JP2000248239A - Production of double-sided cover lay film - Google Patents
Production of double-sided cover lay filmInfo
- Publication number
- JP2000248239A JP2000248239A JP11052120A JP5212099A JP2000248239A JP 2000248239 A JP2000248239 A JP 2000248239A JP 11052120 A JP11052120 A JP 11052120A JP 5212099 A JP5212099 A JP 5212099A JP 2000248239 A JP2000248239 A JP 2000248239A
- Authority
- JP
- Japan
- Prior art keywords
- film
- layer
- heat
- resistant adhesive
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、両面カバーレイフ
ィルムの製造方法に関する。[0001] The present invention relates to a method for producing a double-sided coverlay film.
【０００２】[0002]
【従来の技術】近年、エレクトロニクス分野の発展は目
覚しく、特に通信用・民生用の電子機器は、小型化、軽
量化、高密度化が進み、より一層高度な特性が要求され
るようになっている。それに伴い、フレキシブル印刷配
線板は、可撓性に富み、耐屈曲性に優れ、狭い空間での
立体的高密度の実装が可能であることから、電子機器へ
の配線、ケーブル、あるいは、コネクター機能を付与し
た複合部品としての用途が拡大しつつある。また、フレ
キシブル印刷配線板の高機能化が進むにつれて、複数の
フレキシブル印刷配線板を重ねる多層化する必要性が高
まってきており、その結果、フレキシブル印刷配線板の
回路形成部を保護する役割をもつカバーレイフィルムへ
の要求も高まってきている。2. Description of the Related Art In recent years, the development of the electronics field has been remarkable, and in particular, electronic equipment for communication and consumer use has been reduced in size, weight, and density, and more advanced characteristics have been required. I have. Along with this, flexible printed wiring boards are rich in flexibility, excellent in bending resistance, and can be mounted three-dimensionally with high density in a narrow space, so that wiring, cables, or connector functions for electronic equipment can be performed. The use as a composite part provided with is increasing. Further, as the functions of flexible printed wiring boards have become more sophisticated, the necessity of multilayering a plurality of flexible printed wiring boards has increased, and as a result, the flexible printed wiring boards have a role of protecting circuit forming portions. The demand for coverlay films is also increasing.
【０００３】従来、フレキシブル印刷配線板を多層化す
る方法としては、次の方法が一般的である。すなわち、
まず、電気絶縁性フィルムに耐熱性接着剤層を介して銅
箔を積層したフレキシブル印刷配線板用基板に所望する
銅回路を形成する。次に、電気絶縁性フィルム／耐熱性
接着剤層／離型材層からなるカバーレイフィルムの離型
材層を剥がして、銅回路部分に加熱圧着する。そして、
カバーレイフィルム上に補強板あるいはフレキシブル印
刷配線板をボンディングシートを介して積層し多層化す
る。この時、使用するボンディングシートは、通常、耐
熱性接着剤層の両面に離型材層が設けられてあり、両面
の離型材層を剥がして使用する。Conventionally, the following method is generally used as a method for forming a flexible printed wiring board into multiple layers. That is,
First, a desired copper circuit is formed on a flexible printed wiring board substrate in which a copper foil is laminated on an electrically insulating film via a heat-resistant adhesive layer. Next, the release material layer of the cover lay film composed of the electrically insulating film / heat-resistant adhesive layer / release material layer is peeled off, and is heat-pressed to the copper circuit portion. And
A reinforcing plate or a flexible printed wiring board is laminated on a coverlay film via a bonding sheet to form a multilayer. At this time, the bonding sheet to be used is usually provided with release material layers on both sides of the heat-resistant adhesive layer, and used after peeling off the release material layers on both surfaces.
【０００４】上記のようなカバーレイフィルム及びボン
ディングシートを用いた多層化は、打ち抜き加工、プレ
ス成型、接着シート加工等の複雑な工程を踏むため、膨
大な人手・時間を要し、また、工程数が多いため位置合
わせ等が複雑化し、その結果、収率及び品質の低下を招
くという問題があった。そのため、カバーレイフィルム
の機能とボンディングシートの機能を併せ持つ積層体、
すなわち、電気絶縁性フィルムの両面に耐熱性接着剤層
を設け、さらにその外側に離型材層を形成した構造をも
つ積層体（両面カバーレイフィルム）が提案された。そ
の両面カバーレイフィルムの一般的な製造方法は、電気
絶縁性フィルムの片面に耐熱性接着剤層を塗布し、加熱
乾燥して半硬化状態にした後、離型材層を貼り合わせ、
次いでもう一方の面に、同様にして耐熱性接着剤層を塗
布し、加熱乾燥して半硬化状態にした後、離型材層を貼
り合わせるという方法であった。[0004] The multi-layering using the coverlay film and the bonding sheet as described above requires enormous manpower and time since complicated steps such as punching, press molding, and processing of an adhesive sheet are performed. Due to the large number, positioning and the like become complicated, and as a result, there is a problem that the yield and quality are reduced. Therefore, a laminate having both the function of a coverlay film and the function of a bonding sheet,
That is, a laminate (double-sided coverlay film) having a structure in which a heat-resistant adhesive layer is provided on both sides of an electrically insulating film and a release material layer is further formed outside the heat-resistant adhesive layer has been proposed. The general manufacturing method of the double-sided coverlay film is to apply a heat-resistant adhesive layer on one side of the electrically insulating film, heat and dry to a semi-cured state, and then bond the release material layer,
Next, a heat-resistant adhesive layer was applied to the other surface in the same manner, heated and dried to obtain a semi-cured state, and then a release material layer was bonded.
