JP2000141029A - Connecting method by laser - Google Patents
Connecting method by laserInfo
- Publication number
- JP2000141029A JP2000141029A JP10313138A JP31313898A JP2000141029A JP 2000141029 A JP2000141029 A JP 2000141029A JP 10313138 A JP10313138 A JP 10313138A JP 31313898 A JP31313898 A JP 31313898A JP 2000141029 A JP2000141029 A JP 2000141029A
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- Japan
- Prior art keywords
- laser
- conductor
- molten material
- connection method
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えばフレキシブ
ルプリント配線（ＦＰＣ）やフレキシブルフラットケー
ブル（ＦＦＣ）等の配線部材に備わった導体を相手側の
端子に接続するレーザによる接続方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connection method using a laser for connecting a conductor provided on a wiring member such as a flexible printed circuit (FPC) or a flexible flat cable (FFC) to a terminal on the other side.
【０００２】[0002]
【従来の技術】上述したＦＰＣやＦＦＣ等の配線部材
は、図７に示すように導体２の両側が、間に接着剤４を
介して被覆材３にて挟まれた構成である。その配線部材
１の導体２を、相手側の端子、例えばケーブルリールに
内蔵されているようなバスバー回路の端子に接続する方
式の一つとして、レーザ溶接方式が知られている。この
方式は、例えばＹＡＧレーザ光を照射して、その照射部
にある導体及び端子を溶融させて溶接することにより行
う方式である。2. Description of the Related Art The above-mentioned wiring member such as FPC or FFC has a structure in which both sides of a conductor 2 are sandwiched by a covering material 3 with an adhesive 4 therebetween, as shown in FIG. As one of the methods for connecting the conductor 2 of the wiring member 1 to a terminal on the other side, for example, a terminal of a bus bar circuit built in a cable reel, a laser welding method is known. This method is performed by, for example, irradiating a YAG laser beam and melting and welding a conductor and a terminal in the irradiated portion.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、レーザ
溶接方式による場合には、溶接時に発生するスパッタに
より溶接部に大きな窪みや貫通孔が空洞として出来易
く、その空洞の存在により溶接部の強度が低くなるとい
う問題があった。However, in the case of the laser welding method, large pits or through holes are easily formed in the welded portion due to spatter generated during welding, and the strength of the welded portion is low due to the presence of the cavity. There was a problem of becoming.
【０００４】本発明は、このような従来技術の課題を解
決すべくなされたものであり、溶接部の強度低下を防止
できるレーザによる接続方法を提供することを目的とす
る。[0004] The present invention has been made to solve such problems of the prior art, and an object of the present invention is to provide a connection method using a laser which can prevent a decrease in strength of a welded portion.
【０００５】[0005]
【課題を解決するための手段】本発明のレーザによる接
続方法は、導体の両側が被覆材にて挟まれてなる配線部
材の導体と相手側の板状端子とをレーザ照射による溶接
にて接続するレーザによる接続方法であって、配線部材
における導体の少なくとも片面側を露出させ、その露出
した導体部分を板状端子に重ねると共にその重畳部分の
レーザ照射側に溶融材料を配し、該溶融材料に向けてレ
ーザ照射を行い、そのレーザ照射により生じた窪み部ま
たは貫通孔に溶融材料の溶融したものが充填された溶接
部を形成するようにして接続する。According to the method for connecting with a laser of the present invention, a conductor of a wiring member having both sides of a conductor sandwiched by a covering material is connected to a plate terminal on the other side by welding by laser irradiation. A connection method using a laser, wherein at least one side of the conductor in the wiring member is exposed, the exposed conductor portion is overlapped on the plate-shaped terminal, and a molten material is arranged on the laser irradiation side of the overlapped portion, and the molten material is provided. Is irradiated, and a connection is made in such a manner that a recessed portion or a through hole generated by the laser irradiation forms a welded portion filled with a molten material.
【０００６】この方法による場合には、得られる溶接部
がレーザ照射により生じた窪み部または貫通孔に溶融材
料の溶融したものが充填されて空洞のない状態であるた
め、その溶接部の強度低下は防止される。In the case of this method, the strength of the welded portion is reduced because the obtained welded portion is filled with the molten material of the molten material in the depressions or through holes generated by the laser irradiation and has no voids. Is prevented.
【０００７】本発明のレーザによる接続方法において、
前記重畳部分の板状端子に凹部を、またはその板状端子
に片面側が凹状で、もう一方の片面側が凸状で背中合わ
せに形成しておき、凹部とは反対側に溶融材料を配する
と共にその溶融材料側からレーザ照射し、凹部に溶融材
料の溶融したものが到達するようにして接続するように
してもよい。In the connection method using a laser according to the present invention,
A concave portion in the plate-shaped terminal of the superimposed portion, or a concave surface on one side of the plate-shaped terminal, a convex shape on the other side is formed back-to-back, and a molten material is arranged on the opposite side to the concave portion, and Laser irradiation may be performed from the molten material side, and the connection may be made such that the molten material reaches the concave portion.
