JP2000106478A - Wiring board - Google Patents
Wiring boardInfo
- Publication number
- JP2000106478A JP2000106478A JP10274474A JP27447498A JP2000106478A JP 2000106478 A JP2000106478 A JP 2000106478A JP 10274474 A JP10274474 A JP 10274474A JP 27447498 A JP27447498 A JP 27447498A JP 2000106478 A JP2000106478 A JP 2000106478A
- Authority
- JP
- Japan
- Prior art keywords
- conductor layer
- wiring conductor
- wiring
- connection
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、交互に積層されて
形成された絶縁層と配線導体層とを具備して電子部品搭
載用基板や多層配線基板等に用いられる、マイクロ波帯
またはミリ波帯用高周波回路配線の異なる層間の配線導
体層について高周波特性の劣化が少ない接続構造を有す
る配線基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave band or a millimeter wave having an insulating layer and a wiring conductor layer which are alternately laminated and used for a board for mounting electronic parts or a multilayer wiring board. The present invention relates to a wiring board having a connection structure in which high-frequency characteristics of a wiring conductor layer between different layers of a band high-frequency circuit wiring are less deteriorated.
【０００２】[0002]
【従来の技術】マイクロ波帯またはミリ波帯用高周波回
路配線が形成された多層配線基板や電子部品搭載用基板
等に用いられる配線基板においては、絶縁層を介して上
下の配線導体層を接続する接続構造が必要となる。2. Description of the Related Art In a wiring board used for a multilayer wiring board or a board for mounting electronic parts on which a high frequency circuit wiring for a microwave band or a millimeter wave band is formed, upper and lower wiring conductor layers are connected via an insulating layer. Connection structure is required.
【０００３】従来の配線基板における配線導体層の接続
構造においては、絶縁層に貫通孔を形成し、貫通孔の側
面に導体膜を形成したいわゆるスルーホール導体や、あ
るいは貫通孔の内部に導体を充填したいわゆるビア導体
を用いて、その上下の異なる層間の配線導体層同士が電
気的に接続されていた。In a conventional connection structure of a wiring conductor layer in a wiring board, a so-called through-hole conductor in which a through hole is formed in an insulating layer and a conductor film is formed on a side surface of the through hole, or a conductor is provided inside the through hole. Wiring conductor layers between different upper and lower layers are electrically connected to each other by using a filled so-called via conductor.
【０００４】このような従来の配線導体層の接続構造の
例を図３（ａ）および（ｂ）にそれぞれ平面図および断
面図で示す。FIGS. 3 (a) and 3 (b) show an example of such a conventional connection structure of a wiring conductor layer in a plan view and a sectional view, respectively.
【０００５】図３において、１は支持基板、２は支持基
板１上に形成された第１配線導体層、３は支持基板１上
および第１配線導体層２上に形成された絶縁層、４は絶
縁層３上に形成された第２配線導体層であり、５は第１
配線導体層２と第２配線導体層４とを接続するように絶
縁層３に形成された接続孔、６は接続孔５の側面に被着
された接続用導体層である。ここで、図３（ａ）には、
接続孔５の形状として円錐台状のものと四角錐台状のも
のとを示している。In FIG. 3, reference numeral 1 denotes a support substrate, 2 denotes a first wiring conductor layer formed on the support substrate 1, 3 denotes an insulating layer formed on the support substrate 1 and the first wiring conductor layer 2, Denotes a second wiring conductor layer formed on the insulating layer 3, and 5 denotes a first wiring conductor layer.
A connection hole 6 formed in the insulating layer 3 so as to connect the wiring conductor layer 2 and the second wiring conductor layer 4, and a connection conductor layer 6 attached to the side surface of the connection hole 5. Here, FIG.
The shape of the connection hole 5 is shown as a truncated cone or a truncated square pyramid.
【０００６】このように、従来の配線基板においては、
その配線導体層の接続構造として、絶縁層３の上下に形
成された異なる層の第１および第２配線導体層２・４間
を接続する接続用導体層６は、絶縁層３に貫通孔として
形成された接続孔５の全側面に被着されたスルーホール
導体として形成されており、このような接続用導体層６
を介して第１および第２配線導体層２・４が電気的に接
続されていた。あるいは、接続用導体層６に対して接続
孔５中にさらに導体を充填してビア導体とし、これによ
り第１および第２配線導体層２・４が電気的に接続され
ていた。Thus, in the conventional wiring board,
As a connection structure of the wiring conductor layers, a connection conductor layer 6 for connecting between the first and second wiring conductor layers 2 and 4 of different layers formed above and below the insulating layer 3 is formed as a through hole in the insulating layer 3. The connection conductor layer 6 is formed as a through-hole conductor attached to all side surfaces of the formed connection hole 5.
