JP2004009106A - Composition for moderate temperature soldering, and method for soldering - Google Patents
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【０００１】
【発明の属する技術分野】
本発明は中温はんだ付け用組成物及びはんだ付け方法に関し、より詳しくは、鉛を含有せず、はんだ付け時、例えばリフローソルダリング時に合金化してはんだ付け時の温度よりも高い溶融温度を持つ合金を形成し得る中温はんだ付け用組成物及びはんだ付け方法に関する。
【０００２】
【従来の技術】
従来の中温用はんだ合金は鉛を含有しており、はんだ付けの際にはんだの溶融により有毒ガスが発生するので、作業者に与える影響が懸念されていた。更に、近年、マイクロエレクトロニクス部品のはんだ付けが増加しており、それに伴って、廃棄されたＩＣチップやプリント配線基板等からの鉛の溶出量が多くなり、地下水の汚染、鉛中毒等の環境問題が生じてきた。この為、無鉛はんだの要望が高まっている。
現在種々の無鉛はんだが開発され、提案されているが、はんだ付け可能温度が錫−鉛合金はんだのはんだ付け温度よりも高い等の欠点がある。
【０００３】
【発明が解決しようとする課題】
本発明は、錫−鉛合金はんだのはんだ付け温度と同程度の温度で、具体的には１５０〜２３０℃の温度ではんだ付けが可能であり、濡れ性が良く、はんだ付け後の接合部特性も良好であり、鉛を含有しない中温はんだ付け組成物を提供することを目的としている。
また、本発明は、上記のような中温はんだ付け組成物を用いるはんだ付け方法を提供することを目的としている。
【０００４】
【課題を解決するための手段】
本発明者等は上記の目的を達成するために鋭意検討した結果、中温はんだ付け用組成物として、溶融温度が低い第一金属成分粉末と溶融温度が中程度の第二金属成分粉末とを特定の相対量で含有し、第一金属成分粉末の平均粒径と第二金属成分粉末の平均粒径との粒径比が特定の範囲内にあることにより、はんだ付け時、例えばリフローソルダリング時に合金化する金属粉末組成物を用いることにより上記の目的が達成されることを見いだし、本発明を完成した。
【０００５】
即ち、本発明の中温はんだ付け用組成物は、鉛を含有せず、第一金属成分粉末及び第二金属成分粉末を含み、第一金属成分粉末の溶融温度が１２０℃以上１８３℃未満であり、第二金属成分粉末の溶融温度が１８３〜２６０℃であり、第一金属成分粉末と第二金属成分粉末との合計量を基準にして第一金属成分粉末の含有量が２５〜５７質量％であり、第二金属成分粉末の含有量が４３〜７５質量％であり、第一金属成分粉末の平均粒径をｕ１ 、第二金属成分粉末の平均粒径をｕ２ とした時の粒径比ｕ２ ／ｕ１ が０．４〜０．９の範囲内にあることを特徴とする。
【０００６】
また、本発明のはんだ付け方法は、上記の本発明の中温はんだ付け用組成物を用いてはんだ付けする方法であって、第二金属成分粉末が溶融しない温度で第一金属成分粉末を溶融させ、その第一金属成分溶融物中に第二金属成分粉末を拡散させ、合金化させてはんだ付けすることを特徴とする。
【０００７】
【発明の実施の形態】
以下、本発明の実施の形態について詳細に説明する。
本発明においては、第一金属成分粉末として溶融温度が１２０℃以上１８３℃未満の範囲内の金属成分粉末（単一金属又は合金）を用いる。この条件を満足する第一金属成分粉末としては、例えば、Ｓｎ−Ｂｉ系、Ｓｎ−Ｉｎ系、Ａｇ−Ｉｎ系、Ｃｕ−Ｉｎ系、Ｂｉ−Ｉｎ系、Ｓｂ−Ｉｎ系、Ｚｎ−Ｉｎ系、Ｎｉ−Ｉｎ系等の合金粉末、例えば、二元合金、三元合金、四元合金等の合金粉末等を挙げることができる。
【０００８】
本発明においては、第二金属成分粉末として溶融温度が１８３〜２６０℃の範囲内の金属成分粉末（単一金属又は合金）を用いる。この条件を満足する第二金属成分粉末としては、例えば、Ｓｎ単独、ＳｎとＡｇ、Ｃｕ、Ｉｎ、Ｂｉ、Ｓｂ、Ａｕ、Ｚｎ及び／又はＮｉとの合金、ＩｎとＡｇ、Ｃｕ、Ｂｉ、Ｓｂ、Ａｕ、Ｚｎ及び／又はＮｉとの合金、ＢｉとＡｕ及び／又はＺｎとの合金の粉末等を挙げることができる。
【０００９】
本発明の中温はんだ付け用組成物は、錫−鉛合金はんだのはんだ付け温度と同程度の温度で、具体的には１５０〜２３０℃の温度ではんだ付けできることを目的としており、それで、第一金属成分粉末及び第二金属成分粉末を含む本発明の中温はんだ付け用組成物のはんだ付け可能温度が、第一金属成分と第二金属成分とからなる合金の溶融温度よりも低いことが好ましい。そのためには第一金属成分粉末の種類と第二金属成分粉末の種類との組合せ及び第一金属成分粉末と第二金属成分粉末との相対量は溶融状態の第一金属成分中に第二金属成分粉末が拡散して合金を形成し得る種類の組合せ及び相対量であり、具体的には第一金属成分粉末と第二金属成分粉末との合計量を基準にして第一金属成分粉末の含有量が２５〜５７質量％、好ましくは３０〜５５質量％であり、第二金属成分粉末の含有量が４３〜７５質量％、好ましくは４５〜７０質量％であることが必要である。このような第一金属成分粉末と第二金属成分粉末との種類の組合せ及び第一金属成分粉末と第二金属成分粉末との相対量については、既に知られている合金状態図を参照して適切に選定することができる。なお、本発明において、「溶融状態」とは完全に液相となっている状態だけでなく、一部分固相が残っている状態をも包含する。
