JP2000124300A - Wafer carrier - Google Patents
Wafer carrierInfo
- Publication number
- JP2000124300A JP2000124300A JP10291233A JP29123398A JP2000124300A JP 2000124300 A JP2000124300 A JP 2000124300A JP 10291233 A JP10291233 A JP 10291233A JP 29123398 A JP29123398 A JP 29123398A JP 2000124300 A JP2000124300 A JP 2000124300A
- Authority
- JP
- Japan
- Prior art keywords
- wafer carrier
- lid
- key
- keyhole
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は半導体装置の製造
工程において使用されるウェーハキャリアに関する。The present invention relates to a wafer carrier used in a semiconductor device manufacturing process.
【０００２】[0002]
【従来の技術】半導体装置の製造工程において、ウェー
ハキャリアが用いられる。それにウェーハを詰めて工程
に供給され、工程においては処理済み後は同じまたは別
のウェーハキャリアに詰めて保管または次工程に送る。
ウェーハキャリアは各工程の処理の内容や、処理設備の
構造や特性に応じて特別なウェーハキャリアも種々用い
られるが、多くの工程で共通的に用いられるものもあ
る。2. Description of the Related Art In a semiconductor device manufacturing process, a wafer carrier is used. Then, the wafer is packed and supplied to the process, and after being processed in the process, the wafer is packed in the same or another wafer carrier and stored or sent to the next process.
Various types of wafer carriers are used depending on the contents of the processing in each step and the structure and characteristics of the processing equipment, but some are commonly used in many steps.
【０００３】ところで、半導体ウェーハは大型化が進
み、現在３００ｍｍφが一般化しようとしている。この
３００ｍｍφウェーハの製造工程で用いるウェーハキャ
リアを統一規格のものとして各半導体装置メーカが採用
しようとしている。そうすればそれを取り扱う半導体製
造装置のウェーハキャリアをハンドリングする部分の共
通化が可能となり、製造装置メーカも利するものであ
る。これはＦＯＵＰ（Ｆｒｏｎｔ Ｏｐｅｎｉｎｇ Ｕ
ｎｉｆｉｅｄ Ｐｏｄ）と呼ばれる物である。[0003] By the way, semiconductor wafers are increasing in size, and 300 mmφ is currently being generalized. Each semiconductor device maker intends to adopt a wafer carrier used in the manufacturing process of the 300 mmφ wafer as a unitary standard. This makes it possible to use a common part for handling a wafer carrier in a semiconductor manufacturing apparatus that handles it, which is also advantageous for the manufacturing apparatus manufacturer. This is a FOUP (Front Opening U
nified Pod).
【０００４】このウェーハキャリアを図面を用いて説明
する。図２はその斜視図であり、図３はそのＡ−Ａ線に
沿った縦断面図である。ウェーハキャリア１は前面が開
口した箱状のキャリア本体２と蓋３とよりなる。キャリ
ア本体２は両側壁内部に前後に延びる突起１３が複数設
けられウェーハ（図示せず）を水平方向に支えるように
なっている。そして、開口部は４辺内径よりも広くなっ
た拡開部４を備えている。そして、蓋３は前記開口部に
整合して嵌まり込む鍔部３ａとキャリア本体２の内径に
整合して嵌まり込む径小部３ｂとを備える。そして、キ
ャリア本体２の内径と拡開部４との段差部分にはロの字
状パッキン５が配置され蓋３が嵌まった際に鍔部３ａが
圧接して内部を気密に保ってウェーハ（図示せず）を外
気による汚染より防止するようにしている。[0004] This wafer carrier will be described with reference to the drawings. FIG. 2 is a perspective view, and FIG. 3 is a longitudinal sectional view along the line AA. The wafer carrier 1 includes a box-shaped carrier body 2 having an open front surface and a lid 3. The carrier body 2 is provided with a plurality of protrusions 13 extending forward and backward inside the both side walls so as to horizontally support a wafer (not shown). The opening has an enlarged portion 4 wider than the inner diameter of the four sides. The lid 3 includes a flange 3a that fits into the opening and fits into the inner diameter of the carrier body 2 and a small-diameter portion 3b that fits into the carrier. A square-shaped gasket 5 is disposed at the step between the inner diameter of the carrier main body 2 and the expanded portion 4, and when the cover 3 is fitted, the flange 3a is pressed against the wafer 3 to keep the inside air-tight. (Not shown) is prevented from being contaminated by outside air.