And the first and second wiring conductor layers 2.4 were electrically connected. Alternatively, a conductor is further filled in the connection hole 5 with respect to the connection conductor layer 6 to form a via conductor, thereby electrically connecting the first and second wiring conductor layers 2.4.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、高周波
回路用の配線基板においては第１・第２配線導体層２・
４は例えばストリップ線路やマイクロストリップ線路・
コプレーナ線路等の一定の線幅を有する線路導体層とし
て形成されるのに対して、従来の配線基板における接続
導体層６は、図３に示すように、円錐台状または四角錐
台状の接続孔５の全側面に被着された導体層、あるいは
さらにその内部を導体で充填したものとして形成されて
いたことから、円錐台状の接続用導体層６では接続面が
平面でなく円錐状の側面に応じて湾曲していた。また、
円錐台状あるいは四角錐台状の接続孔５ではその側面が
下部へ行くに従って狭くなるため、線幅を有する配線導
体層として見た場合にその線幅は一定ではなかった。さ
らに、線路導体として形成された第１・第２配線導体層
２・４の線幅と接続孔５に形成された接続用導体層６の
線幅とは同一ではなく、接続孔５の側面の全面を使って
接続用導体層６が形成されていた。However, in a wiring board for a high-frequency circuit, the first and second wiring conductor layers 2.
4 is a strip line or a microstrip line, for example.
While formed as a line conductor layer having a constant line width such as a coplanar line, the connection conductor layer 6 in the conventional wiring board has a truncated conical or quadrangular pyramid-shaped connection as shown in FIG. Since the conductor layer formed on all side surfaces of the hole 5 or the inside thereof is further filled with a conductor, the connection surface of the truncated conical connection conductor layer 6 is not a plane but a conical shape. It was curved depending on the side. Also,
In the connection hole 5 in the shape of a truncated cone or a truncated quadrangular pyramid, the side surface becomes narrower toward the bottom, so that the line width was not constant when viewed as a wiring conductor layer having a line width. Further, the line widths of the first and second wiring conductor layers 2 and 4 formed as the line conductors are not the same as the line width of the connection conductor layer 6 formed in the connection hole 5. The connecting conductor layer 6 was formed over the entire surface.
【０００８】そのため、第１配線導体層２と第２配線導
体層４との接続孔５および接続用導体層６を介した接続
部分で生じるこのような線幅や形状の不連続性が第１・
第２配線導体層２・４を伝搬する高周波電気信号に対し
て障壁となり、その結果、高周波回路用の配線基板とし
ては、電気信号の波形が乱れたり電気信号が減衰したり
するなど高周波回路特性や電気的特性等の劣化を引き起
こすという問題点を有するものであった。Therefore, the discontinuity of the line width and the shape generated at the connection portion between the first wiring conductor layer 2 and the second wiring conductor layer 4 via the connection hole 5 and the connection conductor layer 6 is caused by the first.・
As a barrier against high-frequency electric signals propagating through the second wiring conductor layers 2 and 4, as a result, as a wiring board for a high-frequency circuit, high-frequency circuit characteristics such as a distorted electric signal waveform and an attenuated electric signal occur. And deterioration of electrical characteristics and the like.
【０００９】本発明はこのような従来技術の問題点に鑑
みて案出されたものであり、絶縁層の上下の配線導体層
を接続孔を介して接続する接続構造を有する配線基板に
おいて、その接続部で生じていた線幅や形状の違いなど
の不連続性をなくして、接続部を伝搬する高周波電気信
号の波形の乱れや減衰が少なく高周波回路特性や電気的
特性の劣化を低減させた配線導体層の接続構造を有する
配線基板を提供することを目的とするものである。The present invention has been devised in view of such a problem of the prior art, and has been developed in a wiring board having a connection structure for connecting wiring conductor layers above and below an insulating layer through connection holes. Eliminating discontinuities such as differences in line widths and shapes that occurred at the connection, reducing the disturbance and attenuation of the waveform of the high-frequency electric signal propagating through the connection and reducing the deterioration of high-frequency circuit characteristics and electrical characteristics It is an object of the present invention to provide a wiring board having a connection structure of a wiring conductor layer.
【００１０】[0010]
【課題を解決するための手段】本発明の配線基板は、絶
縁層の下面に形成された第１配線導体層と上面に形成さ
れた第２配線導体層とを前記絶縁層に形成した接続孔の
側面に被着されている接続用配線導体層を介して電気的
に接続して成る配線基板であって、前記接続孔のうち少
なくとも前記接続用配線導体層が被着される領域が平坦
であり、かつ前記接続用配線導体層の上下端の各々の線
幅が前記第１および第２配線導体層の線幅と同一である
ことを特徴とするものである。According to the present invention, there is provided a wiring board in which a first wiring conductor layer formed on a lower surface of an insulating layer and a second wiring conductor layer formed on an upper surface are formed in the insulating layer. A wiring substrate electrically connected via a connection wiring conductor layer attached to the side surface of the wiring board, wherein at least a region of the connection hole where the connection wiring conductor layer is attached is flat. And a line width of each of upper and lower ends of the connection wiring conductor layer is the same as a line width of the first and second wiring conductor layers.
