JPH05218239A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH05218239A JPH05218239A JP33850491A JP33850491A JPH05218239A JP H05218239 A JPH05218239 A JP H05218239A JP 33850491 A JP33850491 A JP 33850491A JP 33850491 A JP33850491 A JP 33850491A JP H05218239 A JPH05218239 A JP H05218239A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- naphthol
- resin composition
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体デバイスの表面
実装化における耐半田ストレス性に優れた半導体封止用
エポキシ樹脂組成物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for semiconductor encapsulation which is excellent in resistance to solder stress in surface mounting semiconductor devices.
【０００２】[0002]
【従来の技術】従来、ダイオード、トランジスタ、集積
回路等の電子部品を熱硬化性樹脂で封止しているが、特
に集積回路では耐熱性、耐湿性に優れたｏ−クレゾール
ノボラックエポキシ樹脂をノボラック型フェノール樹脂
で硬化させたエポキシ樹脂組成物が用いられている。と
ころが近年、集積回路の高集積化に伴いチップがだんだ
ん大型化し、かつパッケージは従来のＤＩＰタイプか
ら、表面実装化された小型、薄型のＱＦＰ，ＳＯＰ，Ｓ
ＯＪ，ＰＬＣＣに変わってきている。つまり大型チップ
を、小型で薄いパッケージに封入することになり、応力
によりクラックが発生、これらのクラックによる耐湿性
の低下等の問題が大きくクローズアップされてきてい
る。特に半田付けの工程において、急激に２５０２００
℃以上の高温にさらされることにより、前記の問題点が
発生しており、これらの大型チップを封止するのに適し
た、信頼性の高い封止用樹脂組成物の開発が望まれてき
ている。2. Description of the Related Art Conventionally, electronic parts such as diodes, transistors, and integrated circuits have been sealed with thermosetting resin. Especially, in integrated circuits, o-cresol novolac epoxy resin, which is excellent in heat resistance and moisture resistance, is used as a novolac resin. An epoxy resin composition cured with a type phenolic resin is used. However, in recent years, as the integration of integrated circuits has increased, the size of the chip has gradually increased, and the package has been changed from the conventional DIP type to a surface mount small and thin QFP, SOP, S.
It is changing to OJ and PLCC. In other words, a large chip is to be enclosed in a small and thin package, and cracks are generated due to stress, and problems such as deterioration of moisture resistance due to these cracks have been greatly highlighted. Especially in the soldering process
The above-mentioned problems are caused by being exposed to a high temperature of ℃ or more, and development of a highly reliable encapsulating resin composition suitable for encapsulating these large chips has been desired. There is.
【０００３】これらの問題点を解決するために、半田付
け時に熱衝撃を緩和する目的で、熱可塑性オリゴマーの
添加（特開昭６２−１１５８４９号公報）や各種シリコ
ーン化合物の添加（特開昭６２−１１５８５号公報、６
２−１１６６５４号公報、６２−１１２８１６２号公
報）、さらにはシリコーン変性（特開昭６２−１３６８
６０号公報）等の手法で対処しているが、いずれも半田
付け時にパッケージにクラックが生じてしまい、信頼性
の高い封止用エポキシ樹脂組成物を得るまでには至らな
かった。In order to solve these problems, addition of a thermoplastic oligomer (Japanese Patent Laid-Open No. 62-15849) and various silicone compounds (Japanese Patent Laid-Open No. 62-15849) for the purpose of mitigating thermal shock during soldering. -11585, 6
2-116654, 62-1128162) and further silicone modification (JP-A-62-1368).
No. 60), but cracks occur in the package during soldering, and it has not been possible to obtain a highly reliable epoxy resin composition for sealing.
【０００４】一方、半田付け時の耐熱ストレス性、つま
り耐半田ストレス性に優れた半導体封止用エポキシ樹脂
組成物を得る為に、樹脂系としてビフェニル型エポキシ
樹脂の使用（特開昭６４−６５１１６号公報）等が検討
されてきたが、ビフェニル型エポキシ樹脂の使用によ
り、リードフレームとの密着性及び、低吸水性が向上
し、耐半田ストレス性の向上、特にクラック発生が低減
するが、２５０℃以上の高温では、耐半田ストレス性が
不十分である。On the other hand, in order to obtain an epoxy resin composition for semiconductor encapsulation which is excellent in heat stress resistance during soldering, that is, solder stress resistance, use of a biphenyl type epoxy resin as a resin system (JP-A-64-65116). However, the use of the biphenyl type epoxy resin improves the adhesion to the lead frame and the low water absorption, and improves the solder stress resistance, especially the crack generation is reduced. At a high temperature of ℃ or more, the solder stress resistance is insufficient.
