JP2000178342A - Insulation paste - Google Patents
Insulation pasteInfo
- Publication number
- JP2000178342A JP2000178342A JP35851998A JP35851998A JP2000178342A JP 2000178342 A JP2000178342 A JP 2000178342A JP 35851998 A JP35851998 A JP 35851998A JP 35851998 A JP35851998 A JP 35851998A JP 2000178342 A JP2000178342 A JP 2000178342A
- Authority
- JP
- Japan
- Prior art keywords
- coupling agent
- organic solvent
- pts
- inorganic filler
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は接着性に優れており
かつブリードアウトが少ない絶縁ペーストに関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulating paste having excellent adhesiveness and low bleed-out.
【０００２】[0002]
【従来の技術】エレクトロニクス業界の最近の著しい発
展により、半導体素子はトランジスター、IC,LSI,超LSI
と進化してきており、これら半導体素子における回路の
集積度が急激に増大すると伴に大量生産が可能となり、
これらを用いた半導体製品の普及に伴ってその量産にお
ける作業性の向上並びにコストダウンが重要な問題にな
ってきた。従来は半導体素子を金属フレームなどの導体
にAu-Si共晶法により接合し、次いでハーメチックシー
ルによって封止して半導体製品とするのが普通であっ
た。しかし、量産時の作業性、コストの面より、樹脂封
止法が開発され現在は一般化されている。これに伴いマ
ウント工程におけるAu-Si共晶法の改良としてハンダ材
料や導電性樹脂ペーストや樹脂ペーストといったマウン
ト用樹脂による方法が採り上げられるようになった。2. Description of the Related Art Due to recent remarkable developments in the electronics industry, semiconductor devices have become transistors, ICs, LSIs and VLSIs.
With the rapid increase in the degree of circuit integration in these semiconductor devices, mass production becomes possible,
With the spread of semiconductor products using these, improvement of workability and cost reduction in mass production have become important issues. Conventionally, it has been common practice to bond a semiconductor element to a conductor such as a metal frame by an Au-Si eutectic method, and then seal it with a hermetic seal to obtain a semiconductor product. However, in view of workability and cost during mass production, a resin encapsulation method has been developed and is now generally used. Along with this, as a modification of the Au-Si eutectic method in the mounting process, a method using a mounting resin such as a solder material, a conductive resin paste or a resin paste has come to be adopted.
【０００３】しかしハンダ法では信頼性が低いこと、素
子の電極を汚染し易いこと等が欠点とされ、高熱伝導性
を要するパワートランジスタ、パワーICの素子に使用が
限られている。これに対しマウント用樹脂はハンダ法に
比べ、作業性に於いても信頼性に於いても優れており、
その需要が急激に拡大している。中でもシリカ粉末を用
いた絶縁ペーストは貴金属を全く用いていないため安価
であり、特に導電性を必要としない用途での需要が拡大
している。[0003] However, the solder method has drawbacks such as low reliability and easy contamination of device electrodes, and its use is limited to power transistors and power IC devices requiring high thermal conductivity. In contrast, the mounting resin is superior in workability and reliability compared to the solder method,
Its demand is growing rapidly. Above all, an insulating paste using silica powder is inexpensive because no precious metal is used, and the demand for applications that do not require conductivity is expanding.
【０００４】ところがこのような絶縁ペーストを用いて
リードフレームや有機基板にシリコンチップをマウント
した場合に硬化中に樹脂成分がブリードアウトしワイヤ
ーボンディング時に不着不良等を引き起こす不具合が発
生した。However, when a silicon chip is mounted on a lead frame or an organic substrate using such an insulating paste, a resin component bleeds out during curing, causing a problem such as non-bonding failure during wire bonding.
【０００５】[0005]
【発明が解決しようとする課題】本発明はこれらの問題
を解決するために鋭意検討した結果、樹脂成分のブリー
ドアウト（以下単にブリードという）が少なく、接着性
に優れた絶縁ペーストを提供するものである。SUMMARY OF THE INVENTION As a result of intensive studies to solve these problems, the present invention provides an insulating paste having a small amount of resin component bleed-out (hereinafter simply referred to as "bleed") and having excellent adhesiveness. It is.
【０００６】[0006]
【課題を解決するための手段】本発明は 一般式（１）
で表される数平均分子量が600〜1000であるエポキシ樹
脂(A)、硬化剤(B)、有機溶剤(C)、カップリング剤(D)、
無機フィラー(E)からなることを特徴とする絶縁ペース
トである。According to the present invention, there is provided a compound represented by the following general formula (1):
An epoxy resin having a number average molecular weight of 600 to 1000 represented by (A), a curing agent (B), an organic solvent (C), a coupling agent (D),
An insulating paste comprising an inorganic filler (E).