【０００５】ウェーハキャリア本体２の開口部（拡開部
４）には上下にそれぞれピン穴６が２個所づつ設けら
れ、蓋３には鍔部３ａの上下端面にピン穴６に対応した
位置に自在に出没するピン７を備えて蓋が嵌まった際に
ピン７がピン穴６に嵌まって保持される。The opening (expanding portion 4) of the wafer carrier body 2 is provided with two pin holes 6 at upper and lower portions, respectively, and the lid 3 is provided at the upper and lower end surfaces of the flange portion 3a at positions corresponding to the pin holes 6. When the lid is fitted with the pin 7 which freely comes and goes, the pin 7 is fitted and held in the pin hole 6.
【０００６】次にピン７が進退動作可能とされる機構に
付いて説明する。蓋３には前面に回動部品８を２個所に
備え、それには矩形な鍵穴９がそれぞれ設けられていて
それを９０度回すことでピン７が突出し、もとに戻すと
ピン７ももどるものである。即ち、図４に示す正面図の
ように円形の回動部品８の周囲にピン７の一端が取り付
けられ、回動部品８が９０度回転動作することによりピ
ン７の他端が進退するものである。Next, a mechanism for enabling the pin 7 to move forward and backward will be described. The lid 3 is provided with two pivoting parts 8 on the front surface thereof, each of which has a rectangular keyhole 9 which is turned by 90 degrees so that the pin 7 protrudes. It is. That is, as shown in the front view of FIG. 4, one end of the pin 7 is attached around the circular rotary component 8, and the other end of the pin 7 advances and retreats by rotating the rotary component 8 by 90 degrees. is there.
【０００７】上述のように構成されたウェーハキャリア
１にウェーハを収納して蓋３を着脱するには、例えば蓋
３を外す場合はキャリア１が所定位置に配置され、図２
に示すように鍵穴９に対応した形状の（断面矩形な）鍵
１０と吸着パッド１１が所定の位置関係で進出し、鍵１
０が鍵穴９に入り込むと共に吸着パッド１１が蓋３の前
面に接触する。そして吸着パッド１１が蓋３を吸着保持
した状態で鍵１０が９０度回転して回動部品８を回転さ
せればピン７が後退して蓋３を外すことが可能となる。
そこで吸着パッド１１が蓋３を吸着したままで吸着パッ
ド１１と鍵１０とが共に後退して更に上下方向又は左右
方向に移動すればウェーハキャリア１の蓋３が開く。そ
の状態でロボットハンド等適宜の手段でウェーハ（図示
せず）を１枚づつ取り出して所定の処理が行なわれる。
処理の終わったウェーハ（図示せず）はもとのウェーハ
キャリア１に返されたり、同様な別のウェーハキャリア
１に返されたりする。所定数のウェーハ（図示せず）が
ウェーハキャリア本体２に詰められると、吸着パッド１
１に吸着保持されると共に鍵穴９に鍵１０が挿入された
状態で蓋３が運ばれ、ウェーハキャリア本体２の前面開
口部に嵌め込まれ、鍵１０が９０度外す時と逆向きに回
転してピン７をピン穴６に挿入して蓋３をウェーハキャ
リア本体２に固定する。In order to store a wafer in the wafer carrier 1 constructed as described above and to attach and detach the lid 3, for example, when the lid 3 is removed, the carrier 1 is placed at a predetermined position.