【００１０】
本発明の中温はんだ付け用組成物においては、上記したように、はんだ付け可能温度が第一金属成分と第二金属成分とからなる合金の溶融温度よりも低いことが好ましいのであり、そのためには、第一金属成分粉末の平均粒径をｕ１ 、第二金属成分粉末の平均粒径をｕ２ とした時の粒径比ｕ２ ／ｕ１ が０．４〜０．９の範囲内、好ましくは０．４５〜０．８の範囲内にあることが必須であることが多数の実験により実証されている。粒径比ｕ２ ／ｕ１ が０．４未満である場合や、０．９を超える場合には、はんだ付け可能温度が、第一金属成分と第二金属成分とからなる合金の溶融温度より低くならない場合が多いことが多数の実験により実証されている。
【００１１】
本発明においては、製造、分級の容易性、コスト、はんだ付け組成物の性能等の点で、並びに粒径比ｕ２ ／ｕ１ が０．４〜０．９の範囲内であることを考慮すると、第一金属成分粉末の平均粒径が２０〜６０μｍであることが好ましく、第二金属成分粉末の平均粒径が８〜５４μｍであることが好ましい。
【００１２】
また、本発明の中温はんだ付け用組成物は、その使用態様に応じて粉末状態のものであっても、圧縮成形した固形物であっても、フラックスを含有するペースト状態のものであってもよい。
更に、本発明の中温はんだ付け用組成物は、微量の第三金属成分粉末を含有することができる。第三金属成分粉末としてＰ、Ｓｉ、Ｇｅ及びＧａを挙げることができ、それらの群より選ばれる少なくとも１種を用いることができる。
【００１３】
本発明のはんだ付け方法においては、上記した本発明の中温はんだ付け用組成物を用い、リフローソルダリング等により第二金属成分粉末が溶融しない温度で第一金属成分粉末を溶融させる。この溶融状態の第一金属成分中に第二金属成分が拡散する。即ち、第二金属成分粉末ははんだ付け温度では溶融しないが、溶融した第一金属成分の溶融物がこの第二金属成分粉末の周囲を覆うので、その溶融物中に第二金属成分が拡散して合金化が進み、均一な組成、ほぼ均一な組成或いは第二金属成分粉末の一部が拡散しないで島状に残った組成の合金となる。本発明において、「溶融させる」とは完全に液相となっている状態にする場合だけでなく、一部分固相が残っている状態にする場合も包含する。
【００１４】
本発明の好ましい態様のはんだ付け方法においては、１５０℃以上の温度であるが、第一金属成分と第二金属成分とからなる合金の溶融温度以下又は２３０℃以下の温度でリフローソルダリングを実施する。
【００１５】
【実施例】
以下に、実施例及び比較例に基づいて本発明を具体的に説明する。
実施例１及び比較例１
第一金属成分粉末として、アトマイジング及び分級によって、Ｓｎ−５８Ｂｉ（溶融温度１３９℃）からなる平均粒径がそれぞれ３５μｍ、４５μｍ及び６４μｍの微粉末を用意し、第二金属成分粉末として、アトマイジング及び分級によって、Ｓｎ−３．５Ａｇ（溶融温度２２１℃）からなる平均粒径がそれぞれ１６μｍ、２０μｍ、２８μｍ、３５μｍ及び６３μｍの微粉末を用意した。
【００１６】
第一金属成分粉末及び第二金属成分粉末を第１表に示す割合（含有量）、第１表に示す粒径比となる組み合わせで機械的に混合した。次いで、この混合物８０質量部と、ロジン５０質量％、カルビトール３５質量％、ハロゲン化水素酸アミン塩５質量％及びワックス１０質量％からなるフラックス２０質量部とを混合してはんだ付け用組成物（ペースト）を調製した。各々の粒径比のはんだ付け組成物は次の組み合わせで調製した。第一金属成分粉末の平均粒径をｕ１ 、第二金属成分粉末の平均粒径をｕ２ とした時の粒径比ｕ２ ／ｕ１ として、０．２５＝１６μｍ／６４μｍ、０．３１＝２０μｍ／６４μｍ、０．３６＝１６μｍ／４５μｍ、０．４６＝１６μｍ／３５μｍ、０．５７＝２０μｍ／３５μｍ、０．６２＝２８μｍ／４５μｍ、０．８０＝２８μｍ／３５μｍ、１．０＝３５μｍ／３５μｍ、１．４＝６３μｍ／４５μｍ、１．８＝６３μｍ／３５μｍ。
【００１７】
得られた各々のはんだ付け用組成物の組成は第１表に示す通りであり、そのような組成物の合金化で生成する合金の溶融温度は第１表に示す通りである。
各々のはんだ付け用組成物をセラミック板上に載せ、徐々に加熱して、各々のはんだ付け用組成物の合金化で生成する合金の溶融温度まで加熱した。各々のはんだ付け用組成物の溶融状態を肉眼で観察し、各々のはんだ付け用組成物の合金化で生成する合金の溶融温度よりも低い温度で全体が溶融した場合（即ち、各々のはんだ付け用組成物の合金化で生成する合金の溶融温度よりも低い温度ではんだ付けが可能な場合）を○、その他の場合を×、観察していない場合を−として第１表に示す。
