JP2000017045A - Epoxy resin composition for sealing semiconductor and semiconductor device sealed with the same - Google Patents
Epoxy resin composition for sealing semiconductor and semiconductor device sealed with the sameInfo
- Publication number
- JP2000017045A JP2000017045A JP10184422A JP18442298A JP2000017045A JP 2000017045 A JP2000017045 A JP 2000017045A JP 10184422 A JP10184422 A JP 10184422A JP 18442298 A JP18442298 A JP 18442298A JP 2000017045 A JP2000017045 A JP 2000017045A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- release agent
- agent
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、成形性，信頼性に
優れた半導体封止用エポキシ樹脂及びそれを用いて封止
された半導体装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin for semiconductor encapsulation which is excellent in moldability and reliability, and a semiconductor device encapsulated using the same.
【０００２】[0002]
【従来の技術】従来、トランジスタ，ＩＣ，ＬＳＩ等の
半導体装置の樹脂封止には、耐熱性，耐湿性に優れたオ
ルソクレゾールノボラック型エポキシ樹脂に、硬化剤と
してフェノールノボラック型樹脂を用い、充填材として
溶融シリカ，結晶シリカ等の無機充填材を配合したエポ
キシ樹脂組成物を用いている。近年、ＬＳＩ等の高集積
化、パッケージの小型、薄型化に伴い、半導体素子は大
型化、パッケージは表面実装タイプのＱＦＰ，ＳＯＰ，
ＴＳＯＰ，ＴＱＦＰ，ＰＬＣＣ等の小型・薄型化の傾向
にある。即ち、大型の半導体素子を小型で薄い形状のパ
ッケージにすることになる。このため、封止用樹脂及び
半導体素子の熱膨張係数の違いに基ずく熱応力により、
封止用樹脂及び半導体素子にクラックが発生し、半導体
装置の耐湿性が低下する等の問題がある。特に、半導体
装置の製造工程の中の半田付け工程において、赤外線加
熱によるＩＲリフローやＶＰＳリフローにより、半導体
装置が急激に２００℃以上の高温に晒される。このた
め、パッケージ中に含まれる水分が気化し、この際の蒸
気圧により、封止樹脂と半導体素子又リードフレーム等
のインサートとの界面において剥離，パッケージの膨れ
や割れが発生し、耐湿性が低化する。2. Description of the Related Art Conventionally, for resin encapsulation of semiconductor devices such as transistors, ICs and LSIs, an ortho-cresol novolak type epoxy resin having excellent heat resistance and moisture resistance is filled with a phenol novolak type resin as a curing agent. An epoxy resin composition containing an inorganic filler such as fused silica or crystalline silica is used as the material. 2. Description of the Related Art In recent years, with the increase in integration of LSIs and the like and the reduction in size and thickness of packages, semiconductor devices have increased in size, and packages have been surface-mounted QFPs, SOPs, and the like.
TSOP, TQFP, PLCC, etc. tend to be smaller and thinner. That is, a large semiconductor element is formed into a small and thin package. Therefore, due to the thermal stress based on the difference in thermal expansion coefficient between the sealing resin and the semiconductor element,
There is a problem that cracks occur in the sealing resin and the semiconductor element, and the moisture resistance of the semiconductor device is reduced. In particular, in a soldering step in a manufacturing process of a semiconductor device, the semiconductor device is rapidly exposed to a high temperature of 200 ° C. or more by IR reflow or VPS reflow by infrared heating. For this reason, the moisture contained in the package is vaporized, and the vapor pressure at this time causes peeling, swelling and cracking of the package at the interface between the sealing resin and the insert such as a semiconductor element or a lead frame, and the moisture resistance is reduced. Lower.
