JP2000124367A - Electronic equipment - Google Patents

Electronic equipment

Info

Publication number
JP2000124367A
JP2000124367A JP29268298A JP29268298A JP2000124367A JP 2000124367 A JP2000124367 A JP 2000124367A JP 29268298 A JP29268298 A JP 29268298A JP 29268298 A JP29268298 A JP 29268298A JP 2000124367 A JP2000124367 A JP 2000124367A
Authority
JP
Japan
Prior art keywords
cpu
substrate
temperature
gap
thermistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29268298A
Other languages
Japanese (ja)
Inventor
Kazutoyo Tanaka
和豊 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP29268298A priority Critical patent/JP2000124367A/en
Publication of JP2000124367A publication Critical patent/JP2000124367A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To measure an accurate temperature of a CPU main body since a gas is generated between the body and a substrate. SOLUTION: This electronic equipment is equipped with a substrate 1, a CPU unit which is electrically connected to the substrate 1 and fitted and a gas is left between a CPU-3 main body and substrate 1, an elastic member, and a temperature sensor which is adhered nearly at the center of one surface of the member, and the thickness when the temperature sensor is fitted to the member is larger than the gap, and the temperature sensor is arranged between the substrate 1 and CPU unit in contact with the CPU-3 main body.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】この発明は、パーソナルコン
ピュータ及びワードプロセッサ等の電子機器に使用され
るＣＰＵの温度測定に関し、特にＰＧＡ型のＣＰＵの温
度測定の構成に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to temperature measurement of a CPU used in electronic equipment such as a personal computer and a word processor, and more particularly to a temperature measurement configuration of a PGA type CPU.

【０００２】[0002]

【従来の技術】電子機器に搭載されるＣＰＵは年々高速
化されており、これに伴ってＣＰＵが発熱する温度の管
理方法も重要になってきている。この温度管理のため
に、従来よりサーミスタ等の温度センサを用いて、ＣＰ
Ｕの温度を測定していた。2. Description of the Related Art The speed of CPUs mounted on electronic devices has been increasing year by year, and accordingly, a method of managing the temperature at which the CPU generates heat has also become important. Conventionally, a temperature sensor such as a thermistor is used to control the temperature.
The temperature of U was being measured.

【０００３】従来のＰＧＡ型のＣＰＵを電子機器に使用
した際の温度測定構成を図４に示す。基板１上に、ＰＧ
Ａソケット２を配置しており、このＰＧＡソケット２内
部のほぼ中心にＣＰＵ３が内設されている。ＰＧＡソケ
ット２は、基板１上に実装した際、３ｍｍ程度の隙間が
生じる。また、ＰＧＡソケット２の上部には、ヒートシ
ンク４が取り付けられている。サーミスタ５は、ＣＰＵ
３とほぼ対向する基板１上に直接取り付けられている。
このような構成で、ＰＧＡ型のＣＰＵ３の温度を測定し
ていた。FIG. 4 shows a temperature measurement configuration when a conventional PGA type CPU is used in electronic equipment. On the substrate 1, PG
An A socket 2 is provided, and a CPU 3 is provided substantially in the center of the PGA socket 2. When the PGA socket 2 is mounted on the substrate 1, a gap of about 3 mm is generated. Further, a heat sink 4 is attached to the upper part of the PGA socket 2. Thermistor 5 is a CPU
3 is mounted directly on the substrate 1 substantially opposed to the substrate 3.
With such a configuration, the temperature of the PGA type CPU 3 was measured.

【０００４】この様に、ＰＧＡ型ＣＰＵを基板１上に配
置した際には、一般に３ｍｍ程度の隙間が生じるため、
ＣＰＵ３の正確な温度が測定できないという不具合があ
った。As described above, when the PGA CPU is arranged on the substrate 1, a gap of about 3 mm generally occurs.
There was a problem that the accurate temperature of the CPU 3 could not be measured.

【０００５】[0005]

【発明が解決しようとする課題】上記したとおり、従来
のＰＧＡ型ＣＰＵの温度測定は、ＣＰＵと基板との間に
隙間が生じるため、ＣＰＵの正確な温度が測定できなか
った。このため、測定したＣＰＵの温度情報を利用する
温度管理方法も、この隙間を考慮して、且つ電子機器筐
体内外の温度を考慮して設計する必要が有り、大変煩雑
であった。As described above, the temperature of the conventional PGA type CPU cannot be measured accurately because a gap is formed between the CPU and the substrate. Therefore, the temperature management method using the measured temperature information of the CPU also needs to be designed in consideration of the gap and the temperature inside and outside the electronic device housing, which is very complicated.