【００１８】
【表１】
生成合金の溶融温度を縦軸にとり、粒径比を横軸にとって第１表に示すデータを図面上プロットすると図１に示す通りとなる。図１から明らかなように、粒径比が０．４〜０．９の範囲内、好ましくは０．４５〜０．８の範囲内で、且つ生成合金の溶融温度が１７５〜２００℃の範囲内、好ましくは１７７〜１９６℃の範囲内で、各々のはんだ付け用組成物は、各々のはんだ付け用組成物の合金化で生成する合金の溶融温度よりも低い温度で全体が溶融し、はんだ付けが可能である。
【００２０】
また、第一金属成分粉末の含有量を縦軸にとり、生成合金の溶融温度を横軸にとってその両者の相関関係をプロットすると図２に示す通りとなる。図２から明らかなように、生成合金の溶融温度がそれぞれ１７５℃、１７７℃、１９６℃及び２００℃となる場合の第一金属成分粉末の含有量はそれぞれ５７質量％、５５質量％、３０質量％及び２５質量％である。
【００２１】
従って、各々のはんだ付け用組成物の合金化で生成する合金の溶融温度よりも低い温度で全体が溶融し、はんだ付けが可能となるはんだ付け用組成物は、粒径比が０．４〜０．９の範囲内、好ましくは０．４５〜０．８の範囲内で、且つ第一金属成分粉末の含有量が２５〜５７質量％の範囲内、好ましくは３０〜５５質量％の範囲内である。
【００２２】
実施例２及び比較例２
第一金属成分粉末として、アトマイジング及び分級によって、Ｓｎ−５８Ｂｉ（溶融温度１３９℃）からなる平均粒径がそれぞれ３５μｍ及び４５μｍの微粉末を用意し、第二金属成分粉末として、アトマイジング及び分級によって、Ｓｎ−５Ｓｂ（溶融温度２４５℃）からなる平均粒径がそれぞれ２０μｍ及び６３μｍの微粉末を用意した。
【００２３】
第一金属成分粉末及び第二金属成分粉末を第２表に示す割合（含有量）、第２表に示す粒径比となる組み合わせで機械的に混合した。次いで、この混合物８０質量部と、ロジン５０質量％、カルビトール３５質量％、ハロゲン化水素酸アミン塩５質量％及びワックス１０質量％からなるフラックス２０質量部とを混合してはんだ付け用組成物（ペースト）を調製した。
【００２４】
得られた各々のはんだ付け用組成物の組成は第２表に示す通りであり、そのような組成物の合金化で生成する合金の溶融温度は第２表に示す通りである。
各々のはんだ付け用組成物をセラミック板上に載せ、徐々に加熱して、各々のはんだ付け用組成物の合金化で生成する合金の溶融温度まで加熱した。各々のはんだ付け用組成物の溶融状態を肉眼で観察し、各々のはんだ付け用組成物の合金化で生成する合金の溶融温度よりも低い温度で全体が溶融した場合（即ち、各々のはんだ付け用組成物の合金化で生成する合金の溶融温度よりも低い温度ではんだ付けが可能な場合）を○、その他の場合を×として第２表に示す。
【００２５】
【表２】
第２表のデータから明らかなように、第一金属成分粉末及び第二金属成分粉末の組成範囲が本発明の範囲内にあり、且つ粒径比ｕ２ ／ｕ１ が本発明の範囲内にある場合には、はんだ付け用組成物の合金化で生成する合金の溶融温度よりも低い温度ではんだ付けが可能である。しかしながら、第一金属成分粉末及び第二金属成分粉末の組成範囲が本発明の範囲外にあるか、又は粒径比ｕ２ ／ｕ１ が本発明の範囲外にある場合には、はんだ付け用組成物の合金化で生成する合金の溶融温度よりも低い温度でははんだ付けはできない。
【００２７】
実施例３及び比較例３
第一金属成分粉末として、アトマイジング及び分級によって、Ｓｎ−３０Ｉｎ（溶融温度１２５℃）からなる平均粒径がそれぞれ３５μｍ及び４５μｍの微粉末を用意し、第二金属成分粉末として、アトマイジング及び分級によって、Ｓｎ−０．７Ｃｕ（溶融温度２２７℃）からなる平均粒径がそれぞれ２０μｍ及び６３μｍの微粉末を用意した。
【００２８】
第一金属成分粉末及び第二金属成分粉末を第３表に示す割合（含有量）、第３表に示す粒径比となる組み合わせで機械的に混合した。次いで、この混合物８０質量部と、ロジン５０質量％、カルビトール３５質量％、ハロゲン化水素酸アミン塩５質量％及びワックス１０質量％からなるフラックス２０質量部とを混合してはんだ付け用組成物（ペースト）を調製した。
【００２９】
得られた各々のはんだ付け用組成物の組成は第３表に示す通りであり、そのような組成物の合金化で生成する合金の溶融温度は第３表に示す通りである。
各々のはんだ付け用組成物をセラミック板上に載せ、徐々に加熱して、各々のはんだ付け用組成物の合金化で生成する合金の溶融温度まで加熱した。各々のはんだ付け用組成物の溶融状態を肉眼で観察し、各々のはんだ付け用組成物の合金化で生成する合金の溶融温度よりも低い温度で全体が溶融した場合（即ち、各々のはんだ付け用組成物の合金化で生成する合金の溶融温度よりも低い温度ではんだ付けが可能な場合）を○、その他の場合を×として第３表に示す。
【００３０】
【表３】