【０００３】この対応として、インサートに対する接着
力，硬化物の吸湿性，高温での機械強度に優れた樹脂組
成物が検討されてきたが、インサートに対する接着力の
強い樹脂は、成型金型との離型性が悪い傾向にある。こ
のバランスをとるため、内部離型剤を多量添加すると今
度は金型の汚れや成形品の外観不良、あるいは成形品を
基板に実装する際に作業性が低下する等の問題がある。In order to cope with this, a resin composition having excellent adhesive strength to the insert, hygroscopicity of the cured product, and mechanical strength at high temperatures has been studied. The releasability tends to be poor. If a large amount of the internal release agent is added to balance this, there are problems such as contamination of the mold, poor appearance of the molded product, and reduced workability when the molded product is mounted on the substrate.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、半導体素
子、リードフレーム等のインサートとの接着力の強い樹
脂に良好な金型離型性を与え、同時に金型汚れ、成形品
の外観不良を抑え、かつ成形品実装時に良好な作業性を
確保できる、高信頼性かつ優れた成形性の半導体封止用
エポキシ樹脂組成物及びそれを用いた半導体装置を提供
することを目的とする。DISCLOSURE OF THE INVENTION The present invention provides a resin having a strong adhesive force to an insert such as a semiconductor element or a lead frame so as to provide a good mold releasability, and at the same time, to reduce mold contamination and poor appearance of a molded product. An object of the present invention is to provide a highly reliable and excellent moldability epoxy resin composition for semiconductor encapsulation and a semiconductor device using the same, which can suppress and secure good workability when mounting a molded product.
【０００５】[0005]
【課題を解決するための手段】本発明の要旨は、以下の
とおりである。The gist of the present invention is as follows.
【０００６】（１）（Ａ）式（１)又は(２）(1) (A) Equation (1) or (2)
【０００７】[0007]
【化３】 Embedded image
【０００８】[0008]
【化４】 Embedded image
【０００９】で表されるエポキシ樹脂の少なくとも１種
以上、（Ｂ）フェノール系硬化剤、（Ｃ）硬化促進剤、
（Ｄ）炭素数１０以上のα―オレフィンと、マレイン酸
の共重合物を、炭素数５以上の一価アルコールでエステ
ル化した、数平均分子量が１，０００〜２０，０００、
軟化点が１００℃以下である離型剤、（Ｅ）無機充填
材、を必須成分とし、前記（Ｅ）無機充填材の含有量が
樹脂組成物全体に対して７０〜９５重量％であること特
徴とする半導体封止用エポキシ樹脂組成物に関し、前記
離型剤が、数平均分子量が５００〜２０、０００の、酸
化型、もしくは非酸化型のパラフィン又はポリエチレン
系離型剤を併用する半導体封止用エポキシ樹脂組成物並
びにエポキシ樹脂と、（Ｄ）の離型剤を予め予備反応さ
せて用いる半導体封止用エポキシ樹脂組成物、及びエポ
キシ樹脂と、（Ｄ）の離型剤及び前記パラフィン又はポ
リエチレンを、予め予備反応させて用いる半導体封止用
エポキシ樹脂組成物に関する。At least one epoxy resin represented by the formula (B): a phenolic curing agent, (C) a curing accelerator,
(D) a copolymer of an α-olefin having 10 or more carbon atoms and maleic acid is esterified with a monohydric alcohol having 5 or more carbon atoms, and the number average molecular weight is 1,000 to 20,000;
A mold release agent having a softening point of 100 ° C. or lower and an inorganic filler (E) are essential components, and the content of the inorganic filler (E) is 70 to 95% by weight based on the entire resin composition. Regarding the epoxy resin composition for semiconductor encapsulation, wherein the release agent is a semiconductor encapsulation in combination with an oxidized or non-oxidized paraffin or a polyethylene type release agent having a number average molecular weight of 500 to 20,000. An epoxy resin composition for semiconductor encapsulation using an epoxy resin composition for stopping and an epoxy resin preliminarily reacted with a release agent of (D), and an epoxy resin, a release agent of (D) and the paraffin or The present invention relates to an epoxy resin composition for semiconductor encapsulation that is used by preliminarily reacting polyethylene.
【００１０】また、前記の半導体封止用エポキシ樹脂組
成物のいずれかで封止された半導体装置に関する。。[0010] The present invention also relates to a semiconductor device encapsulated with any of the epoxy resin compositions for semiconductor encapsulation described above. .