As shown in FIG. 3, a key 10 (having a rectangular cross section) corresponding to the keyhole 9 and a suction pad 11 advance in a predetermined positional relationship, and
0 enters the keyhole 9 and the suction pad 11 contacts the front surface of the lid 3. When the key 10 rotates 90 degrees to rotate the rotary component 8 while the suction pad 11 holds the lid 3 by suction, the pin 7 retreats and the lid 3 can be removed.
The lid 3 of the wafer carrier 1 is opened if the suction pad 11 and the key 10 are both retracted and moved in the vertical or horizontal direction while the suction pad 11 holds the lid 3. In this state, wafers (not shown) are taken out one by one by a suitable means such as a robot hand and a predetermined process is performed.
The processed wafer (not shown) is returned to the original wafer carrier 1 or returned to another similar wafer carrier 1. When a predetermined number of wafers (not shown) are packed in the wafer carrier body 2, the suction pads 1
The cover 3 is carried in a state in which the key 10 is inserted into the key hole 9 while being sucked and held by the key 1, and is fitted into the front opening of the wafer carrier main body 2. The pin 7 is inserted into the pin hole 6 to fix the lid 3 to the wafer carrier body 2.
【０００８】[0008]
【発明が解決しようとする課題】上記のＦＯＵＰタイプ
のウェーハキャリアによればウェーハの保管中、移送中
は外気と遮断され、汚染されることはない。しかしなが
ら蓋がウェーハキャリア本体に嵌まり込むようになされ
るので、上述のように蓋を外す際にウェーハキャリア内
が減圧状態となり、外気の巻き込みが生じダスト等ウェ
ーハの汚染が生じるおそれがある。そこで、この発明は
蓋を開く際に中に外気の巻き込みが生じないようなウェ
ーハキャリアを提供する。According to the above-mentioned FOUP type wafer carrier, during storage and transfer of the wafer, the wafer is shut off from the outside air and is not contaminated. However, since the lid is fitted into the wafer carrier main body, when the lid is removed as described above, the inside of the wafer carrier is depressurized, and there is a possibility that outside air is entrained and the wafer such as dust is contaminated. Therefore, the present invention provides a wafer carrier in which the outside air is not entrained when the lid is opened.
【０００９】[0009]
【課題を解決するための手段】上記の課題を解決するた
めにこの発明は前面に開口を備える箱状のウェーハキャ
リア本体と、その開口に嵌まり込むようにして開口を塞
ぐ蓋とでなり、該蓋には鍵穴を備え、その鍵穴に鍵を挿
入しての操作により該蓋を該ウェーハキャリア本体に固
定したり外したりするウェーハキャリアにおいて、前記
蓋は鍵穴の奥にウェーハキャリア内まで貫通する通気穴
を備え、その通気穴は通常は弁で止められており、外側
の気圧が高くなって弁が開くようになっていることを特
徴とするウェーハキャリアを提供する。このウェーハキ
ャリアによれば蓋を固定したり外したりする鍵の先を清
浄ガスが噴出するノズルとし且つ通気穴の口にフィット
するものとすれば、蓋を外すに際して鍵を鍵穴に挿入し
て通気穴に鍵の先をつなぎ清浄ガスを噴出させればその
圧力で弁が開いてウェーハキャリアの内部の気圧が高く
なる。その状態で鍵を操作して蓋を外せば外気がウェー
ハキャリア内に巻き込まれるのを防止する。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention comprises a box-shaped wafer carrier body having an opening on the front surface, and a lid that fits into the opening and closes the opening. A key hole, wherein the lid is fixed to and removed from the wafer carrier main body by an operation of inserting a key into the key hole, wherein the lid is provided at the back of the key hole with a ventilation hole penetrating into the wafer carrier. Wherein the vent hole is normally closed by a valve and the outside air pressure is increased so that the valve is opened. According to this wafer carrier, if the tip of the key for fixing and removing the lid is a nozzle for ejecting the clean gas and fits into the opening of the ventilation hole, when removing the lid, the key is inserted into the keyhole and vented. If the tip of the key is connected to the hole and a clean gas is ejected, the valve opens at that pressure, and the pressure inside the wafer carrier increases. If the key is operated and the lid is removed in this state, the outside air is prevented from being caught in the wafer carrier.