【０００８】このようにする場合には、レーザ照射側と
は反対側の凹部に溶融材料の溶融したものが流れ込み、
溶接部強度が向上し、かつ安定した溶接部強度を各溶接
の都度確保することが可能となる。In this case, the molten material flows into the concave portion on the side opposite to the laser irradiation side,
The weld strength is improved, and stable weld strength can be ensured each time welding is performed.
【０００９】本発明のレーザによる接続方法において、
前記板状端子がレーザ照射側とは反対側を被覆材にて被
覆された構造の場合には、その被覆材の溶接部形成部分
を除去して覗き穴を形成しておき、レーザ照射を行うよ
うにしてもよい。In the connection method using a laser according to the present invention,
In the case where the plate-like terminal has a structure in which the opposite side to the laser irradiation side is covered with a covering material, a portion where the welding portion of the covering material is formed is removed to form a peephole, and laser irradiation is performed. You may do so.
【００１０】このようにする場合には、本来は溶接部の
確認不可部分でも溶接状況を覗き穴から観察しつつ溶接
を行うことができ、良好な溶接部を得ることが可能とな
る。[0010] In this case, welding can be performed while observing the welding condition from a peephole even in a portion where the welding portion cannot be confirmed, and a good welded portion can be obtained.
【００１１】本発明のレーザによる接続方法において、
前記溶融材料として、銅よりもレーザ反射率の低い材料
またはＳｎ−Ｐｂ系はんだよりも高融点材料を使用する
ようにしてもよい。In the connection method using a laser according to the present invention,
As the molten material, a material having a lower laser reflectivity than copper or a material having a higher melting point than Sn—Pb-based solder may be used.
【００１２】この場合においては、銅よりもレーザ反射
率の低い溶融材料を使用すると、従来技術においてレー
ザ照射される導体や端子が一般的に銅材料からなる場合
よりも、レーザ反射率が低いので、レーザ光の吸収効率
を高めることができ、また熱伝導度が小さいので、レー
ザ溶接を行うこと自体が容易になる。そのような溶融材
料としては、例えばＳｎ−Ｐｂ系はんだや一般的なろう
材が該当する。また、Ｓｎ−Ｐｂ系はんだよりも高融点
材料、例えば請求項５のように、Ａｇ含有量が重量比で
５％以下のＳｎ−Ａｇ系材料からなる溶融材料を使用す
ると、Ｓｎ−Ｐｂ系はんだを用いる場合よりも、溶接部
の強度が向上し信頼性が高い。In this case, when a molten material having a lower laser reflectivity than copper is used, the laser reflectivity is lower than when a conductor or a terminal irradiated with laser in the prior art is generally made of a copper material. In addition, since the laser light absorption efficiency can be increased and the thermal conductivity is small, laser welding itself becomes easy. As such a molten material, for example, a Sn-Pb-based solder or a general brazing material is applicable. Further, when a material having a higher melting point than that of the Sn-Pb-based solder, for example, a molten material composed of an Sn-Ag-based material having an Ag content of 5% or less by weight as in claim 5, is used, the Sn-Pb-based solder can be used. The strength of the weld is improved and the reliability is higher than in the case of using.
【００１３】[0013]
【発明の実施の形態】以下、本発明の実施形態を具体的
に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described specifically.
【００１４】（実施形態１）本実施形態１は、ＦＰＣや
ＦＦＣの配線部材の導体が両側で露出している場合の接
続方法である。(Embodiment 1) Embodiment 1 is a connection method in the case where the conductor of the wiring member of the FPC or FFC is exposed on both sides.
【００１５】図１は、本発明の実施形態１に係るレーザ
による接続方法を適用した場合の説明図であり、（ａ）
は溶接前の状態を示す正面図、（ｂ）は溶接後の状態を
示す正面図（一部断面）である。FIG. 1 is a diagram illustrating a case where a connection method using a laser according to a first embodiment of the present invention is applied.
Is a front view showing a state before welding, and (b) is a front view (partial cross section) showing a state after welding.
【００１６】この接続方法は、次のように行う。まず、
図１（ａ）に示すように、銅からなる導体２の両側が樹
脂フィルム等からなる被覆材３にて挟まれた構成の配線
部材１が、その端部である被溶接部の両側の被覆材３を
剥がして導体２を露出させておく。または、このような
配線部材１を用意する。This connection method is performed as follows. First,
As shown in FIG. 1A, a wiring member 1 having a structure in which a conductor 2 made of copper is sandwiched on both sides by a covering material 3 made of a resin film or the like is coated on both sides of a welded portion which is an end thereof. The material 3 is peeled off to expose the conductor 2. Alternatively, such a wiring member 1 is prepared.