【００１１】本発明で用いられるエポキシ樹脂として
は、インサートとの接着力が強く、無機充填剤の配合割
合の多い成形品を提供できる、式（１）、式（２）、式
（３）で表される樹脂が好ましい。式（１）で表される
エポキシ樹脂としては、油化シェルエポキシ(株)製ＹＸ
−４０００Ｈ、また、式（２）で表されるエポキシ樹脂
としては、大日本インキ化学(株)製ＨＰ−７２００等が
ある。As the epoxy resin used in the present invention, the following formulas (1), (2) and (3) can be used to provide a molded article having a strong adhesive force to the insert and a large proportion of the inorganic filler. The resins represented are preferred. Examples of the epoxy resin represented by the formula (1) include YX manufactured by Yuka Shell Epoxy Co., Ltd.
The epoxy resin represented by the formula (2) includes -HP-7200 manufactured by Dainippon Ink and Chemicals, Inc.
【００１２】本発明においては、上記のエポキシ樹脂
に、従来公知のビスフェノールＡ，ビスフェノールＦ，
ビスフェノールＡＦ，ビスフェノールＳ等のビスフェノ
ール型のエポキシ樹脂、フェノールノボラック型エポキ
シ樹脂、ｏークレゾールノボラック型エポキシ樹脂、ビ
フェニル骨格又はナフタレン骨格を有するエポキシ樹
脂、トリスフェノール型のエポキシ樹脂、液晶エポキシ
樹脂等を併用できる。In the present invention, conventionally known bisphenol A, bisphenol F,
Bisphenol type epoxy resin such as bisphenol AF, bisphenol S, phenol novolak type epoxy resin, o-cresol novolak type epoxy resin, epoxy resin having biphenyl skeleton or naphthalene skeleton, trisphenol type epoxy resin, liquid crystal epoxy resin, etc. it can.
【００１３】硬化剤としては、フェノール系硬化剤であ
れば特に制限はないが、低吸湿の成形品を提供できる、
一般式（４）で表されるフェノール樹脂が好ましい。一
般式（４）で表されるフェノール樹脂としては、三井化
学(株)製ＸＬ−２２５がある。一般式（４）で表される
硬化剤は、単独で用いても他の硬化剤と併用してもよ
い。該硬化剤の配合量は、当量比でエポキシ樹脂に対し
て、０．８〜１．３が好ましい。The curing agent is not particularly limited as long as it is a phenolic curing agent, but it can provide a molded article having low moisture absorption.
Phenolic resins represented by the general formula (4) are preferred. As the phenolic resin represented by the general formula (4), there is XL-225 manufactured by Mitsui Chemicals, Inc. The curing agent represented by the general formula (4) may be used alone or in combination with another curing agent. The compounding amount of the curing agent is preferably 0.8 to 1.3 with respect to the epoxy resin in an equivalent ratio.
【００１４】本発明においては、上記の一般式（４）で
表されるフェノール樹脂と、ノボラック型フェノール樹
脂、レゾール型フェノール樹脂、ｏ―クレゾールノボラ
ック型樹脂、ポリ−ｐ−ヒドロキシレン樹脂等公知のフ
ェノール系の樹脂を併用することができる。In the present invention, a phenol resin represented by the above general formula (4) and a known phenol resin such as a novolak phenol resin, a resol phenol resin, an o-cresol novolak resin, and a poly-p-hydroxylene resin are used. A phenolic resin can be used in combination.