第３表のデータから明らかなように、第一金属成分粉末及び第二金属成分粉末の組成範囲が本発明の範囲内にあり、且つ粒径比ｕ２ ／ｕ１ が本発明の範囲内にある場合には、はんだ付け用組成物の合金化で生成する合金の溶融温度よりも低い温度ではんだ付けが可能である。しかしながら、第一金属成分粉末及び第二金属成分粉末の組成範囲が本発明の範囲外にあるか、又は粒径比ｕ２ ／ｕ１ が本発明の範囲外にある場合には、はんだ付け用組成物の合金化で生成する合金の溶融温度よりも低い温度でははんだ付けはできない。
【００３２】
実施例４
紙フェノール系樹脂基板を用いてプリント基板を作製した。また、実施例１に記載のようにして調製した第４表に示す組成、粒径比となるはんだ付け用組成物（ペースト）を調製した。
【００３３】
上記のプリント基板上に０．２５ｍｍ間隔で上記のはんだペーストを、各箇所でのペーストの塗布量が０．５ｍｇとなるように塗布した。それらのはんだペースト上にＣ０６０３（縦０．６ｍｍ×横０．３ｍｍ×厚み０．１ｍｍ）の積層セラミックコンデンサの両端子部が来るようにして載せ、第４表に示すリフロー温度のリフロー炉に滞留時間が１０分となるように通炉してリフローソルダリングを実施した。各リフロー温度毎に１０個の試料を用いた。
【００３４】
固着強度については、チップ側面から押し、はんだが破壊される時点での押し圧力を測定して固着強度とした。なお、実用上必要な固着強度は１０Ｎ以上である。それらの測定結果は第４表に示す通りであった。
【００３５】
【表４】
【発明の効果】
本発明の中温はんだ付け用組成物は鉛を含有しない中温はんだ付け用組成物であり、本発明のはんだ付け方法を用いることにより、リフローソルダリング時に合金化してはんだ付け時の温度よりも高い溶融温度を持つ合金を形成する。従って、比較的低い温度ではんだ付け作業を行なうことができる。
【図面の簡単な説明】
【図１】生成合金の溶融温度を縦軸にとり、粒径比を横軸にとって実施例１及び比較例１で得たデータをプロットした図である。
【図２】第一金属成分粉末の含有量を縦軸にとり、生成合金の溶融温度を横軸にとってその両者の相関関係をプロットした図である。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a medium-temperature soldering composition and a soldering method, and more particularly, to an alloy that does not contain lead and has a melting temperature higher than the temperature at the time of soldering, for example, alloying at the time of soldering, for example, reflow soldering. TECHNICAL FIELD The present invention relates to a medium-temperature soldering composition and a soldering method capable of forming a solder paste.
[0002]
[Prior art]
Conventional solder alloys for medium temperature use contain lead, and melting of the solder generates toxic gas at the time of soldering. Furthermore, in recent years, the soldering of microelectronic components has been increasing, and as a result, the amount of lead eluted from discarded IC chips, printed wiring boards, etc. has increased, and environmental problems such as groundwater contamination and lead poisoning have occurred. Has arisen. For this reason, the demand for lead-free solder is increasing.
Currently, various lead-free solders have been developed and proposed, but have drawbacks such as the solderable temperature is higher than the soldering temperature of the tin-lead alloy solder.