【００１１】本発明の配線基板によれば、絶縁層の下面
の第１配線導体層と上面の第２配線導体層とを、絶縁層
に形成した接続孔の平坦な側面に被着された、上下端の
各々の線幅が第１および第２配線導体層の線幅と同一で
ある接続用配線導体層を介して電気的に接続したことか
ら、第１配線導体層と第２配線導体層とを平坦面に形成
された線路導体としての接続用配線導体層で接続するこ
ととなり、従来のように接続孔の側面の全面に被着され
た導体層を介して接続した場合に生じていた線幅や形状
の不連続性からくる高周波電気信号の波形の乱れや損失
・減衰等を抑制することができ、高周波回路特性や電気
的特性の劣化を低減させることができる。According to the wiring board of the present invention, the first wiring conductor layer on the lower surface of the insulating layer and the second wiring conductor layer on the upper surface are attached to the flat side surface of the connection hole formed in the insulating layer. The first and second wiring conductor layers are electrically connected via the connection wiring conductor layer in which the line widths of the upper and lower ends are the same as the line widths of the first and second wiring conductor layers. Are connected by a wiring conductor layer for connection as a line conductor formed on a flat surface, which occurs when a connection is made via a conductor layer attached to the entire side surface of the connection hole as in the related art. Disturbance, loss, attenuation, and the like of the high-frequency electric signal resulting from discontinuity in the line width and shape can be suppressed, and deterioration of high-frequency circuit characteristics and electric characteristics can be reduced.
【００１２】[0012]
【発明の実施の形態】以下、本発明の配線基板について
図面に基づき詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a wiring board according to the present invention will be described in detail with reference to the drawings.
【００１３】図１（ａ）および（ｂ）は、それぞれ本発
明の配線基板の実施の形態の一例を示す平面図および斜
視図である。なお、これらの図においては第１配線導体
層と第２配線導体層との接続部近傍のみを示している。
また、接続構造を分かり易く示すために絶縁層を透視し
た状態で示している。FIGS. 1A and 1B are a plan view and a perspective view, respectively, showing an example of an embodiment of a wiring board according to the present invention. In these drawings, only the vicinity of the connection between the first wiring conductor layer and the second wiring conductor layer is shown.
In addition, in order to easily show the connection structure, the insulating layer is shown in a see-through state.
【００１４】図１において、10は絶縁層（図示を省略）
の下面に形成された第１配線導体層、11は絶縁層の下面
に形成された第２配線導体層である。12は第１配線導体
層10と第２配線導体層11とを接続するように絶縁層に形
成された接続孔であり、この例では接続孔12の形状とし
て四角錐台状のものを示している。この場合には接続孔
12の側面は４つの平坦面で構成されることとなるが、本
発明の配線基板においては、少なくとも第１配線導体層
10と第２配線導体層11との間に位置し、第１および第２
配線導体層10・11を電気的に接続する接続用配線導体層
13が被着される領域の側面12ａが平坦であることが必要
である。In FIG. 1, reference numeral 10 denotes an insulating layer (not shown).
A first wiring conductor layer 11 is formed on the lower surface of the insulating layer, and a second wiring conductor layer 11 is formed on the lower surface of the insulating layer. Reference numeral 12 denotes a connection hole formed in the insulating layer so as to connect the first wiring conductor layer 10 and the second wiring conductor layer 11. In this example, the connection hole 12 has a truncated quadrangular pyramid shape. I have. In this case the connection hole
Twelve side surfaces are constituted by four flat surfaces, but in the wiring board of the present invention, at least the first wiring conductor layer
10 and the second and third wiring conductor layers 11,
Wiring conductor layer for electrical connection between wiring conductor layers 10 and 11
It is necessary that the side surface 12a of the area where the cover 13 is to be applied is flat.
【００１５】13は接続孔12の側面のうち第１配線導体層
10と第２配線導体層11との間に位置する平坦な面12ａに
被着された接続用配線導体層である。本発明の配線基板
は、この接続用配線導体層13が従来の接続用導体層とは
異なり、第１および第２配線導体層10・11と同様の線路
導体層としてこれら第１および第２配線導体層10・11の
間に位置する接続孔12の平坦な側面12ａに被着されてお
り、その下端の線幅が第１配線導体層10と同一であり、
またその上端の線幅が第２配線導体層11と同一であっ
て、そのような同一の線幅を有する接続用配線導体層13
でもって第１および第２配線導体層10・11を電気的に接
続したことを特徴とするものである。Reference numeral 13 denotes a first wiring conductor layer on the side surface of the connection hole 12.
The connection wiring conductor layer is provided on the flat surface 12a located between the second wiring conductor layer 10 and the second wiring conductor layer 11. In the wiring board of the present invention, the connection wiring conductor layer 13 is different from the conventional connection conductor layer, and is formed as a line conductor layer similar to the first and second wiring conductor layers 10 and 11. It is attached to the flat side surface 12a of the connection hole 12 located between the conductor layers 10 and 11, and the line width at the lower end thereof is the same as that of the first wiring conductor layer 10,
Further, the line width at the upper end thereof is the same as that of the second wiring conductor layer 11, and the connection wiring conductor layer 13 having such the same line width.
Thus, the first and second wiring conductor layers 10 and 11 are electrically connected.
