JP2000208981A - Environment-oriented fg structure - Google Patents
Environment-oriented fg structureInfo
- Publication number
- JP2000208981A JP2000208981A JP11008507A JP850799A JP2000208981A JP 2000208981 A JP2000208981 A JP 2000208981A JP 11008507 A JP11008507 A JP 11008507A JP 850799 A JP850799 A JP 850799A JP 2000208981 A JP2000208981 A JP 2000208981A
- Authority
- JP
- Japan
- Prior art keywords
- spring
- substrate
- shield plates
- shield plate
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、電子機器のEMI
対策における環境に配慮した環境配慮型FG構造に関す
る。[0001] The present invention relates to EMI of electronic equipment.
The present invention relates to an environment-friendly FG structure that takes the environment into consideration.
【0002】[0002]
【従来の技術】従来、パ−ソナルコンピュ−タ等の電子
機器のEMI対策として、特開平8−307084号公
報および特開平4−116899号公報に示すように、
電子機器の基板を収容するプラスチック製の上下ケ−ス
の内側に導電性シールドメッキやアルミ蒸着を施すこと
で上下ケース内部を電気的にシ−ルドするものがある。2. Description of the Related Art Conventionally, as measures against EMI of electronic devices such as personal computers, as disclosed in Japanese Patent Application Laid-Open Nos. Hei 8-307084 and Hei 4-116899,
In some cases, the inside of the upper and lower cases is electrically shielded by applying conductive shield plating or aluminum vapor deposition to the inside of the upper and lower plastic casings for accommodating the substrates of electronic equipment.
【0003】また、図5に示すように、プラスチック製
の下ケースの内側に配置される下シールド板51の一部
底部を切り起こし、基板を固定するための固定部51a
を形成したものがある。As shown in FIG. 5, a lower part of a lower shield plate 51 disposed inside a lower case made of plastic is cut and raised, and a fixing part 51a for fixing a substrate is provided.
Is formed.
【0004】また、図6に示すように、下シ−ルド板5
2の底部に別部品である金属スタッド52aを圧着や溶
接等により基板等の固定部として設けたものがある。[0004] As shown in FIG. 6, a lower shield plate 5 is provided.
In some cases, a metal stud 52a, which is a separate component, is provided as a fixing portion for a substrate or the like by crimping or welding at the bottom of the base 2.
【0005】また、図7に示すように、下シ−ルド板5
3の側面に板金曲げ加工を施し、固定部53aを設けた
ものがある。[0007] As shown in FIG.
In some cases, the side surface of No. 3 is subjected to sheet metal bending to provide a fixing portion 53a.
【0006】[0006]
【発明が解決しようとする課題】ところが、特開平8−
307084号公報および特開平4−116899号公
報のものは、電子機器の廃棄時に上下ケ−スのメッキ等
の分離が困難であるという問題点がある。SUMMARY OF THE INVENTION However, Japanese Patent Application Laid-Open No. 8-
Japanese Patent Application Laid-Open No. 307084 and Japanese Patent Application Laid-Open No. 4-116899 have a problem that it is difficult to separate upper and lower cases of plating and the like when disposing of electronic equipment.
【0007】また、図5に示すものは、固定部51aを
形成する際、切り欠き部51bが生じるため、EMI対
策として重要なシ−ルド効果が大幅に低下するという問
題点がある。In addition, the structure shown in FIG. 5 has a problem that a notch portion 51b is formed when the fixing portion 51a is formed, so that the shielding effect which is important as a measure against EMI is greatly reduced.
【0008】また、図6に示すものは、図5に示す切り
欠き部51bが無く、シ−ルド効果は高いが、圧着や溶
接を行うため、下シ−ルド板52に板厚の薄い材料が使
用できず、電子機器の重量の増加を招き、圧着や溶接等
により製造コストが上がるという問題点がある。The one shown in FIG. 6 does not have the notch 51b shown in FIG. 5 and has a high shielding effect. However, since the crimping and welding are performed, the lower shield plate 52 is made of a thin material. However, there is a problem that the weight of the electronic device is increased, and the manufacturing cost is increased by crimping or welding.
