JP2000188850A - Motor with built-in temperature detecting element - Google Patents
Motor with built-in temperature detecting elementInfo
- Publication number
- JP2000188850A JP2000188850A JP10362654A JP36265498A JP2000188850A JP 2000188850 A JP2000188850 A JP 2000188850A JP 10362654 A JP10362654 A JP 10362654A JP 36265498 A JP36265498 A JP 36265498A JP 2000188850 A JP2000188850 A JP 2000188850A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- detecting element
- motor
- temperature detecting
- motor drive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は温度検出素子を内蔵
したモータに関連した温度検出素子のプリント配線板へ
の取り付け構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for mounting a temperature detecting element on a printed wiring board in relation to a motor having a built-in temperature detecting element.
【０００２】[0002]
【従来の技術】従来、モータ駆動用に使用されるモータ
駆動ＩＣで過熱保護をもたないＩＣにおいては、モータ
の過負荷状態やロック状態を検出するため、正特性サー
ミスタや負特性サーミスタ、温度ヒューズや温度リレー
等温度を検出する素子をＩＣにネジ止めしたり、温度上
昇する部分に接着材等で固定していた。2. Description of the Related Art Conventionally, in a motor drive IC used for driving a motor, which does not have overheat protection, a positive characteristic thermistor, a negative characteristic thermistor, a temperature characteristic and a temperature characteristic are used to detect an overload state or a locked state of the motor. An element for detecting a temperature, such as a fuse or a temperature relay, is screwed to the IC, or fixed to an area where the temperature rises with an adhesive or the like.
【０００３】また、モールド樹脂でモータ駆動ＩＣと温
度検出素子を一体モールドし、熱的に結合することもあ
った。[0003] In some cases, the motor drive IC and the temperature detecting element are integrally molded with a mold resin and thermally coupled.
【０００４】図９から図１１にモータ駆動ＩＣおよび、
パワー素子に対する温度検出素子取り付けの従来例を示
す。FIGS. 9 to 11 show a motor drive IC and
1 shows a conventional example of attaching a temperature detecting element to a power element.
【０００５】図９は、プリント配線板８にモータ駆動の
ためのパワートランジスタ１９を実装し、正特性サーミ
スタ（ディスクリート部品）１２ａをパワートランジス
タ１９と共締めでヒートシンク２１に固定している。正
特性サーミスタ（ディスクリート部品）１２ａの温度に
よる抵抗値の変化を利用して、パワートランジスタ１９
のベース電流を制限することで、モータ巻線（図示せ
ず）およびパワートランジスタ１９の過熱や破損を防い
でいる。このようなネジ止めによるものは確実に熱結合
できるが、取り付け作業が手作業によるため非常に手間
がかかっていた。In FIG. 9, a power transistor 19 for driving a motor is mounted on a printed wiring board 8, and a positive temperature coefficient thermistor (discrete component) 12 a is fixed to a heat sink 21 together with the power transistor 19. Using the change in resistance value of the positive temperature coefficient thermistor (discrete component) 12a with temperature, the power transistor 19
Of the motor winding (not shown) and the power transistor 19 are prevented from being overheated or damaged. Although the connection by such screwing can be surely thermally bonded, the installation work is manual work, which is very troublesome.
【０００６】また、図１０のように温度ヒューズや、温
度リレーを接着材で固定するものもあるが、これも人間
による手作業が必要で、非常に手間がかかっていた。Further, as shown in FIG. 10, there is a type in which a temperature fuse or a temperature relay is fixed with an adhesive, but this also requires a manual operation by a human, which is very troublesome.
【０００７】また、図１１はプリント配線板上に正特性
サーミスタ（表面実装部品）１２ｂを実装し、モータド
ライブＩＣ（ディスクリート部品）１０ａを含めてモー
ルド樹脂６でモールドし、モータ巻線４とモータドライ
ブＩＣ（ディスクリート部品）１０ａをモールド樹脂６
で熱結合させ、正特性サーミスタ（表面実装部品）１２
ｂに熱を伝えるものである。この場合、モールド樹脂の
熱伝導率が約2.7×10- 3cal／cm・sec・℃とそれほど高
くないため、モータドライブＩＣ１０ａ中心の接合温度
と正特性サーミスタ１２ｂによる温度検出に大きな差異
が生じており、モータドライブＩＣ１０ａの温度が急激
に上昇する場合は追従が悪く、モータドライブＩＣ１０
ａが破損する可能性があった。FIG. 11 shows that a positive temperature coefficient thermistor (surface mounted component) 12b is mounted on a printed wiring board, and is molded with a molding resin 6 including a motor drive IC (discrete component) 10a. Drive IC (discrete part) 10a is molded resin 6
Thermistor (Surface Mount Components) 12
b to transmit heat. In this case, the thermal conductivity of the mold resin is about 2.7 × 10 - for not so high as 3 cal / cm · sec · ℃ , large difference in temperature detection by the junction temperature and the thermistor 12b of the motor drive IC10a center occurs When the temperature of the motor drive IC 10a rises rapidly, the tracking is poor,
a could be damaged.