【０００５】しかし、この製造方法では、後の耐熱性接
着剤層を形成する際に、先に形成した耐熱性接着剤層
が、再度乾燥工程を経て加熱させられるため、耐熱性接
着剤層の熱履歴差による接着性等の変化、耐熱性接着剤
層と離型材層の間の浮き・剥がれや離型性の変化、カー
ル等の発生といった問題が生じた。However, in this manufacturing method, when the heat-resistant adhesive layer is formed later, the previously formed heat-resistant adhesive layer is heated again through the drying step, so that the heat-resistant adhesive layer is formed. Problems such as a change in adhesive properties due to a difference in heat history, floating / peeling between the heat-resistant adhesive layer and the release material layer, a change in releasability, and the occurrence of curls and the like occurred.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、かかる問題
点を解決し、優れた接着性・耐熱性を有する品質の安定
した両面カバーレイフィルムの製造方法を提供しようと
するものである。SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems and to provide a method for producing a stable double-sided coverlay film having excellent adhesion and heat resistance.
【０００７】[0007]
【課題を解決するための手段】本発明者らは、鋭意検討
した結果、３層積層体フィルムと２層積層体フィルムを
組み合わせて用いることを見いだし、本発明を完成する
に至った。即ち、本発明は、離型材層／耐熱性接着剤層
／電気絶縁性フィルムの順に積層してなる３層積層体フ
ィルムと、耐熱性接着剤層と離型材層を積層してなる２
層積層体フィルムを用い、３層積層体フィルムの電気絶
縁性フィルムと、２層積層体フィルムの耐熱性接着剤層
とを貼り合わせる両面カバーレイフィルムの製造方法で
あって、３層積層体フィルムの電気絶縁性フィルムの、
少なくとも２層積層体フィルムの耐熱性接着剤層と貼り
合わせる面を、低温プラズマ処理し、且つこの貼り合わ
せを、温度４０〜１６０℃、線圧１〜２０ｋｇ／ｃｍで
行うことを特徴とする両面カバーレイフィルムの製造方
法である。Means for Solving the Problems As a result of intensive studies, the present inventors have found that a three-layer laminate film and a two-layer laminate film are used in combination, and have completed the present invention. That is, the present invention provides a three-layer laminate film in which a release material layer / a heat-resistant adhesive layer / an electrically insulating film is laminated in this order, and a heat-resistant adhesive layer and a release material layer which are laminated.
A method for producing a double-sided coverlay film, comprising bonding an electrically insulating film of a three-layer laminate film and a heat-resistant adhesive layer of a two-layer laminate film using the layer laminate film, the three-layer laminate film Of electrical insulating film,
At least the two surfaces of the two-layer laminated film to be bonded to the heat-resistant adhesive layer are subjected to low-temperature plasma treatment, and the bonding is performed at a temperature of 40 to 160 ° C. and a linear pressure of 1 to 20 kg / cm. This is a method for manufacturing a coverlay film.
【０００８】[0008]
【発明の実施の形態】以下、本発明を詳細に説明する。
本発明の両面カバーレイフィルムの製造方法は、上記し
たように３層積層体フィルムと２層積層体フィルムを用
いて、３層積層体フィルムの電気絶縁性フィルムと、２
層積層体フィルムの耐熱性接着剤層とを貼り合わせる
際、後記するような特定の条件で貼り合わせることを特
徴とするものである。本発明における３層積層体フィル
ムは、離型材層／耐熱性接着剤層／電気絶縁性フィルム
の順に積層したものであり、２層積層体フィルムは、耐
熱性接着剤層と離型材層を積層したものである本発明に
おける各積層体フィルムを構成する離型材層としては、
ポリエチレンフィルム、ポリプロピレンフィルム、ＴＰ
Ｘフィルム、シリコーン離型材層付きポリエチレンフィ
ルム及びポリプロピレンフィルム、ポリエチレン樹脂コ
ート紙、ポリプロピレン樹脂コート紙、ＴＰＸ樹脂コー
ト紙等が挙げられる。離型材層の厚さは、フィルムベー
スのもので１３〜７５μｍ、紙ベースのもので５０〜２
００μｍが好ましいが、必要に応じて適宜の厚さにすれ
ばよい。３層積層体フィルム及び２層積層体フィルムの
離型材層の材質は、上記例示中、いずれでもよいが、２
層積層体フィルムの離型材層には、離型性等の特性面か
ら、離型材層付きフィルムが特に好ましい。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.
The method for producing a double-sided coverlay film of the present invention uses the three-layer laminate film and the two-layer laminate film as described above,
When laminating the heat-resistant adhesive layer of the layer laminate film, it is characterized by laminating under specific conditions as described later. The three-layer laminate film of the present invention is obtained by laminating a release material layer / a heat-resistant adhesive layer / an electrically insulating film in this order. The two-layer laminate film is a laminate of a heat-resistant adhesive layer and a release material layer. As a release material layer constituting each laminated film in the present invention is a,
Polyethylene film, polypropylene film, TP
X film, polyethylene film and polypropylene film with silicone release material layer, polyethylene resin coated paper, polypropylene resin coated paper, TPX resin coated paper and the like. The thickness of the release material layer is 13 to 75 μm for a film base, and 50 to 2 μm for a paper base.
The thickness is preferably set to 00 μm, but may be set to an appropriate thickness as needed. The material of the release material layer of the three-layer laminate film and the two-layer laminate film may be any of those in the above examples.
As the release material layer of the layer laminate film, a film with a release material layer is particularly preferable from the viewpoint of characteristics such as releasability.
【０００９】本発明における各積層体フィルムを構成す
る耐熱性接着剤層としては、ナイロン／エポキシ樹脂
系、ニトリルゴム（以下、ＮＢＲと略称する）／エポキ
シ樹脂系、ポリエステル／エポキシ樹脂系、アクリル／
フェノール樹脂系等が挙げられ、特に接着性・耐熱性・
電気特性等の面から、ＮＢＲ／エポキシ樹脂系が好まし
い。３層積層体フィルムと２層積層体フィルムの耐熱性
接着剤層は、材質が同じであることが好ましいが、必要
に応じて異なった種類でもよい。耐熱性接着剤層の厚さ
は一般的に１０〜５０μｍであるが、使用状況等により
適宜決定すればよい。３層積層体フィルム及び２層積層
体フィルムの耐熱性接着剤層の厚さは、同じであること
が好ましいが、必要に応じて異なった厚さにしてもよ
い。The heat-resistant adhesive layer constituting each laminated film in the present invention includes nylon / epoxy resin, nitrile rubber (hereinafter abbreviated as NBR) / epoxy resin, polyester / epoxy resin, acryl /
Phenolic resin type, etc.
