JP2000031674A - Electronic apparatus - Google Patents
Electronic apparatusInfo
- Publication number
- JP2000031674A JP2000031674A JP10195703A JP19570398A JP2000031674A JP 2000031674 A JP2000031674 A JP 2000031674A JP 10195703 A JP10195703 A JP 10195703A JP 19570398 A JP19570398 A JP 19570398A JP 2000031674 A JP2000031674 A JP 2000031674A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- case
- conductive member
- heat conductive
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えば、携帯電話
機に用いられる送受信ユニット等の電子機器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device such as a transmission / reception unit used for a portable telephone.
【０００２】[0002]
【従来の技術】図３から図５に従って従来の電子機器を
説明すると、図３は従来の電子機器の斜視図、図４は従
来の電子機器の一部を分解して示す斜視図、図５は従来
の電子機器の要部断面図である。これらの図において、
プラスチック材料で成形されたケース２１は、底壁部２
１ａと、四つの側壁部２１ｂと、底壁部２１ａに対向し
て上方が開放した開口部２１ｃと、底壁部２１ａに設け
られた大きなきな貫通孔２１ｄと、ケーブルを引き出す
貫通孔２１ｅと、大きな貫通孔２１ｄの外周部の数カ所
に設けられ、大きな貫通孔２１ｄに向かって凹部をもつ
Ｌ字状の爪部２１ｆと、底壁部２１ａと同一面で、側壁
部２１ｂの外側に位置する角部に設けられた耳部２１ｇ
と、耳部２１ｇの中央に設けられた貫通孔２１ｈと、側
壁部２１ｂに設けられた内方に突出する凸部２１ｋと、
凸部２１ｋ中央に設けられたネジ孔２１ｍと、ケース２
１の表面全面に、メッキ等の手段によって被着された金
属膜２１ｎとを有している。2. Description of the Related Art Conventional electronic equipment will be described with reference to FIGS. 3 to 5. FIG. 3 is a perspective view of the conventional electronic equipment, FIG. 4 is an exploded perspective view showing a part of the conventional electronic equipment, and FIG. Is a sectional view of a main part of a conventional electronic device. In these figures,
The case 21 formed of a plastic material is used for the bottom wall 2.
1a, four side walls 21b, an opening 21c facing the bottom wall 21a and opening upward, a large through hole 21d provided in the bottom wall 21a, and a through hole 21e for drawing out a cable. An L-shaped claw 21f provided at several locations on the outer periphery of the large through-hole 21d and having a recess toward the large through-hole 21d, and located on the same plane as the bottom wall 21a and outside the side wall 21b. Ears 21g provided at corners
A through hole 21h provided in the center of the ear 21g, and an inwardly protruding protrusion 21k provided in the side wall 21b;
A screw hole 21m provided at the center of the convex portion 21k and a case 2
1 has a metal film 21n deposited on the entire surface thereof by means such as plating.
【０００３】金属板からなる矩形状の熱伝導部材２２
は、平板部２２ａと、平板部２２ａの数カ所において、
一部を切り欠いて上方に切り起こされた舌片２２ｄと、
平板部２２ａに設けられた複数の貫通孔２３とを有して
いる。A rectangular heat conducting member 22 made of a metal plate
In the flat plate portion 22a and several places of the flat plate portion 22a,
A tongue piece 22d partially cut out and cut up,
And a plurality of through holes 23 provided in the flat plate portion 22a.
【０００４】熱伝導部材２２は、舌片２２ｄの切り起こ
された方向を上方に向けて、ケース２１の内部に収納さ
れ、Ｌ字状の爪部２１ｆの凹部に、平板部２２の外周部
を掛け止めして取り付けられ、平板部２２ａによって、
ケース２１の大きな貫通孔２１ｄを塞ぐようになってい
る。このとき、ケース２１の爪部２１ｆと熱伝導部材２
２の間には、爪部２１ｆの凹部の高さと熱伝導部材２２
の厚さとの間において上下方向の遊びがあり、また、大
きな貫通孔２１ｄを挟んで対向する爪部２１ｆ間の距離
と熱伝導板２２の幅のとの間において、横方向の遊びが
あり、このため、熱伝導部材２２は、ケース２１に対し
て、その遊び分、上下、横方向にガタツキが生ずる。[0004] The heat conducting member 22 is housed inside the case 21 with the tongue piece 22d cut and raised upward, and the outer peripheral portion of the flat plate portion 22 is inserted into the concave portion of the L-shaped claw portion 21f. Hooked and attached, by the flat plate portion 22a,
The large through hole 21d of the case 21 is closed. At this time, the claw portion 21f of the case 21 and the heat conductive member 2
2, the height of the concave portion of the claw portion 21f and the heat conduction member 22
There is a play in the vertical direction between the thickness of the heat conduction plate 22 and the distance between the claw portions 21f opposed to each other across the large through-hole 21d and the width of the heat conductive plate 22, Therefore, the heat conductive member 22 rattles in the vertical and horizontal directions with respect to the case 21 due to the play.