【００１７】次に、その露出した導体２の片面に、例え
ばＳｎ−Ｐｂ系はんだからなる溶融材料１０を溶着し、
その導体２を、例えば相手側であるケーブルリールに内
蔵されたバスバー回路の板状端子５の上に重畳させる。
このとき、溶融材料１０は、レーザ照射側（上側）に位
置するように配置させる。Next, on one surface of the exposed conductor 2, a molten material 10 made of, for example, Sn—Pb solder is welded,
The conductor 2 is superimposed on a plate-like terminal 5 of a bus bar circuit incorporated in, for example, a cable reel on the other side.
At this time, the molten material 10 is arranged so as to be located on the laser irradiation side (upper side).
【００１８】次に、溶融材料１０側から、例えばＹＡＧ
レーザを溶融材料１０に向けて照射する。この照射によ
り、図１（ｂ）に示すように、溶融材料１０は勿論であ
るが、その下側の導体２および板状端子５も溶融し、貫
通孔６が形成されるが、溶融した溶融材料１０がその貫
通孔６に充填されてなる溶接部７が得られるようにす
る。このとき、レーザ照射は、溶接箇所を観察しつつ行
い、上記溶接部７が得られた時点で停止する。Next, from the molten material 10 side, for example, YAG
A laser is irradiated toward the molten material 10. By this irradiation, as shown in FIG. 1B, not only the molten material 10 but also the lower conductor 2 and the plate-like terminal 5 are melted to form a through-hole 6. A weld 7 in which the material 10 is filled in the through hole 6 is obtained. At this time, the laser irradiation is performed while observing the welding location, and stops when the above-described welded portion 7 is obtained.
【００１９】したがって、本実施形態１による場合は、
溶接部７には空洞が残っていないので、強度低下を防止
できる。本実施形態１にあっては、溶接部７の形成され
る箇所が貫通孔６となってなく、板状端子５に底が達す
る窪み部となっていてもよい。Therefore, according to the first embodiment,
Since no cavity remains in the welded portion 7, a decrease in strength can be prevented. In the first embodiment, the portion where the welded portion 7 is formed may not be the through hole 6 but may be a recessed portion reaching the bottom of the plate-like terminal 5.
【００２０】なお、以下の実施形態では、実施形態１と
同一部分には同一符番を付している。In the following embodiments, the same parts as those in the first embodiment are denoted by the same reference numerals.
【００２１】（実施形態２）本実施形態２は、導体の片
側が露出している場合の接続方法である。(Embodiment 2) Embodiment 2 is a connection method when one side of a conductor is exposed.
【００２２】図２は、本発明の実施形態２に係るレーザ
による接続方法を適用した場合の説明図であり、（ａ）
は溶接前の状態を示す正面図、（ｂ）は溶接後の状態を
示す正面図（一部断面）である。FIG. 2 is an explanatory diagram in the case where the connection method using a laser according to the second embodiment of the present invention is applied, and FIG.
Is a front view showing a state before welding, and (b) is a front view (partial cross section) showing a state after welding.
【００２３】この接続方法は、図２（ａ）に示すよう
に、配線部材１の片方（下側）の被覆材３が存在してい
て、導体２の片側（上側）が露出している場合に適用し
ている。As shown in FIG. 2A, this connection method is based on the case where one (lower) covering material 3 of the wiring member 1 is present and one side (upper side) of the conductor 2 is exposed. Has been applied.
【００２４】この場合は、導体２の露出部分に溶融材料
１０を溶着し、その溶融材料１０を上側にして導体２と
板状端子５とを重畳させる。このとき、板状端子５を下
側にする。In this case, the molten material 10 is welded to the exposed portion of the conductor 2, and the conductor 2 and the plate terminal 5 are overlapped with the molten material 10 facing upward. At this time, the plate terminal 5 is set to the lower side.
【００２５】その後、溶融材料１０側（上側）から、例
えばＹＡＧレーザを溶融材料１０に向けて照射する。こ
の照射により、図２（ｂ）に示すように、溶融材料１０
は勿論であるが、その下側の導体２、被覆材３および板
状端子５も溶融し、貫通孔６が形成されるが、溶融した
溶融材料１０がその貫通孔６に充填されてなる溶接部７
が得られるようにする。このとき、レーザ照射は、溶接
箇所を観察しつつ行い、上記溶接部７が得られた時点で
停止する。After that, a YAG laser, for example, is irradiated toward the molten material 10 from the molten material 10 side (upper side). By this irradiation, as shown in FIG.
Needless to say, the lower conductor 2, the covering material 3 and the plate-like terminal 5 are also melted to form a through-hole 6, and the molten material 10 is filled with the molten molten material 10 to form a weld. Part 7
Is obtained. At this time, the laser irradiation is performed while observing the welding location, and stops when the above-described welded portion 7 is obtained.
