JP2000164688A5 - Manufacturing method of semiconductor devices - Google Patents
Manufacturing method of semiconductor devices Download PDFInfo
- Publication number
- JP2000164688A5 JP2000164688A5 JP1998337065A JP33706598A JP2000164688A5 JP 2000164688 A5 JP2000164688 A5 JP 2000164688A5 JP 1998337065 A JP1998337065 A JP 1998337065A JP 33706598 A JP33706598 A JP 33706598A JP 2000164688 A5 JP2000164688 A5 JP 2000164688A5
- Authority
- JP
- Japan
- Prior art keywords
- cassette
- processed
- semiconductor wafer
- opening
- carrier cassette
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 26
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 239000000969 carrier Substances 0.000 claims description 25
- 238000007789 sealing Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 claims 24
- 238000000034 method Methods 0.000 claims 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000005755 formation reaction Methods 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 238000010926 purge Methods 0.000 claims 1
- 238000004378 air conditioning Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Description
本発明の目的は、被処理物への異物付着を低減するとともに、クリーンルームの空調エネルギなどにおける消費エネルギの削減を図る半導体装置の製造方法を提供することにある。 An object of the present invention is to provide with reducing the adhesion of foreign substances to the object to be treated, the manufacturing method of FIG Ru semiconductors device to reduce energy consumption, such as in air-conditioning energy of the clean room.
すなわち、本発明の半導体装置の製造方法は、複数の被処理物を収容するカセット本体と、前記被処理物の出し入れが行われる開口部を塞いで前記カセット本体を密閉可能な蓋部材とを備えたキャリアカセットを準備する工程と、前記被処理物を収容した前記キャリアカセットを被処理物処理装置の被処理物搬入出部に配置した後、前記キャリアカセットの前記開口部から流入する外気のうち、前記キャリアカセット内の前記被処理物の被処理面に向かって流入する前記外気が最も少なくなるように前記蓋部材を開ける工程と、前記被処理物を前記開口部を介して前記被処理物処理装置に移載した後、前記被処理物に所望の処理を行う工程と、前記処理終了後、前記被処理物処理装置から前記被処理物を取り出して前記被処理物を空の前記キャリアカセットに収容し、その後、前記蓋部材を取り付けて前記キャリアカセットを密閉する工程と、前記処理済みの前記被処理物を用いて半導体装置を組み立てる工程とを有するものである。 That is, the method for manufacturing a semiconductor device of the present invention includes a cassette body for accommodating a plurality of objects to be processed, and a lid member capable of sealing the cassette body by closing an opening in which the objects to be processed are taken in and out. Of the outside air flowing in from the opening of the carrier cassette after the step of preparing the carrier cassette and the carrier cassette containing the object to be processed are placed in the object loading / unloading portion of the object processing device. The step of opening the lid member so that the outside air flowing toward the surface to be processed of the object to be processed in the carrier cassette is minimized, and the object to be processed through the opening. A step of performing a desired treatment on the object to be processed after being transferred to the processing apparatus, and after the processing is completed, the object to be processed is taken out from the object to be processed and the object to be processed is emptied by the carrier cassette. It has a step of attaching the lid member and sealing the carrier cassette, and a step of assembling the semiconductor device using the processed object to be treated .
Claims (4)
前記被処理物を収容した前記キャリアカセットを被処理物処理装置の被処理物搬入出部に配置した後、前記キャリアカセットの前記開口部から流入する外気のうち、前記キャリアカセット内の前記被処理物の被処理面に向かって流入する前記外気が最も少なくなるように前記蓋部材を開ける工程と、
前記被処理物を前記開口部を介して前記被処理物処理装置に移載した後、前記被処理物に所望の処理を行う工程と、
前記処理終了後、前記被処理物処理装置から前記被処理物を取り出して前記被処理物を空の前記キャリアカセットに収容し、その後、前記蓋部材を取り付けて前記キャリアカセットを密閉する工程と、
前記処理済みの前記被処理物を用いて半導体装置を組み立てる工程とを有することを特徴とする半導体装置の製造方法。Preparing a carrier cassette including a cassette body that accommodates a plurality of objects to be processed, and a lid member that can seal the cassette body by closing an opening where the objects to be processed are put in and out;
After the carrier cassette containing the object to be processed is placed in the object to be processed loading / unloading part of the object processing apparatus, the object to be processed in the carrier cassette out of the outside air flowing in from the opening of the carrier cassette. Opening the lid member so that the outside air flowing into the surface to be processed is minimized,
A step of performing a desired process on the workpiece after transferring the workpiece to the workpiece processing apparatus through the opening;
After the processing is completed, the step of taking out the processing object from the processing object processing apparatus and storing the processing object in the empty carrier cassette, and then attaching the lid member and sealing the carrier cassette;
And a step of assembling a semiconductor device using the processed object to be processed.