【０００５】[0005]
【発明が解決しようとする課題】本発明の特定のエポキ
シ樹脂を用いて、低吸水化、低線膨張化をはかり、更に
パラキシレン変性ナフトール樹脂硬化剤を用いて、低弾
性化、低吸水化、低線膨張化をはかり、その相乗効果に
より、基板実装時における半導体パッケージの耐半田ス
トレス性を著しく向上させた、半導体封止用エポキシ樹
脂組成物を提供するものである。The specific epoxy resin of the present invention is used to attain low water absorption and low linear expansion, and a paraxylene-modified naphthol resin curing agent is used to reduce elasticity and water absorption. The present invention provides an epoxy resin composition for semiconductor encapsulation, which has a low linear expansion coefficient and has a synergistic effect to remarkably improve the solder stress resistance of a semiconductor package when mounted on a substrate.
【０００６】[0006]
【課題を解決するための手段】本発明は（Ａ）下記式
（１）で示されるエポキシ樹脂The present invention provides (A) an epoxy resin represented by the following formula (1):
【０００７】[0007]
【化３】 [Chemical 3]
【０００８】を総エポキシ樹脂量に対して３０〜１００
重量％含むエポキシ樹脂、（Ｂ）下記式（２）で示され
るナフトール樹脂硬化剤30 to 100 relative to the total amount of epoxy resin
(B) Naphthol resin curing agent represented by the following formula (2)
【０００９】[0009]
【化４】 [Chemical 4]
【００１０】を総硬化剤量に対して３０〜１００重量％
含む硬化剤、（Ｃ）無機質充填材及び （Ｄ）硬化促進剤 を必須成分とする半導体封止用エポキシ樹脂組成物であ
る。30 to 100% by weight based on the total amount of curing agent
An epoxy resin composition for semiconductor encapsulation, which comprises a curing agent containing (C) an inorganic filler and (D) a curing accelerator as essential components.
【００１１】式（１）で示されるエポキシ樹脂は、パラ
クレゾールとα−ナフトールの共縮合ノボラックエポキ
シ樹脂であり、低吸水性に優れ、線膨張係数の小さい、
という特徴を有し、半田付け時の半田耐熱性に良好な結
果を示す。このパラクレゾールとα−ナフトールの共縮
合ノボラックエポキシ樹脂の使用量は、これを調節する
ことにより半田耐熱性を最大限に引きだすことができ
る。半田耐熱性の効果を出すためには、パラクレゾール
とα−ナフトールの共縮合ノボラックエポキシ樹脂を総
エポキシ樹脂量の３０重量％以上、好ましくは６０重量
％以上の使用が望ましい。３０重量％未満では低吸水
性、低線膨張係数が十分に得られず、半田耐熱性が不十
分である。ｎの値は１〜６であり、６を超えると流動性
が低下し、成形性が悪くなる。パラクレゾールとα−ナ
フトール共縮合ノボラックエポキシ樹脂以外の他のエポ
キシ樹脂を併用する場合、用いるエポキシ樹脂とは、エ
ポキシ基を有するポリマー全般をいう。例えばビスフェ
ノール型エポキシ樹脂、クレゾールノボラック型エポキ
シ樹脂、ビフェニル型エポキシ樹脂、フェノールノボラ
ック型エポキシ樹脂、及びトリフェノールメタン型エポ
キシ樹脂、アルキル変性トリフェノールメタン型エポキ
シ樹脂等の３官能型エポキシ樹脂、トリアジン環含有エ
ポキシ樹脂等のことをいう。The epoxy resin represented by the formula (1) is a co-condensed novolac epoxy resin of para-cresol and α-naphthol, is excellent in low water absorption and has a small linear expansion coefficient.