【００１６】このように、配線基板中で高周波回路を構
成する第１配線導体層10と第２配線導体層11とを線路導
体層として形成された接続用配線導体層13で接続するこ
とにより、接続部における配線導体層の線幅や形状の不
連続性をなくすことができ、高周波電気信号の波形の乱
れや損失・減衰等の発生を抑制した良好な高周波回路特
性や電気的特性を有する配線基板を得ることができる。As described above, by connecting the first wiring conductor layer 10 and the second wiring conductor layer 11 constituting the high-frequency circuit in the wiring board with the connection wiring conductor layer 13 formed as a line conductor layer, Wiring with good high-frequency circuit characteristics and electrical characteristics that can eliminate discontinuities in the line width and shape of the wiring conductor layer at the connection part, and suppress the occurrence of disturbances, loss, and attenuation of high-frequency electrical signal waveforms A substrate can be obtained.
【００１７】このような本発明の配線基板における配線
導体層の接続構造は、図３に示したように支持基板上に
構成されてもよく、絶縁層と配線導体層とを交互に多層
に積層して形成された多層回路基板中に構成されてもよ
い。Such a connection structure of the wiring conductor layers in the wiring board of the present invention may be formed on a support substrate as shown in FIG. 3, and the insulating layers and the wiring conductor layers are alternately laminated in multiple layers. It may be configured in a multilayer circuit board formed as described above.
【００１８】本発明の配線基板において、絶縁層として
は電子部品搭載用基板や多層配線基板等に用いられる種
々の絶縁層を用いることができる。例えば、酸化アルミ
ニウム質焼結体や窒化アルミニウム質焼結体・窒化珪素
質焼結体・酸化珪素質焼結体・ムライト質焼結体等の各
種のセラミックスもしくはガラスセラミックスといった
無機絶縁物による絶縁層、あるいはポリイミド樹脂・フ
ッ素樹脂やＢＣＢ（Benzo Cyclo Butene：ベンゾシクロ
ブテン）樹脂等といった有機絶縁物による絶縁層、その
他、無機絶縁物粉末を有機樹脂で結合して成る混合材料
の絶縁物による絶縁層などを用いることができる。中で
も、絶縁層して低い誘電率を有するものを用いると、高
周波信号に対する信号遅延や伝搬損失・伝搬減衰が少な
くなるため、高周波回路を構成する場合に伝搬特性の一
層の向上を図ることができ、近年の電子部品の高周波化
にも対応することが可能となる。In the wiring board of the present invention, various insulating layers used for a board for mounting electronic components, a multilayer wiring board, and the like can be used as the insulating layer. For example, an insulating layer made of various kinds of ceramics such as aluminum oxide sintered body, aluminum nitride sintered body, silicon nitride based sintered body, silicon oxide based sintered body, mullite sintered body, or inorganic insulator such as glass ceramics. Or an insulating layer made of an organic insulating material such as polyimide resin, fluororesin, or BCB (Benzo Cyclo Butene: Benzocyclobutene) resin, or an insulating layer made of an insulating material of a mixed material formed by combining an inorganic insulating powder with an organic resin. Etc. can be used. Above all, when a material having a low dielectric constant is used as an insulating layer, signal delay and propagation loss / attenuation for high-frequency signals are reduced, so that the propagation characteristics can be further improved when a high-frequency circuit is formed. In addition, it is possible to cope with the recent increase in the frequency of electronic components.
【００１９】なお、このような絶縁層を形成するには、
それぞれの材料に応じた形成法によればよい。例えば、
ポリイミド樹脂・フッ素樹脂やＢＣＢ樹脂等といった有
機絶縁物による絶縁層であれば、スピンコート法等によ
り所望の厚みや特性を有する絶縁層を形成することがで
きる。In order to form such an insulating layer,
A forming method according to each material may be used. For example,
If the insulating layer is made of an organic insulating material such as a polyimide resin, a fluorine resin, or a BCB resin, an insulating layer having a desired thickness and characteristics can be formed by a spin coating method or the like.
【００２０】第１配線導体層10および第２配線導体層11
も、同様に電子部品搭載用基板や多層配線基板等に用い
られる種々の配線導体層を用いればよい。例えば、銅や
銀・金・アルミニウム・クロム・ニッケル・タングステ
ン・モリブデン・マンガン・ニオブ等の導体材料を用い
て、材料や絶縁層の特性に応じて、蒸着法・イオンプレ
ーティング法・スパッタリング法といった薄膜形成法
や、導体ペーストを用いた厚膜印刷法等の厚膜形成法、
あるいは金属箔を被着させる転写法等によって所望の配
線導体層を被着形成すればよい。First and second wiring conductor layers 10 and 11
Similarly, various wiring conductor layers used for electronic component mounting boards, multilayer wiring boards, and the like may be used. For example, using a conductive material such as copper, silver, gold, aluminum, chromium, nickel, tungsten, molybdenum, manganese, or niobium, the vapor deposition method, the ion plating method, the sputtering method, etc. Thick film forming methods such as thin film forming method and thick film printing method using conductive paste,
Alternatively, a desired wiring conductor layer may be formed by a transfer method or the like in which a metal foil is formed.