前記半導体ウェハを収容した前記キャリアカセットをウェハ処理装置の被処理物搬入出部であるローダ部に配置した後、前記キャリアカセットの前記開口部から流入する外気のうち、前記キャリアカセット内の前記半導体ウェハの被処理面である回路形成面に向かって流入する前記外気が最も少なくなるように前記蓋部材を開ける工程と、
前記半導体ウェハを前記開口部を介して前記ウェハ処理装置内に移載した後、前記半導体ウェハに所望の処理を行う工程と、
前記処理終了後、前記ウェハ処理装置から前記半導体ウェハを取り出して前記半導体ウェハを空の前記キャリアカセットに収容し、その後、前記蓋部材を取り付けて前記キャリアカセットを密閉する工程と、
前記処理済みの前記半導体ウェハを用いて半導体装置を組み立てる工程とを有することを特徴とする半導体装置の製造方法。A step of preparing a carrier cassette including a cassette main body that accommodates a plurality of semiconductor wafers to be processed, and a lid member that closes a rectangular opening where the semiconductor wafer is put in and out, and can seal the cassette main body. When,
After the carrier cassette containing the semiconductor wafer is disposed in a loader unit that is a workpiece loading / unloading unit of a wafer processing apparatus, the semiconductor in the carrier cassette out of the outside air flowing in from the opening of the carrier cassette Opening the lid member so that the outside air flowing in toward the circuit forming surface which is the surface to be processed of the wafer is minimized,
A step of performing a desired process on the semiconductor wafer after the semiconductor wafer is transferred into the wafer processing apparatus through the opening;
After the processing is completed, the semiconductor wafer is taken out from the wafer processing apparatus, the semiconductor wafer is accommodated in an empty carrier cassette, and then the lid member is attached to seal the carrier cassette;
And a step of assembling a semiconductor device using the processed semiconductor wafer.
前記半導体ウェハを収容した前記キャリアカセットをウェハ処理装置の被処理物搬入出部であるローダ部に配置した後、前記ローダ部に設けられたノズルを前記キャリアカセットの前記カセット本体の差し込み口に差し込んで前記ノズルから前記カセット本体内にパージガスを供給する工程と、
前記カセット本体内の圧力を外部の圧力より高くした後、前記キャリアカセットの前記蓋部材を開ける工程と、
前記半導体ウェハを前記開口部を介して前記ウェハ処理装置内に移載した後、前記半導体ウェハに所望の処理を行う工程と、
前記処理終了後、前記ウェハ処理装置から前記半導体ウェハを取り出して前記半導体ウェハを空の前記キャリアカセットに収容し、その後、前記蓋部材を取り付けて前記キャリアカセットを密閉する工程と、
前記処理済みの前記半導体ウェハを用いて半導体装置を組み立てる工程とを有することを特徴とする半導体装置の製造方法。A step of preparing a carrier cassette including a cassette main body that accommodates a plurality of semiconductor wafers to be processed, and a lid member that closes a rectangular opening where the semiconductor wafer is put in and out, and can seal the cassette main body. When,
After the carrier cassette containing the semiconductor wafer is placed in a loader unit which is a workpiece loading / unloading unit of a wafer processing apparatus, a nozzle provided in the loader unit is inserted into an insertion port of the cassette body of the carrier cassette. Supplying a purge gas from the nozzle into the cassette body,
Opening the lid member of the carrier cassette after making the pressure in the cassette body higher than the external pressure;
A step of performing a desired process on the semiconductor wafer after the semiconductor wafer is transferred into the wafer processing apparatus through the opening;
After the processing is completed, the semiconductor wafer is taken out from the wafer processing apparatus, the semiconductor wafer is accommodated in an empty carrier cassette, and then the lid member is attached to seal the carrier cassette;
And a step of assembling a semiconductor device using the processed semiconductor wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33706598A JP4142183B2 (en) | 1998-11-27 | 1998-11-27 | Manufacturing method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33706598A JP4142183B2 (en) | 1998-11-27 | 1998-11-27 | Manufacturing method of semiconductor device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000164688A JP2000164688A (en) | 2000-06-16 |