It has the characteristic that the solder heat resistance during soldering is good. By adjusting the amount of the co-condensed novolac epoxy resin of para-cresol and α-naphthol, the solder heat resistance can be maximized. In order to obtain the effect of solder heat resistance, it is desirable to use the co-condensed novolac epoxy resin of para-cresol and α-naphthol in an amount of 30% by weight or more, preferably 60% by weight or more based on the total amount of epoxy resin. If it is less than 30% by weight, low water absorption and low linear expansion coefficient cannot be sufficiently obtained, and solder heat resistance is insufficient. The value of n is 1 to 6, and if it exceeds 6, the fluidity is lowered and the moldability is deteriorated. When paracresol and an epoxy resin other than the α-naphthol co-condensed novolac epoxy resin are used in combination, the epoxy resin used means all polymers having an epoxy group. For example, bisphenol type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, triphenol methane type epoxy resin, trifunctional epoxy resin such as alkyl modified triphenol methane type epoxy resin, triazine ring-containing Refers to epoxy resin, etc.
【００１２】式（２）で示される硬化剤は、α−ナフト
ールあるいはβ−ナフトールとアラルキルエーテル
（α，α′−ジメトキシパラキシレン）を縮合させて得
たものであり、半田処理温度付近での低弾性率化とリー
ドフレーム及び半導体チップとの密着性に優れ、また吸
水率、線膨張係数が小さい、という特徴を有する。従っ
て半田付け時の熱衝撃に対し、発生応力の低下とそれに
伴う半導体チップ等との剥離不良の防止に有効である。
このナフトール樹脂硬化剤の使用量は、これを調節する
ことにより半田耐熱性を最大限に引き出すことができ
る。半田耐熱性の効果を引き出すためには式（２）で示
されるナフトール樹脂硬化剤を総硬化剤量の３０重量％
以上、好ましくは５０重量％以上の使用が望ましい。３
０重量％未満では低吸水性、低弾性率性、リードフレー
ム及び半導体チップとの密着性が不十分となり、半田付
け時の半田耐熱性が十分に得られない。ｎの値は１〜６
であり、６を超えると流動性が低下し、成形性が悪くな
る。The curing agent represented by the formula (2) is obtained by condensing α-naphthol or β-naphthol and aralkyl ether (α, α'-dimethoxyparaxylene), and is used in the vicinity of the soldering temperature. It has the features of low elastic modulus and excellent adhesion to the lead frame and semiconductor chip, and a low water absorption coefficient and a small linear expansion coefficient. Therefore, it is effective in preventing the reduction of the generated stress against the thermal shock at the time of soldering and the defective peeling from the semiconductor chip or the like.
The heat resistance of the solder can be maximized by adjusting the amount of the naphthol resin curing agent used. In order to bring out the effect of solder heat resistance, the naphthol resin curing agent represented by the formula (2) is used in an amount of 30% by weight of the total amount of the curing agent.
Above, it is desirable to use 50% by weight or more. Three
If it is less than 0% by weight, low water absorption, low elastic modulus, adhesion to the lead frame and the semiconductor chip are insufficient, and sufficient solder heat resistance during soldering cannot be obtained. The value of n is 1 to 6
If it exceeds 6, the fluidity is lowered and the moldability is deteriorated.
【００１３】式（２）で示されるナフトール樹脂硬化剤
以外に他の物を併用する場合、用いるものとしては主に
フェノール性水酸基を有するポリマー全般をいう。例え
ば、フェノールノボラック樹脂、クレゾールノボラック
樹脂、ジシクロペンタジエン変性フェノール樹脂、ジシ
クロペンタジエン変性フェノール樹脂とフェノールノボ
ラック及びクレゾールノボラック樹脂との共重合物、パ
ラキシレン変性フェノール樹脂等を用いることができ
る。When other substances are used in combination in addition to the naphthol resin curing agent represented by the formula (2), those used are mainly polymers having a phenolic hydroxyl group. For example, a phenol novolac resin, a cresol novolac resin, a dicyclopentadiene modified phenol resin, a copolymer of a dicyclopentadiene modified phenol resin with a phenol novolac or a cresol novolac resin, and a paraxylene modified phenol resin can be used.
【００１４】本発明で用いる無機質充填材としては、溶
融シリカ粉末、球状シリカ粉末、結晶シリカ粉末、二次
凝集シリカ粉末、多孔質シリカ粉末を粉砕したシリカ粉
末、アルミナ等が挙げられ、特に溶融シリカ粉末、球状
シリカ粉末及び溶融シリカ粉末と球状シリカ粉末との混
合物が好ましい。また無機質充填材の配合量としては、
耐半田ストレス性と成形性のバランスから、総樹脂組成
物中に７０〜９０重量％含むものが望ましい。Examples of the inorganic filler used in the present invention include fused silica powder, spherical silica powder, crystalline silica powder, secondary agglomerated silica powder, silica powder obtained by crushing porous silica powder, alumina, and the like, and particularly fused silica. Powders, spherical silica powders and mixtures of fused silica powders and spherical silica powders are preferred. In addition, as the compounding amount of the inorganic filler,
From the viewpoint of balance between solder stress resistance and moldability, it is desirable that the total resin composition contains 70 to 90% by weight.