【０００５】プリント基板２４は、貫通孔２８と、導電
パターン（図示せず）を有し、このプリント基板２４の
下面２４ａには、ケーブルを接続するためのコネクタ２
５及び、発熱量の大きな発熱部品２６等が設置され、ま
た上面２４ｂには、比較的発熱量の少ない電子部品２７
等が設置されている。金属板から成る箱形の金属カバー
２９は、下面が開放され、上面に複数個の貫通孔３０を
有し、この金属カバー２９は、上面２４ｂの電子部品２
７を覆うようにプリント基板２４に取り付けられ、金属
カバー２９により上面２４ｂに設置された電子部品２７
が電気的にシールドされる構成となっている。[0005] The printed board 24 has a through hole 28 and a conductive pattern (not shown), and a lower surface 24 a of the printed board 24 has a connector 2 for connecting a cable.
5 and a heat-generating component 26 having a large calorific value are installed.
Are installed. A box-shaped metal cover 29 made of a metal plate has an open lower surface and a plurality of through-holes 30 on the upper surface.
7 are mounted on the printed circuit board 24 so as to cover the electronic component 27, and are mounted on the upper surface 24 b by the metal cover 29.
Are electrically shielded.
【０００６】また、プリント基板２４は、発熱部品２６
の設置された下面２４ａを、ケース２１の底壁部２１ａ
に対向させ、開口部２１ｃを塞ぐようにケース２１に載
置され、そして、プリント基板２４の貫通孔２８に通し
たネジ３１を、ケース２１の凸部２１ｋのネジ孔２１ｍ
にねじ込むことにより、ケース２１に取り付けられてい
る。そして、プリント基板２４が、ケース２１に取り付
けられた状態では、熱伝導部材２２は、プリント基板２
４の下面２４ａの発熱部品２６を含む領域に対向すると
共に、プリント基板２４の下面２４ａに設けられた発熱
部品２６の表面には、熱伝導部材２２の舌片２２ｄが接
触状態となっている。The printed circuit board 24 includes a heat-generating component 26.
The bottom surface 24a on which the
The screw 31 that is placed on the case 21 so as to close the opening 21 c and passes through the through hole 28 of the printed circuit board 24 is screwed into the screw hole 21 m of the projection 21 k of the case 21.
Is attached to the case 21. When the printed circuit board 24 is attached to the case 21, the heat conductive member 22
The tongue piece 22d of the heat conducting member 22 is in contact with the surface of the heat generating component 26 provided on the lower surface 24a of the printed circuit board 24 while facing the area including the heat generating component 26 on the lower surface 24a of the printed circuit board 24.
【０００７】そして、プリント基板２４、及び熱伝導部
材２２を取り付けられたケース２１は、マザー基板３２
の導電パターン３２ａが形成された表面に載置され、ケ
ース２１はマザー基板３２へ、ケース２１の耳部２１ｇ
の貫通孔２１ｈに通したネジ３３を、マザー基板３２に
設けられたネジ孔３２ｂにねじ込みして、固定されてい
る。The printed circuit board 24 and the case 21 to which the heat conductive member 22 is attached are connected to a mother board 32.
Is placed on the surface on which the conductive pattern 32a is formed.
The screw 33 passed through the through hole 21h is screwed into a screw hole 32b provided in the mother board 32 and fixed.
【０００８】上記のような構成を有する電子機器は、そ
の使用時において、発熱部品２６から発生した熱は、発
熱部品２６の表面に接触した舌片２２ｄを伝わり、熱伝
導部材２２の全体へと拡散し、そして、熱伝導部材２２
から放熱されるようになっている。In the electronic device having the above-described configuration, in use, heat generated from the heat generating component 26 is transmitted to the tongue piece 22 d in contact with the surface of the heat generating component 26, and is transmitted to the entire heat conductive member 22. Diffuse and heat conducting member 22
The heat is radiated from.