The NBR / epoxy resin system is preferred from the viewpoint of electrical characteristics and the like. The heat-resistant adhesive layers of the three-layer laminate film and the two-layer laminate film are preferably made of the same material, but may be of different types as necessary. The thickness of the heat-resistant adhesive layer is generally from 10 to 50 μm, but may be appropriately determined depending on the use conditions and the like. The thicknesses of the heat-resistant adhesive layers of the three-layer laminate film and the two-layer laminate film are preferably the same, but may be different if necessary.
【００１０】本発明における３層積層体フィルムを構成
する電気絶縁性フィルムとしては、ポリイミドフィル
ム、ＰＥＴ（ポリエチレンテレフタレート）フィルム、
ポリエステルフィルム、ポリパラバン酸フィルム、ポリ
エーテルエーテルケトンフィルム、ポリフェニルスルフ
ァイドフィルム、アラミドフィルム等が挙げられ、特に
耐熱性・寸法安定性の面からポリイミドフィルムが好ま
しい。電気絶縁性フィルムの厚さは、通常１２．５〜１
２５μｍの範囲であるが、必要に応じて適宜の厚さにす
ればよい。The electrically insulating film constituting the three-layer laminate film in the present invention includes a polyimide film, a PET (polyethylene terephthalate) film,
Examples thereof include a polyester film, a polyparabanic acid film, a polyetheretherketone film, a polyphenylsulfide film, and an aramid film, and a polyimide film is particularly preferable from the viewpoint of heat resistance and dimensional stability. The thickness of the electrically insulating film is usually 12.5-1.
The thickness is in the range of 25 μm, but may be appropriately adjusted as needed.
【００１１】本発明における３層積層体フィルムの電気
絶縁性フィルムは少なくとも２層積層体フィルムの耐熱
性接着剤層と貼り合わせる面が、低温プラズマ処理され
ているものである。低温プラズマ処理を施すことによ
り、３層積層体フィルムの電気絶縁性フィルム面と２層
積層体フィルムの耐熱性接着剤層との接着力が向上する
からである。本発明における低温プラズマ処理法として
は、減圧可能な低温プラズマ処理装置内に電気絶縁性フ
ィルムを入れ、該装置内を無機ガス雰囲気下におき、圧
力を０．００１〜１０Ｔｏｒｒ、好ましくは０．０１〜
１Ｔｏｒｒに保持した状態で、電極間に０．１〜１０ｋ
Ｖ前後の直流あるいは交流を印加してグロー放電させて
無機ガスの低温プラズマを発生させ、電気絶縁性フィル
ムを順次移動しながら、その表面を連続的にプラズマ処
理する。低温プラズマ処理の処理時間は概ね０．１〜１
００秒とするのがよい。無機ガスとしては、ヘリウム、
ネオン、アルゴン等の不活性ガス及び窒素、酸素、一酸
化炭素、二酸化炭素、アンモニア、空気等が使用される
が、これらは１種に限らず２種以上を混合して使用して
もよい。The electric insulating film of the three-layer laminate film in the present invention has a low-temperature plasma treatment on at least the surface of the two-layer laminate film to be bonded to the heat-resistant adhesive layer. This is because the low-temperature plasma treatment improves the adhesive strength between the electrically insulating film surface of the three-layer laminate film and the heat-resistant adhesive layer of the two-layer laminate film. As the low-temperature plasma processing method in the present invention, an electric insulating film is put in a low-pressure plasma processing apparatus capable of decompression, the apparatus is placed under an inorganic gas atmosphere, and the pressure is 0.001 to 10 Torr, preferably 0.01 to 10 Torr. ~
While holding at 1 Torr, 0.1-10k between electrodes
A DC or AC voltage of about V is applied to cause glow discharge to generate low-temperature plasma of inorganic gas, and the surface of the electrically insulating film is continuously plasma-treated while moving sequentially. The processing time of the low-temperature plasma processing is generally 0.1 to 1
00 seconds is recommended. Helium,
Inert gases such as neon and argon and nitrogen, oxygen, carbon monoxide, carbon dioxide, ammonia, air and the like are used, but these are not limited to one type, and two or more types may be used in combination.
【００１２】本発明における３層積層体フィルムを作製
するには通常用いられる方法を利用して行えばよい。例
えば、リバースロールコーター、コンマコーター、ダイ
ヘッドコーター等を用いて、予め調製された接着剤溶液
を、乾燥状態で厚さ１０〜５０μｍになるよう、電気絶
縁性フィルムに塗布する。そして、これをインラインド
ライヤーに温度４０〜１８０℃で１〜２０分間通して、
接着剤の溶剤を乾燥除去させ接着剤を半硬化状態にす
る。その後、加熱ロールにて接着剤塗布面に離型材層を
温度４０〜１６０℃、速度１〜２０ｍ／分、線圧１〜２
０ｋｇ／ｃｍで圧着する。これにより３層積層体フィル
ムが得られる。The production of the three-layer laminate film in the present invention may be carried out by using a commonly used method. For example, using a reverse roll coater, a comma coater, a die head coater, or the like, a previously prepared adhesive solution is applied to the electrically insulating film so as to have a thickness of 10 to 50 μm in a dry state. Then, pass this through an inline dryer at a temperature of 40 to 180 ° C. for 1 to 20 minutes,
The solvent of the adhesive is removed by drying to make the adhesive semi-cured. Thereafter, the release material layer is heated to a temperature of 40 to 160 ° C. at a speed of 1 to 20 m / min.
Crimping at 0 kg / cm. Thereby, a three-layer laminate film is obtained.