【００２６】したがって、この実施形態による場合は、
溶接部７には空洞が残っていないので、強度低下を防止
できる。この図２に示す実施形態は、溶接部７の形成さ
れる箇所が貫通孔６となってなく、板状端子５に底が達
する窪み部となっていてもよい。Therefore, according to this embodiment,
Since no cavity remains in the welded portion 7, a decrease in strength can be prevented. In the embodiment shown in FIG. 2, the location where the welded portion 7 is formed may not be the through hole 6 but may be a recessed portion reaching the bottom of the plate-shaped terminal 5.
【００２７】図３は、本発明の実施形態２に係る他のレ
ーザによる接続方法を適用した場合の説明図であり、
（ａ）は溶接前の状態を示す正面図、（ｂ）は溶接後の
状態を示す正面図（一部断面）である。FIG. 3 is an explanatory diagram in a case where a connection method using another laser according to the second embodiment of the present invention is applied.
(A) is a front view showing a state before welding, and (b) is a front view (partial cross section) showing a state after welding.
【００２８】この接続方法は、図３（ａ）に示すよう
に、配線部材１の片方の被覆材３が存在していて、導体
２の片側（下側）が露出している場合に適用している。As shown in FIG. 3A, this connection method is applied when one covering material 3 of the wiring member 1 is present and one side (lower side) of the conductor 2 is exposed. ing.
【００２９】この場合は、導体２の露出部分を下側にし
て導体２と板状端子５とを、後者を上側にして重畳さ
せ、被溶接部の板状端子５側（上側）に溶融材料１０を
溶着する。In this case, the conductor 2 and the plate-like terminal 5 are overlapped with the exposed part of the conductor 2 on the lower side and the molten material is placed on the plate-like terminal 5 side (upper side) of the portion to be welded. 10 is welded.
【００３０】その後、溶融材料１０側（上側）から、例
えばＹＡＧレーザを溶融材料１０に向けて照射する。こ
の照射により、図３（ｂ）に示すように、溶融材料１０
は勿論であるが、その下側の導体２、被覆材３および板
状端子５も溶融し、貫通孔６が形成されるが、溶融した
溶融材料１０がその貫通孔６に充填されてなる溶接部７
が得られるようにする。このとき、レーザ照射は、溶接
箇所を観察しつつ行い、上記溶接部７が得られた時点で
停止する。Thereafter, a YAG laser, for example, is irradiated toward the molten material 10 from the side of the molten material 10 (upper side). By this irradiation, as shown in FIG.
Needless to say, the lower conductor 2, the covering material 3 and the plate-like terminal 5 are also melted to form a through-hole 6, and the molten material 10 is filled with the molten molten material 10 to form a weld. Part 7
Is obtained. At this time, the laser irradiation is performed while observing the welding location, and stops when the above-described welded portion 7 is obtained.
【００３１】したがって、この実施形態による場合も、
溶接部７には空洞が残っていないので、強度低下を防止
できる。この図３に示す実施形態は、溶接部７の形成さ
れる箇所が貫通孔６となってなく、導体２に底が達する
窪み部となっていてもよい。Therefore, also in the case of this embodiment,
Since no cavity remains in the welded portion 7, a decrease in strength can be prevented. In the embodiment shown in FIG. 3, the location where the welded portion 7 is formed may not be the through hole 6, but may be a recessed portion reaching the bottom of the conductor 2.
【００３２】（実施形態３）本実施形態３は、溶接部の
強度を安定化させる場合である。(Embodiment 3) Embodiment 3 is a case where the strength of the welded portion is stabilized.
【００３３】図４は、本実施形態３に係るレーザによる
接続方法を適用した場合の説明図（斜視図）である。FIG. 4 is an explanatory view (perspective view) when the connection method using a laser according to the third embodiment is applied.
【００３４】この接続方法は、板状端子５の被溶接部を
予め凹凸状に形成しておき、その凸部５ａ上に、溶融材
料１０が溶着された導体２を重ね、溶融材料１０側から
レーザ照射を行う。In this connection method, a welded portion of the plate-like terminal 5 is formed in advance in an uneven shape, and the conductor 2 to which the molten material 10 is welded is superimposed on the convex portion 5a. Laser irradiation is performed.
【００３５】この場合は、レーザ照射により、溶融材料
１０、導体２および板状端子５が溶融するが、その溶融
したものが凸部５ａの裏側の凹部５ｂに流れ込み、溶接
部強度が向上し、かつ安定した溶接部強度を各溶接の都
度確保することが可能となる。In this case, the molten material 10, the conductor 2, and the plate-like terminal 5 are melted by the laser irradiation, and the melted material flows into the concave portion 5b on the back side of the convex portion 5a to improve the strength of the welded portion. In addition, it is possible to secure a stable weld strength each time welding is performed.