【化２】 Embedded image
【０００７】[0007]
【発明の実施の形態】本発明に用いる式（１）のエポキ
シ樹脂は高温時の接着性、耐湿性に優れた硬化物を得る
ことが出来るが、硬化時のブリードを低減し、硬化物の
吸湿後の熱時の接着強度を損なわないためには、樹脂の
数平均分子量が600〜1000であることが好ましい。この
数平均分子量においては上記エポキシ樹脂は常温におい
て固形であり通常有機溶剤に溶解して溶液として使用す
る。樹脂の数平均分子量が1000を越えるとペーストが高
粘度となりマウント作業性に問題があり、また硬化物の
接着強度が著しく低下する。600を下回ると硬化時のブ
リードが激しくなり、特にファインピッチ基板において
は後工程のワイヤーボンディング時に不着不良等を引き
起こすので好ましくない。BEST MODE FOR CARRYING OUT THE INVENTION The epoxy resin of the formula (1) used in the present invention can provide a cured product excellent in adhesiveness and moisture resistance at high temperatures, but reduces bleeding during curing and reduces the cured product. The number average molecular weight of the resin is preferably from 600 to 1,000 in order not to impair the adhesive strength when heated after moisture absorption. With this number average molecular weight, the epoxy resin is solid at room temperature and is usually dissolved in an organic solvent and used as a solution. If the number average molecular weight of the resin exceeds 1000, the paste becomes high in viscosity, causing problems in mounting workability, and the adhesive strength of the cured product is significantly reduced. If it is less than 600, bleeding at the time of curing becomes intense, and particularly in the case of a fine pitch substrate, non-adhesion failure or the like is caused at the time of wire bonding in a later step, which is not preferable.
【０００８】本発明の硬化剤としてはジシアンジアミ
ド、イミダゾール、フェノールノボラック等があるが硬
化時のブリード低減と硬化物の接着強度の点からこれら
の中から選ばれた少なくとも一つを用いることが望まし
い。もちろん併用して用いることも差し支えない。また
本発明で用いられるイミダゾールとして2-メチルイミダ
ゾール、2-エチル-4-メチルイミダゾール,2-ウンデシル
イミダゾール、2-フェニルイミダゾール、2-フェニル-4
-メチルイミダゾール、1-シアノエチル-2-メチルイミダ
ゾール、1-シアノエチル-2-フェニルイミダゾール、2,4
-ジアミノ-6-[2'-メチルイミダゾリル-(1')]エチル-s-
トリアジン、2,4-ジアミノ-6-[2'-エチル-4'-メチルイ
ミダゾリル-(1')]エチル-s-トリアジン、2,4-ジアミノ-
6-[2'-ウンデシルイミダゾリル-(1')]エチル-s-トリア
ジン、2,4-ジアミノ-6-[2'-メチルイミダゾリル-(1')]
エチル-s-トリアジン｛イソシアヌル酸付加物｝、2-フ
ェニル-4,5-ジヒドロキシメチルイミダゾール,2-フェニ
ル-4-メチル-5-ヒドロキシメチルイミダゾール、1-シア
ノエチル-2-フェニル-4,5-ジシアノエトキシメチルイミ
ダゾールなどが挙げられるが特に限定されるものではな
い。As the curing agent of the present invention, there are dicyandiamide, imidazole, phenol novolak and the like, and it is desirable to use at least one selected from these in view of reduction of bleed during curing and adhesive strength of the cured product. Of course, it can be used in combination. Further, as the imidazole used in the present invention, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 2-phenylimidazole, 2-phenyl-4
-Methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 2,4
-Diamino-6- [2'-methylimidazolyl- (1 ')] ethyl-s-
Triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1 ')] ethyl-s-triazine, 2,4-diamino-
6- [2'-undecylimidazolyl- (1 ')] ethyl-s-triazine, 2,4-diamino-6- [2'-methylimidazolyl- (1')]
Ethyl-s-triazine {isocyanuric acid adduct}, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 1-cyanoethyl-2-phenyl-4,5- Dicyanoethoxymethylimidazole may be mentioned, but is not particularly limited.
【０００９】また本発明で用いられるフェノールノボラ
ックとしてはフェノール化合物を酸性条件下でホルムア
ルデヒドなどと反応させて得られるものであれば特に限
定されるものではない。The phenol novolak used in the present invention is not particularly limited as long as it is obtained by reacting a phenol compound with formaldehyde or the like under acidic conditions.
