JP2000208885A - Wiring board - Google Patents
Wiring boardInfo
- Publication number
- JP2000208885A JP2000208885A JP11003435A JP343599A JP2000208885A JP 2000208885 A JP2000208885 A JP 2000208885A JP 11003435 A JP11003435 A JP 11003435A JP 343599 A JP343599 A JP 343599A JP 2000208885 A JP2000208885 A JP 2000208885A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- conductors
- diameter
- signal wiring
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、高速で作動する半
導体素子や光半導体素子等の電子部品を搭載するための
配線基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board for mounting electronic components such as semiconductor devices and optical semiconductor devices operating at high speed.
【０００２】[0002]
【従来の技術】高速で作動する半導体素子や光半導体素
子等の電子部品を搭載するための配線基板においては、
高速の信号を正確かつ効率良く伝播させるために、高速
信号が伝播する信号用配線導体のアイソレーションを高
めたり特性インピーダンスの整合を図ったりすること等
が重要である。2. Description of the Related Art In a wiring board for mounting electronic parts such as semiconductor elements and optical semiconductor elements operating at high speed,
In order to accurately and efficiently propagate a high-speed signal, it is important to increase the isolation of a signal wiring conductor through which the high-speed signal propagates, or to match characteristic impedance.
【０００３】このような配線基板として例えば特許第27
96143 号公報には、信号が伝播する信号用配線導体（信
号線）のアイソレーション値を高めたり特性インピーダ
ンスの整合を図ったりするためのグランド導体層（グラ
ンド層）を基板の２つ以上の面に設けるとともに、これ
らのグランド層同士を信号用配線導体の近くに設けた多
数の貫通導体（ヴィアフィル）を介して接続して成る配
線基板が示されている。As such a wiring board, for example, Japanese Patent No. 27
No. 96143 discloses that a ground conductor layer (ground layer) for increasing an isolation value of a signal wiring conductor (signal line) through which a signal propagates and for matching characteristic impedance is provided on two or more surfaces of a substrate. And a wiring board formed by connecting these ground layers via a large number of through conductors (via fills) provided near the signal wiring conductor.
【０００４】この配線基板では、貫通導体の周りに隙間
やクラックが発生したりすること等を防止するために貫
通導体の直径を0.05〜0.15ｍｍとしており、また貫通導
体形成領域部分の横断面における貫通導体の面積比を３
〜25％としている。そして、これらにより10ＧＨｚ前後
の高速信号を配線導体に伝播させることができる。In this wiring board, the diameter of the through conductor is set to 0.05 to 0.15 mm in order to prevent the occurrence of a gap or a crack around the through conductor, and the cross section of the through conductor forming region in the cross section is reduced. Area ratio of through conductor is 3
~ 25%. Thus, a high-speed signal of about 10 GHz can be propagated to the wiring conductor.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上述の
配線基板は、貫通導体の直径が0.05〜0.15ｍｍと小さい
ことから、貫通導体のインダクタンスが大きなものとな
るとともに貫通導体とグランド導体層との接続信頼性が
低いものとなり、このためグランド導体層と貫通導体と
で安定したグランドネットワークを形成することができ
ず、例えば10ＧＨｚを超える高速の信号を効率よく正確
に伝播させることが困難であるという問題点を有してい
た。However, in the above-mentioned wiring board, since the diameter of the through conductor is as small as 0.05 to 0.15 mm, the inductance of the through conductor becomes large and the connection between the through conductor and the ground conductor layer is increased. The reliability is low, so that a stable ground network cannot be formed by the ground conductor layer and the through conductor, and for example, it is difficult to efficiently and accurately propagate a high-speed signal exceeding 10 GHz. Had a point.
【０００６】本発明は、かかる問題点に鑑み案出された
ものであり、その目的は貫通導体により信号用配線導体
のアイソレーションや特性インピーダンスの整合を良好
に確保するとともにのグランド導体層と貫通導体とで安
定したグランドネットワークを形成し、例えば10ＧＨｚ
を超える高速の信号を効率よく正確に伝播させることが
できる配線基板を提供することにある。The present invention has been devised in view of the above problems, and has as its object the purpose of ensuring good isolation of a signal wiring conductor and matching of characteristic impedance by a through conductor and a ground conductor layer and a through conductor. Form a stable ground network with conductors, for example, 10 GHz
It is an object of the present invention to provide a wiring board capable of efficiently and accurately transmitting a high-speed signal exceeding the above.
【０００７】[0007]
【課題を解決するための手段】本発明の配線基板は、複
数の絶縁層を積層して成る絶縁基体に高周波信号を伝播
するための信号用配線導体とこの信号用配線導体に対し
て前記絶縁層を介して対向するグランド導体層とを配設
するとともに、前記信号用配線導体の両側に前記グラン
ド導体層に接続された多数の貫通導体をこの貫通導体の
直径の0.5 〜５倍の隣接間隔で分散して配設して成る配
線基板であって、前記多数の貫通導体は、前記信号用配
線導体に沿ってその両側に１列ずつ並べて配設された第
１の貫通導体と、この第１の貫通導体より外側の領域に
分散して配設された、前記第１の貫通導体よりも直径が
大きい第２の貫通導体とから成ることを特徴とするもの
である。According to the present invention, there is provided a wiring board comprising: a signal wiring conductor for transmitting a high-frequency signal to an insulating base formed by laminating a plurality of insulating layers; A ground conductor layer opposed to the ground conductor layer is provided with a plurality of through conductors connected to the ground conductor layer on both sides of the signal wiring conductor, and an adjacent space of 0.5 to 5 times the diameter of the through conductor is provided. A plurality of penetrating conductors, the first penetrating conductors being arranged in a row on both sides along the signal wiring conductors; And a second through conductor having a diameter larger than that of the first through conductor and distributed in a region outside the one through conductor.