【００２１】絶縁層に形成される接続孔12の形状として
は、その側面のうち少なくとも第１および第２配線導体
層10・11の間に位置する領域が平坦であって、その平坦
面12ａの下端が接続孔12の下端で第１配線導体層10に接
触し、かつその上端が接続孔12の上端で第２配線導体層
に接触していればよい。例えば、図１に示すような四角
錐台状の他にも、多角形状や半円形状としてもよい。The shape of the connection hole 12 formed in the insulating layer is such that at least a region located between the first and second wiring conductor layers 10 and 11 among the side surfaces is flat, and the flat surface 12a is formed. It is sufficient that the lower end contacts the first wiring conductor layer 10 at the lower end of the connection hole 12 and the upper end contacts the second wiring conductor layer at the upper end of the connection hole 12. For example, in addition to the truncated quadrangular pyramid as shown in FIG. 1, a polygonal shape or a semicircular shape may be used.
【００２２】また、接続孔12の大きさとしては、その平
坦な側面12ａに接続用配線導体層13をその上下端の線幅
をそれぞれ第１および第２配線導体層10・11と同一の線
幅として形成するのに十分な大きさを有していればよ
い。As for the size of the connection hole 12, the connection wiring conductor layer 13 is provided on the flat side surface 12a, and the line widths of the upper and lower ends thereof are the same as those of the first and second wiring conductor layers 10 and 11, respectively. What is necessary is just to have sufficient size to form as width.
【００２３】このような接続孔12を形成するには、絶縁
層の特性に応じて種々の加工法を採用すればよい。例え
ば絶縁層がポリイミド樹脂やＢＣＢ樹脂等の有機絶縁物
から成る場合であれば、ＲＩＥ（Reactive Ion Etchin
g）法やＥＣＲ（Electron Cyclotron Resonance）法等
のドライエッチング法等を採用することにより、所望の
寸法・形状の接続孔12を形成することができる。この他
にも、レーザエッチングや通常のウエットエッチング等
の加工法も採用することができる。In order to form such connection holes 12, various processing methods may be employed according to the characteristics of the insulating layer. For example, if the insulating layer is made of an organic insulator such as a polyimide resin or a BCB resin, RIE (Reactive Ion Etchin)
By using a dry etching method such as a g) method or an ECR (Electron Cyclotron Resonance) method, the connection hole 12 having a desired size and shape can be formed. In addition, a processing method such as laser etching or ordinary wet etching can also be adopted.
【００２４】接続用配線導体層13は、第１および第２配
線導体層10・11と同様の材料ならびに形成法により形成
すればよい。その形成法としては、例えば、マスクを用
いて薄膜形成法により所望の線幅の配線導体層として形
成したり、導体層を被着させた後にフォトリソグラフィ
法により所望の線幅の配線導体層を得るようにしたり、
厚膜印刷法により所望の線幅の配線導体層を印刷・焼成
して形成したりすればよい。いずれの形成法によって
も、その線幅を前述のように上下端でそれぞれ第１およ
び第２配線導体層10・11の線幅と同一とすることによっ
て、それぞれの接続部における高周波信号の反射の発生
等を抑制することができる。The connection wiring conductor layer 13 may be formed by the same material and the same forming method as those of the first and second wiring conductor layers 10 and 11. As a forming method, for example, a wiring conductor layer having a desired line width is formed by a thin film formation method using a mask, or a wiring conductor layer having a desired line width is formed by photolithography after the conductor layer is applied. To get
The wiring conductor layer having a desired line width may be formed by printing and baking by a thick film printing method. In any of the forming methods, the line width at the upper and lower ends is made equal to the line width of the first and second wiring conductor layers 10 and 11 as described above, so that the reflection of the high-frequency signal at each connection portion is reduced. Generation and the like can be suppressed.
【００２５】また、上下端の線幅がそれぞれ第１および
第２配線導体層10・11の線幅と同一であれば上下端の線
幅が異なっていてもよく、この場合には上下端の間で線
幅を連続的に変化させておくことによって、第１配線導
体層10と第２配線導体層11との間でインピーダンスの整
合をとるようにインピーダンス変換部として機能させる
こともできる。If the line widths of the upper and lower ends are the same as the line widths of the first and second wiring conductor layers 10 and 11, respectively, the line widths of the upper and lower ends may be different. By continuously changing the line width between them, the first wiring conductor layer 10 and the second wiring conductor layer 11 can also function as an impedance converter so as to match the impedance.
【００２６】次に、本発明の配線基板の実施の形態の他
の例を図２（ａ）〜（ｃ）にそれぞれ図１（ｂ）と同様
の斜視図で示す。図２において図１と同様の箇所には同
じ符号を付してある。Next, other examples of the embodiment of the wiring board of the present invention are shown in FIGS. 2A to 2C in perspective views similar to FIG. 1B. In FIG. 2, the same parts as those in FIG. 1 are denoted by the same reference numerals.
【００２７】図２（ａ）に示す例においては、第１配線
導体層10と第２配線導体層11とが絶縁層の上下でねじれ
の位置関係にあり、接続孔12の底部で折り曲げて形成さ
れた第１配線導体層10と、第１配線導体層10の元の部分
と例えば直角等のねじれの位置関係にある第２配線導体
層11とを、四角錐台状の接続孔12の平坦な側面12ａに被
着させた接続用配線導体層13を介して電気的に接続して
ある。これにより、第１配線導体層10と第２配線導体層
11とがねじれの位置関係で接続された配線回路を形成す
ることができる。In the example shown in FIG. 2A, the first wiring conductor layer 10 and the second wiring conductor layer 11 are twisted above and below the insulating layer, and are formed by bending at the bottom of the connection hole 12. The formed first wiring conductor layer 10 and the second wiring conductor layer 11 having a twisted position such as a right angle with the original portion of the first wiring conductor layer 10 are flattened by connecting holes 12 having a truncated quadrangular pyramid shape. It is electrically connected via a connection wiring conductor layer 13 attached to the side surface 12a. Thereby, the first wiring conductor layer 10 and the second wiring conductor layer
11 can be formed in a wiring circuit connected in a twisted positional relationship.
