JP2000012991A - Circuit board forming member having variable thickness conductor layer and circuit board using the same - Google Patents
Circuit board forming member having variable thickness conductor layer and circuit board using the sameInfo
- Publication number
- JP2000012991A JP2000012991A JP10171409A JP17140998A JP2000012991A JP 2000012991 A JP2000012991 A JP 2000012991A JP 10171409 A JP10171409 A JP 10171409A JP 17140998 A JP17140998 A JP 17140998A JP 2000012991 A JP2000012991 A JP 2000012991A
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- Japan
- Prior art keywords
- circuit board
- conductor layer
- thickness
- layer
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、回路基板形成部材
およびそれを用いた回路基板、特に同一基板内で微細回
路形成と電気接点用突起形成とを容易に行うことのでき
る回路基板形成部材およびそれを用いた回路基板に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board forming member and a circuit board using the same, and more particularly to a circuit board forming member capable of easily forming a fine circuit and forming a projection for an electrical contact within the same substrate. The present invention relates to a circuit board using the same.
【０００２】[0002]
【従来の技術】従来の回路基板としては、図２（１）に
示す３層基板と図２（２）に示す２層基板とが知られて
いる。図２（１）の３層基板では、絶縁層１であるベー
スフィルムと導体層３である回路配線とが接着層２を介
して積層されている。図２（２）の２層基板では、絶縁
層１であるベースフィルムと導体層３である回路配線と
が接着層を介さずに、直接積層されている。また、いず
れの回路基板も、回路配線上部は、必要に応じて、接着
層を用いて絶縁層４であるカバーレイフィルムが施され
ている。これらの回路基板には、導体回路として導体層
３の厚さが８〜８０μｍの金属箔、特に銅箔が使用され
るが、導体層３の厚さは、同一基板内で同一である。2. Description of the Related Art As a conventional circuit board, a three-layer board shown in FIG. 2A and a two-layer board shown in FIG. 2B are known. In the three-layer substrate shown in FIG. 2A, a base film as an insulating layer 1 and a circuit wiring as a conductor layer 3 are laminated via an adhesive layer 2. In the two-layer board of FIG. 2B, the base film as the insulating layer 1 and the circuit wiring as the conductor layer 3 are directly laminated without interposing an adhesive layer. In addition, in each of the circuit boards, a cover lay film as the insulating layer 4 is provided on the upper portion of the circuit wiring as necessary using an adhesive layer. For these circuit boards, a metal foil having a thickness of 8 to 80 μm, particularly a copper foil, is used as a conductor circuit, and the thickness of the conductor layer 3 is the same in the same substrate.
【０００３】しかし、基板内の導体層の厚さが同一であ
る場合、例えば突起構造を有する電気接点部分と微細な
回路配線からなる回路基板を製造する場合、以下のよう
な問題がある。すなわち、張出成形法によって電気接点
用突起を形成する場合、導体層の厚さが薄いと、張出成
形加工部の金属箔が破れる、または開口するという問題
がある。従って、電気接点部分の導体の厚さは、厚いこ
とが望まれる。一方、導体の厚さが厚ければ、微細な回
路配線部分を湿式エッチング法で形成するため、回路形
成が困難になるという問題がある。However, when the thickness of the conductor layer in the substrate is the same, for example, when manufacturing a circuit board composed of electric contact portions having a protruding structure and fine circuit wiring, there are the following problems. That is, when the projections for electric contacts are formed by the overhang forming method, if the thickness of the conductor layer is small, there is a problem that the metal foil of the overhang-formed portion is broken or opened. Therefore, it is desired that the thickness of the conductor in the electric contact portion is large. On the other hand, if the thickness of the conductor is large, a fine circuit wiring portion is formed by a wet etching method, so that there is a problem that circuit formation becomes difficult.
【０００４】[0004]
【発明が解決しようとする課題】本発明の目的は、上記
問題を解決し、電気接点用突起の形成と微細な回路配線
部分の形成とを容易に行うことができる回路基板形成部
材およびそれを用いた回路基板を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and to provide a circuit board forming member capable of easily forming a projection for an electric contact and forming a fine circuit wiring portion, and a circuit board forming member. It is to provide a used circuit board.
