JP2000049255A - High-frequency package - Google Patents

High-frequency package

Info

Publication number
JP2000049255A
JP2000049255A JP21496098A JP21496098A JP2000049255A JP 2000049255 A JP2000049255 A JP 2000049255A JP 21496098 A JP21496098 A JP 21496098A JP 21496098 A JP21496098 A JP 21496098A JP 2000049255 A JP2000049255 A JP 2000049255A
Authority
JP
Japan
Prior art keywords
package
wall
substrate
line
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21496098A
Other languages
Japanese (ja)
Other versions
JP3441975B2 (en
Inventor
Yoshihisa Amano
義久 天野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP21496098A priority Critical patent/JP3441975B2/en
Publication of JP2000049255A publication Critical patent/JP2000049255A/en
Application granted granted Critical
Publication of JP3441975B2 publication Critical patent/JP3441975B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Waveguide Connection Structure (AREA)

Abstract

PROBLEM TO BE SOLVED: To stabilize the action of a semiconductor device packed in a package by forming a capacitance component and an inductance component in parallel at the portion, where the wiring used for supplying DC power to the semiconductor device passes through a substrate or wall. SOLUTION: Metallic flat electrodes 8 are respectively provided on both surfaces of a dielectric wall 4 in such a way that the electrodes 8 are faced oppositely to each other and constitute a capacitance component C. At the portion where a DC feeder line passes through the wall 4, in addition, the line 9 in the narrowed part of a wiring pattern is formed, and a high impedance is imparted to the line 9 so that the line 9 may exhibit the same electrical effect as impedance does in the range between a microwave band and a milliwave band. Therefore, the nonstability of a semiconductor device 1 packed in a high-frequency package can be suppressed, because an RF blocking filter can be incorporated in the DC feeder line of the package.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、半導体素子を囲っ
て保護するためのパッケージに関し、特にマイクロ波帯
〜ミリ波帯の高い周波数帯で使用されるパッケージに関
する。The present invention relates to a package for surrounding and protecting a semiconductor device, and more particularly to a package used in a high frequency band from a microwave band to a millimeter wave band.

【０００２】[0002]

【従来の技術】一般的な高周波パッケージの構造の一例
を図５に示す。図に於いて、３は誘電体材料から成る絶
縁基板、４は同じく誘電体材料から成る絶縁壁であり、
これら絶縁部材はキャビティを構成する。５は絶縁壁４
を貫通して高周波（ＲＦ）電気信号をキャビティ外部か
ら内部へ伝えるための金属配線（以下ＲＦ入力線と呼
ぶ）であり、６は絶縁壁４を貫通して高周波（ＲＦ）電
気信号をキャビティ内部から外部へ伝えるための金属配
線（以下ＲＦ出力線と呼ぶ）であり、７は絶縁壁４を貫
通して直流（ＤＣ）電力をキャビティ外部から内部へ伝
えるための金属配線（以下ＤＣ給電線と呼ぶ）である。
１は半導体素子であり、キャビティの内部に実装され、
ボンディング・ワイヤ２などによって、ＲＦ入力線５、
ＲＦ出力線６、およびＤＣ給電線７と、電気的に接続さ
れる。キャビティは、半導体素子１を実装した後に、金
属板材などを用いて気密封止される。以上により、半導
体素子１は安全に保護された状態で、ＲＦ電気信号とＤ
Ｃ電力を得て動作することができる。2. Description of the Related Art An example of the structure of a general high-frequency package is shown in FIG. In the figure, 3 is an insulating substrate made of a dielectric material, 4 is an insulating wall also made of a dielectric material,
These insulating members form a cavity. 5 is an insulating wall 4
Is a metal wiring (hereinafter referred to as an RF input line) for transmitting a high-frequency (RF) electric signal from the outside of the cavity to the inside thereof. 7 is a metal wiring (hereinafter referred to as an RF output line) for transmitting the direct current (DC) power from the outside of the cavity to the inside through the insulating wall 4. Call).
1 is a semiconductor element, which is mounted inside the cavity,
The RF input line 5, by the bonding wire 2, etc.
It is electrically connected to the RF output line 6 and the DC power supply line 7. After the semiconductor element 1 is mounted, the cavity is hermetically sealed using a metal plate or the like. As described above, the semiconductor element 1 is safely protected and the RF electric signal and D
It can operate by obtaining C power.