【００１０】[0010]
【発明の実施の形態】この発明の一実施例を図面を参照
して説明する。このウェーハキャリア１００は図２，
３，４に示した従来のウェーハキャリア１に比較して異
なる点は蓋３に変えて蓋１０３となる点である。そし
て、このウェーハキャリア１００を取り扱う（蓋１０３
を外す）装置の鍵１０が鍵１１０に変わる点である。図
１はその要部縦断面図である。An embodiment of the present invention will be described with reference to the drawings. This wafer carrier 100 is shown in FIG.
The difference from the conventional wafer carrier 1 shown in FIGS. 3 and 4 is that a lid 103 is used instead of the lid 3. Then, the wafer carrier 100 is handled (the lid 103).
The key 10 of the device is changed to the key 110. FIG. 1 is a longitudinal sectional view of the main part.
【００１１】このウェーハキャリア１００のウェーハキ
ャリア本体２は図２に示すものと変わらないので説明を
略す。そして、蓋１０３は図２，３に示す蓋３と外形は
同様でウェーハキャリア２の開口部に整合して嵌まり込
む鍔部１０３ａとキャリア本体２の内径に整合して嵌ま
り込む径小部１０３ｂとを備える。そして、キャリア本
体２の内径と拡開部４との段差部分にはロの字状パッキ
ン５が配置され蓋１０３が嵌まった際に鍔部１０３ａが
圧接して内部を気密に保ってウェーハ（図示せず）を外
気による汚染より防止する点も同じである。蓋１０３に
は鍔部１０３ａの上下端面にウェーハ本体２のピン穴６
に対応した位置に自在に出没するピン７を備えて蓋１０
３が嵌まった際にピン７がピン穴６に嵌まって保持され
るのも同様である。ピン７の進退動作が回動部品８を２
個所に備えてその鍵穴９に鍵１１０を挿入して９０度回
すことでピン７が突出し、もとに戻すとピン７ももどる
ものである点も類似する。The wafer carrier body 2 of the wafer carrier 100 is the same as that shown in FIG. The lid 103 has the same outer shape as the lid 3 shown in FIGS. 2 and 3 and has a flange portion 103 a that fits in alignment with the opening of the wafer carrier 2 and a small-diameter portion that fits in alignment with the inner diameter of the carrier body 2. 103b. A square-shaped gasket 5 is arranged at the step between the inner diameter of the carrier main body 2 and the expanded portion 4, and when the cover 103 is fitted, the flange portion 103a is pressed against the inside to keep the inside airtight and the wafer ( (Not shown) is prevented from contamination by outside air. The lid 103 has pin holes 6 in the wafer main body 2 at upper and lower end surfaces of the flange portion 103a.
The cover 10 is provided with a pin 7 that freely comes and goes at a position corresponding to
Similarly, when the pin 3 is fitted, the pin 7 is fitted and held in the pin hole 6. The reciprocating operation of the pin 7 causes the rotating part 8 to move
It is similar that the key 110 is inserted into the keyhole 9 and turned 90 degrees in preparation for the location, and the pin 7 projects by turning it 90 degrees.
【００１２】しかしながら、この蓋１０３は図１に示す
ように鍵穴９の奥に鍵穴９につながるようにウェーハキ
ャリア１００の内部に貫通する通気穴１０４を備える。
そして、通気穴１０４にはバネ１０６で押し付けられて
通常は通気穴１０４を塞ぎ、外側の気圧が高いときに開
く弁１０５を備えている。However, as shown in FIG. 1, the lid 103 is provided with a ventilation hole 104 penetrating into the inside of the wafer carrier 100 so as to be connected to the keyhole 9 at the back of the keyhole 9.
The ventilation hole 104 is provided with a valve 105 which is pressed by a spring 106 to normally close the ventilation hole 104 and open when the outside air pressure is high.