【００２８】また、図２（ｂ）に示す例においては、絶
縁層の上下で互いに平行の位置関係に配設された第１配
線導体層10と第２配線導体層11とを、四角錐台状の接続
孔12の平坦な側面12ａに被着させた接続用配線導体層13
を介して、折り返し状に電気的に接続してある。これに
より、第１配線導体層10と第２配線導体層11とが折り返
し状に接続された配線回路を形成することができる。Further, in the example shown in FIG. 2B, the first wiring conductor layer 10 and the second wiring conductor layer 11 which are disposed in parallel with each other above and below the insulating layer are connected to each other by a truncated square pyramid. Wiring conductor layer 13 attached to the flat side surface 12a of the connection hole 12
And are electrically connected in a folded manner. As a result, a wiring circuit in which the first wiring conductor layer 10 and the second wiring conductor layer 11 are connected in a folded manner can be formed.
【００２９】また、図２（ｃ）に示す例においては、図
１（ｂ）に示した例に対して、接続孔12の形状を、少な
くとも第１配線導体層10と第２配線導体層11との間に位
置し、接続用配線導体層13が被着される領域の側面12ａ
が平坦であ半円形状として、第１配線導体層10と第２配
線導体層11とを接続用配線導体層13を介して電気的に接
続してある。Further, in the example shown in FIG. 2C, the shape of the connection hole 12 is different from the example shown in FIG. 1B by at least the first wiring conductor layer 10 and the second wiring conductor layer 11. And the side surface 12a of the region where the connection wiring conductor layer 13 is to be deposited.
Are flat and semicircular, and the first wiring conductor layer 10 and the second wiring conductor layer 11 are electrically connected via the connection wiring conductor layer 13.
【００３０】[0030]
【実施例】以下のようにして、本発明の配線基板を作製
した。EXAMPLE A wiring board of the present invention was manufactured as follows.
【００３１】まず、回路配線の支持基板となるアルミナ
基板の上面に、第１配線導体層10となる銅をマグネトロ
ンスパッタリング法により厚み約５μｍで成膜した。First, copper as the first wiring conductor layer 10 was formed to a thickness of about 5 μm on the upper surface of an alumina substrate as a support substrate for circuit wiring by magnetron sputtering.
【００３２】次に、この第１配線導体層10を通常のフォ
トリソグラフィ技術を用いて配線加工した。Next, the first wiring conductor layer 10 was subjected to wiring processing using ordinary photolithography technology.
【００３３】次に、この第１配線導体層10ならびに支持
基板の表面に、比誘電率が3.1 であるポリイミド樹脂を
スピンコート法を用いて被着形成し、クリーンオーブン
を用いて85℃の温度で30分間ベークし、さらに420 ℃の
温度で１時間の熱処理を行なうことによって、厚み約10
0 μｍの絶縁層を形成した。Next, a polyimide resin having a relative dielectric constant of 3.1 is formed on the first wiring conductor layer 10 and the surface of the supporting substrate by spin coating, and the temperature is set to 85 ° C. using a clean oven. Baking for 30 minutes at a temperature of 420 ° C. for 1 hour.
An 0 μm insulating layer was formed.
【００３４】次に、この絶縁層上に接続孔12を形成する
ためのマスク層となるアルミニウムをマグネトロンスパ
ッタリング法により厚み約１μｍで成膜した。Next, aluminum as a mask layer for forming the connection holes 12 was formed on the insulating layer to a thickness of about 1 μm by magnetron sputtering.
【００３５】次に、このマスク層のパターニングを通常
のフォトリソグラフィ技術を用いて行ない、燐酸・酢酸
・硝酸の混合水溶液によるウエットエッチングを行なっ
て接続孔12のパターンを形成した。Next, patterning of the mask layer was carried out by using a usual photolithography technique, and wet etching was carried out with a mixed aqueous solution of phosphoric acid / acetic acid / nitric acid to form a pattern of the connection hole 12.
【００３６】次に、ＲＩＥ法によるドライエッチング法
によりこのマスク層を介して絶縁層のエッチングを行な
うことによって、接続孔12の加工を行なった。ここで、
接続孔12の形状は上端面が100 μｍ角・下端面が60μｍ
角の逆四角錐台状とし、下端面の寸法を第１配線導体層
10の線幅50μｍよりも大きいものとした。Next, the connection hole 12 was processed by etching the insulating layer through this mask layer by the dry etching method by the RIE method. here,
The shape of the connection hole 12 is 100 μm square at the top end and 60 μm at the bottom end
The shape of the lower end face is the first wiring conductor layer
The line width of No. 10 was larger than 50 μm.