【００３６】この実施形態においては、導体２の下側に
被覆材（３）が存在しても同様に実施できる。In this embodiment, the same operation can be performed even if the covering material (3) is present below the conductor 2.
【００３７】図５は、本実施形態３に係る他のレーザに
よる接続方法を適用した場合の説明図（一部断面の正面
図）である。FIG. 5 is an explanatory diagram (partial cross-sectional front view) of a case where another laser connection method according to the third embodiment is applied.
【００３８】この接続方法は、板状端子５のレーザ照射
側とは反対側（下側）に凹部５ｂを形成しておき、その
凹部５ｂとは反対側に、溶融材料１０が溶着された導体
２を、溶融材料１０を上側にして重ね、溶融材料１０側
からレーザ照射を行う。In this connection method, a concave portion 5b is formed on the opposite side (lower side) of the plate-like terminal 5 from the laser irradiation side, and a conductor on which the molten material 10 is welded is formed on the opposite side of the concave portion 5b. 2 are stacked with the molten material 10 facing upward, and laser irradiation is performed from the molten material 10 side.
【００３９】この場合にも、溶融材料１０などの溶融し
たものが下側の凹部５ｂに流れ込み、溶接部強度が向上
し、かつ安定した溶接部強度を各溶接の都度確保するこ
とが可能となる。Also in this case, the melted material such as the molten material 10 flows into the lower concave portion 5b, so that the strength of the welded portion is improved, and a stable strength of the welded portion can be ensured each time welding is performed. .
【００４０】（実施形態４）本実施形態４は、樹脂層の
表層に板状端子がその一部を埋め込んだ状態になってい
る場合である。(Embodiment 4) Embodiment 4 is a case where a plate-like terminal is partially embedded in a surface layer of a resin layer.
【００４１】図６は、本実施形態４に係るレーザによる
接続方法を適用した場合の説明図（斜視図）である。FIG. 6 is an explanatory view (perspective view) when the connection method using a laser according to the fourth embodiment is applied.
【００４２】この接続方法は、次のように行う。This connection method is performed as follows.
【００４３】バスバー回路９側の端子部分は、樹脂層８
の表層に板状端子５がその一部を埋め込まれている。そ
こで、板状端子５の露出側とは反対側に、樹脂層８に板
状端子５に達する覗き窓８ａを形成しておく。The terminal portion on the side of the bus bar circuit 9 is
A part of the plate-like terminal 5 is embedded in the surface layer. Therefore, on the side opposite to the exposed side of the plate-shaped terminal 5, a viewing window 8 a reaching the plate-shaped terminal 5 is formed in the resin layer 8.
【００４４】その後、その板状端子５の露出部の上に、
配線部材１から導体２を突出させてあり、かつ導体２上
に溶融材料（図示せず）を溶着してある、配線部材１の
導体２を重ねる。Thereafter, on the exposed portion of the plate-like terminal 5,
The conductor 2 of the wiring member 1 in which the conductor 2 is projected from the wiring member 1 and a molten material (not shown) is welded on the conductor 2 is superposed.
【００４５】そして、溶融材料（図示せず）側（右上か
ら左下に向けて）からレーザ照射を行う。このとき、覗
き窓８ａより観察しつつレーザ照射を行うことができる
ので、樹脂層８に板状端子５がその一部を埋め込まれて
いても、板状端子５の裏側にまで溶接部が達した状態に
溶接を行うことができる。Then, laser irradiation is performed from the side of the molten material (not shown) (from the upper right to the lower left). At this time, since the laser irradiation can be performed while observing from the viewing window 8a, even if the plate-like terminal 5 is partially embedded in the resin layer 8, the welded portion reaches the back side of the plate-like terminal 5. Welding can be performed in a state where it has been set.
【００４６】したがって、本実施形態４による場合に
も、溶接部が裏側（下側）に到達するようにして溶接で
きるので、強度低下を防止できる。Therefore, also in the case of the fourth embodiment, since the welding can be performed so that the welded portion reaches the back side (lower side), a decrease in strength can be prevented.
【００４７】なお、以上の実施形態では、板状端子５を
備える回路として、ケーブルリールに内蔵されたバスバ
ー回路に適用しているが、本発明はこれに限らず、ケー
ブル間の電気的接続が可能な接続箱などに設けられる板
状端子などにも適用できる。In the above embodiment, the circuit provided with the plate terminals 5 is applied to the bus bar circuit built in the cable reel. However, the present invention is not limited to this, and the electrical connection between the cables is not limited to this. The present invention can also be applied to a plate-like terminal provided in a possible connection box or the like.