【0009】また、図7に示すものも、図5に示すよう
な切り欠き部51bが無く、シ−ルド効果は高いが、曲
げ加工における制限が多く汎用性に欠けるという問題点
がある。Also, the one shown in FIG. 7 does not have the notch 51b as shown in FIG. 5 and has a high shielding effect, but has a problem in that it has many limitations in bending and lacks versatility.
【0010】本発明は、このような従来の問題点に鑑み
てなされたもので、材料毎の分別が容易にでき、優れた
シールド効果を有する環境配慮型FG構造を提供するこ
とを目的とする。The present invention has been made in view of such conventional problems, and an object of the present invention is to provide an environment-friendly FG structure which can easily separate materials and has an excellent shielding effect. .
【0011】本発明の前記ならびにその他の目的と新規
な特徴は、本明細書の記述および添付図面から明らかに
なるであろう。The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.
【課題を解決するための手段】前述した目的を達成する
ため、本発明は、複数のケースと、導電性を有し前記複
数のケースの内側に個別に配置された複数のシールド板
と、導電性を有する弾性体とを備え、前記複数のシール
ド板の間に基板および前記弾性体を配置し、前記弾性体
の弾性を利用して前記基板および前記複数のシールド板
を電気的に接続したことを特徴とする。また、複数のケ
ースと、導電性を有し前記複数のケースの内側に個別に
配置された複数のシールド板と、前記複数のシールド板
の間に配置された基板および導電性を有するFGスプリ
ングとを備え、前記FGスプリングを前記複数のシール
ド板および前記基板に接触するように配置し、前記FG
スプリングの弾性を利用して前記複数のシールド板およ
び前記基板を電気的に接続したことを特徴とする。ま
た、下ケース内に固定用ボス部が設けられ、前記下ケ−
スの内側に導電性を有する下シ−ルド板が配置され、前
記固定用ボス部に導電性を有するFGスプリングおよび
基板が固定ネジにより締結固定され、前記FGスプリン
グ、前記基板および前記下シールド板上に上ケ−スおよ
び前記上ケ−スの内側に配置され導電性を有する上シー
ルド板が覆設され、前記FGスプリングを前記上下シー
ルド板および前記基板に接触させ、前記FGスプリング
の弾性を利用して前記上下シールド板および前記基板を
電気的に接続したことを特徴とする。さらに、前記上下
シ−ルド板の材料として、ポリエステル等のプラスチッ
クのシ−トに金属箔を接着したシ−ト材を用いたことを
特徴とする。さらに、前記金属箔はアルミ箔であること
を特徴とする。さらに、前記FGスプリングの材料とし
て、バネ用リン青銅を用いたことを特徴とする。さら
に、前記FGスプリングの材料として、バネ用SUSを
用いたことを特徴とする。SUMMARY OF THE INVENTION In order to achieve the above-mentioned object, the present invention comprises a plurality of cases, a plurality of shield plates having conductivity and individually arranged inside the plurality of cases, and An elastic body having a characteristic, wherein the substrate and the elastic body are arranged between the plurality of shield plates, and the substrate and the plurality of shield plates are electrically connected by utilizing the elasticity of the elastic body. And Also, a plurality of cases, a plurality of shield plates having conductivity and individually disposed inside the plurality of cases, and a substrate and a FG spring having conductivity disposed between the plurality of shield plates are provided. And disposing the FG spring so as to contact the plurality of shield plates and the substrate.
The plurality of shield plates and the substrate are electrically connected by utilizing the elasticity of a spring. Further, a fixing boss is provided in the lower case, and the lower case is provided.