【０００８】[0008]
【発明が解決しようとする課題】従来は温度検出素子を
モータ駆動ＩＣ近傍に取り付ける場合、取り付けに非常
に時間がかかったり、またモータ駆動ＩＣの接合温度に
対して、温度検出素子が取り付けられた箇所の温度に大
きな差が生じる等の課題があった。Conventionally, when a temperature detecting element is mounted near a motor driving IC, it takes a very long time to mount the temperature detecting element, or the temperature detecting element is mounted with respect to the junction temperature of the motor driving IC. There were problems such as a large difference in the temperature of the location.
【０００９】[0009]
【課題を解決するための手段】温度検出素子をモータ駆
動ＩＣのリード脚の近傍に配置することで、熱伝導率の
よいＩＣのリード脚（材質は銅）より伝わってくる温度
を検出することで接合温度により近い温度を検出するこ
とができる。By disposing a temperature detecting element in the vicinity of a lead leg of a motor drive IC, the temperature transmitted from the lead leg (material: copper) of the IC having good thermal conductivity can be detected. Thus, a temperature closer to the bonding temperature can be detected.
【００１０】また、自動実装機による温度検出素子の実
装半田付けにより発熱部と温度検出素子の熱結合を容易
に行うことができる。Further, the thermal connection between the heat generating portion and the temperature detecting element can be easily performed by mounting and soldering the temperature detecting element by the automatic mounting machine.
【００１１】[0011]
【発明の実施の形態】本発明の請求項１に記載の発明で
いうところの、金属板を積層した積層体と、前記積層体
に絶縁部材を介して巻装された巻線と、前記絶縁部材に
固定され前記巻線の終端と電気的に接続された端子片と
で構成された固定子と、前記端子片に電気的に接続され
るプリント配線板と前記プリント配線板に実装されたモ
ータ駆動ＩＣで構成されるモータであって、温度検出素
子を前記モータ駆動ＩＣのリード脚の近傍に設置したこ
とを特徴とする温度検出素子を内蔵したモータとは、け
い素鋼等の金属板を積層した積層体を絶縁部材で絶縁
し、その上にモータ巻線を巻き付けると共に、絶縁部材
に固定され、巻線をかしめた端子片からなる固定子に、
端子片を介して電気的に接続されるプリント配線板と前
記プリント配線板に実装されたモータ駆動ＩＣで構成さ
れたモータであって、過熱保護、ロック保護検出のため
の温度検出素子をモータ駆動ＩＣのリード脚近傍に実装
配置したもので、材質が銅製で熱伝導率の高いＩＣのリ
ード脚の温度を温度検出素子に伝えることで接合部に近
い温度を検出でき、また温度の急激な変化を検出するこ
とができるという作用がある。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, there is provided a laminate in which metal plates are laminated, a winding wound on the laminate via an insulating member, and A stator which is fixed to a member and is composed of a terminal piece electrically connected to the end of the winding, a printed wiring board electrically connected to the terminal piece, and a motor mounted on the printed wiring board A motor comprising a drive IC, wherein the temperature detection element is provided near the lead leg of the motor drive IC, and the motor having the built-in temperature detection element is a metal plate such as silicon steel. The laminated body is insulated with an insulating member, and a motor winding is wound thereon, and the fixed member is fixed to the insulating member, and the stator is formed by crimping the terminal piece.
A motor comprising a printed wiring board electrically connected through terminal pieces and a motor drive IC mounted on the printed wiring board, the motor driving a temperature detecting element for detecting overheat protection and lock protection. It is mounted near the IC's lead legs. The material is made of copper, and the temperature of the IC's lead legs with high thermal conductivity can be transmitted to the temperature detection element to detect the temperature close to the junction. Can be detected.
【００１２】本発明の請求項２に記載の発明でいうとこ
ろの、モータ駆動ＩＣのリード脚を実装する銅箔と、温
度検出素子を実装する銅箔を一体形状とし、前記リード
脚と前記温度検出素子を半田にて熱結合することを特徴
とする温度検出素子を内蔵したモータとは、モータ駆動
ＩＣのリード脚と温度検出素子の熱的接続をプリント配
線板に印刷された銅箔だけでなく、モータ駆動ＩＣのリ
ード脚と温度検出素子のプリント配線板に対する実装位
置をより接近させ、部品実装の際に使用する半田で前記
ＩＣリード脚と前記温度検出素子を熱結合させるもの
で、プリント配線板の銅箔に加えて、半田（錫＋鉛）が
付着することでより熱が伝わり易くなり、請求項１の内
容に対して、さらに熱結合力を強めるという作用があ
る。According to the second aspect of the present invention, a copper foil for mounting a lead leg of a motor drive IC and a copper foil for mounting a temperature detecting element are integrally formed, and the lead leg and the temperature A motor with a built-in temperature detection element, which is characterized in that the detection element is thermally coupled with solder, is a thermal connection between the lead leg of the motor drive IC and the temperature detection element using only copper foil printed on a printed wiring board. Instead, the mounting positions of the lead leg of the motor drive IC and the temperature detecting element with respect to the printed wiring board are made closer to each other, and the IC lead leg and the temperature detecting element are thermally coupled with solder used when mounting components. The adhesion of solder (tin + lead) in addition to the copper foil of the wiring board facilitates the transfer of heat, and has the effect of further strengthening the thermal bonding force with respect to the contents of claim 1.