【０００３】このようなパッケージに於いて、内部の半
導体素子１の動作周波数が高くなるにつれて、しばしば
次のような問題が起こることが知られている。In such a package, it is known that the following problems often occur as the operating frequency of the internal semiconductor element 1 increases.

【０００４】即ち、本来はＲＦ入力線５とＲＦ出力線６
の上にしか流れてはならない高周波電気信号が、ＤＣ給
電線７に漏れ出してしまう。この漏れ出た高周波電気信
号が、図６に示すように、パッケージの外で閉ループを
形成し、その結果、半導体素子１が発振などの不安定動
作を起こす。That is, originally, the RF input line 5 and the RF output line 6
The high-frequency electric signal which must flow only on the DC power supply line 7 leaks out. The leaked high-frequency electric signal forms a closed loop outside the package as shown in FIG. 6, and as a result, the semiconductor element 1 causes unstable operation such as oscillation.

【０００５】上記のような問題を回避するために、従来
は、ＤＣ給電線にＲＦ阻止フィルタを付加する方法が取
られている。ＲＦ阻止フィルタは、半導体素子１の内部
のＤＣ給電回路に設けられるのが普通であるが、更なる
動作安定化を目的として、パッケージ上のＤＣ給電線７
の上にも設けられることがある。[0005] In order to avoid the above-mentioned problem, a method of adding an RF blocking filter to a DC feed line has conventionally been adopted. The RF blocking filter is usually provided in a DC power supply circuit inside the semiconductor element 1. However, in order to further stabilize the operation, the DC power supply line 7 on the package is used.
May also be provided on the top.

【０００６】パッケージ上のＤＣ給電線７の上にＲＦ阻
止フィルタを設けた例が、例えば、特開昭６０―２２５
４４９号公報、特開平４―１６２５５７号公報などに開
示されている。特開昭６０―２２５４４９号公報に於い
ては、パッケージ上に印刷などの手段で形成された金属
配線パターンのみによってスパイラル・インダクタを形
成し、これを高域阻止フィルタとして用いている。特開
平４―１６２５５７号公報に於いては、パッケージにフ
ェライトコアを付加することによって、高域阻止フィル
タを実現している。An example in which an RF blocking filter is provided on a DC power supply line 7 on a package is disclosed in, for example, Japanese Patent Application Laid-Open No. Sho 60-225.
No. 449, JP-A-4-162557 and the like. In Japanese Patent Application Laid-Open No. 60-225449, a spiral inductor is formed only by a metal wiring pattern formed on a package by printing or the like, and this is used as a high-pass filter. In Japanese Patent Application Laid-Open No. 4-162557, a high-frequency blocking filter is realized by adding a ferrite core to a package.

【０００７】[0007]

【発明が解決しようとする課題】しかしながら、前述の
特開昭６０―２２５４４９号公報のような、金属配線で
スパイラル・インダクタを形成する方法では、パッケー
ジのサイズが大型化してしまうという問題がある。ま
た、スパイラル・インダクタは、波長が非常に短いマイ
クロ波帯〜ミリ波帯に於いては、もはやインダクタとし
て正常に機能しなくなるという問題もある。However, the method of forming a spiral inductor with metal wiring as in the above-mentioned Japanese Patent Application Laid-Open No. 60-225449 has a problem that the size of the package is increased. Further, there is a problem that the spiral inductor no longer functions properly as an inductor in a microwave band to a millimeter wave band having a very short wavelength.

【０００８】また、特開平４―１６２５５７号公報のよ
うな、フェライトコアなどを付加する方法では、やはり
パッケージのサイズが大型化し、コストも上昇してしま
う問題がある。パッケージ製造の工程数も増えてしま
う。Further, the method of adding a ferrite core or the like as disclosed in Japanese Patent Application Laid-Open No. 4-162557 has a problem that the size of the package is increased and the cost is increased. The number of package manufacturing steps also increases.