A lower shield plate having conductivity is disposed inside of the boss, and an FG spring and a substrate having conductivity are fastened and fixed to the fixing boss portion by fixing screws, and the FG spring, the substrate, and the lower shield plate are fixed. An upper case and a conductive upper shield plate disposed inside the upper case and covered with the upper case are covered thereon, and the FG spring is brought into contact with the upper and lower shield plates and the substrate to reduce the elasticity of the FG spring. The upper and lower shield plates and the substrate are electrically connected by utilizing. Further, as a material of the upper and lower shield plates, a sheet material in which a metal foil is bonded to a plastic sheet such as polyester is used. Further, the metal foil is an aluminum foil. Further, a phosphor bronze for a spring is used as a material of the FG spring. Further, a SUS for a spring is used as a material of the FG spring.
【0012】[0012]
【発明の実施の形態】以下、本発明の実施の形態につい
て、図1〜図4に基づき説明する。なお、図1は、本発
明の一実施の形態に係る環境配慮型FG構造の組み立て
斜視図、図2は、図1のA−A断面図、図3は、本発明
の他の実施の形態に係る環境配慮型FG構造の組み立て
斜視図、図4は、図3のB−B断面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to FIGS. 1 is an assembled perspective view of an environment-friendly FG structure according to one embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA of FIG. 1, and FIG. 3 is another embodiment of the present invention. FIG. 4 is an assembled perspective view of the environmentally friendly FG structure according to FIG.
【0013】図1、2において、プラスチック製の下ケ
−ス1の底部上に所定間隔をおいて1対の固定用ボス部
1aが立設され、下ケ−ス1の内側には穴部2aを有す
る下シ−ルド板2が配置され、固定用ボス部1aは下シ
−ルド板2の穴部2aに嵌挿している。In FIGS. 1 and 2, a pair of fixing bosses 1a are erected at predetermined intervals on the bottom of a lower case 1 made of plastic, and a hole is formed inside the lower case 1. A lower shield plate 2 having a lower shield plate 2a is disposed, and the fixing boss 1a is inserted into a hole 2a of the lower shield plate 2.
【0014】電子機器の基板4の表裏面の長手方向両端
にはFGベタパタ−ン部4aが形成され、下ケ−ス1の
固定用ボス部1a上には、下接地部3a、上接地部3b
および中接地部3cからなるFGスプリング3の中接地
部3c、基板4のFGベタパタ−ン部4aが固定ネジ5
により順次締結固定されている。このとき、FGスプリ
ング3は下ケ−ス1の位置決め用リブ1bによって位置
決めされる。FG solid pattern portions 4a are formed at both longitudinal ends of the front and back surfaces of the substrate 4 of the electronic device, and a lower grounding portion 3a and an upper grounding portion are formed on the fixing boss portion 1a of the lower case 1. 3b
The FG spring 3 including the middle ground portion 3c and the middle ground portion 3c of the FG spring 3 and the FG solid pattern portion 4a
Are sequentially fastened and fixed. At this time, the FG spring 3 is positioned by the positioning rib 1b of the lower case 1.
【0015】基板4、FGスプリング3および下シール
ド板2上には、プラスチック製の上ケ−ス7および上ケ
−ス7の内側に配置された上シールド板6が覆設されて
いる。A plastic upper case 7 and an upper shield plate 6 disposed inside the upper case 7 are covered on the substrate 4, the FG spring 3 and the lower shield plate 2.
【0016】下シ−ルド板2および上シ−ルド板6の材
料としては、導通性のある金属であれば、特に材料の指
定はなく、安価な材料の使用が可能である。The material of the lower shield plate 2 and the upper shield plate 6 is not particularly specified as long as it is a conductive metal, and inexpensive materials can be used.
【0017】また、FGスプリング3の材料としては、
導通性がありバネ性を有する金属とする。バネ性を有す
ることにより、上ケ−ス7、下ケ−ス1や上シ−ルド板
6、下シ−ルド板2および基板4に反り等の変形が生じ
たり、振動や衝撃が加わっ場合でもFGスプリング3は
下接地部3aと下シ−ルド板2、上接地部3bと上シ−
ルド板6は安定した接触を得ることができる。より詳細
には、FGスプリング3の材料としては、バネ用リン青
銅やバネ用SUS等が好適である。The material of the FG spring 3 is as follows.