【０００９】[0009]
【発明が解決しようとする課題】しかしながら、従来の
電子機器では、熱伝導部材２２が、ケース２１のＬ字状
の爪部２１ｆに掛け止めされて取り付けられているた
め、爪部２１ｆと熱伝導部材２２との間にガタツキを生
じ、このため、電子機器の使用時における振動、衝撃等
において、熱伝導部材２２のガタツキ音が発生するとい
う問題があった。また、熱伝導部材２２のガタツキ時、
舌片２２ｄと発熱部品２６の表面との摩擦により、発熱
部品２６が破損するという問題があった。また、爪部２
１ｆの占める体積により、ケース２１内に設置される電
子部品の配置が制限されたり、ケース２１を大きくせざ
るを得なくなる問題があった。また、発熱部品２６から
の熱は、熱伝導部材２２から、ケース２１内の空気中に
放熱されるため、熱がケース２１内に滞留し、温度上昇
により電子部品の性能劣化が引き起こされる問題があっ
た。However, in the conventional electronic device, since the heat conducting member 22 is hung and attached to the L-shaped claw 21f of the case 21, the heat conduction member 22 and the claw 21f are not thermally conductive. There is a problem that rattling is generated between the heat conduction member 22 and the member 22 due to vibration, impact, or the like during use of the electronic device. When the heat conduction member 22 is loose,
There is a problem that the heat generating component 26 is damaged by friction between the tongue piece 22d and the surface of the heat generating component 26. In addition, the claw 2
Due to the volume occupied by 1f, there is a problem that the arrangement of the electronic components installed in the case 21 is restricted or the case 21 has to be enlarged. Further, since the heat from the heat generating component 26 is radiated from the heat conducting member 22 to the air in the case 21, the heat stays in the case 21, and the performance of the electronic component is degraded due to a rise in temperature. there were.
【００１０】[0010]
【課題を解決するための手段】上記課題を解決するため
の第一の解決手段として、プリント基板と、該プリント
基板上に設置された発熱部品と、前記プリント基板を取
り付けて前記電子部品を収納する樹脂からなるケース
と、該ケースに固定され、前記発熱部品と接触する金属
板からなる熱伝導部材とを有し、前記ケースは、前記熱
伝導部材に対向する面から垂直に突出した複数個の突起
部を有し、前記熱伝導部材は、複数個の貫通孔を有し、
前記突起部が、前記貫通孔に挿入され、前記ケースに前
記熱伝導部材が載置された状態で、前記貫通孔から突出
した前記突起部の頭部を潰して、前記熱伝導部材を前記
頭部で前記ケースに圧接して固定する構成とした。Means for Solving the Problems As a first means for solving the above-mentioned problems, a printed circuit board, a heat-generating component installed on the printed circuit board, and the electronic component mounted on the printed circuit board are stored. And a heat conductive member fixed to the case and made of a metal plate that is in contact with the heat-generating component. The case includes a plurality of cases vertically protruding from a surface facing the heat conductive member. The heat conductive member has a plurality of through holes,
The protrusion is inserted into the through hole, and in a state where the heat conductive member is placed on the case, the head of the protrusion protruding from the through hole is crushed, and the heat conductive member is moved to the head. The portion is pressed into contact with the case and fixed.
【００１１】また、第二の解決手段として、表面に導電
パターンが形成されたマザー基板を有し、該マザー基板
に、前記熱伝導部材が固定された前記ケースを取り付
け、前記熱伝導部材を前記導電パターンに当接させる構
成とした。As a second solution, a mother board having a conductive pattern formed on a surface thereof is provided, and the case to which the heat conducting member is fixed is attached to the mother board, and the heat conducting member is attached to the mother board. It was configured to be in contact with the conductive pattern.
【００１２】また、第三の解決手段として、表面に導電
パターンが形成されたマザー基板と、熱伝導性が良く、
且つ弾性のあるシートを有し、前記シートは、前記ケー
スに固定された前記熱伝導部材の表面、あるいは前記導
電パターンの表面に接着され、前記シートが前記導電パ
ターンと前記熱伝導部材の間に介在するように、前記マ
ザー基板を前記ケースを取り付け、前記熱伝導部材の熱
を、前記熱伝導部材に接触した前記シートを介して、前
記シートに接触した前記導電パターンに伝導するような
構成とした。Further, as a third solution, a mother substrate having a conductive pattern formed on the surface thereof has good thermal conductivity.
