JP2000022444A - High frequency crystal oscillator for resin package and mounting structure - Google Patents
High frequency crystal oscillator for resin package and mounting structureInfo
- Publication number
- JP2000022444A JP2000022444A JP10225106A JP22510698A JP2000022444A JP 2000022444 A JP2000022444 A JP 2000022444A JP 10225106 A JP10225106 A JP 10225106A JP 22510698 A JP22510698 A JP 22510698A JP 2000022444 A JP2000022444 A JP 2000022444A
- Authority
- JP
- Japan
- Prior art keywords
- crystal oscillator
- resin
- wire bonding
- pcb
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、水晶振動子と半導体素
子とを樹脂ケースでパッケージングした水晶発振器及び
実装構造に関するものである。最近、各種電算機、電子
機器が高密度実装化と動作周波数の高周波化に伴い、高
周波水晶発振器の小型化、低価格化が要求されている。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a crystal oscillator and a mounting structure in which a crystal unit and a semiconductor element are packaged in a resin case. 2. Description of the Related Art Recently, as various computers and electronic devices have been mounted at a high density and operating frequencies have been increased, there has been a demand for downsizing and cost reduction of high frequency crystal oscillators.
【０００２】[0002]
【従来の技術】従来広く使用されている樹脂封入型の水
晶発振器は、回路パターンとなるリードフレーム上に発
振用半導体及び水晶振動子とを接合した後にトランスフ
ァーモールドを行い樹脂封入し全体を固着させた実装構
造となっているが、各パターン間又は、各部品とリード
フレーム間に浮遊容量が発生する。この浮遊容量が発振
用半導体の負性抵抗を大きく低下させる為、水晶振動子
の等価抵抗の著しく低い物が必要とされていた。又、発
振用半導体の負性抵抗も著しく高い物が必要とされてい
た。この現象は、特に高周波で顕著にあらわれる。2. Description of the Related Art Conventionally, a resin-enclosed type crystal oscillator is widely used. After bonding an oscillation semiconductor and a crystal oscillator on a lead frame to be a circuit pattern, transfer molding is performed and resin is encapsulated to fix the whole. However, a stray capacitance is generated between each pattern or between each component and the lead frame. Since the stray capacitance greatly reduces the negative resistance of the oscillation semiconductor, a crystal oscillator having an extremely low equivalent resistance has been required. In addition, a semiconductor having a remarkably high negative resistance of the oscillation semiconductor is required. This phenomenon is particularly noticeable at high frequencies.
【０００３】[0003]
【発明が解決しようとする課題】以上説明した従来の樹
脂封入型の水晶発振器の実装構造で問題となるのは、発
振回路全体を樹脂で覆ってしまう為に発生する、浮遊容
量による負性抵抗の低下にある。その低下分を発振用半
導体又は、水晶振動子の高特性な物を使用する設計とす
る事が必要とされる。本発明は上記の様な問題点に鑑
み、さらに高周波化される樹脂封入型の高周波水晶発振
器における浮遊容量を削減し高周波特性を向上する事が
出来る新しい水晶発振器とその実装構造の提供を目的と
するA problem with the mounting structure of the conventional resin-enclosed type crystal oscillator described above is that the negative resistance due to the stray capacitance generated because the entire oscillation circuit is covered with resin. Is on the decline. It is necessary to design a semiconductor device for oscillation or a crystal oscillator having high characteristics to use the reduced amount. The present invention has been made in view of the above-described problems, and has as its object to provide a new crystal oscillator that can reduce stray capacitance and improve high-frequency characteristics in a resin-encapsulated high-frequency crystal oscillator that is further increased in frequency and to provide a mounting structure thereof. Do
【０００４】[0004]
【課題を解決するための手段】本発明の水晶発振器は、
プリント基板上に、水晶振動子を発振させる半導体を固
着すると共にプリント基板パターンとワイヤーボンデン
グし、半導体及びワイヤーボンデング部を樹脂コーテン
グを行い、端子となるリードフレーム及び水晶振動子を
接合する。これらを、はめ込み式上下２種の樹脂ケース
に収納し水晶発振回路を内設する実装構造とする。A crystal oscillator according to the present invention comprises:
A semiconductor that oscillates a quartz oscillator is fixed on a printed board, wire-bonded to the printed board pattern, resin-coated the semiconductor and the wire-bonded portion, and a lead frame serving as a terminal and the quartz oscillator are joined. These are housed in two types of upper and lower resin cases of a fitting type, and have a mounting structure in which a crystal oscillation circuit is provided.