【００１３】上述のように構成されたウェーハキャリア
１００にウェーハ（図示せず）を収納して蓋１０３をし
て、その後蓋１０３を外す場合は図１に示すようにキャ
リア１００が所定位置に配置され、鍵穴９に対応した形
状の（断面矩形な）鍵１１０と吸着パッド図示せずが所
定の位置関係で進出し、鍵１１０が鍵穴９に入り込むと
共に吸着パッド（図示せず）が蓋１０３の前面に接触す
る。ここで、鍵１１０は先端からガスを噴出可能にノズ
ルを形成している。そして鍵１１０の先端は鍵穴９に挿
入した際に通気穴１０４の口に整合して略気密に接続す
る。その状態で先端から清浄ガスを噴出すればその圧力
で弁１０５が開きウェーハキャリア１００の内部が外気
より高圧になる。そして吸着パッド（図示せず）が蓋１
０３を吸着保持した状態で鍵１１０が９０度回転して回
動部品８を回転させればピン７が後退して蓋１０３を外
すことが可能となる。そこで吸着パッド（図示せず）が
蓋１０３を吸着したままで吸着パッド（図示せず）と鍵
１１０とが共に後退して更に上下方向又は左右方向に移
動すればウェーハキャリア１００の蓋１０３が開く。蓋
１０３をどける当初においてウェーハキャリア１００内
の圧力が高い状態にあるので外気の巻き込みが少なくな
り、ウェーハ（図示せず）の汚染を防止する。When a wafer (not shown) is accommodated in the wafer carrier 100 constructed as described above and the lid 103 is closed, and then the lid 103 is removed, the carrier 100 is placed at a predetermined position as shown in FIG. Then, a key 110 (having a rectangular cross section) corresponding to the keyhole 9 and a suction pad (not shown) advance in a predetermined positional relationship, and the key 110 enters the keyhole 9 and the suction pad (not shown) Touch the front. Here, the key 110 has a nozzle formed so that gas can be ejected from the tip. When the key 110 is inserted into the keyhole 9, the tip of the key 110 is aligned with the opening of the ventilation hole 104 and connected substantially airtightly. If a clean gas is ejected from the tip in this state, the valve 105 is opened by the pressure and the inside of the wafer carrier 100 becomes higher in pressure than outside air. Then, the suction pad (not shown) is
If the key 110 is rotated 90 degrees and the rotating component 8 is rotated in a state where the cover 103 is held by suction, the pin 7 is retracted and the lid 103 can be removed. Then, the lid 103 of the wafer carrier 100 is opened when the suction pad (not shown) and the key 110 are both retracted and further moved vertically or horizontally while the suction pad (not shown) is holding the lid 103. . Since the pressure inside the wafer carrier 100 is initially high when the lid 103 is moved, the entrainment of outside air is reduced, and contamination of the wafer (not shown) is prevented.
【００１４】[0014]
【発明の効果】以上説明したように、このウェーハキャ
リアによれば蓋を外す際の外気を内に巻き込むのが少な
くなり、ウェーハの汚染が防止される。As described above, according to this wafer carrier, the outside air when the cover is removed is less likely to be drawn into the inside, and contamination of the wafer is prevented.
【図１】 この発明の一実施例の要部断面図。FIG. 1 is a sectional view of a main part of an embodiment of the present invention.
【図２】 従来のウェーハキャリアの斜視図。FIG. 2 is a perspective view of a conventional wafer carrier.
【図３】 その要部断面図。FIG. 3 is a sectional view of a main part thereof.
【図４】 ピンの動作を説明する正面図。FIG. 4 is a front view illustrating the operation of the pin.