【００１０】本発明で用いる有機溶剤としてはプロピレ
ングリコールエチルエーテル、３メチル３メトキシブタ
ノール、プロピレングリコールメチルエーテルアセテー
ト、メトキシブチルアセテート等が挙げられるが、いず
れも沸点が130〜170℃であることが望ましい。有機溶剤
の沸点が130℃未満であるとペースト混練作業中に溶剤
が飛散するためペーストの粘度を調整するのが困難とな
るためペーストの品質が不安定となり、またペーストの
ディスペンス時に溶剤が飛散しペーストが乾燥しニード
ルの目詰まりを引き起こす可能性がある。溶剤の沸点が
170℃を越えると硬化物中に溶剤が多量に残存し、接着
強度の低下やハンダ処理時のポップコーン現象を引き起
こす可能性があり好ましくない。As the organic solvent used in the present invention, propylene glycol ethyl ether, 3-methyl-3-methoxybutanol, propylene glycol methyl ether acetate, methoxybutyl acetate and the like can be mentioned, all of which have a boiling point of 130 to 170 ° C. . If the boiling point of the organic solvent is less than 130 ° C., the solvent is scattered during the paste kneading operation, so that it is difficult to adjust the viscosity of the paste, so that the quality of the paste becomes unstable, and the solvent is scattered when dispensing the paste. The paste can dry and cause needle clogging. The boiling point of the solvent
If the temperature exceeds 170 ° C., a large amount of solvent remains in the cured product, which may cause a decrease in adhesive strength or a popcorn phenomenon at the time of soldering, which is not preferable.
【００１１】本発明で用いるシランカップリング剤とし
てはメルカプト官能性シラン、エポキシ官能性シラン、
イソシアネート官能性シラン、オレフィン官能性シラン
等が挙げられるがブリードの低減、硬化物の接着強度の
点からメルカプト官能性シランカップリング剤を用いる
のが望ましいが特に限定されるものではない。The silane coupling agent used in the present invention includes mercapto-functional silane, epoxy-functional silane,
An isocyanate-functional silane, an olefin-functional silane and the like can be mentioned, but it is preferable to use a mercapto-functional silane coupling agent from the viewpoints of reduction of bleed and adhesion strength of a cured product, but it is not particularly limited.
【００１２】本発明で用いる無機フィラーとしては炭酸
カルシウム、シリカ、アルミナ等が挙げられ、用途によ
りこれらを複数混合させてもよいがブリード低減と硬化
物の接着強度の点からこれらフィラーの平均粒径が0.5
〜10μｍが望ましい。フィラーの平均粒径が0.5μｍ未
満であるとペーストが高粘度となりマウント作業性に問
題があり、またフィラーの平均粒径が10μｍを越えると
硬化時のブリードが激しくなる。またフィラー表面が疎
水化されていることが硬化物の接着強度の点から望まし
い。The inorganic filler used in the present invention includes calcium carbonate, silica, alumina and the like. A plurality of these may be mixed depending on the application. However, from the viewpoint of bleed reduction and adhesive strength of the cured product, the average particle size of these fillers is considered. Is 0.5
1010 μm is desirable. If the average particle size of the filler is less than 0.5 μm, the paste has a high viscosity, which causes a problem in mounting workability. If the average particle size of the filler exceeds 10 μm, bleeding during curing becomes severe. Further, it is desirable that the filler surface is made hydrophobic from the viewpoint of the adhesive strength of the cured product.
【００１３】本発明においてはエポキシ樹脂(A)100重量
部に対して硬化剤(B)の配合割合が50〜100重量部であ
り、有機溶剤(C)の配合割合が50〜150重量部、カップリ
ング剤(D)の配合割合が5〜10重量部であり、無機フィラ
ーの配合割合が50〜150重量部であることが好ましい。
硬化剤(B)の配合割合が50未満であるとブリードが激し
くなり、また100を越えると硬化物の接着強度が低下す
るので望ましくなく、有機溶剤(C)の配合割合が50未満
であるとペーストが高粘度となり作業性に問題があり、
150を越えると硬化時に飛散する溶剤がマガジン内に滞
留しブリードを促進させるほか、多量に飛散する溶剤は
臭気、安全性において問題があるため好ましくない。In the present invention, the compounding ratio of the curing agent (B) is 50 to 100 parts by weight with respect to 100 parts by weight of the epoxy resin (A), and the compounding ratio of the organic solvent (C) is 50 to 150 parts by weight. The mixing ratio of the coupling agent (D) is preferably 5 to 10 parts by weight, and the mixing ratio of the inorganic filler is preferably 50 to 150 parts by weight.