It is a metal having conductivity and spring properties. When the upper case 7, the lower case 1, the upper shield plate 6, the lower shield plate 2, and the substrate 4 are deformed by warping, or are subjected to vibration or impact due to the spring property. However, the FG spring 3 has the lower grounding portion 3a and the lower shield plate 2, and the upper grounding portion 3b has the upper shield.
The shield plate 6 can obtain stable contact. More specifically, the material of the FG spring 3 is preferably phosphor bronze for spring, SUS for spring, or the like.
【0018】このように、本実施の形態では、下ケ−ス
1の固定用ボス部1aには、FGスプリング3および基
板4が固定ネジ5により締結固定されているので、基板
4とFGスプリング3が接地され、FGスプリング3の
下接地部3aと上接地部3bはバネ性を有する形状であ
り、それぞれ下シ−ルド板2および上シ−ルド板6に接
地するので、筺体や基板4に反り等の変形が生じたり、
振動や衝撃が加わった場合でも基板4と下シ−ルド板2
および上シ−ルド板6とが安定した接触を得ることが可
能であり、電子機器の主要部品である下ケ−ス1および
上ケ−ス7の上下のプラスチック筐体にメッキ等の2次
加工を施すことなく、電子機器全体の電位差が同一に保
たれ、安定した接地構造を実現することができ、従来の
EMI対策と同等の対策効果が得られる。As described above, in the present embodiment, the FG spring 3 and the board 4 are fastened and fixed to the fixing boss 1a of the lower case 1 by the fixing screw 5, so that the board 4 and the FG spring are fixed. 3 is grounded, and the lower grounding portion 3a and the upper grounding portion 3b of the FG spring 3 are spring-shaped and grounded to the lower shield plate 2 and the upper shield plate 6, respectively. Deformation such as warping occurs,
Even when vibration or impact is applied, the substrate 4 and the lower shield plate 2
And a stable contact between the upper shield plate 6 and the upper and lower plastic housings of the lower case 1 and the upper case 7, which are main components of the electronic equipment, can be obtained by plating or the like. Without processing, the potential difference of the entire electronic device is kept the same, a stable grounding structure can be realized, and a countermeasure effect equivalent to a conventional EMI countermeasure can be obtained.
【0019】このように、従来のEMI対策と同等の対
策効果が有り、かつ、プラスチック部品である下ケ−ス
1と上ケ−ス7は従来使用されるEMI対策としてのメ
ッキやアルミ蒸着を施していないため、材料毎の分別が
容易にできる環境に配慮したFG構造が得られる。As described above, there is a countermeasure effect equivalent to that of the conventional EMI countermeasure, and the lower case 1 and the upper case 7 which are plastic parts are formed by plating or aluminum deposition as a conventional EMI countermeasure. Since the FG structure is not applied, an environment-friendly FG structure that can easily separate each material can be obtained.
【0020】また、下シ−ルド板2および上シ−ルド板
6の材料を、板金の替わりにポリエステル等のプラスチ
ックのシ−トにアルミ等の金属箔を接着したシ−ト材を
使用すれば、板金使用時と比較して再利用は困難となる
が、主要部品である上下のプラスチックケ−スとの分別
には問題なく対応可能であり、かつ、部品製造における
金型設備費および材料費は大幅に低減可能である。ま
た、重量低減にも効果がある。Further, the material of the lower shield plate 2 and the upper shield plate 6 may be replaced by a sheet material in which a metal sheet such as aluminum is adhered to a plastic sheet such as polyester instead of sheet metal. For example, it is more difficult to reuse than when using sheet metal, but it is possible to deal with the separation of the upper and lower plastic cases, which are the main parts, without any problems. Costs can be significantly reduced. It is also effective for weight reduction.