And having an elastic sheet, the sheet is bonded to the surface of the heat conductive member fixed to the case, or the surface of the conductive pattern, the sheet is between the conductive pattern and the heat conductive member A configuration in which the case is attached to the mother board so as to intervene, and the heat of the heat conductive member is conducted to the conductive pattern in contact with the sheet via the sheet in contact with the heat conductive member. did.
【００１３】[0013]
【発明の実施の形態】図１、及び図２において、本発明
の電子部品を説明すると、図１は本発明の電子機器の一
部を分解して示す斜視図、図２は本発明の電子機器の要
部の断面図である。これらの図において、プラスチック
材料で成形されたケース１は、底壁部１ａと、四つの側
壁部１ｂと、底壁部１ａに対向して上方が開放した開口
部１ｃと、底壁部１ａに設けられた大きなきな貫通孔１
ｄと、ケーブルを引き出す貫通孔１ｅと、大きな貫通孔
１ｄの外周部の数カ所に形成され、上方に向かって突出
した突起部１ｆと、底壁部１ａと同一面で、側壁部１ｂ
の外側に位置する角部に設けられた耳部１ｇと、耳部１
ｇの中央に設けられた貫通孔１ｈと、側壁部１ｂに設け
られた内方に突出する凸部１ｋと、凸部１ｋ中央に設け
られたネジ孔１ｍと、ケース１の表面全面に、メッキ等
の手段によって被着された金属膜１ｎとを有している。1 and 2, an electronic component of the present invention will be described. FIG. 1 is an exploded perspective view showing a part of an electronic device of the present invention, and FIG. 2 is an electronic component of the present invention. It is sectional drawing of the principal part of an apparatus. In these figures, a case 1 molded of a plastic material includes a bottom wall 1a, four side walls 1b, an opening 1c facing the bottom wall 1a and opening upward, and a bottom wall 1a. Large through hole 1 provided
d, a through-hole 1e for drawing out a cable, a projection 1f formed at several positions on the outer periphery of the large through-hole 1d, and protruding upward, and a side wall 1b on the same plane as the bottom wall 1a.
An ear 1g provided at a corner located outside the
g, a through hole 1h provided in the center of the g, an inwardly projecting protrusion 1k provided in the side wall 1b, a screw hole 1m provided in the center of the protrusion 1k, and plating on the entire surface of the case 1. And the metal film 1n deposited by such means.
【００１４】金属板からなる矩形状の熱伝導部材２は、
平板部２ａと、平板部２ａの外周の数カ所において、外
側に突出して設けられた突出部２ｂと、突出部２ｂの中
央に設けられた貫通孔２ｃと、平板部２ａの数カ所にお
いて、一部を切り欠いて上方に切り起こされた舌片２ｄ
と、平板部２ａに設けられた複数の貫通孔３とを有して
いる。さらに、平板２の平板部２ａは、ケース１の大き
な貫通孔１ｄに合致した形状で下方に突出した膨出部を
有し、また貫通孔３によって、熱伝導部材２の軽量化を
計っている。A rectangular heat conducting member 2 made of a metal plate
The flat plate portion 2a, a projecting portion 2b provided to protrude outward at several places on the outer periphery of the flat plate portion 2a, a through hole 2c provided at the center of the projecting portion 2b, and a part at several places of the flat plate portion 2a Tongue piece 2d cut out and cut up
And a plurality of through holes 3 provided in the flat plate portion 2a. Further, the flat plate portion 2a of the flat plate 2 has a bulging portion protruding downward in a shape matching the large through hole 1d of the case 1, and the through hole 3 reduces the weight of the heat conductive member 2. .