When the blending ratio of the curing agent (B) is less than 50, bleeding becomes severe, and when it exceeds 100, the adhesive strength of the cured product is undesirably reduced, and when the blending ratio of the organic solvent (C) is less than 50. The paste has high viscosity and there is a problem in workability,
If it exceeds 150, the solvent scattered during curing stays in the magazine to promote bleeding, and the solvent scattered in a large amount is not preferable because it has problems in odor and safety.
【００１４】カップリング剤(D)の配合割合が3未満であ
るとブリードの低減、硬化物の接着強度増強の効果が得
られず、また10を越えるとカップリング剤自身がブリー
ドの要因になるので望ましくない。無機フィラーの配合
割合が50未満であるとブリーの低減、硬化物の接着強度
増強の効果が得られず、150を越えるとペーストが高粘
度となり作業性に問題があるため好ましくない。If the compounding ratio of the coupling agent (D) is less than 3, the effect of reducing bleed and enhancing the adhesive strength of the cured product cannot be obtained, and if it exceeds 10, the coupling agent itself causes bleeding. Not so desirable. If the blending ratio of the inorganic filler is less than 50, the effect of reducing the bleeding and enhancing the adhesive strength of the cured product cannot be obtained, and if it exceeds 150, the paste becomes high in viscosity and has a problem in workability.
【００１５】本発明によると式（１）で示されるクレゾ
ールノボラック型エポキシ樹脂（数平均分子量600〜100
0）を有機溶剤を加え溶液にすることでダイアタッチペ
ーストとして適度な粘度の樹脂が得られ、硬化時の樹脂
成分のブリードによる半導体周辺の汚染、それに伴うワ
イヤーボンディング時の不着不良等を極めて少なくする
ことができる。According to the present invention, a cresol novolak type epoxy resin represented by the formula (1) (number average molecular weight 600 to 100)
By adding an organic solvent to form a solution, a resin having an appropriate viscosity can be obtained as a die attach paste, and contamination around the semiconductor due to bleeding of the resin component during curing and non-adhesion failure during wire bonding are extremely reduced. can do.
【００１６】本発明の樹脂組成物はエポキシ樹脂、有機
溶剤を100℃で予備混合し冷却後、この混合物と硬化
剤、カップリング剤及び無機フィラー、必要に応じて硬
化促進剤、顔料、消泡剤等の添加剤を混合し、三本ロー
ルを用いて混練し、ペーストを得て真空脱泡することに
より製造することができる。The resin composition of the present invention is prepared by premixing an epoxy resin and an organic solvent at 100 ° C. and cooling the mixture. The mixture is then mixed with a curing agent, a coupling agent and an inorganic filler, and if necessary, a curing accelerator, a pigment and a defoamer. It can be manufactured by mixing additives such as an agent, kneading using a three-roll mill, obtaining a paste, and defoaming in vacuo.
【００１７】[0017]
【実施例】＜実施例１＞エポキシ樹脂としてオルトクレ
ゾールノボラック型エポキシ樹脂（数平均分子量688）
（以下EOCN-688）100g、硬化剤としてフェノールノボラ
ック（以下PN）50g及びジシアンジアミド（以下DDA）2g
及び2-フェニル-4,5-ジヒドロキシメチルイミダゾール
（以下2PHZ)2g、有機溶剤として３メチル３メトキシブ
タノール（以下SOLFIT）95g、カップリング剤としてメ
ルカプト官能基シランカップリング剤（以下単にカップ
リング剤）7.5g、無機フィラーとして疎水化シリカパウ
ダー（平均粒径0.5um）（以下単に疎水性シリカ）77gを
配合し三本ロールで混練してダイアタッチペーストを調
整した。このダイアタッチペーストの25℃での粘度をE
型粘度計を用いてr.p.m.2.5で測定した。またこのダイ
アタッチペーストを用いて銀メッキ付き銅フレームに2x
2mm角のシリコンチップを150℃、60minで硬化接着さ
せ、200℃における熱時接着力をプッシュプルゲージで
測定した。またファインピッチのtape-BGA上にこのペー
ストを等量滴下し150℃、60minで硬化させたときの金配
線上とPI(ポリイミド)上それぞれのレジンブリードの長
さの最大値を顕微鏡下（x100)で測定した。上記の結果
を表１に示す。<Example 1> Orthocresol novolak type epoxy resin (number average molecular weight 688) as epoxy resin
(Hereinafter EOCN-688) 100g, phenol novolak (hereinafter PN) 50g and dicyandiamide (hereinafter DDA) 2g as curing agent
And 2-phenyl-4,5-dihydroxymethylimidazole (hereinafter 2PHZ) 2 g, 3-methyl-3-methoxybutanol (hereinafter SOLFIT) 95 g as an organic solvent, mercapto-functional silane coupling agent as a coupling agent (hereinafter simply a coupling agent) 7.5 g of hydrophobized silica powder (average particle diameter 0.5 μm) (hereinafter simply referred to as hydrophobic silica) 77 g was blended as an inorganic filler, and kneaded with a three-roll mill to prepare a die attach paste. Let the viscosity of this die attach paste at 25 ° C be E
It measured at rpm2.5 using a mold viscometer. Also use this die attach paste to attach 2x
A 2 mm square silicon chip was cured and adhered at 150 ° C. for 60 minutes, and the adhesive force at 200 ° C. was measured with a push-pull gauge. The maximum value of the resin bleed length on the gold wiring and PI (polyimide) when the paste was dropped in an equal amount on a fine pitch tape-BGA and cured at 150 ° C for 60 minutes was measured under a microscope (x100 ). Table 1 shows the above results.