【００１５】さらに本発明に用いる硬化促進剤はエポキ
シ基とフェノール性水酸機の反応を促進するものであれ
ば良く、一般に封止材料に使用されているものを広く使
用することができる。例えばトリフェニルホスフィン
（ＴＰＰ）、トリブチルホスフィン、トリ（４−メチル
フェニル）ホスフィン等の有機ホスフィン化合物、トリ
ブチアミン、トリエチルアミン、ベンジルジメチルアミ
ン、トリスジメチルアミノメチルフェノール、１，８−
ジアザビシクロ［５，４，０］−７−ウンデセン（ＤＢ
Ｕ）等の３級アミン、２−メチルイミダゾール、２−フ
ェニルイミダゾール、２−エチル−４−メチルイミダゾ
ール等のイミダゾール化合物等があげられる。これらを
単独で用いても、あるいはその２種以上の併用も可能で
ある。本発明の組成物は前述のもの以外、必要に応じて
カーボンブラック等の着色剤、カルナバワックス、合成
ワックス等の離型剤、ブロム化エポキシ樹脂、三酸化ア
ンチモン等の難燃剤、γ−グリシドキシプロピルトリメ
トキシシラン等のカップリング剤、シリコーンオイル、
ゴム等の低応力成分を添加することができる。Further, the curing accelerator used in the present invention may be any one as long as it accelerates the reaction between the epoxy group and the phenolic hydroxide machine, and those generally used for sealing materials can be widely used. For example, organic phosphine compounds such as triphenylphosphine (TPP), tributylphosphine, tri (4-methylphenyl) phosphine, tributyamine, triethylamine, benzyldimethylamine, trisdimethylaminomethylphenol, 1,8-
Diazabicyclo [5,4,0] -7-undecene (DB
U) and the like tertiary amines, 2-methylimidazole, 2-phenylimidazole, imidazole compounds such as 2-ethyl-4-methylimidazole and the like. These may be used alone or in combination of two or more. The composition of the present invention may be a colorant such as carbon black, a mold release agent such as carnauba wax and a synthetic wax, a brominated epoxy resin, a flame retardant such as antimony trioxide, and a γ-glycid other than those described above. Coupling agent such as xypropyltrimethoxysilane, silicone oil,
A low stress component such as rubber can be added.
【００１６】本発明のエポキシ樹脂組成物はエポキシ樹
脂、硬化剤、無機質充填材、硬化促進剤、その他の添加
剤をミキサー等で均一に混合した後、ロール、押し出し
機等の一般混練装置により熱溶融混練し、冷却、粉砕す
ることにより成形材料とすることができる。The epoxy resin composition of the present invention is prepared by uniformly mixing an epoxy resin, a curing agent, an inorganic filler, a curing accelerator, and other additives with a mixer or the like, and then heating the mixture with a general kneading machine such as a roll or an extruder. A molding material can be obtained by melt-kneading, cooling and pulverizing.
【００１７】[0017]
【実施例】以下本発明を実施例で具体的に説明する。EXAMPLES The present invention will be specifically described below with reference to examples.