【００１３】本発明の請求項３に記載の発明でいうとこ
ろの、温度検出素子をプリント基板に実装した部分のプ
リント配線板を前記温度検出素子を囲むようにプリント
基板を貫通する貫通穴を設けたことを特徴とする温度検
出素子を内蔵したモータとは、モータ駆動ＩＣのリード
脚の近傍に実装された温度検出素子のまわりを囲んでプ
リント配線板を貫通する貫通穴を設けたもので、モータ
駆動ＩＣの接合部の熱がＩＣリード脚を伝って温度検出
素子に伝わるがプリント配線板に熱は奪われるため、温
度検出素子を囲んで貫通穴を設けることで、プリント配
線板への熱の拡散を避けることでよりＩＣの接合温度に
近い温度を検出できる。請求項１および請求項２の内容
に対してさらに熱結合力を強めるという作用がある。According to the third aspect of the present invention, a through hole is provided in a portion of the printed wiring board on which the temperature detecting element is mounted on the printed circuit board so as to surround the temperature detecting element. The motor having a built-in temperature detecting element is characterized in that a through hole that penetrates a printed wiring board is provided around a temperature detecting element mounted near a lead leg of a motor drive IC. The heat of the junction of the motor drive IC is transmitted to the temperature detecting element through the IC lead legs, but the heat is taken away by the printed wiring board. Therefore, by providing a through hole surrounding the temperature detecting element, the heat applied to the printed wiring board is reduced. Can be detected by avoiding the diffusion of the IC. There is an effect that the thermal coupling force is further enhanced with respect to the contents of claims 1 and 2.
【００１４】[0014]
【実施例】（実施例１）次に、本発明の具体例を図１、
図４、図５、図６、図７、図８に基づいて説明する。図
４（ａ）から（ｅ）において、けい素鋼板を積層した積
層体１を絶縁部材２にて絶縁し、そこにモータ巻線４を
巻き付ける。絶縁部材２は端子片３が固定される構造と
し、モータ巻線４を端子片３にかしめたものを、絶縁部
材２に固定する。積層体１を複数個組み合わせて、固定
子５とする。端子片３は、三相通電のため３個設ける。
中性点が必要な場合はもう１つ端子片３を追加してもよ
い。(Embodiment 1) Next, a concrete example of the present invention is shown in FIG.
The description will be made based on FIGS. 4, 5, 6, 7, and 8. 4A to 4E, a laminated body 1 in which silicon steel sheets are laminated is insulated by an insulating member 2, and a motor winding 4 is wound therearound. The insulating member 2 has a structure in which the terminal strip 3 is fixed, and the motor winding 4 caulked to the terminal strip 3 is fixed to the insulating member 2. The stator 5 is obtained by combining a plurality of the laminates 1. Three terminal strips 3 are provided for three-phase conduction.
If a neutral point is required, another terminal strip 3 may be added.
【００１５】図５（ａ）はこれらに電子部品が実装され
たプリント配線板を取り付け樹脂モールド材６にてモー
ルドし、モータ本体７としたものを示す。図５（ｂ）は
その要部拡大図である。プリント配線板８にモータドラ
イブＩＣ（ディスクリート部品）１０ａやホールセンサ
９等の電子部品を実装したものをモータ本体７に内蔵固
定し、モータ巻線４をかしめた端子片３をプリント配線
板８の銅箔に半田付けすることで、モータ巻線４とモー
タドライブＩＣ（ディスクリート部品）１０ａが接続さ
れる。モータドライブＩＣ（ディスクリート部品）１０
ａの近傍に正特性サーミスタ（表面実装部品）１２ｂを
実装するパット（銅箔）を設ける。正特性サーミスタ
（表面実装部品）１２ｂは、自動実装機で所定のパット
の位置に乗せ、半田面８ｂを半田槽にて半田付けするこ
とで、正特性サーミスタ（表面実装部品）１２ｂは電気
的に回路に接続されると共に、機械的にも固定される。FIG. 5A shows a motor body 7 in which a printed wiring board on which electronic components are mounted is mounted thereon and molded with a resin molding material 6. FIG. 5B is an enlarged view of the main part. An electronic component such as a motor drive IC (discrete component) 10a or a hall sensor 9 mounted on a printed wiring board 8 is fixed in the motor body 7 and the terminal piece 3 with the motor winding 4 caulked is attached to the printed wiring board 8. By soldering to the copper foil, the motor winding 4 and the motor drive IC (discrete component) 10a are connected. Motor drive IC (discrete parts) 10
A pad (copper foil) for mounting a positive temperature coefficient thermistor (surface mounting component) 12b is provided near a. The positive-characteristic thermistor (surface-mount component) 12b is placed on a predetermined pad position by an automatic mounting machine, and the solder surface 8b is soldered in a solder bath, so that the positive-characteristic thermistor (surface-mount component) 12b is electrically connected. Connected to the circuit and fixed mechanically.