【００３７】なお、このように逆四角錐台状の接続孔12
をＲＩＥ法により形成するには、ＲＩＥプロセス中の圧
力条件を制御することにより接続孔12の側面と下端面と
の角度を制御すればよく、この例では圧力20Ｐａ程度で
エッチングを行なった。The inverted quadrangular pyramid-shaped connection hole 12
Can be formed by the RIE method by controlling the pressure conditions during the RIE process to control the angle between the side surface and the lower end surface of the connection hole 12. In this example, the etching was performed at a pressure of about 20 Pa.
【００３８】次に、この接続孔12を有する絶縁層上に第
２配線導体層11および接続用配線導体層13となる銅を、
第１配線導体層10と同様にマグネトロンスパッタリング
法により厚み約５μｍで成膜した。Next, on the insulating layer having the connection holes 12, copper serving as the second wiring conductor layer 11 and the connection wiring conductor layer 13 is coated.
Like the first wiring conductor layer 10, a film was formed to a thickness of about 5 μm by magnetron sputtering.
【００３９】そして、この銅層をフォトリソグラフィ技
術を用いて接続用配線導体層13の下端の線幅が第１配線
導体層10の線幅に一致するように加工し、また第２配線
導体層11の線幅と接続用配線導体層13の上端の線幅とが
一致するように加工して、図１に示すような配線導体層
の接続構造を有する本発明の配線基板を作製した。な
お、ここでは第１および第２配線導体層10・11の線幅な
らびに接続用配線導体層の線幅とも50μｍとした。Then, this copper layer is processed by photolithography so that the line width at the lower end of the connection wiring conductor layer 13 matches the line width of the first wiring conductor layer 10. Processing was performed so that the line width of 11 and the line width of the upper end of the wiring conductor layer 13 for connection coincided with each other, thereby producing a wiring board of the present invention having a wiring conductor layer connection structure as shown in FIG. Here, the line widths of the first and second wiring conductor layers 10 and 11 and the line width of the connection wiring conductor layer were both 50 μm.
【００４０】続いて、この本発明の配線基板と図３に示
した四角錐台状の接続孔５および接続用導体層６を有す
る従来の配線基板とについて、配線の電気信号の伝搬特
性をネットワークアナライザを用いて測定した。Next, regarding the wiring board of the present invention and the conventional wiring board having the truncated square pyramid-shaped connection hole 5 and the connection conductor layer 6 shown in FIG. It was measured using an analyzer.
【００４１】測定には配線導体層の接続部を100 ヶ所形
成した本発明の配線基板および従来の配線基板を用い
て、測定周波数100 ＧＨｚで伝搬特性を評価した。その
結果、本発明の配線基板によれば、従来の配線基板と比
較して反射損失の低減を主として約10％の伝搬損失低減
ができたことが確認でき、電気信号の反射特性ならびに
透過特性のどちらにおいても本発明の配線導体層の接続
構造をもつ配線の特性が従来の接続構造を持つ配線の特
性よりも優れており、本発明が接続部の配線導体層にお
ける電気信号の反射の抑制・伝搬損失の低減に効果があ
ることが確認できた。また、本発明の配線基板において
は、その電気特性はより高周波になるほど優れているこ
とも確認できた。In the measurement, the propagation characteristics were evaluated at a measurement frequency of 100 GHz using the wiring board of the present invention in which 100 connection portions of the wiring conductor layer were formed and a conventional wiring board. As a result, according to the wiring board of the present invention, it was confirmed that the propagation loss was reduced by about 10% mainly by reducing the reflection loss as compared with the conventional wiring board, and the reflection and transmission characteristics of the electric signal were reduced. In either case, the characteristics of the wiring having the connection structure of the wiring conductor layer of the present invention are superior to the characteristics of the wiring having the conventional connection structure, and the present invention suppresses the reflection of electric signals on the wiring conductor layer of the connection portion. It was confirmed that it was effective in reducing the propagation loss. Further, it was also confirmed that the electrical characteristics of the wiring board of the present invention were more excellent at higher frequencies.
【００４２】なお、本発明は以上の実施の形態の例に限
定されるものではなく、本発明の要旨を逸脱しない範囲
で種々の変更・改良を施すことは何ら差し支えない。It should be noted that the present invention is not limited to the above-described embodiments, and various changes and improvements may be made without departing from the spirit of the present invention.
【００４３】[0043]
【発明の効果】以上のように、本発明の配線基板によれ
ば、絶縁層に形成された下面の第１配線導体層と上面に
形成された第２配線導体層とを、絶縁層に形成した接続
孔の平坦な側面に被着された、上下端の各々の線幅が第
１および第２配線導体層の線幅と同一である接続用配線
導体層を介して電気的に接続したことから、第１配線導
体層と第２配線導体層とを平坦面に形成された線路導体
としての接続用配線導体層で接続することとなり、従来
のようにスルーホール導体やビア導体等を介して接続し
た場合に生じていた線幅や形状の不連続性からくる高周
波電気信号の波形の乱れや損失・減衰等を抑制すること
ができ、高周波回路特性や電気的特性の劣化を低減させ
ることができた。As described above, according to the wiring board of the present invention, the first wiring conductor layer on the lower surface formed on the insulating layer and the second wiring conductor layer formed on the upper surface are formed on the insulating layer. Electrically connected via a connection wiring conductor layer having the same line width as the first and second wiring conductor layers, the line width of each of the upper and lower ends attached to the flat side surface of the connection hole formed. Therefore, the first wiring conductor layer and the second wiring conductor layer are connected by the connection wiring conductor layer as the line conductor formed on the flat surface, and through the through-hole conductor and the via conductor as in the related art. Disturbance, loss, attenuation, etc. of the high-frequency electrical signal resulting from the discontinuity of the line width and shape that occurred when connected can be suppressed, and the deterioration of high-frequency circuit characteristics and electrical characteristics can be reduced. did it.