【０００８】また、本発明の配線基板は、上記構成にお
いて、前記第１の貫通導体の直径が0.03〜0.15ｍｍであ
り、前記第２の貫通導体の直径が0.2 〜0.3 ｍｍである
ことを特徴とするものである。In the wiring board according to the present invention, the diameter of the first through conductor is 0.03 to 0.15 mm, and the diameter of the second through conductor is 0.2 to 0.3 mm. It is assumed that.
【０００９】本発明の配線基板によれば、信号用配線導
体の両側に配設した、グランド導体層に接続された多数
の貫通導体を、信号用配線導体に沿ってその両側に１列
ずつ並べて配設された小径の第１の貫通導体と、信号用
配線導体に対して第１の貫通導体より外側の領域に分散
して配設された、第１の貫通導体よりも直径が大きい大
径の第２の貫通導体とにより構成したことから、信号用
配線導体に沿って設けられた第１の貫通導体はその直径
が小さい分、第１の貫通導体同士の隣接間隔を狭いもの
とすることができ、これにより第１の貫通導体によるシ
ールド性が高いものとなり、信号用配線導体のアイソレ
ーションや特性インピーダンス整合を良好なものとする
ことができる。また、第２の貫通導体はその直径が第１
の貫通導体よりも大きいため第２の貫通導体のインダク
タンスが小さくなるとともに第２の貫通導体とグランド
導体層との接続信頼性が高いものとなり、その結果、第
２の貫通導体とグランド導体層とで安定したグランドネ
ットワークを形成することができる。According to the wiring board of the present invention, a large number of through conductors arranged on both sides of the signal wiring conductor and connected to the ground conductor layer are arranged in a row on both sides along the signal wiring conductor. A first through conductor having a smaller diameter, and a large diameter having a diameter larger than that of the first through conductor, the first through conductor being distributed in a region outside the first through conductor with respect to the signal wiring conductor. Since the first through-conductor provided along the signal wiring conductor has a small diameter, the distance between adjacent first through-conductors is narrow because of the small diameter of the first through-conductor. As a result, the shielding performance of the first through conductor is improved, and the isolation of the signal wiring conductor and the characteristic impedance matching can be improved. The diameter of the second through conductor is the first.
, The inductance of the second through conductor is reduced, and the connection reliability between the second through conductor and the ground conductor layer is high. As a result, the second through conductor and the ground conductor layer Thus, a stable ground network can be formed.
【００１０】また、本発明の配線基板によれば、第１の
貫通導体の直径を0.03〜0.15ｍｍとした場合には、第１
の貫通導体同士の隣接間隔を狭くしつつ優れたシールド
性を有するものとすることができ、信号用配線導体のア
イソレーションや特性インピーダンス整合を極めて良好
なものとすることができる。また、第２の貫通導体の直
径を0.2 〜0.3 ｍｍとした場合には、第２の貫通導体の
インダクタンスを小さくしつつ第２の貫通導体とグラン
ド導体層との高い接続信頼性を有するものとすることが
でき、第２の貫通導体とグランド導体層とで極めて安定
したグランドネットワークを形成することができる。Further, according to the wiring board of the present invention, when the diameter of the first through conductor is set to 0.03 to 0.15 mm,
Can have excellent shielding properties while reducing the distance between adjacent through conductors, and can achieve very good isolation and characteristic impedance matching of signal wiring conductors. When the diameter of the second through conductor is set to 0.2 to 0.3 mm, the second through conductor has a high connection reliability between the second through conductor and the ground conductor layer while reducing the inductance of the second through conductor. Thus, an extremely stable ground network can be formed by the second through conductor and the ground conductor layer.
【００１１】[0011]
【発明の実施の形態】次に、本発明を添付の図面に基づ
いて説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the accompanying drawings.
【００１２】図１は本発明の配線基板の実施の形態の一
例を示す上面図であり、図２は図１のＡ−Ａ線における
断面図、図３は図１のＢ−Ｂ線における断面図である。FIG. 1 is a top view showing an example of an embodiment of a wiring board according to the present invention. FIG. 2 is a cross-sectional view taken along line AA of FIG. 1, and FIG. 3 is a cross-sectional view taken along line BB of FIG. FIG.
【００１３】これらの図において、１は絶縁基体、３は
信号用配線導体、４ａ・４ｂはグランド導体層、５ａ・
５ｂは貫通導体である。In these figures, 1 is an insulating substrate, 3 is a signal wiring conductor, 4a and 4b are ground conductor layers, 5a and 4b.
5b is a through conductor.
【００１４】なお、図１において、貫通導体５ａ・５ｂ
はグランド導体層４ｂの下に位置しているため破線で示
すべきであるが、作図の都合上、細い実線で示してい
る。In FIG. 1, the through conductors 5a and 5b
Should be indicated by a broken line because it is located below the ground conductor layer 4b, but is indicated by a thin solid line for convenience of drawing.
