschleifen, reinigen und passivieren metallischer werkstuecke |
| JP3435698B2 (ja) * | 1992-03-11 | 2003-08-11 | 三菱瓦斯化学株式会社 | 半導体基板の洗浄液 |
| US5863838A (en) * | 1996-07-22 | 1999-01-26 | Motorola, Inc. | Method for chemically-mechanically polishing a metal layer |
| JP3291205B2 (ja) * | 1996-08-27 | 2002-06-10 | 松下電工株式会社 | 磁気研磨方法 |
| KR19980032145A (ko) * | 1996-10-04 | 1998-07-25 | 포만제프리엘 | 알루미늄 구리 합금의 화학기계적 연마시 구리 도금을 방지하는 방법 |
| US6309560B1 (en) * | 1996-12-09 | 2001-10-30 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper substrates |
| JPH10273648A (ja) * | 1997-03-28 | 1998-10-13 | Fuji Photo Film Co Ltd | 研磨液 |
| JPH10310766A (ja) * | 1997-05-14 | 1998-11-24 | Fujimi Inkooporeetetsudo:Kk | 研磨用組成物 |
| US6217416B1 (en) * | 1998-06-26 | 2001-04-17 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper/tantalum substrates |
| US6063306A (en) * | 1998-06-26 | 2000-05-16 | Cabot Corporation | Chemical mechanical polishing slurry useful for copper/tantalum substrate |
| JP4053165B2 (ja) * | 1998-12-01 | 2008-02-27 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびそれを用いた研磨方法 |
| JP2000160139A (ja) * | 1998-12-01 | 2000-06-13 | Fujimi Inc | 研磨用組成物およびそれを用いた研磨方法 |
-
1999
- 1999-12-13 JP JP35288499A patent/JP4816836B2/ja not_active Expired - Lifetime
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