【０００５】[0005]
【作用】本発明では、発振用半導体及びワイヤーボンデ
ング部の樹脂コーテングを除き、発振回路全体が樹脂ケ
ース内に中空構造となっている為、従来の樹脂封止型水
晶発振器に見られる浮遊容量の発生がなくなる。In the present invention, the entire oscillation circuit has a hollow structure inside the resin case except for the semiconductor for oscillation and the resin coating of the wire bonding portion. Is no longer generated.
【０００６】[0006]
【実施例】以下、本考案の実装構造などを図面を参照し
ながら詳細に説明する図１は本考案による水晶発振器の
構造図である。１はＰＣＢ上に配置した水晶振動子であ
る。２はＰＣＢ上に配置した回路駆動用ＩＣである。３
は回路構成用ＰＣＢである。４は外部接続用リードフレ
ームでこのリードフレームにて電源入力波形出力、グラ
ンド接続するものである。５は上ケース、６は下ケースDETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the drawings, the mounting structure of the present invention will be described in detail with reference to the drawings. FIG. 1 is a structural diagram of a crystal oscillator according to the present invention. Reference numeral 1 denotes a crystal oscillator arranged on a PCB. Reference numeral 2 denotes a circuit driving IC arranged on a PCB. Three
Is a circuit configuration PCB. Reference numeral 4 denotes a lead frame for external connection, which is used to connect a power supply input waveform output and ground to the lead frame. 5 is the upper case, 6 is the lower case
【０００７】[0007]
【発明の効果】本発明によれば、極めて簡単な構成で、
更に高周波化された水晶発振器の実装においても発振用
半導体の負性抵抗を悪化ささせる事がない利点があり、
著しい経済的及び、信頼性向上の効果が期待出来る高周
波水晶発振器及び実装構造を提供する事ができる。According to the present invention, with a very simple configuration,
Furthermore, there is an advantage that the negative resistance of the semiconductor for oscillation is not deteriorated even in the mounting of the crystal oscillator having a high frequency,
It is possible to provide a high-frequency crystal oscillator and a mounting structure that can be expected to be significantly economical and have an effect of improving reliability.
【図１】図１は本考案による水晶発振器の構造図であ
る。FIG. 1 is a structural diagram of a crystal oscillator according to the present invention.
１：水晶振動子 ２：ＩＣ ３：ＰＣＢ ４：リードフレーム ５：上ケース ６：下ケー
ス1: Crystal oscillator 2: IC 3: PCB 4: Lead frame 5: Upper case 6: Lower case
Claims (1)
させる半導体を固着すると共にプリント基板パターンと
ワイヤーボンデングし、半導体及びワイヤーボンデング
部の樹脂コーテングを行う（前述の半導体は、フリップ
チップ半導体又はミニモールドパッケージ半導体でも良
い）、端子となるリードフレーム及び水晶振動子を接合
する。これらを樹脂ケースに収納した事を特長とする水
晶発振器及び実装構造。1. A semiconductor for oscillating a crystal oscillator is fixed on a printed circuit board and wire-bonded to a printed circuit board pattern to perform resin coating of the semiconductor and the wire-bonded portion. Alternatively, a mini-mold package semiconductor may be used), and a lead frame serving as a terminal and a crystal oscillator are joined. A crystal oscillator and mounting structure characterized by storing these in a resin case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10225106A JP2000022444A (en) | 1998-07-03 | 1998-07-03 | High frequency crystal oscillator for resin package and mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10225106A JP2000022444A (en) | 1998-07-03 | 1998-07-03 | High frequency crystal oscillator for resin package and mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000022444A true JP2000022444A (en) | 2000-01-21 |
Family
ID=16824086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10225106A Pending JP2000022444A (en) | 1998-07-03 | 1998-07-03 | High frequency crystal oscillator for resin package and mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000022444A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020076040A (en) * | 2001-03-27 | 2002-10-09 | 에스티에스반도체통신 주식회사 | Minimized module type semiconductor package and manufacturing method the same |
| CN107800399A (en) * | 2017-10-23 | 2018-03-13 | 郑州云海信息技术有限公司 | A kind of anti-tampering crystal oscillator mounting structure and installation method |
-
1998
- 1998-07-03 JP JP10225106A patent/JP2000022444A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020076040A (en) * | 2001-03-27 | 2002-10-09 | 에스티에스반도체통신 주식회사 | Minimized module type semiconductor package and manufacturing method the same |
| CN107800399A (en) * | 2017-10-23 | 2018-03-13 | 郑州云海信息技术有限公司 | A kind of anti-tampering crystal oscillator mounting structure and installation method |
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