【００４８】また、以上の実施形態では、溶融材料１０
として、Ｓｎ−Ｐｂ系はんだを使用しているが、本発明
はこれに限らず、銅よりもレーザ反射率の低い他の溶融
材料を使用するようにしてもよい。このようにすると、
従来技術においてレーザ照射される導体や端子が一般的
に銅材料からなる場合よりも、レーザ反射率が低いので
レーザ光の吸収効率を高めることができ、また、熱伝導
度が小さいので、レーザ溶接を行うこと自体が容易にな
る。また、本発明は、Ｓｎ−Ｐｂ系はんだよりも高融点
材料、例えばＡｇ含有量が重量比で５％以下のＳｎ−Ａ
ｇ系材料からなる溶融材料を使用してもよい。このよう
にすると、Ｓｎ−Ｐｂ系はんだを用いる場合よりも、溶
接部の強度が向上して信頼性を高めることが可能にな
る。In the above embodiment, the molten material 10
Although the Sn-Pb-based solder is used as an example, the present invention is not limited to this, and another molten material having a lower laser reflectivity than copper may be used. This way,
Compared to the conventional technology, conductors and terminals to be irradiated with laser are generally lower in laser reflectivity than when copper material is used, so that the absorption efficiency of laser light can be increased. Is easy to perform. In addition, the present invention provides a material having a higher melting point than Sn-Pb-based solder, for example, Sn-A having an Ag content of 5% or less by weight.
A molten material composed of a g-based material may be used. In this case, the strength of the welded portion is improved and the reliability can be increased as compared with the case where the Sn-Pb-based solder is used.
【００４９】また、上記実施形態ではレーザ照射にＹＡ
Ｇレーザを使用しているが、本発明はこれに限らず、他
のレーザを使用することができる。In the above embodiment, YA is used for laser irradiation.
Although a G laser is used, the present invention is not limited to this, and other lasers can be used.
【００５０】[0050]
【発明の効果】以上詳述するように、本発明による場合
には、得られる溶接部がレーザ照射により生じた窪み部
または貫通孔に溶融材料の溶融したものが充填されて空
洞のない状態であるため、その溶接部の強度低下を防止
することができる。As described in detail above, in the case of the present invention, the obtained welded portion is filled with a molten material of the molten material in the recessed portion or through-hole generated by the laser irradiation, and has no void. Therefore, it is possible to prevent a decrease in the strength of the welded portion.
【００５１】また、本発明において、重畳部分の板状端
子に凹部をまたは片面側が凹状で、もう一方の片面側が
凸状で背中合わせに形成しておき、凹部とは反対側に溶
融材料を配すると共に凹部とは反対側からレーザ照射し
て接続するようにすると、レーザ照射側とは反対側の凹
部に溶融材料の溶融したものが流れ込み、溶接部強度が
向上し、かつ安定した溶接部強度を各溶接の都度確保す
ることが可能となる。Further, in the present invention, a concave portion is formed in the plate-shaped terminal at the overlapping portion or one side is concave, and the other side is convex, and the molten material is disposed on the opposite side to the concave portion. At the same time, when connecting by irradiating the laser from the side opposite to the recess, the melted material of the molten material flows into the recess on the side opposite to the laser irradiation side, and the weld strength is improved, and the stable weld strength is improved. It is possible to secure each welding.
【００５２】また、本発明において、板状端子がレーザ
照射側とは反対側を被覆材にて被覆された構造の場合に
は、溶接部を形成する部分の被覆材を除去して覗き穴を
形成しておき、レーザ照射を行うようにすると、溶接状
況を覗き穴から観察しつつ溶接を行うことができ、溶接
部が所望箇所まで達した状態に溶接を行うことができる
ので、溶接部の強度低下を防止することができる。In the present invention, when the plate-like terminal has a structure in which the side opposite to the laser irradiation side is covered with a covering material, the covering material at the portion where the weld is formed is removed to make the peephole. By forming the laser beam and performing laser irradiation, it is possible to perform welding while observing the welding condition from a peephole, and it is possible to perform welding in a state where the welded portion reaches a desired location. A decrease in strength can be prevented.
【００５３】また、本発明において、溶融材料として、
銅よりもレーザ反射率の低い材料からなる溶融材料を使
用すると、銅材料からなる導体や端子にレーザ照射を行
う従来技術の場合よりも、レーザ溶接自体を容易に行い
得るようになる。また、Ｓｎ−Ｐｂ系はんだよりも高融
点材料、例えばＡｇ含有量が重量比で５％以下のＳｎ−
Ａｇ系材料からなる溶融材料を使用すると、Ｓｎ−Ｐｂ
系はんだを用いる場合よりも、溶接信頼性を高めること
が可能となる。Further, in the present invention, as the molten material,
When a molten material made of a material having a lower laser reflectance than copper is used, the laser welding itself can be performed more easily than in the case of a conventional technique in which a conductor or a terminal made of a copper material is irradiated with a laser. Further, a material having a higher melting point than that of the Sn—Pb-based solder, for example, an Sn—
When a molten material made of an Ag-based material is used, Sn-Pb
The welding reliability can be improved as compared with the case where a system solder is used.
