JP2000133801A5 - - Google Patents
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- Publication number
- JP2000133801A5 JP2000133801A5 JP1998305368A JP30536898A JP2000133801A5 JP 2000133801 A5 JP2000133801 A5 JP 2000133801A5 JP 1998305368 A JP1998305368 A JP 1998305368A JP 30536898 A JP30536898 A JP 30536898A JP 2000133801 A5 JP2000133801 A5 JP 2000133801A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- type
- low
- potential side
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000004065 semiconductor Substances 0.000 claims description 25
- 238000009792 diffusion process Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 9
- 230000015556 catabolic process Effects 0.000 claims description 5
- 230000003252 repetitive Effects 0.000 claims description 2
- 239000012535 impurity Substances 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30536898A JP3943732B2 (ja) | 1998-10-27 | 1998-10-27 | 高耐圧半導体素子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30536898A JP3943732B2 (ja) | 1998-10-27 | 1998-10-27 | 高耐圧半導体素子 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2000133801A JP2000133801A (ja) | 2000-05-12 |
JP2000133801A5 true JP2000133801A5 (de) | 2005-07-28 |
JP3943732B2 JP3943732B2 (ja) | 2007-07-11 |
Family
ID=17944278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30536898A Expired - Fee Related JP3943732B2 (ja) | 1998-10-27 | 1998-10-27 | 高耐圧半導体素子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3943732B2 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006210368A (ja) * | 1999-07-02 | 2006-08-10 | Toyota Central Res & Dev Lab Inc | 縦型半導体装置及びその製造方法 |
JP4939760B2 (ja) | 2005-03-01 | 2012-05-30 | 株式会社東芝 | 半導体装置 |
JP4997715B2 (ja) * | 2005-05-18 | 2012-08-08 | 富士電機株式会社 | 半導体装置およびその製造方法 |
JP5052025B2 (ja) | 2006-03-29 | 2012-10-17 | 株式会社東芝 | 電力用半導体素子 |
JP4539680B2 (ja) * | 2007-05-14 | 2010-09-08 | 株式会社デンソー | 半導体装置およびその製造方法 |
JP4670915B2 (ja) | 2008-08-08 | 2011-04-13 | ソニー株式会社 | 半導体装置 |
KR101023079B1 (ko) | 2008-11-04 | 2011-03-25 | 주식회사 동부하이텍 | 반도체 소자 및 그의 제조 방법 |
WO2019186224A1 (ja) * | 2018-03-26 | 2019-10-03 | 日産自動車株式会社 | 半導体装置及びその製造方法 |
CN117766588B (zh) * | 2024-02-22 | 2024-04-30 | 南京邮电大学 | 具有延伸漏结构的超结双soi-ldmos器件及制造方法 |
-
1998
- 1998-10-27 JP JP30536898A patent/JP3943732B2/ja not_active Expired - Fee Related
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