【００１５】熱伝導部材２は、舌片２ｄの切り起こされ
た方向を上方に向けて、ケース１の内部に収納され、熱
伝導部材２の突出部２ｂの貫通孔２ｃに、ケース１の突
起部１ｆを貫通させ、ケース１の大きな貫通孔１ｄを塞
ぐように載置される。そして、熱伝導部材２がケース１
に当接された状態で、突起部１ｆを加熱し、突起部１ｆ
の熱伝導部材２の上面に突出した頭部を潰すことによ
り、突起部１ｆの頭部により、熱伝導部材２はケース１
に圧接されて固定される。そして、熱伝導部材２が取り
付けられたとき、ケース１の大きな貫通孔１ｄの形状に
一致するようにして形成された熱伝導部材２の平板部２
ａの膨出部は、大きな貫通孔１ｄから下方に露出して、
ケース１の底壁部１ａと面一、あるいは、底壁部１ａか
ら突出した構成となっている。The heat conducting member 2 is housed inside the case 1 with the tongue piece 2d cut and raised upward, and is inserted into the through hole 2c of the projecting portion 2b of the heat conducting member 2. The case 1 is placed so as to penetrate the portion 1f and close the large through hole 1d of the case 1. The heat conductive member 2 is the case 1
The protrusion 1f is heated in a state where the protrusion 1f
By crushing the head protruding from the upper surface of the heat conductive member 2 of the case 1, the heat conductive member 2
Is pressed against and fixed. When the heat conductive member 2 is attached, the flat plate portion 2 of the heat conductive member 2 formed so as to conform to the shape of the large through hole 1d of the case 1.
The bulging portion of a is exposed downward from the large through hole 1d,
The case 1 is flush with the bottom wall 1a, or protrudes from the bottom wall 1a.
【００１６】また、熱伝導性が良く、且つ弾性のあるシ
ート１４は、例えばポリイミドフィルムの両面にアクリ
ル系粘着材を塗布したもので、熱伝導部材２の、ケース
１の大きな貫通孔１ｄから露出した表面に接着されて取
り付けられている。The elastic sheet 14 having good heat conductivity and elasticity, for example, is formed by applying an acrylic adhesive on both sides of a polyimide film, and is exposed from the large through hole 1d of the case 1 of the heat conductive member 2. It is attached and adhered to the surface.
【００１７】プリント基板４は、貫通孔８と、導電パタ
ーン（図示せず）を有し、このプリント基板４の下面４
ａには、ケーブルを接続するためのコネクタ５及び、発
熱量の大きな発熱部品６等が設置され、また上面４ｂに
は、比較的発熱量の少ない電子部品７等が設置されてい
る。金属板から成る箱形の金属カバー９は、下面が開放
され、上面に複数個の貫通孔１０を有し、この金属カバ
ー９は、上面４ｂの電子部品７を覆うようにプリント基
板４に取り付けられ、金属カバー９により上面４ｂに設
置された電子部品７が電気的にシールドされる構成とな
っている。The printed board 4 has a through hole 8 and a conductive pattern (not shown).
On a, a connector 5 for connecting a cable and a heat-generating component 6 having a large heat value are provided, and on the upper surface 4b, an electronic component 7 having a relatively small heat value are provided. A box-shaped metal cover 9 made of a metal plate has an open lower surface and a plurality of through holes 10 on the upper surface. The metal cover 9 is attached to the printed circuit board 4 so as to cover the electronic components 7 on the upper surface 4b. The electronic component 7 installed on the upper surface 4 b is electrically shielded by the metal cover 9.
【００１８】また、プリント基板４は、発熱部品６の設
置された下面４ａを、ケース１の底壁部１ａに対向さ
せ、開口部１ｃを塞ぐようにケース１に載置され、そし
て、プリント基板４の貫通孔８に通したネジ１１を、ケ
ース１の凸部１ｋのネジ孔１ｍにねじ込むことにより、
ケース１に取り付けられている。そして、プリント基板
４が、ケース１に取り付けられた状態では、熱伝導部材
２は、プリント基板４の下面４ａの発熱部品６を含む領
域に対向すると共に、プリント基板４の下面４ａに設け
られた発熱部品６の表面には、熱伝導部材２の舌片２ｄ
が接触した状態となっている。The printed circuit board 4 is placed on the case 1 so that the lower surface 4a on which the heat-generating components 6 are installed is opposed to the bottom wall 1a of the case 1 and closes the opening 1c. 4 is screwed into the screw hole 1m of the projection 1k of the case 1 by screwing the screw 11 passed through the through hole 8 of the case 1.
It is attached to case 1. When the printed circuit board 4 is attached to the case 1, the heat conducting member 2 is provided on the lower surface 4 a of the printed circuit board 4 while facing the area including the heat generating component 6 on the lower surface 4 a of the printed circuit board 4. The tongue 2d of the heat conducting member 2 is provided on the surface of the heat generating component 6.
Are in contact with each other.