【0021】次に、他の実施の形態として、コネクタや
電子部品の基板実装レイアウトの都合により筐体と基板
の固定位置を基板周囲に設けられない場合を図3に示
す。Next, as another embodiment, FIG. 3 shows a case where a fixed position between the housing and the substrate cannot be provided around the substrate due to the layout of the connectors and electronic components mounted on the substrate.
【0022】図3、4において、プラスチック製の下ケ
−ス8の底部上に固定用ボス部8aが立設され、下ケ−
ス8の内側には穴部9aを有する下シ−ルド板9が配置
され、固定用ボス部8aは下シ−ルド板9の穴部9aに
嵌挿している。3 and 4, a fixing boss 8a is erected on the bottom of the lower case 8 made of plastic, and the lower case 8 is provided.
A lower shield plate 9 having a hole 9 a is arranged inside the case 8, and the fixing boss 8 a is fitted into the hole 9 a of the lower shield plate 9.
【0023】電子機器の基板10の表面中央部には、F
Gベタパタ−ン部10aが形成され、下ケ−ス8の固定
用ボス部8a上には、基板10のFGベタパタ−ン部1
0aと、バネ性を有する下接地部11a、上接地部11
bおよび中接地部11cからなるFGスプリング11の
中接地部11cとが、固定ネジ5により順次締結固定さ
れている。このとき、FGベタパタ−ン部11の下接地
部11aは基板10の逃げ穴部10bに挿通し、中接地
部11cはFGベタパタ−ン部10aに接地する。In the center of the surface of the substrate 10 of the electronic device, F
The G solid pattern portion 10a is formed, and the FG solid pattern portion 1 of the substrate 10 is provided on the fixing boss 8a of the lower case 8.
0a, lower grounding portion 11a and upper grounding portion 11 having spring properties
b and the middle ground contact portion 11c of the FG spring 11 composed of the middle ground contact portion 11c are sequentially fastened and fixed by fixing screws 5. At this time, the lower ground portion 11a of the FG solid pattern portion 11 is inserted into the escape hole portion 10b of the substrate 10, and the middle ground portion 11c is grounded to the FG solid pattern portion 10a.
【0024】基板10、FGスプリング11および下シ
ールド板9上には、プラスチック製の上ケ−ス7および
上ケ−ス7の内側に配置された上シールド板6が覆設さ
れている。On the substrate 10, the FG spring 11 and the lower shield plate 9, a plastic upper case 7 and an upper shield plate 6 arranged inside the upper case 7 are covered.
【0025】このように他の実施の形態では、基板10
の固定位置が基板10周辺に設けられない場合でも、基
板10のFGベタパタ−ン部10aは固定ネジ5により
FGスプリング11に接地する。また、FGスプリング
11の下接地部11aと上接地部11bはバネ性を有す
る形状であり、それぞれ下シ−ルド板9および上シ−ル
ド板6に接地する。As described above, in another embodiment, the substrate 10
The FG solid pattern portion 10a of the substrate 10 is grounded to the FG spring 11 by the fixing screw 5 even when the fixing position is not provided around the substrate 10. The lower grounding portion 11a and the upper grounding portion 11b of the FG spring 11 have a springy shape, and are grounded to the lower shield plate 9 and the upper shield plate 6, respectively.
【0026】このように、FGスプリング11の下接地
部11aと下シ−ルド板9の内側とを接地させ、かつ、
FGスプリング11の上接地部11bと上シ−ルド板6
の内側とを接地させることで基板10の固定位置に左右
されず、電子機器全体の電位差が同一に保たれ、安定し
た接地構造を実現することができ、従来のEMI対策と
同等の対策効果が得られる。As described above, the lower grounding portion 11a of the FG spring 11 and the inside of the lower shield plate 9 are grounded, and
The upper grounding portion 11b of the FG spring 11 and the upper shield plate 6
By grounding the inside of the substrate 10, the potential difference of the entire electronic device is kept the same regardless of the fixing position of the substrate 10, and a stable grounding structure can be realized. can get.