【００１８】実施例１ 下記式（１）で示されるエポキシ樹脂Example 1 An epoxy resin represented by the following formula (1)
【００１９】[0019]
【化５】 [Chemical 5]
【００２０】 （重量割合でｎ＝１が0.4、ｎ＝２が0.6の混合物、エポキシ当量２３０、軟化点 ８０℃） ５重量部 オルソクレゾールノボラックエポキシ樹脂（エポキシ当量２３０、軟化点８０ ℃） １０重量部 下記式（３）で示されるパラキシレン変性ナフトール樹
脂硬化剤(Mixture in which n = 1 is 0.4 and n = 2 is 0.6 in weight ratio, epoxy equivalent 230, softening point 80 ° C.) 5 parts by weight Orthocresol novolac epoxy resin (epoxy equivalent 230, softening point 80 ° C.) 10 parts by weight Part Paraxylene-modified naphthol resin curing agent represented by the following formula (3)
【００２１】[0021]
【化６】 [Chemical 6]
【００２２】 （重量割合でｎ＝１が1、ｎ＝２が1.４、ｎ＝３が0.４、ｎ＝４が0.１の混合物 、水酸基当量２４０、軟化点１１０℃） ３重量部 フェノールノボラック樹脂硬化剤（水酸基当量１０４、軟化点９５℃） ６重量部 溶融シリカ粉末 ７５重量部 トリフェニルホスフィン ０．２重量部 カーボンブラック ０．３重量部 カルナバワックス ０．５重量部 をミキサーで常温で混合し、７０〜１００℃で２軸ロー
ルにより混練し、冷却後粉砕して成形材料とした。得ら
れた成形材料をタブレット化し、低圧トランスファー成
形機にて１７５℃、７０kg／cm2 、１２０秒の条件で半
田クラック試験用として６×６mmのチップを５２ｐパッ
ケージに封入し、また半田耐湿試験用として３×６mmの
チップを１６ｐＳＯＰパッケージに封入した。封止した
テスト用素子について下記の半田クラック試験及び半田
耐湿性試験を行った。(A mixture of n = 1 for n = 1, n = 2 for 1.4, n = 3 for 0.4, and n = 4 for 0.1 by weight ratio, hydroxyl equivalent 240, softening point 110 ° C.) 3% by weight Parts Phenol novolac resin curing agent (hydroxyl equivalent 104, softening point 95 ° C.) 6 parts by weight fused silica powder 75 parts by weight triphenylphosphine 0.2 parts by weight carbon black 0.3 parts by weight Carnauba wax 0.5 parts by weight with a mixer The mixture was mixed at room temperature, kneaded with a biaxial roll at 70 to 100 ° C., cooled and pulverized to obtain a molding material. The obtained molding material is made into a tablet, and a 6 x 6 mm chip is encapsulated in a 52p package for a solder crack test under conditions of 175 ° C, 70 kg / cm 2 and 120 seconds on a low-pressure transfer molding machine, and also for a solder moisture resistance test. A 3 × 6 mm chip was encapsulated in a 16 pSOP package. The sealed test element was subjected to the following solder crack test and solder moisture resistance test.
【００２３】半田クラック試験：封止したテスト用素子
を８５℃、８５％ＲＨの環境下で４８Ｈｒ及び７２Ｈｒ
処理し、その後２６０℃の半田槽に１０秒間浸漬後、顕
微鏡で外部クラックを観察した。 半田耐湿性試験：封止したテスト用素子を８５℃、８５
％ＲＨの環境下で７２Ｈｒ処理し、その後２６０℃の半
田槽に１０秒間浸漬後、プレッシャ−クッカー試験（１
２５℃、１００％ＲＨ）を行い、回路のオープン不良を
測定した。試験結果を表１に示す。Solder crack test: The sealed test element was subjected to an environment of 85 ° C. and 85% RH for 48 hours and 72 hours.
After processing, it was immersed in a solder bath at 260 ° C. for 10 seconds, and external cracks were observed with a microscope. Solder moisture resistance test: sealed test element at 85 ° C, 85
It is treated for 72 hours in an environment of% RH and then immersed in a solder bath at 260 ° C. for 10 seconds, and then subjected to a pressure cooker test (1
25 degreeC, 100% RH was performed, and the open defect of the circuit was measured. The test results are shown in Table 1.
【００２４】実施例２〜５ 表１の処方に従って配合し、実施例１と同様にして成形
材料を得た。この成形材料でテスト用素子を封止した成
形品を得、この成形品を用いて実施例１と同様に半田ク
ラック試験及び半田耐湿性試験を行った。試験結果を表
１に示す。 比較例１〜５ 表２の処方に従って配合し、実施例１と同様にして成形
材料を得た。この成形材料でテスト用素子を封止した成
形品を得、この成形品を用いて実施例１と同様に半田ク
ラック試験及び半田耐湿性試験を行った。試験結果を表
２に示す。Examples 2 to 5 Compounding was performed according to the formulation shown in Table 1, and a molding material was obtained in the same manner as in Example 1. A molded product in which a test element was sealed with this molding material was obtained, and a solder crack test and a solder moisture resistance test were conducted using this molded product in the same manner as in Example 1. The test results are shown in Table 1. Comparative Examples 1 to 5 Compounding was performed according to the formulation shown in Table 2, and a molding material was obtained in the same manner as in Example 1. A molded product in which a test element was sealed with this molding material was obtained, and a solder crack test and a solder moisture resistance test were conducted using this molded product in the same manner as in Example 1. The test results are shown in Table 2.