【００１５】絶縁基体１は、図２に示すように、酸化ア
ルミニウム質焼結体や窒化アルミニウム質焼結体・ムラ
イト質焼結体・炭化珪素質焼結体・窒化珪素質焼結体・
ガラスセラミックス等の無機系絶縁材料、あるいはポリ
テトラフルオロエチレン・エポキシ・ポリイミド・ガラ
スエポキシ等の有機系絶縁材料、あるいはセラミックス
粉末等の無機絶縁物粉末をエポキシ系樹脂等の熱硬化性
樹脂で結合して成る複合絶縁材料などの電気絶縁材料か
ら成る複数の絶縁層を積層して成る。この例では平板状
の絶縁層１ａと枠状の絶縁層１ｂとが積層一体化されて
いる。そして、その上面中央部には、半導体素子等の電
子部品（図示せず）を収容するための電子部品搭載部と
しての凹部２が形成されている。As shown in FIG. 2, the insulating substrate 1 is made of an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, a silicon nitride sintered body,
An inorganic insulating material such as glass ceramics, an organic insulating material such as polytetrafluoroethylene / epoxy / polyimide / glass epoxy, or an inorganic insulating powder such as ceramic powder is bonded with a thermosetting resin such as epoxy resin. And a plurality of insulating layers made of an electrical insulating material such as a composite insulating material. In this example, a flat insulating layer 1a and a frame-shaped insulating layer 1b are laminated and integrated. In the center of the upper surface, a concave portion 2 is formed as an electronic component mounting portion for accommodating an electronic component (not shown) such as a semiconductor element.
【００１６】絶縁基体１は、例えば酸化アルミニウム質
焼結体から成る場合であれば、酸化アルミニウム・酸化
珪素・酸化カルシウム・酸化マグネシウム等の原料粉末
に適当な有機バインダ・溶剤等を添加混合して泥漿状と
なすとともにこれを従来周知のドクタブレード法を採用
してシート状となすことによって絶縁層１ａ・１ｂとな
るセラミックグリーンシートを得、しかる後、これらセ
ラミックグリーンシートに適当な打ち抜き加工を施すと
ともに上下に積層し、最後にこの積層体を還元雰囲気
中、約1600℃の温度で焼成することによって製作され
る。When the insulating base 1 is made of, for example, an aluminum oxide sintered body, a suitable organic binder, a solvent and the like are added to a raw material powder such as aluminum oxide, silicon oxide, calcium oxide and magnesium oxide. The ceramic green sheets to be used as the insulating layers 1a and 1b are obtained by forming the slurry into a sheet shape and forming the sheet into a sheet shape by employing a well-known doctor blade method. It is manufactured by sintering the stack at a temperature of about 1600 ° C. in a reducing atmosphere.
【００１７】絶縁層１ａの上面には、ほぼその全面にわ
たってグランド導体層４ａが配設されており、このグラ
ンド導体層４ａの凹部２内に露出した部位に半導体素子
等の電子部品が搭載される。A ground conductor layer 4a is provided on substantially the entire upper surface of the insulating layer 1a, and electronic components such as semiconductor elements are mounted on portions of the ground conductor layer 4a exposed in the concave portions 2. .
【００１８】さらに、絶縁層１ｂの上面には、図１に示
すように、信号用配線導体３および信号用配線導体３間
にグランド導体層４ｂが配設されており、信号用配線導
体３およびグランド導体層４ｂの凹部２の周辺には半導
体素子等の電子部品の各電極がボンディングワイヤ等を
介して接続される。Further, as shown in FIG. 1, a signal wiring conductor 3 and a ground conductor layer 4b are disposed between the signal wiring conductors 3 on the upper surface of the insulating layer 1b. Each electrode of an electronic component such as a semiconductor element is connected to the periphery of the concave portion 2 of the ground conductor layer 4b via a bonding wire or the like.
【００１９】信号用配線導体３およびグランド導体層４
ａ・４ｂは、タングステンやモリブデン・モリブデン−
マンガン・銅・銀・銀−パラジウム等の金属粉末メタラ
イズ、あるいは銅・銀・ニッケル・クロム・チタン・金
やそれらの合金等の金属材料などから成る。例えばタン
グステンの金属粉末メタライズから成る場合であれば、
タングステン粉末に適当な有機バインダ・溶剤を添加混
合して得た金属ペーストを絶縁層１ａ・１ｂとなるセラ
ミックグリーンシートに所定のパターンに印刷塗布し、
これをセラミックグリーンシートの積層体とともに焼成
することによって、絶縁層１ａ・１ｂの上面に配設され
る。Signal wiring conductor 3 and ground conductor layer 4
a.4b is tungsten or molybdenum / molybdenum-
It is made of metal powder such as manganese, copper, silver, silver-palladium, or a metal material such as copper, silver, nickel, chromium, titanium, gold, or an alloy thereof. For example, if it consists of metallized metal powder of tungsten,
A metal paste obtained by adding and mixing an appropriate organic binder / solvent to tungsten powder is printed and applied in a predetermined pattern on a ceramic green sheet to be the insulating layers 1a and 1b,
This is fired together with the laminate of the ceramic green sheets to be disposed on the upper surfaces of the insulating layers 1a and 1b.
【００２０】また、グランド導体層４ａと４ｂとは、図
１・図３に示すように、絶縁層１ｂを貫通して設けられ
た多数の第１の貫通導体５ａおよび第１の貫通導体５ａ
よりも直径が大きい第２の貫通導体５ｂにより電気的に
接続されている。As shown in FIGS. 1 and 3, the ground conductor layers 4a and 4b are composed of a large number of first through conductors 5a and first through conductors 5a provided through the insulating layer 1b.
It is electrically connected by the second through conductor 5b having a larger diameter.
【００２１】第１の貫通導体５ａは、好適にはその直径
が0.03〜0.15ｍｍと小径であり、信号用配線導体３に沿
って信号用配線導体３の両側に１列ずつその直径の0.5
〜５倍の隣接間隔ｄ１をもって並べて配設されている。The first through conductor 5a preferably has a small diameter of 0.03 to 0.15 mm, and has a diameter of 0.5 to 0.5 mm in a row along both sides of the signal wiring conductor 3 along the signal wiring conductor 3.
They are arranged side by side with an adjacent distance d1 of up to five times.