【０００９】本発明は上記問題点を解決するために成さ
れたものであり、その目的は、サイズやコストを上昇さ
せることなく、パッケージのＤＣ給電線にＲＦ阻止フィ
ルタを組み込むことである。それによって、パッケージ
内部の半導体素子の動作を安定化させることを目的とし
ている。またその際には、ＲＦ阻止フィルタとして、と
くにマイクロ波帯〜ミリ波帯の高い周波数帯に適したフ
ィルタ構造を用いて実現することを目的とする。The present invention has been made to solve the above problems, and an object of the present invention is to incorporate an RF blocking filter in a DC power supply line of a package without increasing the size and cost. Thereby, it is intended to stabilize the operation of the semiconductor element inside the package. In that case, it is another object of the present invention to use a filter structure suitable for a high frequency band from a microwave band to a millimeter wave band as an RF blocking filter.

【００１０】[0010]

【課題を解決するための手段】本発明の高周波パッケー
ジは、基板、壁、および蓋より成るキャビティ内部に半
導体素子を搭載し保護するパッケージにおいて、前記半
導体素子にＤＣ電力を供給するための配線が基板または
壁を貫通する部分に、キャパシタンス成分Ｃ、およびイ
ンダクタンス成分Ｌを並列に形成したことを特徴とす
る。A high-frequency package according to the present invention is a package for mounting and protecting a semiconductor element inside a cavity comprising a substrate, a wall, and a lid, wherein a wiring for supplying DC power to the semiconductor element is provided. A capacitance component C and an inductance component L are formed in parallel at a portion penetrating a substrate or a wall.

【００１１】また本発明の高周波パッケージは、基板あ
るいは壁が誘電体材料から成り、基板または壁を挟んで
キャビティ外側とキャビティ内側に互いに対向する金属
平面電極を設けることによってキャパシタンスＣ成分を
構成し、また前記配線が基板または壁を貫通する部分に
於ける配線を細くすることによってインダクタンス成分
Ｌを構成したことを特徴とする。In the high-frequency package according to the present invention, the substrate or the wall is made of a dielectric material, and opposed metal plane electrodes are provided on the outside of the cavity and inside the cavity with the substrate or the wall interposed therebetween, thereby forming a capacitance C component. Further, an inductance component L is formed by thinning a wiring at a portion where the wiring penetrates a substrate or a wall.

【００１２】また本発明の高周波パッケージは、前記半
導体素子にＤＣ電力を供給するための配線がピンによっ
て形成され、前記基板を貫通する部分が同軸構造である
ことを特徴とする。Further, in the high frequency package according to the present invention, wiring for supplying DC power to the semiconductor element is formed by pins, and a portion penetrating the substrate has a coaxial structure.

【００１３】さらに本発明の高周波パッケージは、前記
キャパシタンス成分Ｃと前記インダクタンス成分Ｌの並
列共振から成る帯域阻止フィルタ効果の阻止周波数帯
を、前記半導体素子の動作が不安定になる周波数帯に合
わせたことを特徴とする。Further, in the high-frequency package according to the present invention, the rejection frequency band of the band rejection filter effect composed of the parallel resonance of the capacitance component C and the inductance component L is adjusted to the frequency band in which the operation of the semiconductor element becomes unstable. It is characterized by the following.

【００１４】キャパシタンス成分Ｃとインダクタンス成
分Ｌの並列共振から成る帯域阻止フィルタ効果の阻止周
波数帯を、前記半導体素子の動作が不安定になる周波数
帯に合わせることによって、半導体素子の発振などの不
安定動作を抑圧できる。By adjusting the rejection frequency band of the band rejection filter effect composed of the parallel resonance of the capacitance component C and the inductance component L to the frequency band in which the operation of the semiconductor element becomes unstable, unstable operation such as oscillation of the semiconductor element is caused. Operation can be suppressed.