【００１９】そして、プリント基板４、及びシート１４
が接着された熱伝導部材２を取り付けられたケース１
は、マザー基板１２の導電パターン１２ａが形成された
表面に載置され、ケース１はマザー基板１２へ、ケース
１の耳部１ｇの貫通孔１ｈに通したネジ１３を、マザー
基板１２に設けられたネジ孔１２ｂにねじ込みして、固
定されている。The printed board 4 and the sheet 14
Case 1 with heat conductive member 2 attached with
Is mounted on the surface of the mother board 12 on which the conductive patterns 12a are formed. The case 1 is provided with screws 13 passing through the through holes 1h of the ears 1g of the case 1 on the mother board 12. Screwed into the screw hole 12b.
【００２０】上記のような構成を有する電子機器は、そ
の使用時において、発熱部品６から発生した熱は、舌片
２ｄを伝わり、熱伝導部材２の全体へと拡散し、そして
熱伝導部材２に密着したシート１４を介して、シート１
４に密着したマザー基板１２の導電パターン１２ａへと
放熱されるようになっている。即ち、発熱部品６からの
熱は、熱伝導部材２から速やかにシート１４、導電パタ
ーン１２ａを介してケース１の外部に放出され、ケース
１の内部の温度上昇は抑えられるようになっている。In the electronic device having the above-described configuration, in use, heat generated from the heat-generating component 6 is transmitted through the tongue piece 2d, diffuses to the entire heat-conductive member 2, and The sheet 1 through the sheet 14 which is in close contact with
The heat is radiated to the conductive pattern 12a of the mother substrate 12 which is in close contact with the substrate 4. That is, heat from the heat generating component 6 is quickly released from the heat conductive member 2 to the outside of the case 1 via the sheet 14 and the conductive pattern 12a, so that a rise in the temperature inside the case 1 is suppressed.
【００２１】なお、発熱部品６と、舌片２ｄの接触面に
は、シリコングリースを塗布しても良く、また、シート
１４はマザー基板１２の導電パターン１２ａに接着して
おいても良い。さらに、シートを使用せず、熱伝導部材
２を導電パターン１２ａに直接当接させても良い。The contact surface between the heat generating component 6 and the tongue piece 2d may be coated with silicone grease, and the sheet 14 may be bonded to the conductive pattern 12a of the mother board 12. Further, the heat conductive member 2 may be directly in contact with the conductive pattern 12a without using a sheet.
【００２２】なお、熱伝導部材２は、ケース１の内部に
収納される必要はなく、外部に取り付けられても良い。
また、突起部１ｆの頭部は、加熱でなくとも圧力などに
より潰しても良い。The heat conducting member 2 does not need to be housed inside the case 1 and may be attached outside.
Further, the head of the projection 1f may be crushed by pressure or the like instead of heating.
【００２３】[0023]
【発明の効果】本発明の電子機器においては、ケース１
に収納された発熱部品６に熱伝導部材２が接触した状態
で、ケース１の、熱伝導部材２に対向する面から上方に
向かい突出した複数個の突起部１ｆを、熱伝導部材２に
設けられた複数個の貫通孔２ｃを貫通させ、熱伝導部材
２をケース１に当接した状態で、突起部１ｆの、熱伝導
部材２から突出した頭部を加熱などにより潰すことによ
り、突起部１ｆの頭部で熱伝導部材２をケース１に圧接
して固定する構成としたので、熱伝導部材２のガタツキ
がなく、ガタツキ音のない、製品価値の高い電子機器が
提供できる。また、従来のように舌片２２と発熱部品２
６との摩擦による発熱部品２６の破損がなく、長寿命の
電子機器を提供できる。さらに、ケース１と熱伝導部材
２の接合に要する体積が小さいので、小型の電子機器を
提供できる。また、発熱部品６に接触した熱伝導部材２
を、マザー基板の表面に形成された導電パターンに当接
させることにより、発熱部品６からの熱は、導電パター
ンに放熱され、ケース１内の温度は上昇することなく、
温度上昇による電子部品の性能劣化のない信頼性の高い
電子機器が提供できる。また、本発明の電子機器におい
て、熱伝導部材２とマザー基板１２の導電パターン１２
ａの間に、熱伝導性が良く、且つ弾性のあるシート１４
を介在させることにより、シート１４と熱伝導部材２
間、及びシート１４と導電パターン１２ａ間を隙間を隙
間なく密着させることができ、発熱部品６の熱の導電パ
ターン１２ａへの放熱効率を向上させることができる。According to the electronic apparatus of the present invention, case 1
A plurality of protrusions 1f projecting upward from a surface of the case 1 facing the heat conductive member 2 are provided on the heat conductive member 2 in a state where the heat conductive member 2 is in contact with the heat generating component 6 stored in the heat conductive member 2. A plurality of through-holes 2c are made to penetrate, and in a state where the heat conducting member 2 is in contact with the case 1, the head of the projecting portion 1f projecting from the heat conducting member 2 is crushed by heating or the like, whereby the projecting portion is formed. Since the heat conducting member 2 is fixed to the case 1 by pressing the head 1f, the electronic device of high product value can be provided without rattling of the heat conducting member 2 and without rattling sound. Further, the tongue piece 22 and the heat-generating component 2
The heat-generating component 26 is not damaged due to friction with the electronic component 6, and a long-life electronic device can be provided. Furthermore, since the volume required for joining the case 1 and the heat conducting member 2 is small, a small electronic device can be provided. Further, the heat conducting member 2 in contact with the heat generating component 6
Is brought into contact with the conductive pattern formed on the surface of the motherboard, the heat from the heat-generating component 6 is radiated to the conductive pattern, and the temperature in the case 1 does not rise.