【００１５】硬化促進剤としては、特に制限はないが、
トリフェニルホスフィン、トリフェニルホスフィンとベ
ンゾキノンの付加物、１，８−ジアザ−ビシクロ（５，
４，０）−ウンデセン−７、２−フエニル−４メチル−
イミダゾール、４−ジメチルアミノピリジン等を単独ま
たは併用することができる。これらの中でも特に、耐湿
信頼性、硬化性に優れたトリフェニルホスフィンとベン
ゾキノンの付加物が好ましい。該硬化促進剤の配合量
は、 エポキシ樹脂１００重量部に対して ０．１〜５
重量部が好ましい。Although there is no particular limitation on the curing accelerator,
Triphenylphosphine, an adduct of triphenylphosphine and benzoquinone, 1,8-diaza-bicyclo (5,
(4,0) -undecene-7,2-phenyl-4methyl-
Imidazole, 4-dimethylaminopyridine and the like can be used alone or in combination. Among these, an adduct of triphenylphosphine and benzoquinone, which is excellent in moisture resistance reliability and curability, is particularly preferred. The amount of the curing accelerator is 0.1 to 5 with respect to 100 parts by weight of the epoxy resin.
Parts by weight are preferred.
【００１６】カップリング剤は、特に制限はなく公知の
カップリング剤を用いることができる。その中でも、エ
ポキシシラン，アミノシラン等のシラン系カップリング
剤、が耐湿信頼性の点で好ましい。The coupling agent is not particularly limited, and a known coupling agent can be used. Among them, silane coupling agents such as epoxy silane and amino silane are preferable in terms of moisture resistance reliability.
【００１７】離型剤は、本発明の効果を得る上で特に重
要である。本発明で用いることのできる離型剤として
は、炭素数１０以上のα―オレフィンと無水マレイン酸
共重合物を炭素数５以上の一価アルコールでエステル化
した、数平均分子量が１，０００〜２０，０００、軟化
点が１００℃以下である離型剤（Ｄ）、及び数平均分子
量が５００〜２０，０００の酸化型又は非酸化型である
ポリエチレンもしくはパラフィン系離型剤（Ｆ）であ
る。The release agent is particularly important for obtaining the effects of the present invention. As the release agent that can be used in the present invention, an α-olefin having 10 or more carbon atoms and a maleic anhydride copolymer are esterified with a monohydric alcohol having 5 or more carbon atoms, and the number average molecular weight is 1,000 to 20,000, a release agent (D) having a softening point of 100 ° C. or lower, and an oxidized or non-oxidized polyethylene or paraffin-based release agent (F) having a number average molecular weight of 500 to 20,000. .
【００１８】本発明においては、離型剤（Ｄ）を単独、
又は離型剤（Ｆ）と併用して用いる。In the present invention, the release agent (D) is used alone,
Alternatively, it is used in combination with the release agent (F).
【００１９】前記の式(１）で表されるエポキシ樹脂
と、前記一般式(４）で表される硬化剤より得られるエ
ポキシ樹脂組成物の離型剤とした場合、離型剤（Ｄ）単
独の場合、離型剤（Ｆ）と併用する場合には、エポキシ
樹脂１００重量部に対して０.５〜１０ 重量部、（Ｄ）
が０．５〜５重量部、（Ｆ）が０．２〜５重量部とする
ことが密着性及び金型離型性のバランスの点で好まし
い。この他に、さらに、分子量が５００未満の高級脂肪
酸系の離型剤等と併用することができる。When the release agent of the epoxy resin composition obtained from the epoxy resin represented by the above formula (1) and the curing agent represented by the above general formula (4) is used, the release agent (D) When used alone, when used in combination with the release agent (F), 0.5 to 10 parts by weight with respect to 100 parts by weight of the epoxy resin, (D)
Is preferably 0.5 to 5 parts by weight, and (F) is 0.2 to 5 parts by weight, from the viewpoint of balance between adhesion and mold release properties. In addition, it can be used in combination with a higher fatty acid-based release agent having a molecular weight of less than 500.
【００２０】無機充填材は、溶融シリカ，結晶シリカ，
ジルコン、アルミナ、チタニア、炭酸カルシウム、クレ
ー等を単独で使用又は併用できる。無機充填材の配合量
は、エポキシ樹脂組成物全体に対して５０〜９５重量％
が好ましく、更に７０〜９０重量％が好ましい。７０重
量％未満では、耐クラック性という本来の目的が充分に
果たせず問題があり、９５重量％を超えると流動性の低
下等の問題がある。無機充填材の形状は特に制限はない
が、球状が半導体素子に対する損傷を押さえる上で有効
である。無機充填材の粒径については、特に制限はない
が、０．５μｍ〜１００μｍが好ましく、１μｍ〜４４
μｍが更に好ましい。As the inorganic filler, fused silica, crystalline silica,
Zircon, alumina, titania, calcium carbonate, clay and the like can be used alone or in combination. The amount of the inorganic filler is 50 to 95% by weight based on the entire epoxy resin composition.