【００２２】第１の貫通導体５ａは、信号用配線導体３
の両側を電磁的にシールドして信号用配線導体３のアイ
ソレーションを高めるとともに信号用配線導体３の特性
インピーダンスを整合させる作用をなし、その直径が比
較的小さいことからその隣接間隔ｄ１を狭いものとして
密に配設することができ、高周波に対して高いシールド
性を確保することができる。The first through conductor 5a is formed of the signal wiring conductor 3
Electromagnetically shield both sides of the wire to enhance the isolation of the signal wiring conductor 3 and to match the characteristic impedance of the signal wiring conductor 3, and have a relatively small diameter so that the adjacent distance d1 is narrow. And a high shielding property against high frequencies can be secured.
【００２３】また、その直径を0.03〜0.15ｍｍとした場
合には、その隣接間隔ｄ１を0.015〜0.75ｍｍの狭いも
のとして密に配設することができ、例えば10ＧＨｚを超
える高周波に対して極めて優れたシールド性を確保する
ことができる。When the diameter is set to 0.03 to 0.15 mm, the adjacent distance d1 can be densely arranged as narrow as 0.015 to 0.75 mm, and is extremely excellent for high frequencies exceeding 10 GHz, for example. Shielding performance can be ensured.
【００２４】第１の貫通導体５ａは、その隣接間隔ｄ１
がその直径の２分の１（0.5 倍）未満となると、隣接す
る第１の貫通導体５ａの間の絶縁層１ｂにクラックが発
生しやすいものとなる傾向にある。一方、その隣接間隔
ｄ１がその直径の５倍を超えると、信号用配線導体３の
両側を良好にシールドすることが困難となる傾向にあ
る。したがって、第１の貫通導体５ａの隣接間隔ｄ１は
第１の貫通導体５ａの直径の0.5 〜５倍の範囲に特定さ
れる。The first through conductor 5a has a distance d1 adjacent to the first through conductor 5a.
When the diameter is less than half (0.5 times) the diameter, cracks tend to occur in the insulating layer 1b between the adjacent first through conductors 5a. On the other hand, if the adjacent distance d1 exceeds five times its diameter, it tends to be difficult to shield both sides of the signal wiring conductor 3 properly. Therefore, the adjacent distance d1 between the first through conductors 5a is specified in the range of 0.5 to 5 times the diameter of the first through conductor 5a.
【００２５】また、第１の貫通導体５ａは、その直径が
0.03ｍｍ未満であると、第１の貫通導体５ａ自体を良好
に形成することが困難となる傾向にある。一方、その直
径が0.15ｍｍを超えると、第１の貫通導体５ａの隣接間
隔ｄ１を狭いものとして例えば10ＧＨｚを超える高周波
に対する高いシールド性を確保して良好なアイソレーシ
ョンや特性インピーダンスの整合を得ることが困難とな
る傾向にある。したがって、第１の貫通導体５ａの直径
は0.03〜0.15ｍｍの範囲に設定することが好ましい。The diameter of the first through conductor 5a is
If it is less than 0.03 mm, it tends to be difficult to form the first through conductor 5a itself in a good condition. On the other hand, when the diameter exceeds 0.15 mm, the adjacent space d1 between the first through conductors 5a is narrowed to secure a high shielding property against a high frequency exceeding, for example, 10 GHz to obtain good isolation and matching of characteristic impedance. Tends to be difficult. Therefore, the diameter of the first through conductor 5a is preferably set in the range of 0.03 to 0.15 mm.
【００２６】なお、第１の貫通導体５ａは、その隣接間
隔ｄ１を信号用配線導体３によって伝播させる高周波信
号の波長の４分の１以下、さらに好適には８分の１以下
としておくと、信号用配線導体３のアイソレーションを
極めて高いものとすることができる。したがって、第１
の貫通導体５ａの隣接間隔ｄ１は、信号用配線導体３に
よって伝播させる高周波信号の波長の４分の１以下、さ
らに好ましくは８分の１以下としておくことが望まし
い。It is to be noted that the first through conductor 5a has an adjacent distance d1 of not more than 以下, more preferably not more than の of the wavelength of the high-frequency signal propagated by the signal wiring conductor 3. The isolation of the signal wiring conductor 3 can be made extremely high. Therefore, the first
It is desirable that the adjacent distance d1 between the through conductors 5a is set to １ or less, more preferably ８ or less, of the wavelength of the high frequency signal propagated by the signal wiring conductor 3.
【００２７】さらに、第１の貫通導体５ａは、信号用配
線導体３を挟む各列同士の間隔ｄ２を信号用配線導体３
によって伝播させる高周波信号の波長の２分の１以下と
しておくと、信号用配線導体３を伝播する高周波信号の
反射損を小さいものとすることができる。したがって、
信号用配線導体３を挟む第１の貫通導体５ａの各列同士
の間隔ｄ２は、信号用配線導体３によって伝播させる高
周波信号の２分の１以下としておくことが好ましい。Further, the first penetrating conductor 5a is arranged so that the distance d2 between the respective rows sandwiching the signal wiring conductor 3 is equal to the distance d2 between the columns.
If the wavelength of the high-frequency signal propagated through the signal wiring conductor 3 is set to 以下 or less, the reflection loss of the high-frequency signal transmitted through the signal wiring conductor 3 can be reduced. Therefore,
It is preferable that the distance d2 between the columns of the first through conductors 5a sandwiching the signal wiring conductor 3 be equal to or less than half the high-frequency signal propagated by the signal wiring conductor 3.
【００２８】一方、第２の貫通導体５ｂは、その直径が
第１の貫通導体５ａの直径よりも大きいものであり、信
号用配線導体３に対して第１の貫通導体５ａより外側の
領域に互いに直径の0.5 〜５倍の隣接間隔ｄ３をもって
ほぼ均等に分散して設けられている。On the other hand, the diameter of the second through conductor 5b is larger than the diameter of the first through conductor 5a, and the second through conductor 5b is located outside the first through conductor 5a with respect to the signal wiring conductor 3. They are provided almost uniformly distributed with an adjacent distance d3 of 0.5 to 5 times the diameter of each other.