【0027】[0027]
【発明の効果】以上説明したように、本発明によれば、
ケースの内側に個別に配置された複数のシールド板と、
導電性を有する弾性体(FGスプリング)とを備え、弾
性体の弾性を利用して基板および複数のシールド板を電
気的に接続したので、従来のプラスチック筺体へのメッ
キやアルミ蒸着と同等のEMI対策効果を保ち、容易に
各材料毎の分別を行うことができる。また、筺体や内部
基板に反り等の変形が生じたり、振動や衝撃が加わった
場合でもバネ材のスプリング部と筺体内側のメッキ部の
擦れから生ずるメッキ剥がれによる接地の劣化や剥がれ
た金属片による電気的ショ−トの問題が無くなり、安全
かつ安定した接地構造が得られる。As described above, according to the present invention,
With multiple shield plates individually arranged inside the case,
Since an elastic body (FG spring) having conductivity is provided, and the substrate and a plurality of shield plates are electrically connected by utilizing the elasticity of the elastic body, the EMI is equivalent to the conventional plating or aluminum deposition on a plastic housing. Separation of each material can be easily performed while keeping the countermeasure effect. Also, even when the housing or internal substrate is deformed such as warpage, or when vibration or impact is applied, deterioration of the ground due to peeling of the plating caused by rubbing of the spring part of the spring material and the plating part inside the housing or metal pieces that are peeled off The problem of electrical short is eliminated, and a safe and stable grounding structure is obtained.
【図1】本発明の一実施の形態を示す環境配慮型FG構
造の組み立て斜視図である。FIG. 1 is an assembled perspective view of an environment-friendly FG structure showing one embodiment of the present invention.
【図2】図1のA−A断面図である。FIG. 2 is a sectional view taken along line AA of FIG.
【図3】本発明の他の実施の形態を示す環境配慮型FG
構造の組み立て斜視図である。FIG. 3 is an environment-friendly FG showing another embodiment of the present invention.
It is an assembly perspective view of a structure.
【図4】図3のB−B断面図である。FIG. 4 is a sectional view taken along line BB of FIG. 3;
【図5】従来の環境配慮型FG構造の部分斜視図であ
る。FIG. 5 is a partial perspective view of a conventional environment-friendly FG structure.
【図6】従来の他の環境配慮型FG構造の部分斜視図で
ある。FIG. 6 is a partial perspective view of another conventional environment-friendly FG structure.
【図7】従来の他の環境配慮型FG構造の部分斜視図で
ある。FIG. 7 is a partial perspective view of another conventional environment-friendly FG structure.
1,8 下ケース 2,9 下シールド板 2a,9a 穴部 3,11 FGスプリング 3a,11a 下接地部 3b,11b 上接地部 3c,11c 中接地部 4,10 基板 4a,10a FGベタパターン部 5 固定ネジ 6 上シールド板 7 上ケース 10b 逃げ穴部 1,8 Lower case 2,9 Lower shield plate 2a, 9a Hole 3,11 FG spring 3a, 11a Lower ground part 3b, 11b Upper ground part 3c, 11c Middle ground part 4,10 Substrate 4a, 10a FG solid pattern part 5 Fixing screw 6 Upper shield plate 7 Upper case 10b Escape hole
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成11年10月20日(1999.10.
20)[Submission date] October 20, 1999 (1999.10.
20)
【手続補正1】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】特許請求の範囲[Correction target item name] Claims
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【特許請求の範囲】[Claims]
【手続補正2】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0011[Correction target item name] 0011
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【0011】本発明の前記ならびにその他の目的と新規
な特徴は、本明細書の記述および添付図面から明らかに
なるであろう。The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.