| JP2000164688A5 true JP2000164688A5 (en) | 2005-09-08 |
| JP4142183B2 JP4142183B2 (en) | 2008-08-27 |
Family
ID=18305107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33706598A Expired - Fee Related JP4142183B2 (en) | 1998-11-27 | 1998-11-27 | Manufacturing method of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4142183B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3581310B2 (en) | 2000-08-31 | 2004-10-27 | Ｔｄｋ株式会社 | Semiconductor wafer processing equipment with dustproof function |
| JP3955724B2 (en) | 2000-10-12 | 2007-08-08 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor integrated circuit device |
| JP5051948B2 (en) * | 2001-05-30 | 2012-10-17 | 株式会社ダイヘン | Cassette transport method and cassette transport system |
| US7614840B2 (en) | 2002-12-30 | 2009-11-10 | Tdk Corporation | Wafer processing apparatus having dust proof function |
| JP2005340243A (en) * | 2004-05-24 | 2005-12-08 | Miraial Kk | Gas replacing apparatus of accommodation vessel and gas replacing method using the same |
| JP6291878B2 (en) | 2014-01-31 | 2018-03-14 | シンフォニアテクノロジー株式会社 | Load port and EFEM |
| KR102653120B1 (en) * | 2023-04-27 | 2024-04-01 | (주)한국엔지니어링 | Transferring material fixing apparatus and transporting cart comprising the same |
-
1998
- 1998-11-27 JP JP33706598A patent/JP4142183B2/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3769417B2 (en) | Substrate storage container | |
| KR100304127B1 (en) | Electronic-substrate treatment system using portable sealed container and apparatus thereof | |
| US8074597B2 (en) | Methods and apparatus for purging a substrate carrier | |
| TWI681915B (en) | Loading port | |
| TWI297925B (en) | Purge system for a product container and table for use in the purge system | |
| JP6099945B2 (en) | Lid opening / closing mechanism, shielding mechanism and internal purging method of container | |
| JP2020510320A (en) | Load port operation in electronic device manufacturing apparatus, system, and method | |
| JP2005150706A (en) | Substrate transfer container, device, and method | |
| JPH05286567A (en) | Enclosed type container for clean room | |
| JP2010166077A (en) | Method of loading and unloading substrate, and method of manufacturing semiconductor device | |
| JP2006228808A (en) | Apparatus and method of transporting substrate, and semiconductor fabrication apparatus | |
| JP2006086308A (en) | Semiconductor manufacturing device | |
| JP2000164688A5 (en) | Manufacturing method of semiconductor devices | |
| JPH0531472A (en) | Washing device | |
| JP4255222B2 (en) | Substrate processing apparatus, substrate processing method, and semiconductor device manufacturing method | |
| JP3925918B2 (en) | FOUP gas replacement device | |
| JP4142183B2 (en) | Manufacturing method of semiconductor device | |
| JP4227137B2 (en) | Substrate storage container | |
| JPS6353943A (en) | Semiconductor manufacturing equipment | |
| JP5465979B2 (en) | Semiconductor manufacturing equipment | |
| JPH0735396Y2 (en) | Wafer cassette transport box | |
| KR101674107B1 (en) | Cover opening and closing device for substrate container | |
| JPH0864666A (en) | Substrate container and processing method for substrate | |
| JP4728383B2 (en) | Substrate processing apparatus and semiconductor device manufacturing method | |
| JPH07130831A (en) | Housing/conveying device for semiconductor wafer |