【００１６】正特性サーミスタ１２を接続する回路構成
および、動作を図６および図７にて説明する。回路図中
のＶｄｃはモータドライブ用の電源端子、Ｖｃｃは制御
回路の電源端子、Ｖｓｐは速度指令電圧入力端子、ＧＮ
Ｄはグランドを示す。偶数極に着磁されたロータの極性
をホールセンサ９にて検出する。ホールセンサ９の信号
は各々１２０゜の位相差があり、モータドライブＩＣ１
０の内部で三相分配され、モータドライブＩＣ１０内部
の６個のパワー素子を駆動し、モータ巻線４を三相全波
で通電する。モータドライブＩＣ１０は、特定の周波数
の三角波と速度指令電圧Ｖｓｐとを比較し、その結果に
よりモータドライブＩＣ１０内部のパワー素子をスイッ
チングし、モータ巻線４への通電を制御し結果的にモー
タの回転速度を制御する。Ｖｓｐは電圧で与えられ、電
圧が低ければモータへの通電時間が短くなって、回転数
は遅くなり、電圧が高ければモータへの通電時間が長く
なって、回転数が高くなる。通常Ｖｓｐはマイコン等に
よって制御される。A circuit configuration for connecting the positive temperature coefficient thermistor 12 and its operation will be described with reference to FIGS. In the circuit diagram, Vdc is a power terminal for motor drive, Vcc is a power terminal of a control circuit, Vsp is a speed command voltage input terminal, GN
D indicates the ground. The polarity of the rotor magnetized to the even-numbered pole is detected by the Hall sensor 9. The signals of the Hall sensors 9 each have a phase difference of 120 °, and the motor drive IC 1
0, the three phases are distributed, and the six power elements inside the motor drive IC 10 are driven to energize the motor winding 4 with three-phase full waves. The motor drive IC 10 compares the triangular wave of a specific frequency with the speed command voltage Vsp, and switches the power element inside the motor drive IC 10 based on the result, controls the energization of the motor winding 4 and consequently rotates the motor. Control the speed. Vsp is given as a voltage. If the voltage is low, the energizing time to the motor is short and the number of revolutions is low. If the voltage is high, the energizing time to the motor is long and the number of revolutions is high. Usually, Vsp is controlled by a microcomputer or the like.
【００１７】図６は正特性サーミスタ１２を速度指令電
圧入力端子Ｖｓｐに取り付けたもので、速度指令は正特
性サーミスタ１２と固定抵抗１８の分圧比で入力され
る。正特性サーミスタ１２は、モータドライブＩＣ１０
の速度指令入力端子Ｖｓｐの近傍に配置する。正特性サ
ーミスタ１２は図８のような抵抗ー温度特性を有してお
り、常温では約５００Ωであるが、温度が１００℃を超
えると抵抗値も１０ｋΩ以上と急激に抵抗値が増加す
る。FIG. 6 shows that the positive characteristic thermistor 12 is attached to the speed command voltage input terminal Vsp, and the speed command is input by the voltage dividing ratio between the positive characteristic thermistor 12 and the fixed resistor 18. The positive characteristic thermistor 12 is a motor drive IC 10
In the vicinity of the speed command input terminal Vsp. The positive temperature coefficient thermistor 12 has a resistance-temperature characteristic as shown in FIG. 8 and is about 500Ω at room temperature, but when the temperature exceeds 100 ° C., the resistance value rapidly increases to 10 kΩ or more.
【００１８】Ｖｓｐ端子につけられた正特性サーミスタ
１２は、固定抵抗１８を充分大きい値を選定すれば、常
温において全く無視できる値であるが、モータドライブ
ＩＣの温度が上昇し、正特性サーミスタ１２の温度が高
くなるとそれに伴って、抵抗値が上昇すると、その分圧
比で速度指令電圧が低くなる。何等かの不具合でＶｓｐ
が最大値のままであってモータが過負荷状態となって
も、ドライブＩＣの温度を検出することで、速度指令電
圧Ｖｓｐを下げ、モータへの通電を減らし、モータの過
熱やモータドライブＩＣの破損を防ぐ。The value of the positive temperature coefficient thermistor 12 attached to the Vsp terminal is negligible at room temperature if the value of the fixed resistor 18 is selected to be sufficiently large. However, the temperature of the motor drive IC rises, and the temperature of the positive temperature coefficient thermistor 12 increases. When the temperature increases, the resistance value increases, and the speed command voltage decreases at the divided voltage ratio. Vsp with some trouble
Even if the motor remains overloaded and the motor is overloaded, the temperature of the drive IC is detected to reduce the speed command voltage Vsp, reduce the power supply to the motor, overheat the motor, Prevent damage.