【課題を解決するための手段】前述した目的を達成する
ため、本発明は、下ケース内に固定用ボス部が設けら
れ、前記下ケ−スの内側に導電性を有する下シ−ルド板
が配置され、前記固定用ボス部に導電性を有するFGス
プリングおよび基板が固定ネジにより締結固定され、前
記FGスプリング、前記基板および前記下シールド板上
に上ケ−スおよび前記上ケ−スの内側に配置され導電性
を有する上シールド板が覆設され、前記FGスプリング
を前記上下シールド板および前記基板に接触させ、前記
FGスプリングの弾性を利用して前記上下シールド板お
よび前記基板を電気的に接続したことを特徴とする。さ
らに、前記上下シ−ルド板の材料として、ポリエステル
等のプラスチックのシ−トに金属箔を接着したシ−ト材
を用いたことを特徴とする。さらに、前記金属箔はアル
ミ箔であることを特徴とする。In order to achieve the above-mentioned object, according to the present invention , a fixing boss is provided in a lower case.
A lower shield plate having conductivity inside the lower case.
Are disposed, and the boss portion having conductivity is provided on the fixing boss portion.
The mounting and the board are fastened and fixed with the fixing screws.
FG spring, on the substrate and the lower shield plate
And an upper case and a conductive member disposed inside the upper case.
The FG spring is covered with an upper shield plate having
Contact the upper and lower shield plate and the substrate,
Utilizing the elasticity of the FG spring, the upper and lower shield plates and
And the substrate is electrically connected. Further, as the material of the upper and lower shield plates, a sheet material in which a metal foil is bonded to a plastic sheet such as polyester is used. Further, the metal foil is an aluminum foil.
Claims (7)
のケースの内側に個別に配置された複数のシールド板
と、導電性を有する弾性体とを備え、前記複数のシール
ド板の間に基板および前記弾性体を配置し、前記弾性体
の弾性を利用して前記基板および前記複数のシールド板
を電気的に接続したことを特徴とする環境配慮型FG構
造。An electronic apparatus comprising: a plurality of cases; a plurality of conductive shield plates individually disposed inside the plurality of cases; and a conductive elastic body, wherein a substrate is provided between the plurality of shield plates. An environment-friendly FG structure, wherein the elastic body is arranged, and the substrate and the plurality of shield plates are electrically connected by utilizing elasticity of the elastic body.
のケースの内側に個別に配置された複数のシールド板
と、前記複数のシールド板の間に配置された基板および
導電性を有するFGスプリングとを備え、前記FGスプ
リングを前記複数のシールド板および前記基板に接触す
るように配置し、前記FGスプリングの弾性を利用して
前記複数のシールド板および前記基板を電気的に接続し
たことを特徴とする環境配慮型FG構造。2. A plurality of cases, a plurality of conductive shield plates individually disposed inside the plurality of cases, a substrate disposed between the plurality of shield plates, and a conductive FG spring. Wherein the FG spring is arranged to be in contact with the plurality of shield plates and the substrate, and the plurality of shield plates and the substrate are electrically connected by utilizing the elasticity of the FG spring. Environmentally friendly FG structure.
前記下ケ−スの内側に導電性を有する下シ−ルド板が配
置され、前記固定用ボス部に導電性を有するFGスプリ
ングおよび基板が固定ネジにより締結固定され、前記F
Gスプリング、前記基板および前記下シールド板上に上
ケ−スおよび前記上ケ−スの内側に配置され導電性を有
する上シールド板が覆設され、前記FGスプリングを前
記上下シールド板および前記基板に接触させ、前記FG
スプリングの弾性を利用して前記上下シールド板および
前記基板を電気的に接続したことを特徴とする環境配慮
型FG構造。3. A fixing boss portion is provided in the lower case,
A conductive lower shield plate is disposed inside the lower case, and a conductive FG spring and a substrate are fastened and fixed to the fixing boss portion by fixing screws.
An upper case and a conductive upper shield plate disposed inside the upper case on the G spring, the substrate, and the lower shield plate, and covering the FG spring with the upper and lower shield plates and the substrate; And contact the FG
An environment-friendly FG structure, wherein the upper and lower shield plates and the substrate are electrically connected by utilizing elasticity of a spring.