【００２９】第２の貫通導体５ｂは、グランド導体層４
ａと４ｂとを低いインダクタンスで接続することによっ
てグランドを強化する作用をなし、その直径が第１の貫
通導体よりも大きいことから、第２の貫通導体５ｂのイ
ンダクタンスが小さいものとなるとともに第２の貫通導
体５ｂとグランド導体層４ａ・４ｂとの接続信頼性が高
いものとなるため、第２の貫通導体５ｂとグランド導体
層４ａ・４ｂとで安定したグランドネットワークを形成
することができる。The second through conductor 5b is formed on the ground conductor layer 4
a and 4b are connected with a low inductance to strengthen the ground. Since the diameter of the second through conductor 5b is larger than that of the first through conductor, the inductance of the second through conductor 5b becomes smaller and the second through conductor 5b becomes smaller. Since the connection reliability between the through conductor 5b and the ground conductor layers 4a and 4b is high, a stable ground network can be formed by the second through conductor 5b and the ground conductor layers 4a and 4b.
【００３０】また、その直径を0.2 〜0.3 ｍｍとした場
合には、第２の貫通導体５ｂのインダクタンスを小さく
しつつグランド導体層４ａ・４ｂとの優れた接続信頼性
を有するものとできるため、第２の貫通導体５ｂとグラ
ンド導体層４ａ・４ｂとで極めて安定したグランドネッ
トワークを形成することができる。When the diameter is 0.2 to 0.3 mm, the second through conductor 5b can have excellent connection reliability with the ground conductor layers 4a and 4b while reducing the inductance. An extremely stable ground network can be formed by the second through conductor 5b and the ground conductor layers 4a and 4b.
【００３１】したがって、このような本発明の配線基板
によれば、信号用配線導体３中に例えば10ＧＨｚを超え
る高速の信号を損失少なくかつ正確に伝達させることが
容易となる。Therefore, according to such a wiring board of the present invention, it becomes easy to transmit a high-speed signal exceeding 10 GHz, for example, in the signal wiring conductor 3 with little loss and accurately.
【００３２】なお、第２の貫通導体５ｂは、隣接するも
の同士の間隔ｄ３がその直径の0.5倍未満となると、絶
縁層１ｂにクラックが発生しやすいものとなる傾向にあ
る。When the distance d3 between the adjacent second through conductors 5b is less than 0.5 times the diameter thereof, cracks tend to occur in the insulating layer 1b.
【００３３】一方、５倍を超えると、グランド導体層４
ａと４ｂとを低インダクタンスで接続して安定したグラ
ンドネットワークを形成することが困難となる傾向にあ
る。したがって、第２の貫通導体５ｂ同士の隣接間隔ｄ
３は第２の貫通導体５ｂの直径の0.5 〜５倍の範囲に特
定される。On the other hand, if it exceeds five times, the ground conductor layer 4
It tends to be difficult to connect a and 4b with low inductance to form a stable ground network. Accordingly, the adjacent distance d between the second through conductors 5b is d.
3 is specified in the range of 0.5 to 5 times the diameter of the second through conductor 5b.
【００３４】また、第２の貫通導体５ｂは、その直径が
0.2 ｍｍ未満であると、第２の貫通導体５ｂのインダク
タンスが大きなものとなるとともに第２の貫通導体５ｂ
とグランド導体層４ａ・４ｂとの接続信頼性が低いもの
となり、その結果、グランド導体層４ａ・４ｂと第２の
貫通導体５ｂとで安定したグランドネットワークを形成
することが困難となる傾向にある。一方、その直径が0.
3 ｍｍを超えると、第２の貫通導体５ｂと絶縁層１ｂと
の熱膨張量等の差が大きなものとなり、第２の貫通導体
５ｂと絶縁層１ｂとの間に隙間が発生したり、絶縁層１
ｂにクラックが発生しやすいものとなる傾向にある。し
たがって、第２の貫通導体５ｂの直径は0.2 〜0.3 ｍｍ
の範囲に設定することが好ましい。The diameter of the second through conductor 5b is
If it is less than 0.2 mm, the inductance of the second through conductor 5b becomes large and the second through conductor 5b
And the ground conductor layers 4a and 4b have low connection reliability. As a result, it tends to be difficult to form a stable ground network with the ground conductor layers 4a and 4b and the second through conductor 5b. . On the other hand, its diameter is 0.
If it exceeds 3 mm, the difference in the amount of thermal expansion between the second penetrating conductor 5b and the insulating layer 1b becomes large, and a gap is generated between the second penetrating conductor 5b and the insulating layer 1b, Layer 1
There is a tendency that cracks easily occur in b. Therefore, the diameter of the second through conductor 5b is 0.2 to 0.3 mm.
Is preferably set in the range.