It is possible to provide a highly reliable electronic device in which the performance of electronic components does not deteriorate due to a temperature rise. In the electronic device of the present invention, the heat conductive member 2 and the conductive pattern 12 of the mother substrate 12 are provided.
a, a sheet 14 having good thermal conductivity and elasticity
, The sheet 14 and the heat conductive member 2
The gap between the sheet and the sheet and the conductive pattern 12a can be brought into close contact with each other without any gap, and the heat radiation efficiency of the heat of the heat generating component 6 to the conductive pattern 12a can be improved.
【図１】本発明の電子機器の一部を分解して示す斜視
図。FIG. 1 is an exemplary exploded perspective view showing an electronic device according to the present invention;
【図２】本発明の電子機器の要部の断面図。FIG. 2 is a cross-sectional view of a main part of the electronic device of the invention.
【図３】従来の電子機器の斜視図。FIG. 3 is a perspective view of a conventional electronic device.
【図４】従来の電子機器の一部を分解して示す斜視図。FIG. 4 is an exploded perspective view showing a part of a conventional electronic device.
【図５】従来の電子機器の要部の断面図。FIG. 5 is a cross-sectional view of a main part of a conventional electronic device.
１ ケース １ａ 底壁部 １ｂ 側壁部 １ｃ 開口部 １ｄ 大きな貫通孔 １ｅ ケーブルを引き出すための貫通孔 １ｆ 突起部 １ｇ 耳部 １ｈ 貫通孔 １ｋ 凸部 １ｍ ネジ孔 １ｎ 金属膜 ２ 熱伝導部材 ２ａ 平板部 ２ｂ 突出部 ２ｃ 貫通孔 ２ｄ 舌片 ３ 貫通孔 ４ プリント基板 ４ａ 下面 ４ｂ 上面 ５ コネクタ ６ 発熱部品 ７ 電子部品 ８ 貫通孔 ９ 金属カバー １０ 貫通孔 １１ ネジ １２ マザー基板 １２ａ 導電パターン １２ｂ ネジ孔 １３ ネジ １４ シート DESCRIPTION OF SYMBOLS 1 Case 1a Bottom wall 1b Side wall 1c Opening 1d Large through-hole 1e Through-hole for pulling out cable 1f Projection 1g Ear 1h Through-hole 1k Convex 1m Screw hole 1n Metal film 2 Heat conductive member 2a Flat plate 2b Projecting portion 2c Through hole 2d Tongue piece 3 Through hole 4 Printed circuit board 4a Lower surface 4b Upper surface 5 Connector 6 Heating component 7 Electronic component 8 Through hole 9 Metal cover 10 Through hole 11 Screw 12 Mother substrate 12a Conductive pattern 12b Screw hole 13 Screw 14 Sheet
Claims (3)
置された発熱部品と、前記プリント基板を取り付けて前
記電子部品を収納する樹脂からなるケースと、該ケース
に固定され、前記発熱部品と接触状態にある金属板から
なる熱伝導部材とを有し、前記ケースは、前記熱伝導部
材に対向する面から垂直に突出した複数個の突起部を有
し、前記熱伝導部材は、複数個の貫通孔を有し、前記突
起部が、前記貫通孔に挿入され、前記ケースに前記熱伝
導部材が載置された状態で、前記貫通孔から突出した前
記突起部の頭部を潰して、前記熱伝導部材を前記頭部で
前記ケースに圧接して固定したことを特徴とする電子機
器。1. A printed circuit board, a heat-generating component mounted on the printed circuit board, a case made of a resin for mounting the electronic component by mounting the printed circuit board, and being fixed to the case and in contact with the heat-generating component. A heat conductive member made of a metal plate in a state, wherein the case has a plurality of protrusions vertically protruding from a surface facing the heat conductive member, and the heat conductive member has a plurality of heat conductive members. Having a through hole, the protrusion is inserted into the through hole, and in a state where the heat conductive member is placed on the case, the head of the protrusion protruding from the through hole is crushed, An electronic device, wherein a heat conductive member is fixed by being pressed against the case with the head.