【００１３】本発明における２層積層体フィルムについ
ても、３層積層体フィルムの場合と同様にして作製すれ
ばよい。例えば、リバースロールコーター、コンマコー
ター、ダイヘッドコーター等を用いて、予め調製された
接着剤溶液を、乾燥状態で厚さ１０〜５０μｍになるよ
う電気絶縁性フィルムに塗布し、これをインラインドラ
イヤーに温度４０〜１８０℃で１〜２０分間通して、接
着剤の溶剤を乾燥除去させ、接着剤を半硬化状態とする
ことにより得られる。The two-layer laminate film of the present invention may be produced in the same manner as the three-layer laminate film. For example, using a reverse roll coater, comma coater, die head coater, or the like, a previously prepared adhesive solution is applied to an electrically insulating film in a dry state so as to have a thickness of 10 to 50 μm. It is obtained by passing the adhesive at a temperature of 40 to 180 ° C. for 1 to 20 minutes to dry and remove the solvent of the adhesive to make the adhesive into a semi-cured state.
【００１４】本発明においては３層積層体フィルムの電
気絶縁性フィルム面と、２層積層体フィルムの耐熱性接
着剤層とを貼り合わせるが、このとき貼り合わせは、温
度４０〜１６０℃、好ましくは６０〜１２０℃、更に好
ましくは８０〜１２０℃である。貼り合わせの線圧は１
〜２０ｋｇ／ｃｍ、好ましくは３〜１０ｋｇ／ｃｍ、速
度１〜２０ｍ／分の条件で貼り合わせることにより、両
面カバーレイフィルムが得られる。貼り合わせる際の温
度が４０℃未満であると、接着力が弱いために剥がれや
すくなり、１６０℃を超えると積層体フィルムが伸びて
表面に皺が発生し易くなる。貼り合わせる際の線圧が１
ｋｇ／ｃｍ未満であると、電気絶縁性フィルム面と耐熱
性接着剤層との密着性が悪く、剥がれや気泡混入の原因
となり、２０ｋｇ／ｃｍを超えると、密着力が強すぎる
ために皺の発生原因になる。また、貼り合わせる際の速
度が１ｍ／分未満であると、表面に皺が発生しやすくな
り、２０ｍ／分を超えると接着力が低下して剥がれ易く
なる。以上、説明した本発明方法により、離型材層／耐
熱性接着剤層／電気絶縁性フィルム／耐熱性接着剤層／
離型材層の順に積層してなる５層構造を有する両面カバ
ーレイフィルムが得られる。In the present invention, the surface of the electrically insulating film of the three-layer laminate film is bonded to the heat-resistant adhesive layer of the two-layer laminate film, and the bonding is performed at a temperature of 40 to 160 ° C., preferably. Is from 60 to 120C, more preferably from 80 to 120C. The bonding linear pressure is 1
By laminating under conditions of 20 kg / cm, preferably 3-10 kg / cm and a speed of 1-20 m / min, a double-sided coverlay film is obtained. If the temperature at the time of laminating is less than 40 ° C., the adhesive strength is weak and the film is easily peeled off. If the temperature exceeds 160 ° C., the laminate film is stretched and wrinkles are likely to be generated on the surface. Linear pressure when bonding is 1
If it is less than kg / cm, the adhesion between the surface of the electrically insulating film and the heat-resistant adhesive layer will be poor, causing peeling or air bubbles. If it exceeds 20 kg / cm, the adhesion will be too strong, and wrinkles will result. It causes the occurrence. When the bonding speed is less than 1 m / min, wrinkles are likely to be generated on the surface, and when the bonding speed is more than 20 m / min, the adhesive strength is reduced and the film is easily peeled off. According to the method of the present invention described above, the release material layer / heat-resistant adhesive layer / electrically insulating film / heat-resistant adhesive layer /
A double-sided coverlay film having a five-layer structure obtained by laminating the release material layers in this order is obtained.
【００１５】[0015]
【実施例】次に、本発明の実施態様を実施例を挙げて具
体的に説明するが、本発明はこれらに限定されるもので
はない。EXAMPLES Next, embodiments of the present invention will be specifically described with reference to examples, but the present invention is not limited to these.
【００１６】（実施例１）電気絶縁性フィルムである、
厚さ２５μｍ、幅５１４ｍｍのポリイミドフィルム・カ
プトン（東レ・デュポン社製商品名）の両面に対し、連
続プラズマ処理装置により低温プラズマ処理を行った。
その際、真空度０．１Ｔｏｒｒ以下、酸素流量２．０Ｌ
／分で酸素供給し、印加電圧２ｋＶ、周波数１１０ｋＨ
ｚで３０ｋＷの電力を入力した。連続プラズマ処理装置
は、電極４本を円筒状に配置したもので、電極の外側４
０ｍｍの距離でカプトンフィルムを電極の外周に沿って
１０．０ｍ／分、処理時間約２５秒で移動させプラズマ
処理した。このカプトンフィルム上に、乾燥後の厚みが
２５μｍになるようコンマコーターを用いて、ＮＢＲ／
エポキシ系接着剤を塗布し、インラインドライヤーで温
度１２０℃以下で溶剤を除去して、該接着剤を半硬化状
態（耐熱性接着剤層）とした。そして、得られた積層体
を、温度７０℃、速度１０．０ｍ／分、線圧５．０ｋｇ
／ｃｍの条件で、シリコーン樹脂処理を施したポリエチ
レンコート紙（離型材層）と貼り合わせ、離型材層／耐
熱性接着剤層／電気絶縁性フィルムの順に積層した３層
積層体フィルムを作製した。(Example 1) An electrically insulating film,
Both surfaces of a polyimide film Kapton (trade name, manufactured by Du Pont-Toray Co., Ltd.) having a thickness of 25 μm and a width of 514 mm were subjected to low-temperature plasma treatment by a continuous plasma treatment device.
At this time, the degree of vacuum is 0.1 Torr or less, and the oxygen flow rate is 2.0 L.
/ Min, oxygen applied at 2 kV, frequency 110 kHz
A power of 30 kW was input at z. In the continuous plasma processing apparatus, four electrodes are arranged in a cylindrical shape.