エステル等のプラスチックのシ−トに金属箔を接着した
シ−ト材を用いたことを特徴とする請求項3記載の環境
配慮型FG構造。4. The environmentally friendly FG according to claim 3, wherein a sheet material in which a metal foil is adhered to a plastic sheet such as polyester is used as a material of the upper and lower shield plates. Construction.
とする請求項4記載の環境配慮型FG構造。5. The environment-friendly FG structure according to claim 4, wherein said metal foil is an aluminum foil.
用リン青銅を用いたことを特徴とする請求項2または3
記載の環境配慮型FG構造。6. A phosphor bronze for a spring as a material of the FG spring.
The described environmentally friendly FG structure.
用SUSを用いたことを特徴とする請求項2または3記
載の環境配慮型FG構造。7. The environment-friendly FG structure according to claim 2, wherein SUS for a spring is used as a material of the FG spring.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11008507A JP3028956B1 (en) | 1999-01-14 | 1999-01-14 | Environmentally friendly FG structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11008507A JP3028956B1 (en) | 1999-01-14 | 1999-01-14 | Environmentally friendly FG structure |
Publications (2)
Publication Number | Publication Date |
---|---|
JP3028956B1 JP3028956B1 (en) | 2000-04-04 |
JP2000208981A true JP2000208981A (en) | 2000-07-28 |
Family
ID=11695049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11008507A Expired - Fee Related JP3028956B1 (en) | 1999-01-14 | 1999-01-14 | Environmentally friendly FG structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3028956B1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007035361A (en) * | 2005-07-25 | 2007-02-08 | Fujitsu Ltd | Connection terminal |
WO2009063734A1 (en) * | 2007-11-13 | 2009-05-22 | Nec Corporation | Apparatus having electronic component mounted thereon |
CN102025362A (en) * | 2009-09-14 | 2011-04-20 | 卡西欧计算机株式会社 | Electronic apparatus |
JP2011082140A (en) * | 2009-09-14 | 2011-04-21 | Casio Computer Co Ltd | Electronic apparatus |
JP2021525965A (en) * | 2018-06-06 | 2021-09-27 | エスエムエイ ソーラー テクノロジー アクティエンゲゼルシャフトSMA Solar Technology AG | An electrical or electronic device that includes a housing with two regions that are electromagnetically shielded from each other. |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113194646B (en) * | 2021-04-29 | 2022-09-13 | 合肥阳光电动力科技有限公司 | Motor controller and electric automobile |
-
1999
- 1999-01-14 JP JP11008507A patent/JP3028956B1/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007035361A (en) * | 2005-07-25 | 2007-02-08 | Fujitsu Ltd | Connection terminal |
WO2009063734A1 (en) * | 2007-11-13 | 2009-05-22 | Nec Corporation | Apparatus having electronic component mounted thereon |
CN102025362A (en) * | 2009-09-14 | 2011-04-20 | 卡西欧计算机株式会社 | Electronic apparatus |
JP2011082140A (en) * | 2009-09-14 | 2011-04-21 | Casio Computer Co Ltd | Electronic apparatus |
US8422246B2 (en) | 2009-09-14 | 2013-04-16 | Casio Computer Co., Ltd. | Electronic apparatus |
JP2021525965A (en) * | 2018-06-06 | 2021-09-27 | エスエムエイ ソーラー テクノロジー アクティエンゲゼルシャフトSMA Solar Technology AG | An electrical or electronic device that includes a housing with two regions that are electromagnetically shielded from each other. |
JP7265564B2 (en) | 2018-06-06 | 2023-04-26 | エスエムエイ ソーラー テクノロジー アクティエンゲゼルシャフト | Electrical or electronic device comprising a housing with two areas electromagnetically shielded from each other |
Also Published As
Publication number | Publication date |
---|---|
JP3028956B1 (en) | 2000-04-04 |
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