[0003]
[Problems to be solved by the invention]
The present invention can be soldered at a temperature similar to the soldering temperature of the tin-lead alloy solder, specifically, at a temperature of 150 to 230 ° C., has good wettability, and has good joint characteristics after soldering. The object is to provide a medium-temperature soldering composition containing no lead.
Another object of the present invention is to provide a soldering method using the above-mentioned medium-temperature soldering composition.
[0004]
[Means for Solving the Problems]
The present inventors have conducted intensive studies to achieve the above object, and as a result, specified a first metal component powder having a low melting temperature and a second metal component powder having a medium melting temperature as a medium-temperature soldering composition. In the relative amount of, the average particle diameter of the first metal component powder and the average particle diameter of the second metal component powder is within a specific range, during soldering, for example, during reflow soldering The present inventors have found that the above objects can be achieved by using a metal powder composition to be alloyed, and have completed the present invention.
[0005]
That is, the medium-temperature soldering composition of the present invention does not contain lead, includes a first metal component powder and a second metal component powder, and has a melting temperature of 120 ° C or higher and lower than 183 ° C. The melting temperature of the second metal component powder is 183 to 260 ° C., and the content of the first metal component powder is 25 to 57% by mass based on the total amount of the first metal component powder and the second metal component powder. Wherein the content of the second metal component powder is 43 to 75% by mass, the average particle size of the first metal component powder is u 1 , and the average particle size of the second metal component powder is u 2 diameter ratio u 2 / u 1, characterized in that the in the range of 0.4 to 0.9.
[0006]
Further, the soldering method of the present invention is a method of soldering using the medium-temperature soldering composition of the present invention, wherein the first metal component powder is melted at a temperature at which the second metal component powder does not melt. The second metal component powder is diffused in the first metal component melt, alloyed, and soldered.
[0007]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail.
In the present invention, a metal component powder (single metal or alloy) having a melting temperature in the range of 120 ° C. or more and less than 183 ° C. is used as the first metal component powder. As the first metal component powder satisfying this condition, for example, Sn-Bi-based, Sn-In-based, Ag-In-based, Cu-In-based, Bi-In-based, Sb-In-based, Zn-In-based, Alloy powders such as Ni-In alloys, for example, alloy powders such as binary alloys, ternary alloys, and quaternary alloys can be given.
[0008]
In the present invention, a metal component powder (single metal or alloy) having a melting temperature in the range of 183 to 260 ° C is used as the second metal component powder. Examples of the second metal component powder satisfying this condition include Sn alone, an alloy of Sn and Ag, Cu, In, Bi, Sb, Au, Zn and / or Ni, In and Ag, Cu, Bi, and Sb. , Au, Zn and / or Ni, and alloy powder of Bi with Au and / or Zn.
[0009]
The purpose of the medium-temperature soldering composition of the present invention is to enable soldering at a temperature similar to the soldering temperature of the tin-lead alloy solder, specifically, at a temperature of 150 to 230 ° C. The solderable temperature of the medium-temperature soldering composition of the present invention containing the metal component powder and the second metal component powder is preferably lower than the melting temperature of the alloy composed of the first metal component and the second metal component. For this purpose, the combination of the type of the first metal component powder and the type of the second metal component powder, and the relative amounts of the first metal component powder and the second metal component powder are determined by mixing the second metal component in the molten first metal component. The combination and relative amount of the types in which the component powders can diffuse to form an alloy, specifically, the content of the first metal component powder based on the total amount of the first metal component powder and the second metal component powder It is necessary that the amount is 25 to 57% by mass, preferably 30 to 55% by mass, and the content of the second metal component powder is 43 to 75% by mass, preferably 45 to 70% by mass. For the combination of the types of the first metal component powder and the second metal component powder and the relative amounts of the first metal component powder and the second metal component powder, refer to the known alloy phase diagram. Can be properly selected. In the present invention, the “molten state” includes not only a state in which a liquid phase is completely formed but also a state in which a solid phase partially remains.
[0010]
In the medium-temperature soldering composition of the present invention, as described above, it is preferable that the solderable temperature is lower than the melting temperature of the alloy composed of the first metal component and the second metal component. , in the range of the average particle diameter of the first metal component powder u 1, particle size ratio u 2 / u 1 when the average particle diameter of the second metal component powder was u 2 is 0.4 to 0.9, Numerous experiments have demonstrated that it is essential that it is preferably in the range of 0.45 to 0.8. When the particle size ratio u 2 / u 1 is less than 0.4 or more than 0.9, the solderable temperature is lower than the melting temperature of the alloy composed of the first metal component and the second metal component. Many experiments have demonstrated that they often do not decrease.
[0011]
In the present invention, it is considered that the particle size ratio u 2 / u 1 is in the range of 0.4 to 0.9 in view of easiness of production and classification, cost, performance of the soldering composition, and the like. Then, the average particle size of the first metal component powder is preferably 20 to 60 μm, and the average particle size of the second metal component powder is preferably 8 to 54 μm.