【００１９】図７は正特性サーミスタ１２を電流制限回
路の基準電圧部に取り付けたもので、基準電圧Ｖｒｅｆ
を正特性サーミスタ１２と固定抵抗１８の比で分圧した
ものを電流制限回路の基準電圧としている。モータドラ
イブＩＣ１０の出力電流はモータ巻線４を経由した後、
電流検出抵抗２２に流れ、電流検出抵抗２２の両端に電
圧として現れる。電流制限回路は、基準電圧を正特性サ
ーミスタ１２と固定抵抗１８で分圧した電圧と、電流検
出抵抗２２の両端電圧を比較し、電流検出抵抗２２の両
端電圧が高くなった時、モータドライブＩＣの出力をＯ
ＦＦし、モータドライブＩＣおよびモータ巻線に流れる
電流を制限する。基準電圧入力端子の近傍につけられた
正特性サーミスタ１２が、モータドライブＩＣの温度上
昇に伴って、抵抗値が上昇すると電流制限回路に入力さ
れる基準電圧が低くなり、電流検出抵抗２２に流れる電
流がモータドライブＩＣの温度が上昇すればするほど、
少なく制限されモータの過熱やモータドライブＩＣの破
損を防ぐ。FIG. 7 shows a PTC thermistor 12 attached to a reference voltage section of a current limiting circuit.
Is divided by the ratio of the positive characteristic thermistor 12 and the fixed resistor 18 to obtain the reference voltage of the current limiting circuit. After the output current of the motor drive IC 10 passes through the motor winding 4,
It flows through the current detection resistor 22 and appears as a voltage across the current detection resistor 22. The current limiting circuit compares the voltage obtained by dividing the reference voltage with the positive temperature coefficient thermistor 12 and the fixed resistor 18 with the voltage across the current detection resistor 22, and when the voltage across the current detection resistor 22 increases, the motor drive IC Output of O
FF is performed to limit the current flowing through the motor drive IC and the motor winding. When the positive temperature coefficient thermistor 12 attached near the reference voltage input terminal increases the resistance value with the temperature rise of the motor drive IC, the reference voltage input to the current limiting circuit decreases, and the current flowing through the current detection resistor 22 decreases. As the temperature of the motor drive IC rises,
Limited to prevent overheating of the motor and damage to the motor drive IC.
【００２０】図１（ａ）は、モータドライブＩＣがディ
スクリート部品の場合の実装例を示す。半田付けは、半
田槽を使用したフロー半田で行う。便宜上、プリント配
線板の半田に浸す面を半田面、その反対面を部品面と定
義する。モータ駆動ＩＣはプリント配線板の部品面８ａ
に実装し、表面実装形状の正特性サーミスタは半田面８
ｂに実装する。プリント配線板８にはモータドライブＩ
Ｃ１０を実装し、そのリード脚１３の近傍に正特性サー
ミスタ（表面実装部品）１２ｂを実装し、何れも半田１
１でプリント配線板８のランド１４やパット１５に電気
的に接続する。正特性サーミスタは温度の上昇と共に抵
抗値が上昇する特性を有し、特に指数関数的変化が好ま
しい。モータ駆動用ＩＣの接合温度を測定するのには、
ＩＣの樹脂フレームや金属フレームにネジ止め等で固定
する方法が最も理想的であるが、実際の量産においては
作業性が極めて悪いという問題点がある。FIG. 1A shows an example of mounting when the motor drive IC is a discrete component. Soldering is performed by flow solder using a solder bath. For convenience, the surface of the printed wiring board that is immersed in the solder is defined as the solder surface, and the opposite surface is defined as the component surface. The motor drive IC is the component surface 8a of the printed wiring board.
And the surface mount PTC thermistor is solder surface 8
b. The printed wiring board 8 has a motor drive I
C10 is mounted, and a positive temperature coefficient thermistor (surface mount component) 12b is mounted near the lead leg 13 thereof.
At 1, the printed wiring board 8 is electrically connected to the lands 14 and the pads 15. The positive temperature coefficient thermistor has a characteristic that the resistance value increases with an increase in temperature, and an exponential change is particularly preferable. To measure the junction temperature of the motor drive IC,
The most ideal method is to fix it to the resin frame or metal frame of the IC with screws or the like, but there is a problem that workability is extremely poor in actual mass production.
【００２１】そこで、ＩＣの樹脂フレームにモールドさ
れ、かつ材料が銅で熱伝導率が約9.1×10-1cal／cm・se
c・℃と極めて高いＩＣのリード脚に着目し、そのリー
ド脚に正特性サーミスタの表面実装部品を近づけて配置
し、モータ駆動ＩＣの温度を検知する構造とする。正特
性サーミスタは電子部品のひとつとして、プリント配線
板組立の工程で半田にて、電気的・機械的に接続固定さ
れる。Therefore, it is molded on the resin frame of the IC, is made of copper, and has a thermal conductivity of about 9.1 × 10 −1 cal / cm · se.
Focusing on the lead leg of the IC, which is extremely high at c.degree. C., a surface mount component of a positive temperature coefficient thermistor is arranged close to the lead leg to detect the temperature of the motor drive IC. The PTC thermistor is electrically and mechanically connected and fixed as one of the electronic components by solder in a process of assembling the printed wiring board.
