JP2000141077A - Solder paste - Google Patents
Solder pasteInfo
- Publication number
- JP2000141077A JP2000141077A JP10316760A JP31676098A JP2000141077A JP 2000141077 A JP2000141077 A JP 2000141077A JP 10316760 A JP10316760 A JP 10316760A JP 31676098 A JP31676098 A JP 31676098A JP 2000141077 A JP2000141077 A JP 2000141077A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- alloy
- generation
- particles
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品等をプリ
ント基板上に接続するソルダペーストに関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder paste for connecting electronic parts and the like on a printed circuit board.
【０００２】[0002]
【従来の技術】従来のこの種のソルダペーストに含まれ
る半田合金の粉末は、通常錫−鉛共晶合金が使用されて
いる。錫−鉛共晶合金は、銅の表面における濡れ拡がり
性が良好であって、接合の信頼性も高い。2. Description of the Related Art Conventionally, a tin-lead eutectic alloy is used as a solder alloy powder contained in this type of solder paste. The tin-lead eutectic alloy has good wet-spreading property on the surface of copper, and has high bonding reliability.
【０００３】[0003]
【発明が解決しようとする課題】しかしながらこれらの
半田合金は、銅の表面における濡れ拡がり性が良好であ
る反面、熔融状態における表面張力が小さいために、電
子部品を接合する際に半田ボールが生じやすいという問
題がある。However, these solder alloys have good wet-spreadability on the copper surface, but have low surface tension in the molten state, so that solder balls are generated when electronic components are joined. There is a problem that it is easy.
【０００４】すなわちプリント基板のパッドの表面に電
子部品を接合する際に、その半田付けに供される半田の
一部が半田ボールとしてパッドや電子部品から遊離し、
その半田ボールが表面張力の小ささのために、パッドや
電子部品を接合している半田と合体することができず、
電子部品の側部に遊離した半田ボールとして残留するの
である。That is, when an electronic component is joined to the surface of a pad on a printed circuit board, part of the solder used for the soldering is released from the pad or the electronic component as a solder ball,
Due to the small surface tension of the solder ball, it cannot be combined with the solder joining the pads and electronic components,
The solder balls are left on the side of the electronic component as solder balls.
【０００５】近年、各種の電子機器においては、機器の
小形化や機能の高度化に伴ってプリント基板が小形化
し、パッドの間隔が小さくなり、微細な半田ボールであ
っても回線の短絡などの不良を生じる原因となってい
る。In recent years, in various electronic devices, the printed circuit board has been reduced in size with the miniaturization of the devices and the sophistication of functions, the spacing between the pads has been reduced, and even a fine solder ball has a problem such as a short circuit of a line. This is a cause of failure.
【０００６】本発明はかかる事情に鑑みなされたもので
あって、半田付け性を確保しつつ、半田ボールの発生を
低減し、電子回路の信頼性を向上せしめることのできる
ソルダペーストを提供することを目的とするものであ
る。The present invention has been made in view of the above circumstances, and provides a solder paste capable of reducing the generation of solder balls and improving the reliability of an electronic circuit while ensuring solderability. It is intended for.
【０００７】[0007]
【課題を解決するための手段】而して本発明は、錫と鉛
とよりなる半田合金の粉末を含むソルダペーストにおい
て、前記半田合金に０．５〜２重量％の銅を含有するこ
とを特徴とするものである。According to the present invention, there is provided a solder paste containing a solder alloy powder consisting of tin and lead, wherein the solder alloy contains 0.5 to 2% by weight of copper. It is a feature.
【０００８】本発明における半田合金は、錫と鉛との合
金を基礎とするものであって、その混合比率は従来半田
として使用されている範囲とすることができるが、錫と
鉛との共晶合金の比率とするのが好ましい。[0008] The solder alloy in the present invention is based on an alloy of tin and lead, and the mixing ratio thereof can be within the range conventionally used as solder. It is preferable that the ratio be a crystal alloy.
【０００９】而して本発明は、錫と前記他の金属との合
金に、銅を含有せしめた点に特徴を有するものである。[0009] The present invention is characterized in that an alloy of tin and the other metal contains copper.
【００１０】銅の含有比率は、半田合金全体に対して、
０．５〜２重量％とするのが適当である。０．５重量％
未満では、半田ボールの発生を十分に抑制することがで
きず、また２重量％を超えると、銅の表面に対する濡れ
拡がり性が低下して、半田付け性が悪くなる。[0010] The copper content ratio is based on the entire solder alloy.
Suitably, it is 0.5 to 2% by weight. 0.5% by weight
If the amount is less than the above, the generation of solder balls cannot be sufficiently suppressed. If the amount exceeds 2% by weight, the wettability and spreadability on the copper surface is reduced, and the solderability is deteriorated.
【００１１】本発明のソルダペーストは、上記半田合金
の粉末とフラックスとを混合したものであるが、そのフ
ラックスとしては、従来のソルダペーストのフラックス
として使用されるものをそのまま使用することができ
る。また半田粉末の粒子径や、半田粉末とフラックスと
の混合比率についても、従来のソルダペーストにおける
のと全く同様に取り扱うことができる。The solder paste of the present invention is a mixture of the above-mentioned solder alloy powder and a flux. As the flux, the flux used as a conventional solder paste flux can be used as it is. The particle size of the solder powder and the mixing ratio between the solder powder and the flux can be handled in exactly the same manner as in the conventional solder paste.