【００３５】なお、第１の貫通導体５ａおよび第２の貫
通導体５ｂは、タングステンやモリブデン・モリブデン
−マンガン・銅・銀・銀−パラジウム等の金属粉末メタ
ライズ、あるいは銅・銀・ニッケル・クロム・チタン・
金やそれらの合金等の金属材料などから成る。例えばタ
ングステンの金属粉末メタライズから成る場合であれ
ば、絶縁層１ｂとなるセラミックグリーンシートのグラ
ンド導体層４ｂが配設される領域に、焼成後の直径が例
えば0.03〜0.15ｍｍとなる貫通孔および焼成後の直径が
例えば0.2 〜0.3 ｍｍとなる貫通孔を所定の配列で打ち
抜くとともに、この貫通孔内にタングステン粉末を主成
分とする導体ペーストを従来周知のスクリーン印刷法を
採用して充填し、これを絶縁基体１となるセラミックグ
リーンシートの積層体とともに焼成することによって形
成される。The first through conductor 5a and the second through conductor 5b are made of metal powder such as tungsten or molybdenum / molybdenum-manganese / copper / silver / silver / palladium, or copper / silver / nickel / chrome / metal. Titanium·
It is made of a metal material such as gold or an alloy thereof. For example, in the case of metallization of tungsten metal powder, a through-hole having a diameter of, for example, 0.03 to 0.15 mm after firing is formed in a region where the ground conductor layer 4b of the ceramic green sheet to be the insulating layer 1b is provided. A through hole having a diameter of, for example, 0.2 to 0.3 mm is punched out in a predetermined arrangement, and a conductive paste containing tungsten powder as a main component is filled into the through hole by using a conventionally known screen printing method. Is fired together with a laminate of ceramic green sheets to be the insulating base 1.
【００３６】この場合、第１の貫通導体５ａおよび第２
の貫通導体５ｂとなる導体ペースト中に絶縁基体１と略
同一成分を絶縁基体１および貫通導体５ａ・５ｂの材料
特性に応じて適量含有させておくと、第１の貫通導体５
ａおよび第２の貫通導体５ｂの焼成収縮率や熱膨張係数
を絶縁基体１の焼成収縮率や熱膨張係数に近似させるこ
とができ、これにより両者の焼成収縮率や熱膨張係数の
相違に起因して第１の貫通導体５ａや第２の貫通導体５
ｂと絶縁層１ｂとの間に隙間が発生したり、あるいは絶
縁基体１にクラックが発生したりするのを有効に防止す
ることができる。したがって、第１の貫通導体５ａおよ
び第２の貫通導体５ｂとなる導体ペーストには、絶縁基
体１と略同一成分を適量含有させておくことが好まし
い。In this case, the first through conductor 5a and the second through conductor 5a
If the same amount of components as those of the insulating base 1 are contained in the conductive paste to be the through-conductors 5b according to the material properties of the insulating base 1 and the through-conductors 5a and 5b, the first through-conductor 5
a and the coefficient of thermal expansion of the second through conductor 5b can be approximated to the coefficient of thermal contraction and the coefficient of thermal expansion of the insulating substrate 1, thereby resulting from the difference between the coefficient of thermal contraction and the coefficient of thermal expansion of both. The first through conductor 5a and the second through conductor 5
It is possible to effectively prevent a gap from being generated between the insulating substrate 1 and the insulating layer 1b or a crack from being generated in the insulating base 1. Therefore, it is preferable that the conductor paste to be the first penetrating conductor 5a and the second penetrating conductor 5b contain an appropriate amount of substantially the same component as that of the insulating base 1.
【００３７】かくして、上述のような本発明の配線基板
によれば、絶縁基体１の凹部２の底面に半導体素子等の
電子部品を搭載するとともにこの電子部品の各電極を信
号用配線導体３およびグランド導体層４ｂにボンディン
グワイヤ等を介して接続することにより、高速で作動す
る電子部品を搭載する配線基板として供される。Thus, according to the wiring board of the present invention as described above, an electronic component such as a semiconductor element is mounted on the bottom surface of the concave portion 2 of the insulating base 1 and each electrode of the electronic component is connected to the signal wiring conductor 3 and By connecting to the ground conductor layer 4b via a bonding wire or the like, it is provided as a wiring board on which electronic components operating at high speed are mounted.
【００３８】なお、本発明は上述の実施の形態の一例に
限定されるものではなく、本発明の要旨を逸脱しない範
囲であれば種々の変更が可能である。例えば図４に要部
拡大断面図で示すように、信号用配線導体13の上下に絶
縁層11を介してグランド導体層14ａ・14ｂを設けるとと
もに、グランド導体層14ａと14ｂとを信号用配線導体13
に沿って１列に並べて設けられた小径の第１の貫通導体
15ａおよびその外側に分散して設けられた、第１の貫通
導体15ａよりも直径が大きい大径の第２の貫通導体15ｂ
で接続するようになした配線基板にも適用できる。Note that the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the scope of the present invention. For example, as shown in an enlarged sectional view of a main part in FIG. 4, ground conductor layers 14a and 14b are provided above and below a signal wiring conductor 13 via an insulating layer 11, and the ground conductor layers 14a and 14b are connected to the signal wiring conductor. 13
Small-diameter first through conductors arranged in a line along
15a and a large-diameter second through conductor 15b dispersedly provided outside thereof and having a larger diameter than the first through conductor 15a.
The present invention can be applied to a wiring board that is connected by the above.
【００３９】また、図１〜図３に示した例では絶縁基体
１の上面の信号用配線導体３間にグランド導体層４ｂを
配設していたが、このグランド導体層４ａを配設しない
場合であっても、第１の貫通導体５ａによるシールド性
は高く、信号用配線導体３のアイソレーションや特性イ
ンピーダンス整合を良好なものとすることができ、また
第２の貫通導体５ｂとグランド導体層４ａとで安定した
グランドネットワークを形成することができる。In the example shown in FIGS. 1 to 3, the ground conductor layer 4b is provided between the signal wiring conductors 3 on the upper surface of the insulating base 1, but when the ground conductor layer 4a is not provided. In this case, the shielding properties of the first through conductor 5a are high, the isolation of the signal wiring conductor 3 and the characteristic impedance matching can be improved, and the second through conductor 5b and the ground conductor layer 4a can form a stable ground network.