, And more preferably 70 to 90% by weight. If it is less than 70% by weight, there is a problem that the original purpose of crack resistance cannot be sufficiently achieved, and if it exceeds 95% by weight, there is a problem such as a decrease in fluidity. The shape of the inorganic filler is not particularly limited, but a spherical shape is effective in suppressing damage to the semiconductor element. The particle size of the inorganic filler is not particularly limited, but is preferably 0.5 μm to 100 μm, and more preferably 1 μm to 44 μm.
μm is more preferred.
【００２１】その他の添加物として、着色剤（カーボン
ブラック等），改質材(シリコーン,シリコーンゴム
等），イオントラッパー（ハイドロタルサイト等）等を
用いることができる。As other additives, colorants (such as carbon black), modifiers (such as silicone and silicone rubber), ion trappers (such as hydrotalcite), and the like can be used.
【００２２】以上に記載の各成分（原材料）を用いて成
形材料を作製する方法としては、所定の配合量の原材料
混合物をミキサー等によって充分混合した後、熱ロー
ル，押出機等によって混練し、冷却、粉砕する。As a method for producing a molding material using the above-described components (raw materials), a raw material mixture having a predetermined blending amount is sufficiently mixed by a mixer or the like, and then kneaded by a hot roll, an extruder, or the like. Cool and pulverize.
【００２３】本発明のエポキシ樹脂組成物を用いて電子
部品を封止する方法としては、低圧トランスファ成形法
が最も一般的であるが、射出成形，圧縮成形，注型等も
可能である。本発明のエポキシ樹脂組成物は、成形性，
信頼性に優れており、トランジスタ，ＩＣ，ＬＳＩ等の
封止に適用できる。As a method for sealing an electronic component using the epoxy resin composition of the present invention, a low-pressure transfer molding method is most common, but injection molding, compression molding, casting, and the like are also possible. The epoxy resin composition of the present invention has moldability,
It has excellent reliability and can be applied to sealing of transistors, ICs, LSIs and the like.
【００２４】[0024]
【発明の実施の形態】以下に、本発明を実施例を用いて
説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to embodiments.
【００２５】[0025]
【実施例１〜３】Embodiments 1 to 3
【比較例１及び２】表１に本発明のエポキシ樹脂組成物
の配合組成及びそれらの各種特性を示す。Comparative Examples 1 and 2 Table 1 shows the composition of the epoxy resin composition of the present invention and various properties thereof.
【００２６】[0026]
【表１】 [Table 1]
【００２７】（Ａ）成分であるエポキシ樹脂として、式
（１）及び式（２）で表される化合物、（Ｂ）成分であ
るフェノール系硬化剤として、ＸＬ−２２５（三井化学
株製）、（Ｃ）成分である硬化促進剤として、トリフェ
ニルホスフィンとベンゾキノンの付加物、(Ｄ)成分であ
るαオレフィン−無水マレイン酸共重合体のエステル化
物としては、数平均分子量が１０，０００（αオレフィ
ンの炭素数２０〜２４、アルコールの炭素数１０；表
中、請求項１−(Ｄ)の離型剤(1)と表記）と、数平均分
子量が１２，０００でαオレフィンの炭素数２０〜２
４、アルコールの炭素数１８；同様に、表中請求項１−
(Ｄ)の離型剤(2)と表記）及び酸化型ポリエチレンとし
て、数平均分子量が２０００〜２，５００で、酸価が２
５mgＫＯＨ／ｇのクラリアント（旧ヘキスト）(株)製Ｐ
ＥＤ−５２２を用いた。The epoxy resin as the component (A) is a compound represented by the formula (1) or (2), and the phenolic curing agent as the component (B) is XL-225 (manufactured by Mitsui Chemicals, Inc.). As a curing accelerator as a component (C), an adduct of triphenylphosphine and benzoquinone, and as an ester of an α-olefin-maleic anhydride copolymer as a component (D), a number average molecular weight of 10,000 (α) 20 to 24 carbon atoms of the olefin, 10 carbon atoms of the alcohol; in the table, the release agent (1) of claim 1- (D)), and a number average molecular weight of 12,000 and 20 carbon atoms of the α-olefin. ~ 2
4, alcohol having 18 carbon atoms;
(D) (release agent (2)) and oxidized polyethylene having a number average molecular weight of 2,000 to 2,500 and an acid value of 2
5 mgKOH / g Clariant (former Hoechst) P
ED-522 was used.