At a distance of 0 mm, the Kapton film was moved along the outer periphery of the electrode at 10.0 m / min for a processing time of about 25 seconds to perform plasma processing. On this Kapton film, NBR /
An epoxy-based adhesive was applied, and the solvent was removed at a temperature of 120 ° C. or lower with an inline dryer to make the adhesive into a semi-cured state (heat-resistant adhesive layer). Then, the obtained laminate was subjected to a temperature of 70 ° C., a speed of 10.0 m / min, and a linear pressure of 5.0 kg.
And a silicone resin-treated polyethylene-coated paper (release material layer) under the condition of / cm, to produce a three-layer laminate film in which a release material layer / a heat-resistant adhesive layer / an electrically insulating film were laminated in this order. .
【００１７】次に、シリコーンで表面処理された厚さ２
５μｍ、幅５２０ｍｍのＰＥＴフィルム（離型材層）上
に、乾燥後の厚みが２５μｍになるようコンマコーター
を用いて、ＮＢＲ／エポキシ系接着剤を塗布し、インラ
インドライヤーにて温度１２０℃下で溶剤を除去して、
該接着剤を半硬化状態（耐熱性接着剤層）とし、耐熱性
接着剤層と離型材層を積層した２層積層体フィルムを作
製した。この２層積層体フィルムの耐熱性接着剤層と前
記３層積層体フィルムのカプトンフィルムとを温度７０
℃、速度１０．０ｍｍ／分、線圧５．０ｋｇ／ｃｍの条
件で貼り合わせて、離型材層／耐熱性接着剤層／電気絶
縁性フィルム／耐熱性接着剤層／離型材層の順に積層し
てなる５層構造を有する両面カバーレイフィルムを作製
した。この両面カバーレイフィルムの特性を、後記する
方法で作製した評価用サンプルについて、後記する方法
で評価し、結果を（表１）に示した。Next, a silicone-treated surface having a thickness of 2
Using a comma coater, apply an NBR / epoxy adhesive on a PET film (release material layer) having a width of 5 μm and a width of 520 mm so that the thickness after drying becomes 25 μm. To remove
The adhesive was in a semi-cured state (heat-resistant adhesive layer), and a two-layer laminate film in which the heat-resistant adhesive layer and the release material layer were laminated was produced. The heat-resistant adhesive layer of the two-layer laminate film and the Kapton film of the three-layer laminate film were heated at a temperature of 70.
C., speed: 10.0 mm / min, linear pressure: 5.0 kg / cm, and laminated in the following order: release material layer / heat-resistant adhesive layer / electric insulating film / heat-resistant adhesive layer / release material layer Thus, a double-sided coverlay film having a five-layer structure was prepared. The characteristics of the double-sided coverlay film were evaluated by a method described later for an evaluation sample prepared by a method described later, and the results are shown in (Table 1).
【００１８】（実施例２）厚さ２５μｍ、幅５１４ｍｍ
のカプトンフィルム（前出）の片面（２層積層体フィル
ムの耐熱性接着剤層と貼り合わせる面、表１中のＢ面）
を連続プラズマ処理装置により低温プラズマ処理した以
外は、実施例１と同じ方法・条件で両面カバーレイフィ
ルムを作製した。この両面カバーレイフィルムの特性
を、後記する方法で作製した評価用サンプルについて後
記する方法で評価し、結果を（表１）に示した。(Example 2) thickness 25 μm, width 514 mm
One side of the Kapton film (described above) (the surface to be bonded to the heat-resistant adhesive layer of the two-layer laminate film, the B surface in Table 1)
Was prepared in the same manner and under the same conditions as in Example 1 except that was subjected to low-temperature plasma treatment by a continuous plasma treatment apparatus. The characteristics of the double-sided coverlay film were evaluated by the method described later for evaluation samples prepared by the method described later, and the results are shown in (Table 1).
【００１９】（実施例３）ＮＢＲ／エポキシ系接着剤の
塗布厚を２５μｍから３５μｍに変更し、かつ、２層積
層体フィルムの耐熱性接着剤層と３層積層体フィルムの
カプトンフィルムとを貼り合わせる際の温度条件を７０
℃から１００℃に、線圧条件を５．０ｋｇ／ｃｍから３
ｋｇ／ｃｍに変更した以外は、実施例１と同じ方法・条
件で両面カバーレイフィルムを作製した。この両面カバ
ーレイフィルムの特性を、後記する方法で作製した評価
用サンプルについて後記する方法で評価し、結果を（表
１）に示した。Example 3 The coating thickness of the NBR / epoxy adhesive was changed from 25 μm to 35 μm, and the heat-resistant adhesive layer of the two-layer laminate film and the Kapton film of the three-layer laminate film were adhered. The temperature condition when matching is 70
℃ to 100 ℃, linear pressure condition from 5.0 kg / cm to 3
A double-sided coverlay film was produced in the same manner and under the same conditions as in Example 1 except that the weight was changed to kg / cm. The characteristics of the double-sided coverlay film were evaluated by the method described later for evaluation samples prepared by the method described later, and the results are shown in (Table 1).
【００２０】（実施例４）低温プラズマ処理を行う際の
無機ガスを酸素から窒素に変更し、ＮＢＲ／エポキシ系
接着剤の塗布厚を２５μｍから３５μｍに変更し、か
つ、２層積層体フィルムの耐熱性接着剤層と３層積層体
フィルムのカプトンフィルムとを貼り合わせる際の温度
条件を７０℃から１２０℃に、線圧条件を５．０ｋｇ／
ｃｍから３．０ｋｇ／ｃｍに変更した以外は、実施例１
と同じ方法・条件で両面カバーレイフィルムを作製し
た。この両面カバーレイフィルムの特性を、後記する方
法で作製した評価用サンプルについて後記する方法で評
価し、結果を（表１）に示した。(Example 4) The inorganic gas used in the low-temperature plasma treatment was changed from oxygen to nitrogen, the coating thickness of the NBR / epoxy adhesive was changed from 25 μm to 35 μm, and the two-layer laminate film was The temperature conditions for laminating the heat-resistant adhesive layer and the Kapton film of the three-layer laminate film were from 70 ° C to 120 ° C, and the linear pressure condition was 5.0 kg /.