【００４０】また、信号用配線導体は、図１・図３に示
したようないわゆるグランド付コプレーナ線路構造の線
路導体や図４に示したようなストリップ線路構造の線路
導体の他にも、マイクロストリップ線路構造の線路導体
やマイクロストリップ線路構造の線路導体の片側のみに
コプレーナ線路と同様の同一面グランド導体層を設けた
ものなど、高周波用の線路導体を用いた種々の形態であ
ってよい。The signal wiring conductor may be a line conductor having a so-called coplanar line structure with a ground as shown in FIGS. 1 and 3 or a line conductor having a strip line structure as shown in FIG. Various forms using a high-frequency line conductor, such as a line conductor having a strip line structure or a line conductor having a microstrip line structure having a ground conductor layer on the same plane as the coplanar line on only one side, may be used.
【００４１】[0041]
【発明の効果】本発明の配線基板によれば、信号用配線
導体の両側に配設した、グランド導体層に接続された多
数の貫通導体を、信号用配線導体に沿って両側に１列ず
つ並べて配設された第１の貫通導体と、信号用配線導体
に対して第１の貫通導体より外側の領域に分散して配設
された、第１の貫通導体よりも直径が大きい第２の貫通
導体とにより構成したことから、信号用配線導体に沿っ
て設けられた第１の貫通導体はその直径が比較的小さい
分、第１の貫通導体同士の隣接間隔を狭いものとするこ
とができ、これにより第１の貫通導体によるシールド性
を高いものとすることができて、信号用配線導体のアイ
ソレーションや特性インピーダンス整合を良好なものと
することができる。また、第２の貫通導体はその直径が
第１の貫通導体の直径よりも大きいため第２の貫通導体
のインダクタンスが小さくなるとともに第２の貫通導体
とグランド導体層との接続信頼性が高いものとなり、そ
の結果、第２の貫通導体とグランド導体層とで安定した
グランドネットワークを形成することができる。According to the wiring board of the present invention, a large number of penetrating conductors arranged on both sides of the signal wiring conductor and connected to the ground conductor layer are arranged in a row on both sides along the signal wiring conductor. A first penetrating conductor arranged side by side and a second penetrating conductor having a larger diameter than the first penetrating conductor, the second penetrating conductor being distributed in a region outside the first penetrating conductor with respect to the signal wiring conductor; Since the first through conductors provided along the signal wiring conductors are constituted by the through conductors, the distance between adjacent first through conductors can be narrowed by the relatively small diameter of the first through conductors. Thus, the shielding performance of the first through conductor can be improved, and the isolation of the signal wiring conductor and the characteristic impedance matching can be improved. The second through conductor has a diameter larger than the diameter of the first through conductor, so that the inductance of the second through conductor is reduced and the connection reliability between the second through conductor and the ground conductor layer is high. As a result, a stable ground network can be formed by the second through conductor and the ground conductor layer.
【００４２】また、本発明の配線基板によれば、第１の
貫通導体の直径を0.03〜0.15ｍｍとした場合には、第１
の貫通導体同士の隣接間隔を狭くしつつ優れたシールド
性を有するものとすることができ、信号用配線導体のア
イソレーションや特性インピーダンス整合を極めて良好
なものとすることができる。また、第２の貫通導体の直
径を0.2 〜0.3 ｍｍとした場合には、第２の貫通導体の
インダクタンスを小さくしつつ第２の貫通導体とグラン
ド導体層との高い接続信頼性を有するものとすることが
でき、第２の貫通導体とグランド導体層とで極めて安定
したグランドネットワークを形成することができる。According to the wiring board of the present invention, when the diameter of the first through conductor is set to 0.03 to 0.15 mm,
Can have excellent shielding properties while reducing the distance between adjacent through conductors, and can achieve very good isolation and characteristic impedance matching of signal wiring conductors. When the diameter of the second through conductor is set to 0.2 to 0.3 mm, the second through conductor has a high connection reliability between the second through conductor and the ground conductor layer while reducing the inductance of the second through conductor. Thus, an extremely stable ground network can be formed by the second through conductor and the ground conductor layer.
【００４３】したがって、本発明の配線基板によれば、
例えば10ＧＨｚを超える高速の信号を信号用配線導体に
よって効率良く、かつ正確に伝播させることができる。Therefore, according to the wiring board of the present invention,
For example, a high-speed signal exceeding 10 GHz can be efficiently and accurately propagated by the signal wiring conductor.
【図１】本発明の配線基板の実施の形態の一例を示す平
面図である。FIG. 1 is a plan view showing an example of an embodiment of a wiring board of the present invention.
【図２】図１に示す配線基板のＡ−Ａ線における断面図
である。FIG. 2 is a sectional view taken along line AA of the wiring board shown in FIG. 1;
【図３】図１に示す配線基板のＢ−Ｂ線における断面図
である。FIG. 3 is a cross-sectional view taken along line BB of the wiring board shown in FIG. 1;
【図４】本発明の配線基板の実施の形態の別の例を示す
要部拡大断面図である。FIG. 4 is an essential part enlarged cross-sectional view showing another example of the embodiment of the wiring board of the present invention.