【００２２】図１（ｂ）のようにモータ駆動ＩＣが表面
実装部品の場合も同様に、ＩＣのリード脚に正特性サー
ミスタ１２ｂを近づけて配置することで同様に効果があ
る。これらの工夫により、モータ駆動ＩＣの異常時の温
度上昇をＩＣの接合部との温度差を小さく、速やかに検
出でき、また温度検出素子の容易な取り付けで実現でき
るという作用がある。Similarly, when the motor drive IC is a surface mount component as shown in FIG. 1B, the same effect can be obtained by disposing the positive temperature coefficient thermistor 12b close to the lead leg of the IC. With these measures, there is an effect that the temperature rise at the time of abnormality of the motor drive IC can be quickly detected with a small temperature difference from the junction of the IC, and the temperature detecting element can be easily mounted.
【００２３】（実施例２）具体的な実施例として図２に
基づいて説明する。実施例１と同様なモータ構造におい
て、プリント配線板８にモータドライブＩＣ１０ａを実
装し、モータドライブＩＣ１０ａのリード脚１３の近傍
に温度検出素子である正特性サーミスタ１２ｂを実装す
る。その際、モータ駆動ドライブＩＣ１０ａのリード脚
用のランド１４と正特性サーミスタのパット１５を一体
のランドとし、モータドライブＩＣ１０ａのリード脚１
３と正特性サーミスタ１２ｂを半田槽で半田１１で接続
する。半田で接続することで、熱伝導性がさらに改善さ
れ、モータ駆動ドライブＩＣの接合温度に近い温度を検
出することができ、実施例１に対してさらにＩＣの接合
部と正特性サーミスタの温度差を小さくする作用があ
る。(Embodiment 2) A specific embodiment will be described with reference to FIG. In the motor structure similar to that of the first embodiment, a motor drive IC 10a is mounted on the printed wiring board 8, and a positive temperature coefficient thermistor 12b as a temperature detecting element is mounted near the lead leg 13 of the motor drive IC 10a. At this time, the land 14 for the lead leg of the motor drive IC 10a and the pad 15 of the positive temperature coefficient thermistor are integrated lands, and the lead leg 1 of the motor drive IC 10a is
3 and the PTC thermistor 12b are connected by solder 11 in a solder bath. By connecting with solder, the thermal conductivity is further improved, a temperature close to the junction temperature of the motor drive IC can be detected, and the temperature difference between the junction of the IC and the positive temperature coefficient thermistor with respect to Example 1 Has the effect of reducing
【００２４】（実施例３）具体的な実施例として図３に
基づいて説明する。実施例１と同様なモータ構造におい
て、プリント配線板８にモータドライブＩＣ１０ａを実
装し、モータドライブＩＣ１０ａのリード脚１３の近傍
に温度検出素子である正特性サーミスタ１２ｂを実装す
る。正特性サーミスタ１２ｂを実装したパットを囲むよ
うに、プリント配線板８に貫通穴１６（スリット）を設
ける。プリント配線板材料は、ガラス複合材のもので約
7.1×10-3cal／cm・sec・℃で、熱絶縁物である空気に
比べると熱伝導性が良い。(Embodiment 3) A specific embodiment will be described with reference to FIG. In the motor structure similar to that of the first embodiment, a motor drive IC 10a is mounted on the printed wiring board 8, and a positive temperature coefficient thermistor 12b as a temperature detecting element is mounted near the lead leg 13 of the motor drive IC 10a. A through hole 16 (slit) is provided in the printed wiring board 8 so as to surround the pad on which the PTC thermistor 12b is mounted. Printed wiring board materials are glass composite materials.
At 7.1 × 10 -3 cal / cm · sec · ° C, it has better thermal conductivity than air, which is a thermal insulator.
【００２５】したがって、モータドライブＩＣのリード
脚から正特性サーミスタに伝わったＩＣ接合部の温度を
スリットを入れることで、より熱伝導性の悪い空気によ
りプリント配線板に逃げないようにするもので、結果的
に正特性サーミスタの温度が高くなり、実施例２に対し
て接合部と温度を検出する正特性サーミスタの温度差を
小さくするという効果がある。Therefore, by slitting the temperature of the IC junction transmitted from the lead leg of the motor drive IC to the positive temperature coefficient thermistor, it is possible to prevent the air having poor thermal conductivity from escaping to the printed wiring board. As a result, the temperature of the positive temperature coefficient thermistor is increased, and there is an effect that the temperature difference between the junction and the temperature of the positive temperature coefficient thermistor for detecting the temperature is reduced.
【００２６】なお、本実施例はあくまでも代表例であ
り、モータの種類、モータ本体のモールドの有無や固定
子の形状・構造、回路形式を限定するものではない。The present embodiment is merely a representative example, and does not limit the type of motor, the presence or absence of a molded motor body, the shape and structure of the stator, and the circuit type.
【００２７】[0027]
【発明の効果】以上のように請求項１記載の発明によれ
ば、モータ駆動ＩＣを使ったモータにおいて、過熱保護
用の温度検出素子を熱伝導率の高いモータ駆動ＩＣのリ
ード脚近傍に半田付け固定したもので、温度検出素子の
取り付けが容易で、生産性が高いという効果がある。As described above, according to the first aspect of the present invention, in a motor using a motor drive IC, a temperature detecting element for overheating protection is soldered near a lead leg of the motor drive IC having high thermal conductivity. Since the temperature detecting element is attached and fixed easily, there is an effect that the productivity is high.