【０００６】[0006]

【課題を解決するための手段】上記課題を解決するため
に、本願の電子機器は、基板と、この基板と電気的に接
続されておりＣＰＵ本体と前記基板との間には隙間を設
けて取り付けられるＣＰＵユニットと、弾力性を有する
部材と、この部材の一表面のほぼ中央付近に接着される
温度センサーとを備え、前記部材に前記温度センサーを
取り付けた際の厚みは前記隙間よりも厚みを有してお
り、また、前記基板と前記ＣＰＵユニットとの間に、前
記温度センサが前記ＣＰＵ本体と接触するように配置さ
れるようにした。これにより、基板とＣＰＵ本体との間
に隙間を有する構成とした電子機器であっても、ＣＰＵ
本体の温度を正確に測定することができる。In order to solve the above-mentioned problems, an electronic apparatus according to the present invention is provided with a board, a board electrically connected to the board, and a gap provided between the CPU body and the board. A CPU unit to be attached, a member having elasticity, and a temperature sensor adhered to substantially one center of one surface of the member, wherein the thickness when the temperature sensor is attached to the member is thicker than the gap. And the temperature sensor is arranged between the substrate and the CPU unit so as to be in contact with the CPU main body. Accordingly, even in an electronic device having a configuration in which a gap is provided between a substrate and a CPU
The temperature of the main body can be accurately measured.

【０００７】更に、前記部材は、前記一表面に硬化部材
を貼り付けたものからなるようにした。これにより、製
造当初は、接触していたためＣＰＵの温度を正しく測定
できていたが、時間が経過すると隙間が生じ、ＣＰＵの
温度を正しく測定できないといった不具合も解消でき
る。Further, the member is formed by attaching a hardening member to the one surface. In this way, the temperature of the CPU could be correctly measured at the beginning of manufacture because of the contact, but it is possible to solve the problem that a gap is generated after a lapse of time and the temperature of the CPU cannot be measured correctly.

【０００８】[0008]

【発明の実施の形態】以下、本発明の一実施形態につい
て、図面を用いて説明する。なお、従来の技術で示した
ものと同一の構成、作用を有するものは同一番号を付し
説明を省略する。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. Elements having the same configuration and operation as those shown in the related art are denoted by the same reference numerals, and description thereof is omitted.

【０００９】図１は、ＰＧＡ型ＣＰＵを電子機器の基板
に取付けた際の構成を側面から示した図であり、また、
図２は、図１の構成を上面から示した図である。サーミ
スタ５を取り付けたサーミスタ押さえ部材６は、基板１
上にＰＧＡソケット２のほぼ中心に対向する位置に接着
配置される。このサーミスタ押え部材６は、絶縁性且つ
弾性に富む部材であり、例えばスポンジで構成される。
サーミスタ５は、サーミスタ押え部材６の上面ほぼ中央
に配置され、またリード線９を介して基板１と電気的に
接続されている。サーミスタ押え部材６にサーミスタ５
を取り付けた後の高さ（厚み）は、ＰＧＡソケット２を
基板１上に取り付けた際の隙間以上の厚みを備えてい
る。FIG. 1 is a side view showing a configuration of a PGA type CPU mounted on a substrate of an electronic apparatus.
FIG. 2 is a diagram showing the configuration of FIG. 1 from above. The thermistor holding member 6 with the thermistor 5 attached thereto
The PGA socket 2 is bonded and disposed at a position substantially facing the center of the PGA socket 2. The thermistor holding member 6 is an insulating and elastic member, and is made of, for example, a sponge.
The thermistor 5 is disposed substantially at the center of the upper surface of the thermistor holding member 6 and is electrically connected to the substrate 1 via a lead wire 9. Thermistor 5 is attached to the thermistor holding member 6.
The height (thickness) after mounting the PGA socket 2 is equal to or greater than the gap when the PGA socket 2 is mounted on the substrate 1.

【００１０】以上により、サーミスタ５がＰＧＡ型ＣＰ
Ｕに内設するＣＰＵ３と直接接触するため、ＣＰＵ３の
温度を正確に測定することができる。次に前記サーミス
タ押え部材６に関する他の実施の形態を図３で示し、説
明する。As described above, the thermistor 5 is a PGA type CP.
Since it is in direct contact with the CPU 3 provided in U, the temperature of the CPU 3 can be accurately measured. Next, another embodiment of the thermistor holding member 6 will be described with reference to FIG.

【００１１】サーミスタ押さえ部材６は、弾性に富むス
ポンジ７の上面に硬い材質のインシュレータ８を貼り付
けたもので構成される。そして、インシュレータ８に、
基板１とリード線９で電気的に接続されるサーミスタ５
が取り付けられる。サーミスタ押え部材６にサーミスタ
５を取り付けた後の高さ（厚み）は、ＰＧＡソケット２
を基板１上に取り付けた際の隙間以上の厚みを備えてい
る。The thermistor holding member 6 is formed by attaching an insulator 8 made of a hard material to the upper surface of a sponge 7 having a high elasticity. And, to the insulator 8,
Thermistor 5 electrically connected to substrate 1 by lead wire 9
Is attached. The height (thickness) after the thermistor 5 is attached to the thermistor holding member 6 is the PGA socket 2
Has a thickness equal to or greater than the gap when the substrate is mounted on the substrate 1.