１・・・・・・・・・・・・・・絶縁基体 １ａ、１ｂ、11・・・・・・・・絶縁層 ３、13・・・・・・・・・・・・信号用配線導体 ４ａ、４ｂ、14ａ、14ｂ・・・・グランド導体層 ５ａ、15ａ・・・・・・・・・・第１の貫通導体 ５ｂ、15ｂ・・・・・・・・・・第２の貫通導体 1 ... Insulating base 1a, 1b, 11 ... Insulating layer 3, 13 ... Signal wiring Conductors 4a, 4b, 14a, 14b ··· Ground conductor layer 5a, 15a ············ First through conductor 5b, 15b ·································· conductor
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 5E317 AA24 BB01 BB02 BB04 BB11 CC22 CC25 GG11 GG14 5E338 AA02 AA03 BB02 BB15 BB16 BB25 BB63 BB75 CC01 CC02 CC05 CC06 CD11 CD23 EE13 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E317 AA24 BB01 BB02 BB04 BB11 CC22 CC25 GG11 GG14 5E338 AA02 AA03 BB02 BB15 BB16 BB25 BB63 BB75 CC01 CC02 CC05 CC06 CD11 CD23 EE13
Claims (2)
高周波信号を伝播するための信号用配線導体と該信号用
配線導体に対して前記絶縁層を介して対向するグランド
導体層とを配設するとともに、前記信号用配線導体の両
側に前記グランド導体層に接続された多数の貫通導体を
該貫通導体の直径の0.5 〜５倍の隣接間隔で分散して配
設して成る配線基板であって、前記多数の貫通導体は、
前記信号用配線導体に沿ってその両側に１列ずつ並べて
配設された第１の貫通導体と、該第１の貫通導体より外
側の領域に分散して配設された、前記第１の貫通導体よ
りも直径が大きい第２の貫通導体とから成ることを特徴
とする配線基板。A signal wiring conductor for transmitting a high-frequency signal to an insulating base formed by laminating a plurality of insulating layers, and a ground conductor layer facing the signal wiring conductor via the insulating layer. A wiring board having a large number of through conductors connected to the ground conductor layer at both sides of the signal wiring conductor and distributed at adjacent intervals of 0.5 to 5 times the diameter of the through conductor; Wherein the plurality of through conductors are:
A first penetrating conductor arranged in a row along both sides of the signal wiring conductor on both sides thereof; and a first penetrating conductor dispersedly disposed in a region outside the first penetrating conductor. A wiring board comprising a second through conductor having a diameter larger than that of the conductor.
ｍｍであり、前記第２の貫通導体の直径が0.2 〜0.3 ｍ
ｍであることを特徴とする請求項１記載の配線基板。2. The first through conductor has a diameter of 0.03 to 0.15.
mm, and the diameter of the second through conductor is 0.2 to 0.3 m.
2. The wiring board according to claim 1, wherein m is m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00343599A JP3784185B2 (en) | 1999-01-08 | 1999-01-08 | Wiring board for mounting electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00343599A JP3784185B2 (en) | 1999-01-08 | 1999-01-08 | Wiring board for mounting electronic components |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006030502A Division JP4177849B2 (en) | 2006-02-08 | 2006-02-08 | Wiring board for mounting electronic parts and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000208885A true JP2000208885A (en) | 2000-07-28 |
| JP3784185B2 JP3784185B2 (en) | 2006-06-07 |
Family
ID=11557294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP00343599A Expired - Fee Related JP3784185B2 (en) | 1999-01-08 | 1999-01-08 | Wiring board for mounting electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3784185B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007012726A (en) * | 2005-06-29 | 2007-01-18 | Fuji Electric Holdings Co Ltd | Semiconductor device |
| JP2010177710A (en) * | 2010-05-17 | 2010-08-12 | Fuji Electric Systems Co Ltd | Semiconductor device |
| JP2012138506A (en) * | 2010-12-27 | 2012-07-19 | Fujitsu Ltd | High frequency circuit |
-
1999
- 1999-01-08 JP JP00343599A patent/JP3784185B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007012726A (en) * | 2005-06-29 | 2007-01-18 | Fuji Electric Holdings Co Ltd | Semiconductor device |
| JP2010177710A (en) * | 2010-05-17 | 2010-08-12 | Fuji Electric Systems Co Ltd | Semiconductor device |
| JP2012138506A (en) * | 2010-12-27 | 2012-07-19 | Fujitsu Ltd | High frequency circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3784185B2 (en) | 2006-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2001339170A (en) | Multilayer wiring board | |
| JP3784185B2 (en) | Wiring board for mounting electronic components | |
| JP3784188B2 (en) | Wiring board for mounting electronic components | |
| JP2005243970A (en) | Complex circuit board | |
| JP4177849B2 (en) | Wiring board for mounting electronic parts and electronic device | |
| JP4601369B2 (en) | Wiring board | |
| JP3921079B2 (en) | Wiring board | |
| JP3792472B2 (en) | Multilayer wiring board | |
| JP3784192B2 (en) | Wiring board for mounting electronic components | |
| WO2024024945A1 (en) | Circuit board, semiconductor device, and electronic module | |
| JP2000277657A (en) | Multilayer wiring board | |
| JP3754865B2 (en) | Multilayer wiring board | |
| JP3754863B2 (en) | Multilayer wiring board | |
| JP3921078B2 (en) | Wiring board | |
| JP3792424B2 (en) | Wiring board for mounting electronic components | |
| JP3754866B2 (en) | Multilayer wiring board | |
| JP3754864B2 (en) | Multilayer wiring board | |
| JP3792425B2 (en) | Wiring board for mounting electronic components | |
| JP3618061B2 (en) | Multilayer wiring board | |
| JP2001044328A (en) | High-frequency semiconductor element mounting wiring board and high-frequency semiconductor device using the same | |
| JP3793551B2 (en) | Wiring board | |
| JP2001077542A (en) | Multilayer wiring board | |
| JP3792422B2 (en) | Wiring board for mounting electronic components | |
| JP2001077541A (en) | Multilayer wiring board | |
| JP2001127385A (en) | Multilayer wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20050627 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050705 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050905 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20051213 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060208 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20060228 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20060314 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090324 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100324 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110324 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110324 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120324 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120324 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130324 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130324 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140324 Year of fee payment: 8 |
|
| LAPS | Cancellation because of no payment of annual fees |