【００２５】[0025]
【表１】 [Table 1]
【００２６】[0026]
【表２】 [Table 2]
【００２７】[0027]
【発明の効果】本発明に従うと従来技術では得ることが
できなかった耐半田ストレス性を有するエポキシ樹脂組
成物を得ることができるので、半田付け工程時の耐クラ
ック性に非常に優れ、更に耐湿性が良好なことから表面
実装パッケージに搭載された高集積大型チップＩＣにお
いて好適である。According to the present invention, it is possible to obtain an epoxy resin composition having resistance to solder stress which could not be obtained by the prior art. It is suitable for a highly integrated large chip IC mounted in a surface mount package because of its excellent property.
【手続補正書】[Procedure amendment]
【提出日】平成４年２月３日[Submission date] February 3, 1992
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００２[Name of item to be corrected] 0002
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００２】[0002]
【従来の技術】従来、ダイオード、トランジスタ、集積
回路等の電子部品を熱硬化性樹脂で封止しているが、特
に集積回路では耐熱性、耐湿性に優れたｏ−クレゾール
ノボラックエポキシ樹脂をノボラック型フェノール樹脂
で硬化させたエポキシ樹脂組成物が用いられている。と
ころが近年、集積回路の高集積化に伴いチップがだんだ
ん大型化し、かつパッケージは従来のＤＩＰタイプか
ら、表面実装化された小型、薄型のＱＦＰ，ＳＯＰ，Ｓ
ＯＪ，ＰＬＣＣに変わってきている。つまり大型チップ
を、小型で薄いパッケージに封入することになり、応力
によりクラックが発生、これらのクラックによる耐湿性
の低下等の問題が大きくクローズアップされてきてい
る。特に半田付けの工程において、急激に２５０℃以上
の高温にさらされることにより、前記の問題点が発生し
ており、これらの大型チップを封止するのに適した、信
頼性の高い封止用樹脂組成物の開発が望まれてきてい
る。2. Description of the Related Art Conventionally, electronic parts such as diodes, transistors, and integrated circuits have been sealed with thermosetting resin. Especially, in integrated circuits, o-cresol novolac epoxy resin, which is excellent in heat resistance and moisture resistance, is used as a novolac resin. An epoxy resin composition cured with a type phenolic resin is used. However, in recent years, as the integration of integrated circuits has increased, the size of the chip has gradually increased, and the package has been changed from the conventional DIP type to a surface mount small and thin QFP, SOP, S.
It is changing to OJ and PLCC. In other words, a large chip is to be enclosed in a small and thin package, and cracks are generated due to stress, and problems such as deterioration of moisture resistance due to these cracks have been greatly highlighted. Especially in the soldering process, the above-mentioned problems are caused by being rapidly exposed to a high temperature of 250 ° C. or higher, and it is suitable for sealing these large-sized chips and has high reliability. The development of resin compositions has been desired.
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００３[Name of item to be corrected] 0003
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００３】これらの問題点を解決するために、半田付
け時に熱衝撃を緩和する目的で、熱可塑性オリゴマーの
添加（特開昭６２−１１５８４９号公報）や各種シリコ
ーン化合物の添加（特開昭６２−１１５８５０号公報、
６２−１１６６５４号公報、６２−１２８１６２号公
報）、さらにはシリコーン変性（特開昭６２−１３６８
６０号公報）等の手法で対処しているが、いずれも半田
付け時にパッケージにクラックが生じてしまい、信頼性
の高い封止用エポキシ樹脂組成物を得るまでには至らな
かった。In order to solve these problems, addition of a thermoplastic oligomer (Japanese Patent Laid-Open No. 62-15849) and various silicone compounds (Japanese Patent Laid-Open No. 62-15849) for the purpose of mitigating thermal shock during soldering. -11850 publication,
62-116654, 62-128162), and further silicone modification (JP-A-62-1368).
No. 60), but cracks occur in the package during soldering, and it has not been possible to obtain a highly reliable epoxy resin composition for sealing.