【図面の簡単な説明】[Brief description of the drawings]
【図１】本発明の実施形態１に係るレーザによる接続方
法を適用した場合の説明図（正面図）であり、（ａ）は
溶接前の状態を示し、（ｂ）は溶接後の状態を示す。FIG. 1 is an explanatory view (front view) of a case where a connection method using a laser according to a first embodiment of the present invention is applied, where (a) shows a state before welding and (b) shows a state after welding. Show.
【図２】本発明の実施形態２に係るレーザによる接続方
法を適用した場合の説明図（正面図）であり、（ａ）は
溶接前の状態を示し、（ｂ）は溶接後の状態を示す。FIG. 2 is an explanatory view (front view) of a case where a connection method using a laser according to a second embodiment of the present invention is applied, wherein (a) shows a state before welding and (b) shows a state after welding. Show.
【図３】本発明の実施形態２に係る他のレーザによる接
続方法を適用した場合の説明図（正面図）であり、
（ａ）は溶接前の状態を示し、（ｂ）は溶接後の状態を
示す。FIG. 3 is an explanatory view (a front view) in a case where a connection method using another laser according to the second embodiment of the present invention is applied;
(A) shows the state before welding, and (b) shows the state after welding.
【図４】本実施形態３に係るレーザによる接続方法を適
用した場合の説明図（斜視図）である。FIG. 4 is an explanatory view (perspective view) in a case where a connection method using a laser according to a third embodiment is applied.
【図５】本実施形態３に係る他のレーザによる接続方法
を適用した場合の説明図（正面図）である。FIG. 5 is an explanatory diagram (front view) of a case where a connection method using another laser according to the third embodiment is applied.
【図６】本実施形態４に係るレーザによる接続方法を適
用した場合の説明図（斜視図）である。FIG. 6 is an explanatory view (perspective view) in a case where a connection method using a laser according to a fourth embodiment is applied.
【図７】本発明で用いる配線部材の構造を示す断面図で
ある。FIG. 7 is a sectional view showing a structure of a wiring member used in the present invention.
１ 配線部材 ２ 導体 ３ 被覆材 ５ 板状端子 ５ａ 凸部 ５ｂ 凹部 ６ 貫通孔 ７ 溶接部 ８ 樹脂層 ８ａ 覗き窓 ９ バスバー回路 １０ 溶融材料 DESCRIPTION OF SYMBOLS 1 Wiring member 2 Conductor 3 Covering material 5 Plate-shaped terminal 5a Convex part 5b Concave part 6 Through-hole 7 Weld part 8 Resin layer 8a Viewing window 9 Bus bar circuit 10 Melting material
フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） // Ｃ２２Ｃ 13/00 Ｃ２２Ｃ 13/00 (72)発明者 坂 喜文 愛知県名古屋市南区菊住１丁目７番10号 株式会社ハーネス総合技術研究所内 (72)発明者 坂田 知之 愛知県名古屋市南区菊住１丁目７番10号 株式会社ハーネス総合技術研究所内 Ｆターム(参考） 4E068 BA06 BH01 CA14 CA17 DA09 DA11 DA14 DA16 DB02 5E344 AA02 AA22 BB02 BB04 CC05 CD01 DD05 EE11 Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (reference) // C22C 13/00 C22C 13/00 (72) Inventor Yoshifumi Saka 1-7-10 Kikuzumi, Minami-ku, Nagoya-shi, Aichi Prefecture Harness Research Institute, Inc. (72) Inventor Tomoyuki Sakata 1-7-10 Kikuzumi, Minami-ku, Nagoya-shi, Aichi F-term (reference) in Harness Research Institute, Inc. 4E068 BA06 BH01 CA14 CA17 DA09 DA11 DA14 DA16 DB02 5E344 AA02 AA22 BB02 BB04 CC05 CD01 DD05 EE11
Claims (5)
線部材の導体と相手側の板状端子とをレーザ照射による
溶接にて接続するレーザによる接続方法であって、 配線部材における導体の少なくとも片面側を露出させ、
その露出した導体部分を板状端子に重ねると共にその重
畳部分のレーザ照射側に溶融材料を配し、該溶融材料に
向けてレーザ照射を行い、そのレーザ照射により生じた
窪み部または貫通孔に溶融材料の溶融したものが充填さ
れた溶接部を形成するようにして接続することを特徴と
するレーザによる接続方法。1. A connection method using a laser for connecting a conductor of a wiring member in which both sides of a conductor are sandwiched by a covering material and a plate-shaped terminal of the other side by welding by laser irradiation, wherein the conductor in the wiring member is provided. Expose at least one side of the
The exposed conductor portion is superimposed on the plate-like terminal, and a molten material is arranged on the laser irradiation side of the overlapped portion, and laser irradiation is performed on the molten material. A connection method using a laser, wherein the connection is performed such that a welded portion filled with a molten material is formed.