【００２８】（Ｅ）成分である無機充填材として、球状
溶融シリカを、表１に示した所定量配合した。それらを
別個に予備混合 （ドライブレンド）した後、二軸型押
出機（内部温度約１１０℃）で溶融，混練し、冷却粉砕
して、５種の半導体封止用エポキシ樹脂組成物（封止
材）を製造した。この封止材を用い、トランスファー成
形機にて、金型温度１８０℃，成形圧力７０kgｆ／cm
２ ，硬化時間６０秒で成形を用い、密着性，金型離型
性，連続成形性及びそれに伴うＰＫＧ汚れ （ステイ
ン），ガラスエポキシ基板との仮止性の各種試験片を作
成し、各評価を行った。各評価方法は下記のとおりであ
る。[0028] Spherical fused silica was blended in a predetermined amount as shown in Table 1 as an inorganic filler as the component (E). After premixing them separately (dry blending), they are melted and kneaded in a twin-screw extruder (internal temperature of about 110 ° C.), cooled and pulverized, and the five types of epoxy resin compositions for semiconductor encapsulation (encapsulation) Material). Using this sealing material, at a transfer molding machine, a mold temperature of 180 ° C. and a molding pressure of 70 kgf / cm.
2. Using a mold with a curing time of 60 seconds, prepare various test pieces of adhesion, mold release property, continuous moldability, PKG stain (stain) accompanying it, and temporary fixability with glass epoxy board, and evaluate each. Was done. Each evaluation method is as follows.
【００２９】（１）密着性 表面を洗浄したアルミ箔上に幅１.２７mm のエポキシ樹
脂硬化物を成形して試験片を作成し、該試験片を１７５
℃、６時間後硬化させた後に引き剥がし試験を行い、そ
の引き剥がし強度を測定した。(1) Adhesiveness A test piece was prepared by molding an epoxy resin cured product having a width of 1.27 mm on an aluminum foil whose surface had been cleaned, and the test piece was placed at 175 mm.
After being cured at 6 ° C. for 6 hours, a peeling test was performed, and the peeling strength was measured.
【００３０】（２）金型離型性 図１に示した４枚組みの金型で封止材を成形し、３枚目
の、上径１０ｍｍ，下径１２ｍｍ，高さ２０mmt の寸法
を持った空洞部分に充填された成形品を、プッシュ−プ
ルゲージにて、成形直後に上から突つき、成形品が抜け
た時の荷重を測定（抜き荷重）した。金型クリーニング
材を２シット打った後、離型回復材を使わずに１０ショ
ット成形し、後半の５ショットの平均値で示した。(2) Mold Release Property The sealing material is molded using the four-piece mold shown in FIG. 1 and has a third sheet having an upper diameter of 10 mm, a lower diameter of 12 mm, and a height of 20 mmt. The molded product filled in the cavity was bumped from above immediately after molding with a push-pull gauge, and the load when the molded product came off was measured (pulling load). After hitting the mold cleaning material for 2 sheets, 10 shots were formed without using the mold release material, and the average value was shown for the last 5 shots.