【００１２】サーミスタ押え部材６をこの様に構成した
ことにより、サーミスタ自身の重みによりスポンジ７が
経年変化し、スポンジ７内に埋め込まれることによって
生じる隙間等を防ぐことができる。これにより、製造当
初は、ＣＰＵ３の温度を正しく測定できていたが、時間
が経過すると、正しく測定できないといった不具合も解
消できる。With the thermistor holding member 6 configured as described above, it is possible to prevent the sponge 7 from aging due to the weight of the thermistor itself and a gap or the like caused by being embedded in the sponge 7. As a result, the temperature of the CPU 3 can be correctly measured at the beginning of the manufacturing process, but it is possible to solve the problem that the temperature cannot be correctly measured after a lapse of time.

【００１３】[0013]

【発明の効果】以上のように、ＣＰＵ本体と基板との間
に、弾力性を有する部材にて隙間を埋めＣＰＵ本体に直
接温度センサが接触するから、ＣＰＵ本体の温度を正確
に測定することができるようになる。As described above, since the gap between the CPU main body and the substrate is filled with an elastic member and the temperature sensor directly contacts the CPU main body, the temperature of the CPU main body can be accurately measured. Will be able to

【００１４】更に、前記部材は、前記一表面に硬化部材
を貼り付けたものからなるようにしたので、製造当初
は、接触していたためＣＰＵの温度を正しく測定できて
いたが、時間が経過すると隙間が生じ、ＣＰＵの温度を
正しく測定できないといった不具合も解消できる。Further, since the member is made of a member having a hardened member attached to the one surface, the temperature of the CPU could be measured correctly at the beginning of manufacture because the member was in contact with the member. It is possible to solve the problem that a gap is generated and the temperature of the CPU cannot be measured correctly.

【図面の簡単な説明】[Brief description of the drawings]

【図１】ＰＧＡ型ＣＰＵを電子機器の基板に取付けた際
の構成を側面から示した図。FIG. 1 is a side view showing a configuration when a PGA CPU is mounted on a substrate of an electronic device.

【図２】ＰＧＡ型ＣＰＵを電子機器の基板に取付けた際
の構成を上面から示した図。FIG. 2 is a top view illustrating a configuration in which a PGA CPU is mounted on a substrate of an electronic device.

【図３】サーミスタ押え部材６に関する他の実施の形態
を示した図。FIG. 3 is a view showing another embodiment relating to a thermistor pressing member 6;

【図４】従来のＰＧＡ型のＣＰＵを電子機器に使用した
際の温度測定構成を示した図。FIG. 4 is a diagram showing a temperature measurement configuration when a conventional PGA type CPU is used in an electronic device.

【符号の説明】[Explanation of symbols]

１ 基板 ２ ＰＧＡソケット ３ ＣＰＵ ４ ヒートシンク ５ サーミスタ ６ サーミスタ押え部材 ７ スポンジ ８ インシュレータ ９ リード線 DESCRIPTION OF SYMBOLS 1 Substrate 2 PGA socket 3 CPU 4 Heat sink 5 Thermistor 6 Thermistor holding member 7 Sponge 8 Insulator 9 Lead wire

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】基板と、この基板と電気的に接続されてお
りＣＰＵ本体と前記基板との間には隙間を設けて取り付
けられるＣＰＵユニットと、弾力性を有する部材と、こ
の部材の一表面のほぼ中央付近に接着される温度センサ
ーとを備え、前記部材に前記温度センサーを取り付けた
際の厚みは前記隙間よりも厚みを有しており、また、前
記基板と前記ＣＰＵユニットとの間に、前記温度センサ
が前記ＣＰＵ本体と接触するように配置されるように構
成したことを特徴とする電子機器。1. A board, a CPU unit electrically connected to the board and provided with a gap between the CPU body and the board, an elastic member, and one surface of the member. A temperature sensor adhered near the center of the member, the thickness when the temperature sensor is attached to the member has a thickness greater than the gap, and between the substrate and the CPU unit. An electronic device, wherein the temperature sensor is arranged to be in contact with the CPU main body. 【請求項２】前記部材は、前記一表面に硬化部材を貼り
付けたもので有ることを特徴とする請求項１記載の電子
機器。2. The electronic device according to claim 1, wherein said member has a hardened member attached to said one surface.
JP29268298A 1998-10-15 1998-10-15 Electronic equipment Pending JP2000124367A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29268298A JP2000124367A (en) 1998-10-15 1998-10-15 Electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29268298A JP2000124367A (en) 1998-10-15 1998-10-15 Electronic equipment

Publications (1)

Publication Number Publication Date
JP2000124367A true JP2000124367A (en) 2000-04-28

Family

ID=17784945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29268298A Pending JP2000124367A (en) 1998-10-15 1998-10-15 Electronic equipment

Country Status (1)

Country Link
JP (1) JP2000124367A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008232527A (en) * 2007-03-20 2008-10-02 Matsushita Electric Ind Co Ltd Air conditioner

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008232527A (en) * 2007-03-20 2008-10-02 Matsushita Electric Ind Co Ltd Air conditioner

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