[0012]
Further, the medium-temperature soldering composition of the present invention may be in the form of a powder depending on the use mode, may be a solid formed by compression molding, or may be in the form of a paste containing flux. Good.
Furthermore, the composition for medium temperature soldering of the present invention can contain a trace amount of third metal component powder. Examples of the third metal component powder include P, Si, Ge, and Ga, and at least one selected from the group can be used.
[0013]
In the soldering method of the present invention, the first metal component powder is melted at a temperature at which the second metal component powder does not melt by reflow soldering or the like, using the above-described medium-temperature soldering composition of the present invention. The second metal component diffuses into the molten first metal component. That is, the second metal component powder does not melt at the soldering temperature, but the molten first metal component melts around the second metal component powder, so that the second metal component diffuses into the melt. Alloying proceeds to form an alloy having a uniform composition, a substantially uniform composition, or a composition in which a part of the second metal component powder does not diffuse and remains in an island shape. In the present invention, “melting” includes not only a state in which the solid phase is completely in a liquid phase but also a state in which a solid phase is partially left.
[0014]
In the soldering method according to a preferred embodiment of the present invention, the reflow soldering is performed at a temperature of 150 ° C. or higher, but not higher than the melting temperature of the alloy composed of the first metal component and the second metal component or 230 ° C. or lower. I do.
[0015]
【Example】
Hereinafter, the present invention will be specifically described based on Examples and Comparative Examples.
Example 1 and Comparative Example 1
Fine powder of Sn-58Bi (melting temperature: 139 ° C.) having average particle diameters of 35 μm, 45 μm, and 64 μm, respectively, was prepared as the first metal component powder by atomization and classification, and was atomized as the second metal component powder. By classification, fine powders of Sn-3.5Ag (melting temperature: 221 ° C.) having average particle diameters of 16 μm, 20 μm, 28 μm, 35 μm, and 63 μm were prepared.
[0016]
The first metal component powder and the second metal component powder were mechanically mixed in a combination having a ratio (content) shown in Table 1 and a particle size ratio shown in Table 1. Next, 80 parts by mass of this mixture, 20 parts by mass of a flux composed of 50% by mass of rosin, 35% by mass of carbitol, 5% by mass of an amine salt of hydrohalic acid and 10% by mass of a wax, are mixed, and the composition for soldering is mixed. (Paste) was prepared. The soldering compositions of each particle size ratio were prepared in the following combinations. Assuming that the average particle size of the first metal component powder is u 1 and the average particle size of the second metal component powder is u 2 , the particle size ratio u 2 / u 1 is 0.25 = 16 μm / 64 μm, 0.31 = 20 μm / 64 μm, 0.36 = 16 μm / 45 μm, 0.46 = 16 μm / 35 μm, 0.57 = 20 μm / 35 μm, 0.62 = 28 μm / 45 μm, 0.80 = 28 μm / 35 μm, 1.0 = 35 μm / 35 μm, 1.4 = 63 μm / 45 μm, 1.8 = 63 μm / 35 μm.
[0017]
The composition of each of the obtained soldering compositions is as shown in Table 1, and the melting temperatures of the alloys formed by alloying such compositions are as shown in Table 1.
Each soldering composition was placed on a ceramic plate and gradually heated to the melting temperature of the alloy formed by alloying each soldering composition. The molten state of each soldering composition is visually observed, and the whole is melted at a temperature lower than the melting temperature of the alloy formed by alloying each soldering composition (that is, each soldering composition is melted). Table 1 shows the case where soldering can be performed at a temperature lower than the melting temperature of the alloy formed by alloying the composition for use) as ○, x as other cases, and-as not observed.
[0018]
[Table 1]
The data shown in Table 1 are plotted on the drawing with the melting temperature of the formed alloy on the vertical axis and the particle size ratio on the horizontal axis, as shown in FIG. As is clear from FIG. 1, the particle size ratio is in the range of 0.4 to 0.9, preferably in the range of 0.45 to 0.8, and the melting temperature of the formed alloy is in the range of 175 to 200 ° C. , Preferably within the range of 177 to 196 ° C, each soldering composition melts entirely at a temperature lower than the melting temperature of the alloy formed by alloying each soldering composition, Can be attached.
[0020]
FIG. 2 is a graph plotting the content of the first metal component powder on the vertical axis and the melting temperature of the formed alloy on the horizontal axis, and plotting the correlation between the two. As is clear from FIG. 2, when the melting temperatures of the formed alloys are 175 ° C., 177 ° C., 196 ° C., and 200 ° C., respectively, the content of the first metal component powder is 57% by mass, 55% by mass, and 30% by mass, respectively. % And 25% by mass.
[0021]
Therefore, the entire composition is melted at a temperature lower than the melting temperature of the alloy produced by alloying each soldering composition, and the solderable composition capable of being soldered has a particle size ratio of 0.4 to 0.4. Within the range of 0.9, preferably within the range of 0.45 to 0.8, and the content of the first metal component powder within the range of 25 to 57% by mass, preferably within the range of 30 to 55% by mass. It is.