【０００５】[0005]
【課題を解決するための手段】本発明者は、上記の課題
を解決すべく鋭意検討した結果、同一の絶縁層に積層す
る導体層の厚さが異なれば、電気接点用突起と微細な回
路配線部分の形成とを容易に行うことができることが判
明した。即ち、本発明は以下のとおりである。 導体層と絶縁層とが積層されてなる回路基板形成部
材であって、少なくとも導体層の電気接点用突起加工部
の厚さが、導体層の配線パターン形成部の厚さよりも厚
いことを特徴とする回路基板形成部材。 少なくとも上記導体層の電気接点用突起加工部の厚
さが１５〜８０μｍであり、上記導体層の配線パターン
形成部の厚さが５〜６０μｍであるに記載の回路基板
形成部材。 少なくとも上記導体層の電気接点用突起加工部の厚
さが、上記導体層の配線パターン形成部の厚さよりも、
５μｍ以上厚くなっているまたはに記載の回路基板
形成部材。 少なくとも上記導体層の電気接点用突起加工部と配
線パターン形成部とが一体成形されている〜のいず
れかに記載の回路基板形成部材。 上記〜のいずれかに記載の回路基板形成部材か
らなる回路基板。 上記回路基板が可撓性であるに記載の回路基板。 電気接点用突起の頭部の導体部分の厚さが、１５〜
２５μｍであるまたはに記載の回路基板。The present inventors have conducted intensive studies to solve the above-mentioned problems. As a result, if the thickness of the conductor layer laminated on the same insulating layer is different, the protrusion for electric contact and the fine circuit It has been found that the formation of the wiring portion can be easily performed. That is, the present invention is as follows. A circuit board forming member formed by laminating a conductor layer and an insulating layer, wherein at least the thickness of the electrical contact projection processing portion of the conductor layer is larger than the thickness of the wiring pattern formation portion of the conductor layer. Circuit board forming member. The circuit board forming member according to the above, wherein at least a thickness of the electrical contact projection processed portion of the conductor layer is 15 to 80 μm, and a thickness of the wiring pattern forming portion of the conductor layer is 5 to 60 μm. At least the thickness of the electrical contact protruding portion of the conductor layer is greater than the thickness of the wiring pattern forming portion of the conductor layer,
The circuit board forming member according to or described in or having a thickness of 5 μm or more. The circuit board forming member according to any one of the above-mentioned items, wherein at least the electric contact projecting portion of the conductor layer and the wiring pattern forming portion are integrally formed. A circuit board comprising the circuit board forming member according to any one of the above. The circuit board according to the above, wherein the circuit board is flexible. The thickness of the conductor at the head of the electrical contact projection is 15 to
A circuit board having a thickness of 25 μm.
【０００６】[0006]
【作用】本発明は、上記手段を講じたので、少なくとも
導体部の電気接点用突起の形成が必要な部分を厚く、微
細な回路配線部分の形成が必要な部分を薄くしたので、
同一基板上で電気接点用突起の形成と微細な回路配線部
分の形成とを容易に行うことができる。According to the present invention, since the above means are taken, at least a portion of the conductor portion where the electrical contact projection is required to be formed is thickened, and a portion where the fine circuit wiring portion is required to be formed is thinned.
The formation of the electrical contact projection and the formation of the fine circuit wiring portion can be easily performed on the same substrate.
【０００７】[0007]
【発明の実施の形態】以下、本発明を詳細に説明する。
図１は、本発明の回路基板形成部材の一例を示してい
る。また、図３は、本発明の回路基板形成部材を用いた
回路基板の一例を示している。さらに、図４は、図３の
回路基板のＡ−Ａ’断面の部分的拡大図を、図５は、図
３の回路基板のＢ−Ｂ’断面の部分的拡大図を、図６
は、図３の回路基板のＣ−Ｃ’断面の部分的拡大図を、
それぞれ示している。なお、図３では、説明のために回
路配線を５本として、簡単に表現している。本発明で
は、図１に示すように、少なくとも電気接点用突起加工
部３−３の導体層３の厚さが厚いので、張出成形法によ
っても破損しない電気接点用突起が得られる。また、配
線パターン形成部３−２の導体層３の厚さが薄いので、
微細な回路配線を形成できる。また、電気接続端子形成
部３−１の厚さを、図１に示すように電気接点用突起加
工部３−３の厚さと同じ厚さにすると、粗い回路配線が
形成できるので、図４に示すような電気接続端子が容易
に形成できる。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.
FIG. 1 shows an example of a circuit board forming member of the present invention. FIG. 3 shows an example of a circuit board using the circuit board forming member of the present invention. 4 is a partially enlarged view of a cross section taken along line AA 'of the circuit board of FIG. 3, and FIG. 5 is a partially enlarged view of a cross section taken along line BB' of the circuit board of FIG.