Example 1 except that cm was changed to 3.0 kg / cm.
A double-sided coverlay film was produced in the same manner and under the same conditions as described above. The characteristics of the double-sided coverlay film were evaluated by the method described later for evaluation samples prepared by the method described later, and the results are shown in (Table 1).
【００２１】（実施例５）低温プラズマ処理を行う際の
処理速度を１０．０ｍ／分から３０．０ｍ／分に変更
し、かつ、ＮＢＲ／エポキシ系接着剤の塗布厚を２５μ
ｍから３５μｍに変更した以外は、実施例１と同じ方法
・条件で両面カバーレイフィルムを作製した。この両面
カバーレイフィルムの特性を、後記する方法で作製した
評価用サンプルについて後記する方法で評価し、結果を
（表１）に示した。(Embodiment 5) The processing speed for performing low-temperature plasma processing was changed from 10.0 m / min to 30.0 m / min, and the coating thickness of the NBR / epoxy adhesive was 25 μm.
A double-sided coverlay film was produced in the same manner and under the same conditions as in Example 1 except that m was changed to 35 μm. The characteristics of the double-sided coverlay film were evaluated by the method described later for evaluation samples prepared by the method described later, and the results are shown in (Table 1).
【００２２】（実施例６）ＮＢＲ／エポキシ系接着剤の
塗布厚を２５μｍから５０μｍに変更し、かつ、２層積
層体フィルムの耐熱性接着剤層と３層積層体フィルムの
カプトンフィルムとを貼り合わせる際の温度条件を７０
℃から１００℃に変更した以外は、実施例１と同じ方法
・条件で両面カバーレイフィルムを作製した。この両面
カバーレイフィルムの特性を、後記する方法で作製した
評価用サンプルについて後記する方法で評価し、結果を
（表１）に示した。Example 6 The coating thickness of the NBR / epoxy adhesive was changed from 25 μm to 50 μm, and the heat-resistant adhesive layer of the two-layer laminate film and the Kapton film of the three-layer laminate film were adhered. The temperature condition when matching is 70
A double-sided coverlay film was produced in the same manner and under the same conditions as in Example 1 except that the temperature was changed from 100 ° C. to 100 ° C. The characteristics of the double-sided coverlay film were evaluated by the method described later for evaluation samples prepared by the method described later, and the results are shown in (Table 1).
【００２３】（実施例７）ＮＢＲ／エポキシ系接着剤の
塗布厚を２５μｍから３５μｍに変更し、かつ、２層積
層体フィルムの耐熱性接着剤層と３層積層体フィルムの
カプトンフィルムとを貼り合わせる際の線圧を５．０ｋ
ｇ／ｃｍから１０．０ｋｇ／ｃｍに変更した以外は、実
施例１と同じ方法・条件で両面カバーレイフィルムを作
製した。この両面カバーレイフィルムの特性を、後記す
る方法で作製した評価用サンプルについて後記する方法
で評価し、結果を（表１）に示した。Example 7 The coating thickness of the NBR / epoxy adhesive was changed from 25 μm to 35 μm, and the heat-resistant adhesive layer of the two-layer laminate film and the Kapton film of the three-layer laminate film were adhered. 5.0k linear pressure when combined
A double-sided coverlay film was produced in the same manner and under the same conditions as in Example 1 except that g / cm was changed to 10.0 kg / cm. The characteristics of the double-sided coverlay film were evaluated by the method described later for evaluation samples prepared by the method described later, and the results are shown in (Table 1).
【００２４】（比較例１）実施例１使用したカプトンフ
ィルム（前出）上に、乾燥後の厚みが２５μｍになるよ
うにコンマコーターを用いて、ＮＢＲ／エポキシ系接着
剤を塗布し、インラインドライヤーで温度１２０℃以下
で溶剤を除去、接着剤を半硬化状態（耐熱性接着剤層）
とした。得られた積層体の耐熱性接着剤層を温度７０
℃、速度１０．０ｍ／分、線圧５．０ｋｇ／ｃｍの条件
で剥離紙（前出）と貼り合わせ、離型材層／耐熱性接着
剤層／電気絶縁性フィルムの順に積層した３層積層体フ
ィルムを作製した。続いて、この３層積層体フィルムの
カプトンフィルムのもう一方の面に、乾燥後の厚みが２
５μｍになるようにコンマコーターを用いて、ＮＢＲ／
エポキシ系接着剤を塗布し、インラインドライヤーにて
温度１２０℃以下で溶剤を除去、接着剤を半硬化状態
（耐熱性接着剤層）とした。そして、この耐熱性接着剤
層にシリコーン樹脂処理を施したポリエチレンコート紙
（前出）を温度７０℃、速度１０．０ｍ／分、線圧５．
０ｋｇ／ｃｍの条件で貼り合わせて両面カバーレイフィ
ルムを作製した。この両面カバーレイフィルムの特性
を、後記する方法で作製した評価用サンプルについて後
記する方法で評価し、結果を（表１）に示した。(Comparative Example 1) An NBR / epoxy adhesive was applied on a Kapton film (described above) using a comma coater so that the thickness after drying was 25 μm. The solvent is removed at a temperature of 120 ° C. or less, and the adhesive is in a semi-cured state (heat-resistant adhesive layer)
And The heat-resistant adhesive layer of the obtained laminate was heated to a temperature of 70.