[0022]
Example 2 and Comparative Example 2
Fine powder of Sn-58Bi (melting temperature: 139 ° C.) having an average particle diameter of 35 μm and 45 μm, respectively, was prepared as the first metal component powder by atomizing and classification, and was atomized and classified as the second metal component powder. Thus, fine powders of Sn-5Sb (melting temperature: 245 ° C.) having average particle diameters of 20 μm and 63 μm, respectively, were prepared.
[0023]
The first metal component powder and the second metal component powder were mechanically mixed in a combination having a ratio (content) shown in Table 2 and a particle size ratio shown in Table 2. Next, 80 parts by mass of this mixture, 20 parts by mass of a flux composed of 50% by mass of rosin, 35% by mass of carbitol, 5% by mass of an amine salt of hydrohalic acid and 10% by mass of a wax, are mixed, and the composition for soldering is mixed. (Paste) was prepared.
[0024]
The composition of each of the obtained soldering compositions is as shown in Table 2, and the melting temperatures of the alloys formed by alloying such compositions are as shown in Table 2.
Each soldering composition was placed on a ceramic plate and gradually heated to the melting temperature of the alloy formed by alloying each soldering composition. The molten state of each soldering composition is visually observed, and the whole is melted at a temperature lower than the melting temperature of the alloy formed by alloying each soldering composition (that is, each soldering composition is melted). Table 2 shows the case where soldering can be performed at a temperature lower than the melting temperature of the alloy formed by alloying the composition for use) as ○, and the other cases as ×.
[0025]
[Table 2]
As is clear from the data in Table 2, the composition ranges of the first metal component powder and the second metal component powder are within the scope of the present invention, and the particle size ratio u 2 / u 1 is within the scope of the present invention. In some cases, soldering can be performed at a temperature lower than the melting temperature of the alloy formed by alloying the soldering composition. However, when the composition range of the first metal component powder and the second metal component powder is out of the range of the present invention, or the particle size ratio u 2 / u 1 is out of the range of the present invention, the soldering agent is used for soldering. Soldering cannot be performed at a temperature lower than the melting temperature of the alloy formed by alloying the composition.
[0027]
Example 3 and Comparative Example 3
Fine powder of Sn-30In (melting temperature 125 ° C.) having an average particle size of 35 μm and 45 μm, respectively, was prepared as the first metal component powder by atomizing and classification, and was atomized and classified as the second metal component powder. Thus, fine powders of Sn-0.7Cu (melting temperature: 227 ° C.) having average particle diameters of 20 μm and 63 μm were prepared.
[0028]
The first metal component powder and the second metal component powder were mechanically mixed in a combination having a ratio (content) shown in Table 3 and a particle size ratio shown in Table 3. Next, 80 parts by mass of this mixture, 20 parts by mass of a flux composed of 50% by mass of rosin, 35% by mass of carbitol, 5% by mass of an amine salt of hydrohalic acid and 10% by mass of a wax, are mixed, and the composition for soldering is mixed. (Paste) was prepared.
[0029]
The composition of each of the obtained soldering compositions is as shown in Table 3, and the melting temperatures of the alloys formed by alloying such compositions are as shown in Table 3.
Each soldering composition was placed on a ceramic plate and gradually heated to the melting temperature of the alloy formed by alloying each soldering composition. The molten state of each soldering composition is visually observed, and the whole is melted at a temperature lower than the melting temperature of the alloy formed by alloying each soldering composition (that is, each soldering composition is melted). Table 3 shows the case where soldering can be performed at a temperature lower than the melting temperature of the alloy formed by alloying the composition for use) as ○, and the other cases as ×.
[0030]
[Table 3]
As is clear from the data in Table 3, the composition ranges of the first metal component powder and the second metal component powder are within the scope of the present invention, and the particle size ratio u 2 / u 1 is within the scope of the present invention. In some cases, soldering can be performed at a temperature lower than the melting temperature of the alloy formed by alloying the soldering composition. However, when the composition range of the first metal component powder and the second metal component powder is out of the range of the present invention, or the particle size ratio u 2 / u 1 is out of the range of the present invention, the soldering agent is used for soldering. Soldering cannot be performed at a temperature lower than the melting temperature of the alloy formed by alloying the composition.
[0032]
Example 4
Printed circuit boards were prepared using paper phenolic resin substrates. Further, a soldering composition (paste) having the composition and particle size ratio shown in Table 4 prepared as described in Example 1 was prepared.
[0033]
The solder paste was applied on the printed circuit board at intervals of 0.25 mm so that the applied amount of the paste at each location was 0.5 mg. The two terminals of a C0603 (0.6 mm long × 0.3 mm wide × 0.1 mm thick) multilayer ceramic capacitor are placed on the solder paste so that both terminals come and stay in a reflow furnace at the reflow temperature shown in Table 4. Reflow soldering was performed by passing the furnace so that the time became 10 minutes. Ten samples were used for each reflow temperature.