【００３１】（３）連続成形性及びそれに伴うＰＫＧ汚
れ ＴＯＷＡプレス（ＴＯＷＡ株製 ＴＰＳ−６０Ｈ，ＴＳ
ＯＰ２８ｐ用）にて、各封止材毎に５００ショットの連
続成形を行い、金型へのはりつき，ゲート残りの有無等
により連続成形性を確認し、さらに５０ショット毎に成
形品をサンプリング、これを目視により確認すること
で、ＰＫＧ汚れの有無を確認した。(3) Continuous formability and accompanying PKG contamination TOWA press (TOPS Corporation TPS-60H, TS
In the case of OP28p), continuous molding of 500 shots was performed for each sealing material, continuous moldability was checked by sticking to the mold and remaining gate, etc., and the molded product was sampled every 50 shots. Was visually confirmed to confirm the presence or absence of PKG contamination.
【００３２】（４）仮止め性 ＦＵＪＩＷＡプレス（ＦＵＪＩＷＡ株製，ＤＩＰ−１４
ｐ用）にて成形を行い、１７５℃で６ｈ後硬化を行った
後、ガラスエポキシ基板に仮止め剤をＩＲ−１００を用
いて７ヶのテストピースを接着した。その後、１５０
℃、５分間硬化を行った後、引っ張り強度を測定して仮
止め性を測定した。(4) Temporary fixing property FUJIWA press (manufactured by FUJIWA, DIP-14)
After performing post-curing at 175 ° C. for 6 hours, seven test pieces were bonded to a glass epoxy substrate using IR-100. Then 150
After curing at 5 ° C. for 5 minutes, the tensile strength was measured to determine the temporary fixing property.
【００３３】実施例１〜３の本発明のエポキシ樹脂組成
物は、比較例１及び２に比べて接着性，離型性に優れ、
かつＰＫＧ汚れ，仮止め性も良好である。これは、本発
明が特定のエポキシ樹脂と、離型剤としてαオレフィン
と無水マレイン酸又はマレイン酸の共重合物と、酸化ま
たは非酸化型ポリエチレンあるいはパラフィン系離型剤
と併せ用いたことによるものである。The epoxy resin compositions of the present invention of Examples 1 to 3 are superior in adhesiveness and releasability to Comparative Examples 1 and 2,
In addition, PKG stains and temporary fixing properties are good. This is due to the fact that the present invention uses a specific epoxy resin, a copolymer of α-olefin and maleic anhydride or maleic acid as a releasing agent, and an oxidized or non-oxidized polyethylene or a paraffin-based releasing agent. It is.
【００３４】[0034]
【発明の効果】本発明の半導体封止用エポキシ樹脂組成
物は、接着性、離型性、ＰＫＧ汚れ、仮止め性に優れ、
該エポキシ樹脂組成物で封止した半導体装置は信頼性に
優れている。The epoxy resin composition for semiconductor encapsulation of the present invention is excellent in adhesiveness, releasability, PKG stain and temporary fixing property,
A semiconductor device sealed with the epoxy resin composition has excellent reliability.
【図１】金型離型性の測定方法の説明図である。FIG. 1 is an explanatory diagram of a method for measuring mold releasability.