【００１５】キャパシタンス成分Ｃとしては、パッケー
ジを構成する誘電体壁をＤＣ給電線が貫通する部分に於
いて、その誘電体壁を挟んでキャビティの内側と外側に
互いに対向する金属平面電極を設けることで、キャパシ
タンス成分Ｃを実現でき、また、インダクタンス成分Ｌ
としては、パッケージを構成する誘電体基板または壁を
ＤＣ給電線が貫通する部分の金属配線を細くして高イン
ピーダンスにすることによって、高周波帯に於いてイン
ダクタンス成分Ｌを実現できる。As the capacitance component C, at the portion where the DC feed line passes through the dielectric wall constituting the package, metal plane electrodes facing each other are provided inside and outside the cavity with the dielectric wall interposed therebetween. Thus, the capacitance component C can be realized, and the inductance component L
As an example, the inductance component L can be realized in a high frequency band by narrowing a metal wiring in a portion where a DC power supply line penetrates a dielectric substrate or a wall constituting a package to have a high impedance.

【００１６】[0016]

【発明の実施の形態】以下、本発明の実施の形態を、図
面を用いて具体的に説明する。Embodiments of the present invention will be specifically described below with reference to the drawings.

【００１７】（実施の形態１）図１は、本発明の第１の
実施の形態である。図１（ａ）はパッケージ全体の俯瞰
図であり、図１（ｂ）はＤＣ給電線が誘電体壁４を貫通
する部分の拡大図である。図に於いて、８は、誘電体壁
４を挟んで両面に形成された、互いに対向する金属平面
電極である。図から明らかなように、８は、キャパシタ
ンス成分Ｃを形成する。また、９は、ＤＣ給電線が誘電
体壁４を貫通する部分に於いて、配線パターンを細くし
た部分である。配線パターンが細くなったことにより、
この部分の線路は、高インピーダンスになる。このよう
な高インピーダンス線路は、本発明が狙いとするマイク
ロ波帯〜ミリ波帯では、インダクタンスＬと同等の電気
的効果が得られる。(Embodiment 1) FIG. 1 shows a first embodiment of the present invention. FIG. 1A is an overhead view of the entire package, and FIG. 1B is an enlarged view of a portion where the DC power supply line passes through the dielectric wall 4. In the figure, reference numeral 8 denotes metal flat electrodes which are formed on both sides of the dielectric wall 4 and face each other. As is clear from the figure, 8 forms a capacitance component C. Reference numeral 9 denotes a portion where the DC power supply line penetrates the dielectric wall 4 and has a thin wiring pattern. Due to the thinner wiring pattern,
The line in this part has high impedance. In such a high impedance line, an electrical effect equivalent to the inductance L can be obtained in the microwave band to the millimeter wave band targeted by the present invention.

【００１８】以上のように形成されたキャパシタンスＣ
とインダクタンスＬは、図３の等価回路に示すように、
ＬＣ並列共振回路を形成している。そのため、下記式１
で計算される周波数の近傍に於いて、高周波信号を阻止
するフィルタとして働く。The capacitance C formed as described above
And inductance L, as shown in the equivalent circuit of FIG.
An LC parallel resonance circuit is formed. Therefore, the following equation 1
In the vicinity of the frequency calculated by the above, the filter functions as a filter that blocks high-frequency signals.

【００１９】[0019]

【数１】 (Equation 1)

【００２０】図４は、図１の実施例におけるＲＦ阻止フ
ィルタの性能を表すグラフの一例である。グラフにおい
て横軸は周波数、縦軸はＳ２１パラメータのｄＢ表示で
ある。２０ＧＨｚ付近の周波数において、約２ｄＢの減
衰特性が確認できる。この時の設計は、図１（ｂ）にお
いて、誘電体材料は比誘電率１０弱のセラミック材、
Ａ、Ｂは金属平面電極８の寸法を表しそれぞれ、１．８
ｍｍ、０．７ｍｍ、Ｃは誘電体壁４の厚さで、０．４ｍ
ｍ、Ｄは誘電体基板３の厚さで０．３ｍｍ、インダクタ
ンスＬを作るための高インピーダンス線路部分の線幅は
８０μｍであった。FIG. 4 is an example of a graph showing the performance of the RF blocking filter in the embodiment of FIG. In the graph, the horizontal axis represents frequency, and the vertical axis represents S21 parameter in dB. At a frequency around 20 GHz, an attenuation characteristic of about 2 dB can be confirmed. The design at this time is as shown in FIG.
A and B represent the dimensions of the metal flat electrode 8, each being 1.8.
mm, 0.7 mm, C is the thickness of the dielectric wall 4 and is 0.4 m
m and D were 0.3 mm in the thickness of the dielectric substrate 3, and the line width of the high impedance line portion for forming the inductance L was 80 μm.