At a temperature of 10.0 ° C., a speed of 10.0 m / min, and a linear pressure of 5.0 kg / cm, a three-layer lamination is performed by laminating a release paper layer, a heat-resistant adhesive layer and an electrically insulating film in this order. A body film was prepared. Subsequently, on the other surface of the Kapton film of the three-layer laminate film, the thickness after drying was 2
Using a comma coater, NBR /
An epoxy-based adhesive was applied, and the solvent was removed at a temperature of 120 ° C. or lower using an inline dryer, and the adhesive was brought into a semi-cured state (heat-resistant adhesive layer). Then, a polyethylene-coated paper (described above) in which this heat-resistant adhesive layer was subjected to a silicone resin treatment was applied at a temperature of 70 ° C., a speed of 10.0 m / min, and a linear pressure of 5.
The two-sided cover lay film was produced by laminating under a condition of 0 kg / cm. The characteristics of the double-sided coverlay film were evaluated by the method described later for evaluation samples prepared by the method described later, and the results are shown in (Table 1).
【００２５】（比較例２）厚さ２５μｍ、幅５１４ｍｍ
のカプトンフィルム（前出）に連続プラズマ処理装置に
より低温プラズマ処理を行わなかったこと以外は、実施
例１と同じ方法・条件で両面カバーレイフィルムを作製
した。この両面カバーレイフィルムの特性を、後記する
方法で作製した評価用サンプルについて後記する方法で
評価し、結果を（表１）に示した。(Comparative Example 2) thickness 25 μm, width 514 mm
A double-sided coverlay film was produced in the same manner and under the same conditions as in Example 1 except that the low temperature plasma treatment was not performed on the Kapton film (described above) by the continuous plasma treatment apparatus. The characteristics of the double-sided coverlay film were evaluated by the method described later for evaluation samples prepared by the method described later, and the results are shown in (Table 1).
【００２６】（比較例３）ＮＢＲ／エポキシ系接着剤の
塗布厚が３５μｍで、かつ、２層積層体フィルムの耐熱
性接着剤層と３層積層体フィルムのカプトンフィルムと
を貼り合わせる際の温度を１８０℃とした以外は、実施
例１と同じ方法・条件で両面カバーレイフィルムを作製
した。この両面カバーレイフィルムの特性を、後記する
方法で作製した評価用サンプルについて後記する方法で
評価し、結果を（表１）に示した。(Comparative Example 3) Temperature at which the NBR / epoxy adhesive was applied at a thickness of 35 μm and the heat-resistant adhesive layer of the two-layer laminate film was bonded to the Kapton film of the three-layer laminate film. Was changed to 180 ° C., and a double-sided coverlay film was produced in the same manner and under the same conditions as in Example 1. The characteristics of the double-sided coverlay film were evaluated by the method described later for evaluation samples prepared by the method described later, and the results are shown in (Table 1).
【００２７】（比較例４）ＮＢＲ／エポキシ系接着剤の
塗布厚を３５μｍで、かつ、２層積層体フィルムの耐熱
性接着剤層と３層積層体フィルムのカプトンフィルムと
を貼り合わせる際の線圧を３０．０ｋｇ／ｃｍとした以
外は、実施例１と同じ方法・条件で両面カバーレイフィ
ルムを作製した。この両面カバーレイフィルムの特性
を、後記する方法で作製した評価用サンプルについて後
記する方法で評価し、結果を（表１）に示した。(Comparative Example 4) A line for bonding an NBR / epoxy adhesive having a coating thickness of 35 μm and bonding a heat-resistant adhesive layer of a two-layer laminate film to a Kapton film of a three-layer laminate film. A double-sided coverlay film was produced in the same manner and under the same conditions as in Example 1 except that the pressure was 30.0 kg / cm. The characteristics of the double-sided coverlay film were evaluated by the method described later for evaluation samples prepared by the method described later, and the results are shown in (Table 1).
【００２８】（比較例５）２層積層体フィルムの耐熱性
接着剤層と３層積層体フィルムのカプトンフィルムとを
貼り合わせる際の温度条件を３０℃、線圧条件を０．５
ｋｇ／ｃｍとした以外は、実施例１と同じ方法・条件で
両面カバーレイフィルムを作製した。この両面カバーレ
イフィルムの特性を、後記する方法で作製した評価用サ
ンプルについて後記する方法で評価し、結果を（表１）
に示した。(Comparative Example 5) The temperature conditions for bonding the heat-resistant adhesive layer of the two-layer laminate film to the Kapton film of the three-layer laminate film were 30 ° C and the linear pressure condition was 0.5.
A double-sided coverlay film was produced in the same manner and under the same conditions as in Example 1 except that the weight was set to kg / cm. The characteristics of the double-sided coverlay film were evaluated by the method described later for the evaluation sample prepared by the method described later, and the results were obtained (Table 1).
It was shown to.
【００２９】ここで、（表１）記載の諸特性の評価方法
及び評価用サンプルの作製方法について記載する。 ［評価用サンプル作製方法］両面カバーレイフィルムの
離型材層を剥がし、両接着剤塗布面に各々電解銅箔・Ｊ
ＴＣ箔（ジャパンエナジー社製商品名）の光沢面を貼り
合わせ、１６０℃×５０ｋｇ／ｃｍ２ の条件で３０分
間加熱圧着したものを用いた。Here, a method for evaluating various characteristics described in Table 1 and a method for preparing a sample for evaluation will be described. [Evaluation sample preparation method] The release material layer of the double-sided coverlay film was peeled off, and electrolytic copper foil
A glossy surface of a TC foil (trade name, manufactured by Japan Energy Co., Ltd.) was adhered, and heated and pressed for 30 minutes at 160 ° C. × 50 kg / cm 2 .