【００２８】また、請求項２記載の発明によれば、モー
タ駆動ＩＣを使ったモータにおいて、過熱保護用の温度
検出素子を熱伝導率の高いモータ駆動ＩＣのリード脚と
同じランドに実装し、半田付け固定したもので、プリン
ト配線板の銅箔以外に半田でもリード脚と温度検出素子
を熱結合したもので、接合部に近い温度を温度検出素子
に伝えることができるという効果がある。According to the second aspect of the present invention, in a motor using a motor drive IC, a temperature detecting element for overheating protection is mounted on the same land as a lead leg of the motor drive IC having high thermal conductivity. Since the lead leg and the temperature detecting element are thermally bonded to each other by soldering instead of the copper foil of the printed wiring board, there is an effect that a temperature close to the junction can be transmitted to the temperature detecting element.
【００２９】また、請求項３記載の発明によれば、モー
タ駆動ＩＣを使ったモータにおいて過熱保護用の温度検
出素子を熱伝導率の高いモータ駆動ＩＣのリード脚近傍
に半田付けで固定し、温度検出素子の周囲を囲んで、プ
リント配線板を貫通するスリットを設けたものでＩＣリ
ード脚からの熱が温度検出素子に伝わった後、プリント
配線板に放熱しにくくし、ＩＣの温度上昇に対する追従
性を良くするという効果がある。According to the third aspect of the present invention, in a motor using a motor drive IC, a temperature detecting element for overheating protection is fixed by soldering near a lead leg of the motor drive IC having a high thermal conductivity. A slit that penetrates the printed wiring board is provided around the temperature detecting element. After the heat from the IC lead leg is transmitted to the temperature detecting element, it is difficult to radiate the heat to the printed wiring board. This has the effect of improving followability.
【図１】（ａ）本発明の実施例１を示す断面図 （ｂ）同モータドライブＩＣを表面実装部品とした断面
図FIG. 1A is a cross-sectional view showing a first embodiment of the present invention. FIG. 1B is a cross-sectional view showing the same motor drive IC as a surface-mounted component.
【図２】（ａ）本発明の実施例２を示す断面図 （ｂ）同正特性サーミスタ実装ランド・パットを示す図 （ｃ）同正特性サーミスタを実装半田付けした図FIG. 2A is a cross-sectional view illustrating a second embodiment of the present invention. FIG. 2B is a view illustrating a land pad mounted with the same positive temperature coefficient thermistor. FIG.
【図３】（ａ）本発明の実施例３を示す断面図 （ｂ）同正特性サーミスタを実装し周囲に空隙を設けた
図FIG. 3A is a cross-sectional view illustrating a third embodiment of the present invention. FIG. 3B is a view in which the same positive temperature coefficient thermistor is mounted and a gap is provided around the thermistor.
【図４】（ａ）本発明に関連する鋼板積層体の斜視図 （ｂ）同鋼板積層体に絶縁部材と端子片を取り付けた斜
視図 （ｃ）同端子片の斜視図 （ｄ）同モータ巻線をかしめた端子片の斜視図 （ｅ）同固定子を示す図FIG. 4 (a) is a perspective view of a laminated steel sheet related to the present invention; (b) is a perspective view of an insulating member and a terminal piece attached to the laminated steel sheet; (c) is a perspective view of the same terminal piece; Perspective view of terminal piece with crimped winding (e) View showing same stator
【図５】（ａ）本発明に関連するモータとプリント配線
板の構造断面図 （ｂ）同正特性サーミスタ取付け部拡大図5A is a cross-sectional view of the structure of a motor and a printed wiring board related to the present invention. FIG.
【図６】正特性サーミスタを速度指令電圧入力部に取付
けた回路図FIG. 6 is a circuit diagram in which a positive temperature coefficient thermistor is attached to a speed command voltage input unit.
【図７】同電流制限回路部に取付けた回路図FIG. 7 is a circuit diagram attached to the current limiting circuit unit.
【図８】正特性サーミスタの抵抗−温度特性図FIG. 8 is a resistance-temperature characteristic diagram of a positive temperature coefficient thermistor;
【図９】（ａ）従来の正特性サーミスタとパワー素子の
取付正面図 （ｂ）同側面図FIG. 9A is a front view of mounting a conventional PTC thermistor and a power element, and FIG. 9B is a side view of the same.
【図１０】従来の温度ヒューズとモータドライブＩＣの
取付け図FIG. 10 is a mounting diagram of a conventional thermal fuse and a motor drive IC.
【図１１】従来のモールドモータの構造断面図FIG. 11 is a structural sectional view of a conventional molded motor.