【００１２】[0012]
【実施例】錫−鉛共晶合金を基礎とし、それに銅を種々
の比率で添加した半田合金の粉末と、ＲＡタイプ（塩素
含有量０．２％）のフラックスとを、半田粉末／フラッ
クス＝９０／１０の重量比で混合してソルダペーストを
調製した。EXAMPLE A solder alloy powder based on a tin-lead eutectic alloy, to which copper was added in various ratios, and an RA type (chlorine content 0.2%) flux were prepared by using the following equation: solder powder / flux = The mixture was mixed at a weight ratio of 90/10 to prepare a solder paste.
【００１３】プリント配線基板上にこれらのソルダペー
ストを２００μｍの厚さに印刷し、その上にチップ形積
層セラミックコンデンサー部品を搭載し、加熱して半田
を熔融したときの電子部品の側部における半田ボールの
発生状況を、目視により観察して評価した。These solder pastes are printed to a thickness of 200 μm on a printed wiring board, and a chip-type multilayer ceramic capacitor component is mounted thereon, and the solder on the side of the electronic component when the solder is heated and melted is heated. The state of occurrence of the ball was visually observed and evaluated.
【００１４】また半田付け性及び電気的信頼性は、それ
ぞれＪＩＳ Ｚ ３２８４の、濡れ効力試験方法及び、
絶縁抵抗試験方法に従って評価した。試験の結果を表１
に示した。[0014] Solderability and electrical reliability are measured in accordance with JIS Z 3284, the method of testing the wetting effect, and
The evaluation was performed according to the insulation resistance test method. Table 1 shows the test results.
It was shown to.
【００１５】[0015]
【表１】 [Table 1]
【００１６】[0016]
【作用】本発明において半田ボールが抑制される理由は
必ずしも明確ではないが、以下のような事情に基づくの
ではないかと推測される。The reason why the solder balls are suppressed in the present invention is not necessarily clear, but it is presumed to be based on the following circumstances.
【００１７】すなわち、半田粉末が熔融された状態にお
いて、半田合金中の銅が析出して微細な粒子が生じ、錫
−鉛共晶合金は銅に対する濡れ拡がり性が良好であるた
め、錫−鉛共晶合金が析出した銅粒子の表面を強く濡ら
す。That is, in a state where the solder powder is melted, copper in the solder alloy precipitates and fine particles are generated, and the tin-lead eutectic alloy has good wet-spreading property with respect to copper. The surface of the copper particles on which the eutectic alloy has precipitated is strongly wetted.
【００１８】そのため銅粒子が錫−鉛共晶合金の熔融物
を捕捉して、熔融半田の見掛けの表面張力が大きくな
り、一旦発生した半田ボールが、パッドや電子部品に付
着した半田と合体しやすくなり、結果的に遊離した半田
ボールの発生が抑制されるものと思われる。[0018] Therefore, the copper particles capture the melt of the tin-lead eutectic alloy, increasing the apparent surface tension of the molten solder, and the solder balls once formed are combined with the solder adhering to the pads and electronic components. It is thought that the occurrence of loose solder balls is suppressed as a result.
【００１９】[0019]
【発明の効果】本発明によれば、プリント基板上に電子
部品を半田付けするに際して、ソルダペーストの半田付
け性を損なうことなく、半田ボールの発生を抑制し、微
細なパターンのプリント基板に対して、パッド間の短絡
などの問題を生じることなく、電子部品を半田付けする
ことができる。According to the present invention, when an electronic component is soldered on a printed circuit board, the generation of solder balls is suppressed without impairing the solderability of the solder paste, and the printed circuit board having a fine pattern can be formed. Thus, the electronic component can be soldered without causing a problem such as a short circuit between the pads.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 穴田 隆昭 兵庫県加古川市野口町水足671番地の４ ハリマ化成株式会社中央研究所内 Ｆターム(参考） 5E319 AC01 BB05 BB07 GG05 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takaaki Anada 4F, 671 Mizuashi, Noguchi-cho, Kakogawa-shi, Hyogo F-term in Harima Chemicals, Inc. Central Research Laboratory 5E319 AC01 BB05 BB07 GG05
Claims (1)
ソルダペーストにおいて、前記半田合金に０．５〜２重
量％の銅を含有することを特徴とする、ソルダペースト1. A solder paste containing a solder alloy powder comprising tin and lead, wherein the solder alloy contains 0.5 to 2% by weight of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10316760A JP2000141077A (en) | 1998-11-09 | 1998-11-09 | Solder paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10316760A JP2000141077A (en) | 1998-11-09 | 1998-11-09 | Solder paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000141077A true JP2000141077A (en) | 2000-05-23 |
Family
ID=18080626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10316760A Pending JP2000141077A (en) | 1998-11-09 | 1998-11-09 | Solder paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000141077A (en) |
-
1998
- 1998-11-09 JP JP10316760A patent/JP2000141077A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050711 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20071029 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20071106 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20080408 |