２ ウェーハキャリア本体 ９ 鍵穴 １００ ウェーハキャリア １０３ 蓋 １０４ 通気穴 １０５ 弁 １１０ 鍵 2 Wafer carrier body 9 Keyhole 100 Wafer carrier 103 Lid 104 Vent hole 105 Valve 110 Key
Claims (2)
ア本体と、その開口に嵌まり込むようにして開口を塞ぐ
蓋とでなり、該蓋には鍵穴を備え、その鍵穴に鍵を挿入
しての操作により該蓋を該ウェーハキャリア本体に固定
したり外したりするウェーハキャリアにおいて、 前記蓋は鍵穴の奥にウェーハキャリア内まで貫通する通
気穴を備え、 その通気穴は通常は弁で止められており、外側の気圧が
高くなって弁が開くようになっていることを特徴とする
ウェーハキャリア。1. A box-shaped wafer carrier body having an opening on a front surface thereof, and a lid for closing the opening so as to fit into the opening. The lid has a keyhole, and a key is inserted into the keyhole. In a wafer carrier for fixing and removing the lid to and from the wafer carrier body by operation, the lid has a ventilation hole penetrating into the wafer carrier at the back of the keyhole, and the ventilation hole is usually stopped by a valve. A wafer carrier, wherein the outside air pressure is increased to open the valve.
整合して略気密に接続して、 前記鍵を先端より清浄ガスを噴出するノズル状として、
前記鍵により前記蓋を外す際に内部に外気が巻き込まれ
るのを防止すべく清浄ガスを吹き込んで内部の圧力を高
めることを可能としたウェーハキャリア。2. The front opening of the vent hole is aligned with the tip of the key and connected substantially airtightly. The key has a nozzle shape for jetting clean gas from the tip.
A wafer carrier capable of increasing a pressure inside by blowing a clean gas in order to prevent outside air from being trapped inside when the lid is removed by the key.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10291233A JP2000124300A (en) | 1998-10-14 | 1998-10-14 | Wafer carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10291233A JP2000124300A (en) | 1998-10-14 | 1998-10-14 | Wafer carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000124300A true JP2000124300A (en) | 2000-04-28 |
Family
ID=17766208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10291233A Pending JP2000124300A (en) | 1998-10-14 | 1998-10-14 | Wafer carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000124300A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011061106A (en) * | 2009-09-14 | 2011-03-24 | Shin Etsu Polymer Co Ltd | Substrate housing vessel |
| US8074597B2 (en) | 2006-01-11 | 2011-12-13 | Applied Materials, Inc. | Methods and apparatus for purging a substrate carrier |
| CN110660718A (en) * | 2019-08-21 | 2020-01-07 | 长江存储科技有限责任公司 | Wafer storage and transmission device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08203993A (en) * | 1995-01-24 | 1996-08-09 | Shinko Electric Co Ltd | Gas supply system of carriable airtight container |
| JPH10125763A (en) * | 1996-08-29 | 1998-05-15 | Tokyo Electron Ltd | Treatment device |
-
1998
- 1998-10-14 JP JP10291233A patent/JP2000124300A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08203993A (en) * | 1995-01-24 | 1996-08-09 | Shinko Electric Co Ltd | Gas supply system of carriable airtight container |
| JPH10125763A (en) * | 1996-08-29 | 1998-05-15 | Tokyo Electron Ltd | Treatment device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8074597B2 (en) | 2006-01-11 | 2011-12-13 | Applied Materials, Inc. | Methods and apparatus for purging a substrate carrier |
| US8601975B2 (en) | 2006-01-11 | 2013-12-10 | Applied Materials, Inc. | Methods and loadport apparatus for purging a substrate carrier |
| US8689812B2 (en) | 2006-01-11 | 2014-04-08 | Applied Materials, Inc. | Methods and loadport for purging a substrate carrier |
| JP2011061106A (en) * | 2009-09-14 | 2011-03-24 | Shin Etsu Polymer Co Ltd | Substrate housing vessel |
| CN110660718A (en) * | 2019-08-21 | 2020-01-07 | 长江存储科技有限责任公司 | Wafer storage and transmission device |
| CN110660718B (en) * | 2019-08-21 | 2022-03-29 | 长江存储科技有限责任公司 | Wafer storage and transmission device |
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