【００４４】以上により、本発明によれば、絶縁層の上
下の配線導体層を接続孔を介して接続する接続構造を有
する配線基板において、その接続部で生じていた線幅や
形状の違いなどの不連続性をなくして、接続部を伝搬す
る高周波電気信号の波形の乱れや減衰が少なく高周波回
路特性や電気的特性の劣化を低減させた配線導体層の接
続構造を有する配線基板を提供することができた。As described above, according to the present invention, in a wiring board having a connection structure in which wiring conductor layers above and below an insulating layer are connected through connection holes, differences in line widths and shapes caused in the connection portions, etc. Provided is a wiring board having a wiring conductor layer connection structure in which the discontinuity of the wiring is eliminated, the waveform of the high-frequency electric signal propagating in the connection portion is less disturbed and attenuated, and the deterioration of the high-frequency circuit characteristics and the electric characteristics is reduced I was able to.
【図１】（ａ）および（ｂ）は、それぞれ本発明の配線
基板の実施の形態の一例を示す平面図および斜視図であ
る。FIGS. 1A and 1B are a plan view and a perspective view, respectively, showing an example of an embodiment of a wiring board of the present invention.
【図２】（ａ）〜（ｃ）は、それぞれ本発明の配線基板
の実施の形態の他の例を示す斜視図である。FIGS. 2A to 2C are perspective views showing another example of the embodiment of the wiring board of the present invention.
【図３】（ａ）および（ｂ）は、それぞれ従来の配線基
板の例を示す平面図および斜視図である。FIGS. 3A and 3B are a plan view and a perspective view, respectively, showing an example of a conventional wiring board.
10・・・・・第１配線導体層 11・・・・・第２配線導体層 12・・・・・接続孔 12ａ・・・・平坦な側面（平坦な領域） 13・・・・・接続用配線導体層 10 First wiring conductor layer 11 Second wiring conductor layer 12 Connection hole 12a Flat side surface (flat area) 13 Connection Wiring conductor layer
Claims (1)
層と上面に形成された第２配線導体層とを前記絶縁層に
形成した接続孔の側面に被着されている接続用配線導体
層を介して電気的に接続して成る配線基板であって、前
記接続孔のうち少なくとも前記接続用配線導体層が被着
される領域が平坦であり、かつ前記接続用配線導体層の
上下端の各々の線幅が前記第１および第２配線導体層の
線幅と同一であることを特徴とする配線基板。1. A connection wiring in which a first wiring conductor layer formed on a lower surface of an insulating layer and a second wiring conductor layer formed on an upper surface are attached to a side surface of a connection hole formed in the insulating layer. A wiring board electrically connected via a conductor layer, wherein at least a region of the connection hole where the connection wiring conductor layer is applied is flat, and A wiring board, wherein the line width of each end is the same as the line width of the first and second wiring conductor layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10274474A JP2000106478A (en) | 1998-09-29 | 1998-09-29 | Wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10274474A JP2000106478A (en) | 1998-09-29 | 1998-09-29 | Wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000106478A true JP2000106478A (en) | 2000-04-11 |
Family
ID=17542203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10274474A Withdrawn JP2000106478A (en) | 1998-09-29 | 1998-09-29 | Wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000106478A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007115864A (en) * | 2005-10-20 | 2007-05-10 | Nitto Denko Corp | Wiring circuit substrate and manufacturing method thereof |
| US8227710B2 (en) | 2006-12-22 | 2012-07-24 | Tdk Corporation | Wiring structure of printed wiring board and method for manufacturing the same |
| US9093117B2 (en) | 2012-03-22 | 2015-07-28 | Hutchinson Technology Incorporated | Ground feature for disk drive head suspension flexures |
| US11363715B2 (en) | 2018-09-27 | 2022-06-14 | Nichia Corporation | Lighting device with intermediate contacts and method of manufacturing the same |
-
1998
- 1998-09-29 JP JP10274474A patent/JP2000106478A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007115864A (en) * | 2005-10-20 | 2007-05-10 | Nitto Denko Corp | Wiring circuit substrate and manufacturing method thereof |
| US8227710B2 (en) | 2006-12-22 | 2012-07-24 | Tdk Corporation | Wiring structure of printed wiring board and method for manufacturing the same |
| US9093117B2 (en) | 2012-03-22 | 2015-07-28 | Hutchinson Technology Incorporated | Ground feature for disk drive head suspension flexures |
| US11363715B2 (en) | 2018-09-27 | 2022-06-14 | Nichia Corporation | Lighting device with intermediate contacts and method of manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20050112 |