【００３０】［諸特性の測定方法及び検査方法］ イ）剥離強度［ｋｇ/ ｃｍ］：ＪＩＳ Ｃ ６４７１に準
拠して、１０ｍｍ幅にカットしたサンプルを９０度方向
に５０ｍｍ／分の速度で銅箔側から引き剥がしその強度
を測定した。 ロ）半田耐熱性［℃］：ＪＩＳ Ｃ ６４７１に準拠し
て、２０℃、６０％ＲＨの条件の下で２４時間調整を行
ったサンプルを２５ｍｍ角にカットし、これを半田浴上
に３０秒間浮かべた後、外観を目視により検査し、フク
レ・ハガレ等が生じない最高温度を測定した。 ハ）カバーレイフィルムのカール性［ｍｍ］：カバーレ
イフィルムのサンプルの頂点４点のカール（平面に置い
た時の高さ）を測定し、４点の値を平均とした。ニ）外
観検査：カバーレイフィルムの外観において、皺・剥が
れが見られるか否か、気泡が発生しているか否かを目視
により確認した。 ・皺・剥がれが見られるか ○：見られない ×：見られる ・気泡が発生しているか ○：発生していない ×：発生している[Measurement Method and Inspection Method for Various Properties] a) Peel strength [kg / cm]: A copper foil is cut at a rate of 50 mm / min in a 90 ° direction from a sample cut to a width of 10 mm in accordance with JIS C6471. It was peeled off from the side and its strength was measured. B) Solder heat resistance [° C.]: A sample that has been adjusted for 24 hours under the conditions of 20 ° C. and 60% RH according to JIS C 6471 is cut into a 25 mm square, and this is placed on a solder bath for 30 seconds. After floating, the appearance was visually inspected, and the maximum temperature at which blistering and peeling did not occur was measured. C) Curling property of coverlay film [mm]: Curling (height when placed on a flat surface) at four vertices of a sample of the coverlay film was measured, and the values at four points were averaged. D) Appearance inspection: In the appearance of the coverlay film, it was visually confirmed whether wrinkles and peeling were observed and whether or not bubbles were generated. -Whether wrinkles / peeling is seen ○: Not seen ×: Can be seen-Whether bubbles are generated ○: Not generated ×: Generated
【００３１】[0031]
【表１】 [Table 1]
【００３２】[0032]
【発明の効果】本発明により、優れた接着性・耐熱性を
有し、かつ、品質の良好な両面カバーレイフィルムを提
供することが可能となり、それにより製造の安定化が図
られ、実用上、その利用価値は非常に高い。According to the present invention, it is possible to provide a double-sided coverlay film having excellent adhesiveness and heat resistance and good quality, thereby stabilizing the production and realizing practical use. , Its utility value is very high.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 栄口 吉次 茨城県鹿島郡神栖町大字東和田１番地 信 越化学工業株式会社塩ビ技術研究所内 Ｆターム(参考） 4F100 AK04A AK27B AK27D AK27G AK27J AK29B AK29D AK29G AK29J AK42E AK49C AK52A AK53B AK53D AK53G AL01B AL01D AL01G BA05 BA07 BA10A BA10E CA30A CA30E CB00 CB00B CB00D DG10A EJ172 EJ241 EJ422 EJ611 GB43 JG04C JJ03 JJ03B JJ03D JL11 4J004 AA05 AA10 AA12 AA13 AA15 AA16 AB05 CA06 CB03 CC02 CD08 CE01 DB01 DB02 DB03 EA05 FA04 FA05 GA01 5E314 AA31 AA32 AA33 AA34 CC15 DD01 FF06 GG08 GG24 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Yoshiji Sakaguchi 1-family Towada, Kamisu-cho, Kashima-gun, Ibaraki Pref. AK29G AK29J AK42E AK49C AK52A AK53B AK53D AK53G AL01B AL01D AL01G BA05 BA07 BA10A BA10E CA30A CA30E CB00 CB00B CB00D DG10A EJ172 EJ241 EJ422 EJ611 GB43 JG04C JJ03 JJ03B JJ03D JL11 4J004 AA05 AA10 AA12 AA13 AA15 AA16 AB05 CA06 CB03 CC02 CD08 CE01 DB01 DB02 DB03 EA05 FA04 FA05 GA01 5E314 AA31 AA32 AA33 AA34 CC15 DD01 FF06 GG08 GG24
Claims (1)
フィルムの順に積層してなる３層積層体フィルムと、耐
熱性接着剤層と離型材層を積層してなる２層積層体フィ
ルムを用い、３層積層体フィルムの電気絶縁性フィルム
と、２層積層体フィルムの耐熱性接着剤層とを貼り合わ
せる両面カバーレイフィルムの製造方法であって、３層
積層体フィルムの電気絶縁性フィルムの、少なくとも２
層積層体フィルムの耐熱性接着剤層と貼り合わせる面
を、低温プラズマ処理し、且つこの貼り合わせを、温度
４０〜１６０℃、線圧１〜２０ｋｇ／ｃｍで行うことを
特徴とする両面カバーレイフィルムの製造方法。1. A three-layer laminate film in which a release material layer / a heat-resistant adhesive layer / an electrically insulating film is laminated in this order, and a two-layer laminate in which a heat-resistant adhesive layer and a release material layer are laminated. A method for producing a double-sided coverlay film using a film and bonding an electrically insulating film of a three-layer laminate film and a heat-resistant adhesive layer of a two-layer laminate film, wherein the electrical insulation of the three-layer laminate film is performed. At least 2
A double-sided coverlay, characterized in that the surface of the layer laminate film to be bonded to the heat-resistant adhesive layer is subjected to low-temperature plasma treatment, and the bonding is performed at a temperature of 40 to 160 ° C and a linear pressure of 1 to 20 kg / cm. Film production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11052120A JP2000248239A (en) | 1999-03-01 | 1999-03-01 | Production of double-sided cover lay film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11052120A JP2000248239A (en) | 1999-03-01 | 1999-03-01 | Production of double-sided cover lay film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000248239A true JP2000248239A (en) | 2000-09-12 |
Family
ID=12906029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11052120A Pending JP2000248239A (en) | 1999-03-01 | 1999-03-01 | Production of double-sided cover lay film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000248239A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006310643A (en) * | 2005-04-28 | 2006-11-09 | Sumitomo Electric Ind Ltd | Flexible printed wiring board |
-
1999
- 1999-03-01 JP JP11052120A patent/JP2000248239A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006310643A (en) * | 2005-04-28 | 2006-11-09 | Sumitomo Electric Ind Ltd | Flexible printed wiring board |
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