【手続補正３】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１５[Correction target item name] 0015
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１５】さらに本発明に用いる硬化促進剤はエポキ
シ基とフェノール性水酸機の反応を促進するものであれ
ば良く、一般に封止材料に使用されているものを広く使
用することができる。例えばトリフェニルホスフィン
（ＴＰＰ）、トリブチルホスフィン、トリ（４−メチル
フェニル）ホスフィン等の有機ホスフィン化合物、トリ
ブチルアミン、トリエチルアミン、ベンジルジメチルア
ミン、トリスジメチルアミノメチルフェノール、１，８
−ジアザビシクロ［５，４，０］−７−ウンデセン（Ｄ
ＢＵ）等の３級アミン、２−メチルイミダゾール、２−
フェニルイミダゾール、２−エチル−４−メチルイミダ
ゾール等のイミダゾール化合物等があげられる。これら
を単独で用いても、あるいはその２種以上の併用も可能
である。本発明の組成物は前述のもの以外、必要に応じ
てカーボンブラック等の着色剤、カルナバワックス、合
成ワックス等の離型剤、ブロム化エポキシ樹脂、三酸化
アンチモン等の難燃剤、γ−グリシドキシプロピルトリ
メトキシシラン等のカップリング剤、シリコーンオイ
ル、ゴム等の低応力成分を添加することができる。Further, the curing accelerator used in the present invention may be any one as long as it accelerates the reaction between the epoxy group and the phenolic hydroxide machine, and those generally used for sealing materials can be widely used. For example, organic phosphine compounds such as triphenylphosphine (TPP), tributylphosphine, tri (4-methylphenyl) phosphine, tributylamine, triethylamine, benzyldimethylamine, trisdimethylaminomethylphenol, 1,8
-Diazabicyclo [5,4,0] -7-undecene (D
BU) and other tertiary amines, 2-methylimidazole, 2-
Examples thereof include imidazole compounds such as phenylimidazole and 2-ethyl-4-methylimidazole. These may be used alone or in combination of two or more. The composition of the present invention may be a colorant such as carbon black, a mold release agent such as carnauba wax and a synthetic wax, a brominated epoxy resin, a flame retardant such as antimony trioxide, and a γ-glycid other than those described above. A coupling agent such as xypropyltrimethoxysilane and a low stress component such as silicone oil and rubber can be added.
【手続補正４】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００２０[Correction target item name] 0020
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００２０】 （重量割合でｎ＝１が0.4、ｎ＝２が0.6の混合物、エポキシ当量２３０、軟化点 ８０℃） ５重量部 オルソクレゾールノボラックエポキシ樹脂（エポキシ当量２００、軟化点６５ ℃） １０重量部 下記式（３）で示されるパラキシレン変性ナフトール樹
脂硬化剤(Mixture in which n = 1 is 0.4 and n = 2 is 0.6 in weight ratio, epoxy equivalent 230, softening point 80 ° C.) 5 parts by weight Orthocresol novolac epoxy resin (epoxy equivalent 200, softening point 65 ° C.) 10 parts by weight Part Paraxylene-modified naphthol resin curing agent represented by the following formula (3)
【手続補正５】[Procedure Amendment 5]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００２２[Name of item to be corrected] 0022
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００２２】 （重量割合でｎ＝１が1、ｎ＝２が1.４、ｎ＝３が0.４、ｎ＝４が0.１の混合物 、水酸基当量２４０、軟化点１１０℃） ３重量部 フェノールノボラック樹脂硬化剤（水酸基当量１０４、軟化点９５℃） ６重量部 溶融シリカ粉末 ７５重量部 トリフェニルホスフィン ０．２重量部 カーボンブラック ０．３重量部 カルナバワックス ０．５重量部 をミキサーで常温で混合し、７０〜１００℃で２軸ロー
ルにより混練し、冷却後粉砕して成形材料とした。得ら
れた成形材料をタブレット化し、低圧トランスファー成
形機にて１７５℃、７０kg／cm2 、１２０秒の条件で半
田クラック試験用として６×６mmのチップを５２ｐＱＦ
Ｐパッケージに封入し、また半田耐湿試験用として３×
６mmのチップを１６ｐＳＯＰパッケージに封入した。封
止したテスト用素子について下記の半田クラック試験及
び半田耐湿性試験を行った。(A mixture of n = 1 for n = 1, n = 2 for 1.4, n = 3 for 0.4, and n = 4 for 0.1 by weight ratio, hydroxyl equivalent 240, softening point 110 ° C.) 3% by weight Parts Phenol novolac resin curing agent (hydroxyl equivalent 104, softening point 95 ° C.) 6 parts by weight fused silica powder 75 parts by weight triphenylphosphine 0.2 parts by weight carbon black 0.3 parts by weight Carnauba wax 0.5 parts by weight with a mixer The mixture was mixed at room temperature, kneaded with a biaxial roll at 70 to 100 ° C., cooled and pulverized to obtain a molding material. The obtained molding material is made into a tablet, and a 6 × 6 mm chip for solder crack test is put on a low-pressure transfer molding machine under the conditions of 175 ° C., 70 kg / cm 2 and 120 seconds for 52 pQF.