はその板状端子に片面側が凹状で、もう一方の片面側が
凸状で背中合わせに形成しておき、凹部とは反対側に溶
融材料を配すると共にその溶融材料側からレーザ照射
し、凹部に溶融材料の溶融したものが到達するようにし
て接続することを特徴とする請求項１に記載のレーザに
よる接続方法。2. A recess is formed in the plate-shaped terminal of the overlapping portion, or the plate-shaped terminal is formed with a concave shape on one side and a convex shape on the other side, and a molten material is formed on the opposite side to the concave portion. 2. The connection method according to claim 1, wherein the laser beam is radiated from the side of the molten material, and the molten material is connected to reach the concave portion.
を被覆材にて被覆された構造の場合には、その被覆材の
溶接部形成部分を除去して覗き穴を形成しておき、レー
ザ照射を行うことを特徴とする請求項１または２に記載
のレーザによる接続方法。3. In the case where the plate-like terminal has a structure in which the side opposite to the laser irradiation side is covered with a covering material, a portion where the welding portion of the covering material is formed is removed to form a peephole. 3. The connection method using a laser according to claim 1, wherein laser irradiation is performed.
射率の低い材料またはＳｎ−Ｐｂ系はんだよりも高融点
材料を使用することを特徴とする請求項１乃至３のいず
れかに記載のレーザによる接続方法。4. The laser according to claim 1, wherein a material having a lower laser reflectivity than copper or a material having a higher melting point than Sn—Pb based solder is used as the molten material. Connection method.
量比で５％以下のＳｎ−Ａｇ系材料を用いる請求項４に
記載のレーザによる接続方法。5. The connection method according to claim 4, wherein an Sn-Ag-based material having an Ag content of 5% or less by weight is used as the high melting point material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10313138A JP2000141029A (en) | 1998-11-04 | 1998-11-04 | Connecting method by laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10313138A JP2000141029A (en) | 1998-11-04 | 1998-11-04 | Connecting method by laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000141029A true JP2000141029A (en) | 2000-05-23 |
Family
ID=18037563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10313138A Withdrawn JP2000141029A (en) | 1998-11-04 | 1998-11-04 | Connecting method by laser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000141029A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007227893A (en) * | 2006-01-24 | 2007-09-06 | Nec Electronics Corp | Semiconductor device manufacturing method |
| EP2380690A1 (en) * | 2010-04-26 | 2011-10-26 | Forschungszentrum Jülich GmbH | Joining of metallic and/or ceramic materials with the help of a glass ceramic filler material and a laser beam; Joint with two metallic and/or ceramic materials parts |
| KR101325838B1 (en) * | 2006-12-20 | 2013-11-05 | 엘지전자 주식회사 | A dryer and capillary tube connecting method for using the same |
| CN109216266A (en) * | 2018-09-10 | 2019-01-15 | 华南理工大学 | The production method of via hole, the production method of array substrate and array substrate |
| CN111197944A (en) * | 2018-11-19 | 2020-05-26 | 昭和电工株式会社 | Cooling device |
| US10981246B2 (en) | 2016-03-30 | 2021-04-20 | Panasonic Intellectual Property Management Co., Ltd. | Laser welding method |
| CN112692485A (en) * | 2020-12-14 | 2021-04-23 | 上海骄成机电设备有限公司 | Welding tool |
-
1998
- 1998-11-04 JP JP10313138A patent/JP2000141029A/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007227893A (en) * | 2006-01-24 | 2007-09-06 | Nec Electronics Corp | Semiconductor device manufacturing method |
| KR101325838B1 (en) * | 2006-12-20 | 2013-11-05 | 엘지전자 주식회사 | A dryer and capillary tube connecting method for using the same |
| EP2380690A1 (en) * | 2010-04-26 | 2011-10-26 | Forschungszentrum Jülich GmbH | Joining of metallic and/or ceramic materials with the help of a glass ceramic filler material and a laser beam; Joint with two metallic and/or ceramic materials parts |
| US10981246B2 (en) | 2016-03-30 | 2021-04-20 | Panasonic Intellectual Property Management Co., Ltd. | Laser welding method |
| CN109216266A (en) * | 2018-09-10 | 2019-01-15 | 华南理工大学 | The production method of via hole, the production method of array substrate and array substrate |
| CN109216266B (en) * | 2018-09-10 | 2020-09-01 | 华南理工大学 | Manufacturing method of via hole, manufacturing method of array substrate and array substrate |
| CN111197944A (en) * | 2018-11-19 | 2020-05-26 | 昭和电工株式会社 | Cooling device |
| CN112692485A (en) * | 2020-12-14 | 2021-04-23 | 上海骄成机电设备有限公司 | Welding tool |
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