【００１８】＜実施例２〜３及び比較例１〜１０＞表１
に示した配合例に従ってペーストを調整した以外は全て
実施例１と同様に行い、各種特性を測定して結果を表１
及び表２に示した。<Examples 2-3 and Comparative Examples 1-10> Table 1
All were performed in the same manner as in Example 1 except that the paste was adjusted according to the formulation examples shown in Table 1.
And Table 2.
【００１９】[0019]
【表１】 [Table 1]
【００２０】[0020]
【表２】 [Table 2]
【００２１】[0021]
【発明の効果】表１及び表２に示したように実施例では
いずれも粘度が著しく高くなく、接着性に優れ、かつブ
リードの少ないことがわかる。As shown in Tables 1 and 2, in each of the examples, it is found that the viscosity is not extremely high, the adhesiveness is excellent, and the bleeding is small.
Claims (5)
00〜1000であるエポキシ樹脂(A)、硬化剤(B)、有機溶剤
(C)、カップリング剤(D)、無機フィラー(E)からなり、
該エポキシ樹脂(A)100重量部に対して該硬化剤(B)の配
合割合が50〜100重量部であり、該有機溶剤(C)の配合割
合が50〜150重量部、該カップリング剤(D)の配合割合が
5〜10重量部であり、該無機フィラー(E)の配合割合が50
〜150重量部であることを特徴とする絶縁ペースト。 【化１】 The number average molecular weight represented by the general formula (1) is 6
Epoxy resin (A), curing agent (B), organic solvent of 100 to 1000
(C), a coupling agent (D), an inorganic filler (E),
The mixing ratio of the curing agent (B) is 50 to 100 parts by weight with respect to 100 parts by weight of the epoxy resin (A), and the mixing ratio of the organic solvent (C) is 50 to 150 parts by weight, the coupling agent. (D)
5 to 10 parts by weight, the mixing ratio of the inorganic filler (E) is 50
Insulating paste characterized in that the amount is up to 150 parts by weight. Embedded image
ノールノボラック、イミダゾールから選ばれた少なくと
も一つである請求項１記載の絶縁ペースト。2. The insulating paste according to claim 1, wherein the curing agent (B) is at least one selected from dicyandiamide, phenol novolak, and imidazole.
る請求項１または２記載の絶縁ペースト。3. The insulating paste according to claim 1, wherein said organic solvent (C) has a boiling point of 130 to 170 ° C.
ング剤である請求項１、２または３記載の絶縁ペース
ト。4. The insulating paste according to claim 1, wherein said coupling agent (D) is a silane coupling agent.
つ平均粒径が0.5〜10μｍである請求項１、２、３また
は４記載の絶縁ペースト。5. The insulating paste according to claim 1, wherein said inorganic filler (E) has a hydrophobic property and has an average particle size of 0.5 to 10 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35851998A JP2000178342A (en) | 1998-12-17 | 1998-12-17 | Insulation paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35851998A JP2000178342A (en) | 1998-12-17 | 1998-12-17 | Insulation paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000178342A true JP2000178342A (en) | 2000-06-27 |
Family
ID=18459746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35851998A Pending JP2000178342A (en) | 1998-12-17 | 1998-12-17 | Insulation paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000178342A (en) |
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