Enclosed in P package and for solder moisture resistance test 3 ×
A 6 mm chip was encapsulated in a 16 pSOP package. The sealed test element was subjected to the following solder crack test and solder moisture resistance test.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ０８Ｇ 59/62 ＮＪＵ 8416−4Ｊ Ｃ０８Ｋ 3/36 ＮＫＸ 7167−4Ｊ Ｃ０８Ｌ 63/00 ＮＪＷ 8830−4Ｊ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI Technical display location C08G 59/62 NJU 8416-4J C08K 3/36 NKX 7167-4J C08L 63/00 NJW 8830-4J
Claims (1)
樹脂 【化１】 （ｎ＝１〜６）を総エポキシ樹脂量に対して３０〜１０
０重量％含むエポキシ樹脂、（Ｂ）下記式（２）で示さ
れるナフトール樹脂硬化剤 【化２】 （ｎ＝１〜６）を総硬化剤量に対して３０〜１００重量
％含む硬化剤、（Ｃ）無機質充填材及び （Ｄ）硬化促進剤 を必須成分とする半導体封止用エポキシ樹脂組成物。1. An epoxy resin represented by the following formula (1): (N = 1 to 6) is 30 to 10 relative to the total amount of epoxy resin
An epoxy resin containing 0% by weight, (B) a naphthol resin curing agent represented by the following formula (2): Epoxy resin composition for semiconductor encapsulation containing (n = 1 to 6) a curing agent containing 30 to 100% by weight based on the total amount of the curing agent, (C) an inorganic filler, and (D) a curing accelerator as essential components. .
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3-329276 | 1991-12-13 | ||
| JP32927691 | 1991-12-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05218239A true JPH05218239A (en) | 1993-08-27 |
| JP2951092B2 JP2951092B2 (en) | 1999-09-20 |
Family
ID=18219644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33850491A Expired - Fee Related JP2951092B2 (en) | 1991-12-13 | 1991-12-20 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2951092B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG87012A1 (en) * | 1997-11-10 | 2002-03-19 | Sumitomo Bakelite Co | Epoxy resin composition and semiconductor device using the same |
| WO2013035808A1 (en) * | 2011-09-08 | 2013-03-14 | 日本化薬株式会社 | Epoxy resin, epoxy resin composition, and cured product thereof |
| WO2014050419A1 (en) * | 2012-09-25 | 2014-04-03 | Dic株式会社 | Epoxy resin, curable resin composition, cured product thereof, and printed circuit board |
-
1991
- 1991-12-20 JP JP33850491A patent/JP2951092B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG87012A1 (en) * | 1997-11-10 | 2002-03-19 | Sumitomo Bakelite Co | Epoxy resin composition and semiconductor device using the same |
| WO2013035808A1 (en) * | 2011-09-08 | 2013-03-14 | 日本化薬株式会社 | Epoxy resin, epoxy resin composition, and cured product thereof |
| JP2013056987A (en) * | 2011-09-08 | 2013-03-28 | Nippon Kayaku Co Ltd | Epoxy resin, epoxy resin composition, and cured material thereof |
| CN103906782A (en) * | 2011-09-08 | 2014-07-02 | 日本化药株式会社 | Epoxy resin, epoxy resin composition, and cured product thereof |
| WO2014050419A1 (en) * | 2012-09-25 | 2014-04-03 | Dic株式会社 | Epoxy resin, curable resin composition, cured product thereof, and printed circuit board |
| JP5532368B1 (en) * | 2012-09-25 | 2014-06-25 | Ｄｉｃ株式会社 | Epoxy resin, curable resin composition, cured product thereof, and printed wiring board |
| CN104704021A (en) * | 2012-09-25 | 2015-06-10 | Dic株式会社 | Epoxy resin, curable resin composition, cured product thereof, and printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2951092B2 (en) | 1999-09-20 |
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