【００２１】（実施の形態２）図２は、本発明の第２の
実施の形態である。図２（ａ）はパッケージ全体の俯瞰
図であり、図２（ｂ）はＤＣ給電線が誘電体基板３を貫
通する部分の拡大図である。この実施例では、ＤＣ給電
線は、パッケージの下部にピン１０によって形成されて
いる。ＤＣ給電線は、パッケージ下面の誘電体基板３を
貫通する部分に於いて、スルーホール１１による同軸構
造を通して、パッケージのキャビティ内部へ導通してい
る。本実施例では、スルーホール１１を細くすることで
インダクタンスＬを形成し、またスルーホール１１のパ
ッド１２を広くすることでキャパシタンスＣを形成して
いる。等価回路は、図１の実施の形態１と同じく、図３
のようになる。(Embodiment 2) FIG. 2 shows a second embodiment of the present invention. FIG. 2A is an overhead view of the entire package, and FIG. 2B is an enlarged view of a portion where the DC power supply line passes through the dielectric substrate 3. In this embodiment, the DC feed line is formed by pins 10 at the bottom of the package. The DC power supply line is conducted to the inside of the cavity of the package through a coaxial structure formed by the through hole 11 at a portion penetrating the dielectric substrate 3 on the lower surface of the package. In the present embodiment, the inductance L is formed by making the through hole 11 thinner, and the capacitance C is formed by making the pad 12 of the through hole 11 wider. The equivalent circuit is the same as that of the first embodiment shown in FIG.
become that way.

【００２２】[0022]

【発明の効果】本発明によれば、サイズやコストを上昇
することなく、パッケージのＤＣ給電線にＲＦ阻止フィ
ルタを組み込むことができる。また、ＲＦ阻止フィルタ
の構成としては、マイクロ波帯〜ミリ波帯の高い周波数
帯に適した構成になっている。その結果、パケージ内部
に実装された半導体素子の発振などの不安定性を抑制す
ることができる。According to the present invention, the RF blocking filter can be incorporated in the DC power supply line of the package without increasing the size and cost. Further, the configuration of the RF blocking filter is suitable for a high frequency band from a microwave band to a millimeter wave band. As a result, instability such as oscillation of the semiconductor element mounted inside the package can be suppressed.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明によるパッケージの構造の俯瞰図、およ
びそのＲＦ阻止フィルタ部の拡大図である。FIG. 1 is an overhead view of the structure of a package according to the present invention, and an enlarged view of an RF blocking filter unit thereof.

【図２】本発明の別の実施の形態である、パッケージの
構造の俯瞰図、およびそのＲＦ阻止フィルタ部の拡大図
である。FIG. 2 is a bird's-eye view of the structure of a package, which is another embodiment of the present invention, and an enlarged view of an RF blocking filter unit thereof.

【図３】本発明のＲＦ阻止フィルタの等価回路図であ
る。FIG. 3 is an equivalent circuit diagram of the RF blocking filter of the present invention.

【図４】本発明のＲＦ阻止フィルタの性能を表すグラフ
の一例である。FIG. 4 is an example of a graph showing the performance of the RF blocking filter of the present invention.

【図５】従来の一般的なパッケージの構造の俯瞰図であ
る。FIG. 5 is an overhead view of the structure of a conventional general package.