基板を有し、該マザー基板に、前記熱伝導部材が固定さ
れた前記ケースを取り付け、前記熱伝導部材を前記導電
パターンに当接させたことを特徴とする請求項１記載の
電子機器。2. A mother board having a conductive pattern formed on a surface thereof, the case to which the heat conductive member is fixed is attached to the mother board, and the heat conductive member is brought into contact with the conductive pattern. The electronic device according to claim 1, wherein:
基板と、熱伝導性が良く、且つ弾性のあるシートを有
し、前記シートは、前記ケースに固定された前記熱伝導
部材の表面、あるいは前記導電パターンの表面に接着さ
れ、前記シートが前記導電パターンと前記熱伝導部材の
間に介在するように、前記マザー基板を前記ケースを取
り付け、前記熱伝導部材の熱を、前記熱伝導部材に接触
した前記シートを介して、前記シートに接触した前記導
電パターンに伝導することを特徴とする請求項１記載の
電子機器。3. A mother board having a conductive pattern formed on a surface thereof, and a sheet having good thermal conductivity and elasticity, wherein the sheet is a surface of the heat conductive member fixed to the case, or The mother board is attached to the case so that the sheet is interposed between the conductive pattern and the heat conductive member, and the heat of the heat conductive member is applied to the heat conductive member. The electronic device according to claim 1, wherein conduction is made to the conductive pattern in contact with the sheet via the contacted sheet.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19570398A JP3601980B2 (en) | 1998-07-10 | 1998-07-10 | Electronics |
| US09/336,292 US6147866A (en) | 1998-07-02 | 1999-06-21 | Electronic device |
| CN99109392A CN1133358C (en) | 1998-07-02 | 1999-06-29 | Electronic device |
| KR1019990026286A KR100311274B1 (en) | 1998-07-02 | 1999-07-01 | Portable telephone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19570398A JP3601980B2 (en) | 1998-07-10 | 1998-07-10 | Electronics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000031674A true JP2000031674A (en) | 2000-01-28 |
| JP3601980B2 JP3601980B2 (en) | 2004-12-15 |
Family
ID=16345583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19570398A Expired - Fee Related JP3601980B2 (en) | 1998-07-02 | 1998-07-10 | Electronics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3601980B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018526294A (en) * | 2015-07-29 | 2018-09-13 | ピーチ グレゴール アントンＰＩＥＣＨ， Ｇｒｅｇｏｒ Ａｎｔｏｎ | Can lid |
| WO2021221364A1 (en) * | 2020-04-29 | 2021-11-04 | 삼성전자 주식회사 | Electronic device including heat dissipation sheet |
-
1998
- 1998-07-10 JP JP19570398A patent/JP3601980B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018526294A (en) * | 2015-07-29 | 2018-09-13 | ピーチ グレゴール アントンＰＩＥＣＨ， Ｇｒｅｇｏｒ Ａｎｔｏｎ | Can lid |
| JP2020147377A (en) * | 2015-07-29 | 2020-09-17 | ピーチ グレゴール アントンＰＩＥＣＨ， Ｇｒｅｇｏｒ Ａｎｔｏｎ | Can lid |
| JP6990744B2 (en) | 2015-07-29 | 2022-01-12 | ピーチ グレゴール アントン | Can lid |
| JP6993331B2 (en) | 2015-07-29 | 2022-01-13 | ピーチ グレゴール アントン | Can lid |
| WO2021221364A1 (en) * | 2020-04-29 | 2021-11-04 | 삼성전자 주식회사 | Electronic device including heat dissipation sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3601980B2 (en) | 2004-12-15 |
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