１ 積層体 ２ 絶縁部材 ３ 端子片 ４ モータ巻線 ５ 固定子 ６ 樹脂モールド材 ７ モータ本体 ８ プリント配線板 ８ａ 部品面 ８ｂ 半田面 ９ ホールセンサ １０ モータドライブＩＣ １０ａ モータドライブＩＣ（ディスクリート部品） １０ｂ モータドライブＩＣ（表面実装部品） １１ 半田 １２ 正特性サーミスタ １２ａ 正特性サーミスタ（ディスクリート部品） １２ｂ 正特性サーミスタ（表面実装部品） １３ リード脚 １４ ランド １５ パット １６ 空隙 １７ 温度ヒューズ １８ 固定抵抗 １９ パワートランジスタ ２０ 接着剤 ２１ ヒートシンク ２２ 電流検出抵抗 DESCRIPTION OF SYMBOLS 1 Laminated body 2 Insulating member 3 Terminal piece 4 Motor winding 5 Stator 6 Resin molding material 7 Motor main body 8 Printed wiring board 8a Component surface 8b Solder surface 9 Hall sensor 10 Motor drive IC 10a Motor drive IC (discrete component) 10b Motor Drive IC (Surface Mounted Component) 11 Solder 12 Positive Characteristic Thermistor 12a Positive Characteristic Thermistor (Discrete Component) 12b Positive Characteristic Thermistor (Surface Mounted Component) 13 Lead Leg 14 Land 15 Pad 16 Air Gap 17 Thermal Fuse 18 Fixed Resistance 19 Power Transistor 20 Adhesion Agent 21 Heat sink 22 Current detection resistor
Claims (3)
に絶縁部材を介して巻装された巻線と、前記絶縁部材に
固定され前記巻線の終端と電気的に接続された端子片と
で構成された固定子と、前記端子片に電気的に接続され
るプリント配線板と前記プリント配線板に実装されたモ
ータ駆動ＩＣで構成されるモータであって、温度検出素
子を前記モータ駆動ＩＣのリード脚の近傍に設置したこ
とを特徴とする温度検出素子を内蔵したモータ。1. A laminated body formed by laminating metal plates, a winding wound around the laminated body via an insulating member, and a terminal fixed to the insulating member and electrically connected to an end of the winding. A motor comprising: a stator comprising a plurality of pieces; a printed wiring board electrically connected to the terminal pieces; and a motor drive IC mounted on the printed wiring board, wherein the motor comprises a temperature detecting element. A motor having a built-in temperature detecting element, which is provided near a lead leg of a drive IC.
ド脚を実装する銅箔と、温度検出素子を実装する銅箔を
一体形状とし、前記リード脚と前記温度検出素子を半田
にて熱結合することを特徴とする温度検出素子を内蔵し
た請求項１記載のモータ。2. A copper foil for mounting a lead leg of a motor drive IC of a printed wiring board and a copper foil for mounting a temperature detecting element are integrally formed, and the lead leg and the temperature detecting element are thermally coupled by soldering. The motor according to claim 1, further comprising a temperature detecting element.
部分のプリント配線板を前記温度検出素子を囲むように
プリント基板を貫通する貫通穴を設けたことを特徴とす
る温度検出素子を内蔵した請求項１または請求項２記載
のモータ。3. A built-in temperature detecting element, wherein a through hole penetrating the printed circuit board is provided so as to surround the temperature detecting element at a portion of the printed wiring board on which the temperature detecting element is mounted on the printed circuit board. The motor according to claim 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10362654A JP2000188850A (en) | 1998-12-21 | 1998-12-21 | Motor with built-in temperature detecting element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10362654A JP2000188850A (en) | 1998-12-21 | 1998-12-21 | Motor with built-in temperature detecting element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000188850A true JP2000188850A (en) | 2000-07-04 |
Family
ID=18477413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10362654A Withdrawn JP2000188850A (en) | 1998-12-21 | 1998-12-21 | Motor with built-in temperature detecting element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000188850A (en) |
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| JP2002021794A (en) * | 2000-07-12 | 2002-01-23 | Matsushita Electric Ind Co Ltd | Electric blower and vacuum cleaner using the same |
| JP2002354870A (en) * | 2001-05-21 | 2002-12-06 | Matsushita Electric Ind Co Ltd | Brushless motor drive |
| JP4696395B2 (en) * | 2001-05-21 | 2011-06-08 | パナソニック株式会社 | Brushless motor drive device |
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| WO2011099258A1 (en) * | 2010-02-10 | 2011-08-18 | パナソニック株式会社 | Brushless motor drive device, brushless motor, and air conditioner |
| US20130175012A1 (en) * | 2010-09-15 | 2013-07-11 | Mitsubishi Electric Corporation | Power conversion device, motor including the same, air conditioner having the motor incorporated therein, and ventilation fan having the motor incorporated therein |
| EP2618464A4 (en) * | 2010-09-15 | 2016-10-19 | Mitsubishi Electric Corp | Power conversion device, motor containing same, air conditioner containing motor, and ventilation fan containing motor |
| US9819297B2 (en) | 2010-09-15 | 2017-11-14 | Mitsubishi Electric Corporation | Power conversion device, motor including the same, air conditioner having the motor incorporated therein, and ventilation fan having the motor incorporated therein |
| JP2012100421A (en) * | 2010-11-01 | 2012-05-24 | Mitsubishi Electric Corp | Stator of motor, mold stator, motor, air conditioner, and method of manufacturing motor |
| JP2011050247A (en) * | 2010-12-10 | 2011-03-10 | Mitsubishi Electric Corp | Motor with built-in power conversion circuit and device mounting the same |
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