【図６】半導体素子がＤＣ給電線を通じて不安定動作を
する仕組みを説明する模式図である。FIG. 6 is a schematic diagram illustrating a mechanism in which a semiconductor element performs an unstable operation through a DC power supply line.

【符号の説明】[Explanation of symbols]

１ 半導体素子 ２ ボンディング・ワイヤ ３ 誘電体基板 ４ 誘電体壁 ５ ＲＦ入力線 ６ ＲＦ出力線 ７ ＤＣ給電線 ８ 対向金属平面電極 ９ 高インピーダンス線路 １０ ＤＣ給電ピン １１ スルーホール １２ スルーホール・パッド DESCRIPTION OF SYMBOLS 1 Semiconductor element 2 Bonding wire 3 Dielectric substrate 4 Dielectric wall 5 RF input line 6 RF output line 7 DC feed line 8 Opposite metal flat electrode 9 High impedance line 10 DC feed pin 11 Through hole 12 Through hole pad

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 基板、壁、および蓋より成るキャビティ
内部に半導体素子を搭載し保護するパッケージにおい
て、前記半導体素子にＤＣ電力を供給するための配線が
基板または壁を貫通する部分に、キャパシタンス成分
Ｃ、およびインダクタンス成分Ｌを並列に形成したこと
を特徴とする高周波パッケージ。1. A package for mounting and protecting a semiconductor element inside a cavity formed by a substrate, a wall, and a lid, wherein a wiring for supplying DC power to the semiconductor element has a capacitance component at a portion penetrating the substrate or the wall. A high-frequency package wherein C and an inductance component L are formed in parallel. 【請求項２】 前記基板あるいは壁が誘電体材料から成
り、前記基板または壁を挟んでキャビティ外側とキャビ
ティ内側に互いに対向する金属平面電極を設けることに
よってキャパシタンスＣ成分を構成し、また前記配線が
基板または壁を貫通する部分に於ける配線を細くするこ
とによってインダクタンス成分Ｌを構成したことを特徴
とする請求項１記載の高周波パッケージ。2. The method according to claim 1, wherein the substrate or the wall is made of a dielectric material, and a metal plate electrode facing each other is provided on the outside of the cavity and inside the cavity with the substrate or the wall interposed therebetween, thereby forming a capacitance C component. 2. The high-frequency package according to claim 1, wherein the inductance component L is formed by thinning a wiring at a portion penetrating the substrate or the wall. 【請求項３】 前記半導体素子にＤＣ電力を供給するた
めの配線がピンによって形成され、前記基板を貫通する
部分が同軸構造であることを特徴とする請求項１記載の
高周波パッケージ。3. The high-frequency package according to claim 1, wherein wiring for supplying DC power to the semiconductor element is formed by pins, and a portion penetrating the substrate has a coaxial structure. 【請求項４】 前記キャパシタンス成分Ｃと前記インダ
クタンス成分Ｌの並列共振から成る帯域阻止フィルタ効
果の阻止周波数帯を、前記半導体素子の動作が不安定に
なる周波数帯に合わせたことを特徴とする請求項１ない
し３のいずれかに記載の高周波パッケージ。4. A rejection frequency band of a band rejection filter effect comprising a parallel resonance of the capacitance component C and the inductance component L is set to a frequency band in which the operation of the semiconductor element becomes unstable. Item 4. The high-frequency package according to any one of Items 1 to 3.
JP21496098A 1998-07-30 1998-07-30 High frequency package Expired - Fee Related JP3441975B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21496098A JP3441975B2 (en) 1998-07-30 1998-07-30 High frequency package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21496098A JP3441975B2 (en) 1998-07-30 1998-07-30 High frequency package

Publications (2)

Publication Number Publication Date
JP2000049255A true JP2000049255A (en) 2000-02-18
JP3441975B2 JP3441975B2 (en) 2003-09-02

Family

ID=16664426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21496098A Expired - Fee Related JP3441975B2 (en) 1998-07-30 1998-07-30 High frequency package

Country Status (1)

Country Link
JP (1) JP3441975B2 (en)

Also Published As

Publication number Publication date
JP3441975B2 (en) 2003-09-02

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