[0034]
With respect to the fixing strength, the pressure was applied from the side of the chip, and the pressing force at the time when the solder was broken was measured to determine the fixing strength. The fixing strength required for practical use is 10 N or more. The measurement results were as shown in Table 4.
[0035]
[Table 4]
【The invention's effect】
The medium-temperature soldering composition of the present invention is a lead-free medium-temperature soldering composition.By using the soldering method of the present invention, the composition is alloyed during reflow soldering and melts at a temperature higher than the temperature during soldering. Form an alloy with temperature. Therefore, the soldering operation can be performed at a relatively low temperature.
[Brief description of the drawings]
FIG. 1 is a diagram plotting data obtained in Example 1 and Comparative Example 1 with the melting temperature of a formed alloy on the vertical axis and the particle size ratio on the horizontal axis.
FIG. 2 is a diagram plotting the content of a first metal component powder on the vertical axis and the melting temperature of the formed alloy on the horizontal axis, and plotting the correlation between the two.
Claims (10)
Ｓｎ単独の粉末、又は
Ｓｎと、Ａｇ、Ｃｕ、Ｉｎ、Ｂｉ、Ｓｂ、Ａｕ、Ｚｎ及びＮｉの少なくとも１種とを含む合金、
Ｉｎと、Ａｇ、Ｃｕ、Ｂｉ、Ｓｂ、Ａｕ、Ｚｎ及びＮｉの少なくとも１種とを含む合金、及び
Ｂｉと、Ａｕ及びＺｎの少なくとも１種とを含む合金
からなる群から選ばれる合金の粉末である請求項１〜４の何れかに記載の中温はんだ付け用組成物。An alloy in which the second metal component powder contains Sn alone or Sn and at least one of Ag, Cu, In, Bi, Sb, Au, Zn, and Ni;
An alloy containing In and at least one of Ag, Cu, Bi, Sb, Au, Zn and Ni; and an alloy powder selected from the group consisting of an alloy containing Bi and at least one of Au and Zn. The medium-temperature soldering composition according to claim 1.
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| JP2002166874A JP3877300B2 (en) | 2002-06-07 | 2002-06-07 | Medium temperature soldering composition and soldering method |
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| JP2002166874A JP3877300B2 (en) | 2002-06-07 | 2002-06-07 | Medium temperature soldering composition and soldering method |
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| JP2004009106A true JP2004009106A (en) | 2004-01-15 |
| JP3877300B2 JP3877300B2 (en) | 2007-02-07 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005254254A (en) * | 2004-03-09 | 2005-09-22 | Toshiba Corp | Lead-free solder, its manufacturing method and electronic component |
| US7017795B2 (en) * | 2003-11-03 | 2006-03-28 | Indium Corporation Of America | Solder pastes for providing high elasticity, low rigidity solder joints |
| JP2008027588A (en) * | 2006-07-18 | 2008-02-07 | Asahi Kasei Electronics Co Ltd | Conductive filler, and intermediate-temperature soldering material |
| WO2008056676A1 (en) * | 2006-11-06 | 2008-05-15 | Victor Company Of Japan, Limited | Lead-free solder paste, electronic circuit board using lead-free solder paste, and method for manufacturing electronic circuit board |
| JP2011167761A (en) * | 2010-01-25 | 2011-09-01 | Mitsubishi Materials Corp | Au-Sn ALLOY SOLDER PASTE, AND Au-Sn ALLOY SOLDER FORMED THEREBY |
| CN103273218A (en) * | 2013-06-17 | 2013-09-04 | 东莞市宝拓来金属有限公司 | Soldering tin material used for automotive glass hot-coating belts and application of soldering tin material |
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2002
- 2002-06-07 JP JP2002166874A patent/JP3877300B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7017795B2 (en) * | 2003-11-03 | 2006-03-28 | Indium Corporation Of America | Solder pastes for providing high elasticity, low rigidity solder joints |
| JP2005254254A (en) * | 2004-03-09 | 2005-09-22 | Toshiba Corp | Lead-free solder, its manufacturing method and electronic component |
| JP2008027588A (en) * | 2006-07-18 | 2008-02-07 | Asahi Kasei Electronics Co Ltd | Conductive filler, and intermediate-temperature soldering material |
| JP4662483B2 (en) * | 2006-07-18 | 2011-03-30 | 旭化成イーマテリアルズ株式会社 | Conductive filler and medium temperature solder material |
| WO2008056676A1 (en) * | 2006-11-06 | 2008-05-15 | Victor Company Of Japan, Limited | Lead-free solder paste, electronic circuit board using lead-free solder paste, and method for manufacturing electronic circuit board |
| JP2011167761A (en) * | 2010-01-25 | 2011-09-01 | Mitsubishi Materials Corp | Au-Sn ALLOY SOLDER PASTE, AND Au-Sn ALLOY SOLDER FORMED THEREBY |
| CN103273218A (en) * | 2013-06-17 | 2013-09-04 | 东莞市宝拓来金属有限公司 | Soldering tin material used for automotive glass hot-coating belts and application of soldering tin material |
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| JP3877300B2 (en) | 2007-02-07 |
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