なし None
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｌ 23/31 Ｈ０１Ｌ 23/30 Ｒ // Ｃ０８Ｌ 35/02 (72)発明者 柏原 隆貴 茨城県結城市大字鹿窪1772−１ 日立化成 工業株式会社下館工場内 (72)発明者 堀江 隆宏 茨城県結城市大字鹿窪1772−１ 日立化成 工業株式会社下館工場内 (72)発明者 水上 義裕 茨城県結城市大字鹿窪1772−１ 日立化成 工業株式会社下館工場内 Ｆターム(参考） 4J002 BB004 BH024 CC053 CD06X CD07W DE047 DE147 DE237 DJ017 DJ037 EU046 EU116 EU186 EW136 FD017 FD143 FD156 FD164 GQ05 4J036 AD07 AF07 DA02 DA04 DA05 DC38 DD07 DD08 FA01 FA03 FA05 FB02 FB04 FB07 JA07 4M109 EA03 EB03 EB04 EB06 EB08 EB09 EB12 EB19 EC09 EC20──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H01L 23/31 H01L 23/30 R // C08L 35/02 (72) Inventor Takaki Kashiwara Yuki, Ibaraki 1772-1 Shikabo, Hitachi Chemical Industry Co., Ltd., Shimodate Plant (72) Inventor Takahiro Horie, Ojika Kubo, Yuki-shi, Ibaraki Prefecture 172-1 Inside Shimodate Plant, Hitachi Chemical Co., Ltd. -1 Hitachi Chemical Industries, Ltd. Shimodate Plant F term (reference) 4J002 BB004 BH024 CC053 CD06X CD07W DE047 DE147 DE237 DJ017 DJ037 EU046 EU116 EU186 EW136 FD017 FD143 FD143 FD156 FD164 GQ05 4J036 AD07 AF07 DA02 DA04 DA05 DC38 DD07 DD05 FB03 FA03 JA07 4M109 EA03 EB03 EB04 EB06 EB08 EB09 EB12 EB19 EC09 EC20
Claims (5)
フェノール系硬化剤、（Ｃ）硬化促進剤、（Ｄ）炭素数
１０以上のα―オレフィンと、マレイン酸の共重合物
を、炭素数５以上の一価アルコールでエステル化した、
数平均分子量が１，０００〜２０，０００、軟化点が１
００℃以下である離型剤、（Ｅ）無機充填材、を必須成
分とし、前記（Ｅ）無機充填材の含有量が樹脂組成物全
体に対して７０〜９５重量％であること特徴とする半導
体封止用エポキシ樹脂組成物。(A) Formula (1) or (2) Embedded image At least one epoxy resin represented by the formula (B):
A phenolic curing agent, (C) a curing accelerator, (D) a copolymer of maleic acid and an α-olefin having 10 or more carbon atoms was esterified with a monohydric alcohol having 5 or more carbon atoms,
Number average molecular weight of 1,000 to 20,000, softening point of 1
A mold release agent having a temperature of 00 ° C. or lower and an inorganic filler (E) are essential components, and the content of the inorganic filler (E) is 70 to 95% by weight based on the entire resin composition. Epoxy resin composition for semiconductor encapsulation.
０、０００の、酸化型、もしくは非酸化型のパラフィン
又はポリエチレン系離型剤を併用する請求項１記載の半
導体封止用エポキシ樹脂組成物。2. A releasing agent having a number average molecular weight of 500 to 2
The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein a 000 oxidized or non-oxidized paraffin or polyethylene release agent is used in combination.
を予め予備反応させて用いる請求項１又は請求項２記載
の半導体封止用エポキシ樹脂組成物。3. The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein the epoxy resin and the release agent according to claim 1 (D) are pre-reacted and used.
及び請求項２のパラフィン又はポリエチレンを、予め予
備反応させて用いる請求項１、２又は３のいずれかに記
載の半導体封止用エポキシ樹脂組成物。4. The semiconductor encapsulation according to claim 1, wherein the epoxy resin, the release agent according to claim 1 (D) and the paraffin or polyethylene according to claim 2 are pre-reacted and used. An epoxy resin composition for stopping.
求項３、もしくは請求項４の半導体封止用エポキシ樹脂
組成物で封止された半導体装置。5. A semiconductor device encapsulated with the epoxy resin composition for semiconductor encapsulation according to claim 1, 2, 3 or 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10184422A JP2000017045A (en) | 1998-06-30 | 1998-06-30 | Epoxy resin composition for sealing semiconductor and semiconductor device sealed with the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10184422A JP2000017045A (en) | 1998-06-30 | 1998-06-30 | Epoxy resin composition for sealing semiconductor and semiconductor device sealed with the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000017045A true JP2000017045A (en) | 2000-01-18 |
Family
ID=16152888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10184422A Pending JP2000017045A (en) | 1998-06-30 | 1998-06-30 | Epoxy resin composition for sealing semiconductor and semiconductor device sealed with the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000017045A (en) |
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