Is a partially enlarged view of a cross section taken along line CC ′ of the circuit board in FIG.
Each is shown. Note that, in FIG. 3, for the sake of explanation, five circuit wirings are simply represented. In the present invention, as shown in FIG. 1, at least the thickness of the conductor layer 3 of the electrical contact projection processing section 3-3 is large, so that the electrical contact projection which is not damaged by the overhang molding method can be obtained. Further, since the thickness of the conductor layer 3 of the wiring pattern forming section 3-2 is small,
Fine circuit wiring can be formed. If the thickness of the electrical connection terminal forming portion 3-1 is the same as the thickness of the electrical contact projection forming portion 3-3 as shown in FIG. 1, coarse circuit wiring can be formed. Electrical connection terminals as shown can be easily formed.
【０００８】本発明の導体層３として使用できる導電性
材料としては、導電性を有するものであればいずれでも
使用できる。導電性材料として例えば、銅、金、銀、ア
ルミニウム、ニッケル、鉄、ハンダ、鉛、白金等の金属
材料等が挙げられる。これらの導電性材料は、単独で、
または二種以上を組み合わせて使用できる。導電性材料
は、本発明の基板の使用目的により適宜選択できるが、
好ましくは導電性に優れる銅、金、アルミニウムであ
る。As the conductive material that can be used as the conductor layer 3 of the present invention, any conductive material can be used. Examples of the conductive material include metal materials such as copper, gold, silver, aluminum, nickel, iron, solder, lead, and platinum. These conductive materials alone,
Alternatively, two or more kinds can be used in combination. The conductive material can be appropriately selected depending on the purpose of use of the substrate of the present invention,
Preferably, copper, gold, and aluminum having excellent conductivity are used.
【０００９】これらの導電性材料は、通常、金属箔とし
て用いる。金属箔は、圧延箔、電解箔などいずれの製法
による金属箔であってもよい。These conductive materials are usually used as a metal foil. The metal foil may be a metal foil formed by any method such as a rolled foil and an electrolytic foil.
【００１０】本発明の絶縁層１に用いられる絶縁材料と
しては、十分な絶縁特性を有しているものであれば、特
に制限されず、公知のものを使用することができる。絶
縁性を有する材料としては、熱硬化性樹脂、熱可塑性樹
脂などの公知の絶縁材料が挙げられる。具体的には、フ
ェノール系、ビフェニル系などのエポキシ樹脂、ポリエ
ステル樹脂、アクリル樹脂、シリコーン樹脂、ポリウレ
タン樹脂、ポリカルボジイミド樹脂等の熱硬化性樹脂
や、フェノキシ樹脂、フッ素樹脂、ナイロン６やナイロ
ン６，６などのポリアミド樹脂、ＰＥＴ系、ＰＢＴ系、
ポリエチレンナフタレート（ＰＥＮ）系などの飽和ポリ
エステル樹脂、ポリエーテルイミド樹脂、ポリアミドイ
ミド樹脂等のポリイミド樹脂等の熱可塑性樹脂が挙げら
れ、目的に応じて適宜選択される。これらの樹脂は単独
でも、２種以上混合して使用してもよい。回路基板に可
撓性を持たせる場合は、ポリイミド樹脂、ＰＥＮ樹脂な
どの飽和ポリエステル樹脂などが使用できる。The insulating material used for the insulating layer 1 of the present invention is not particularly limited as long as it has sufficient insulating properties, and known materials can be used. Examples of the insulating material include known insulating materials such as a thermosetting resin and a thermoplastic resin. Specifically, a thermosetting resin such as a phenol-based or biphenyl-based epoxy resin, a polyester resin, an acrylic resin, a silicone resin, a polyurethane resin, a polycarbodiimide resin, a phenoxy resin, a fluororesin, nylon 6, nylon 6, or the like. 6, polyamide resin such as PET, PBT,
Saturated polyester resins such as polyethylene naphthalate (PEN) and thermoplastic resins such as polyetherimide resin and polyimide resin such as polyamideimide resin are exemplified, and are appropriately selected according to the purpose. These resins may be used alone or in combination of two or more. When the circuit board has flexibility, a saturated polyester resin such as a polyimide resin or a PEN resin can be used.
【００１１】絶縁層１は、通常フィルム状にして使用す
る。フィルムの厚さとしては、通常１０〜８０μｍ程
度、好ましくは１５〜３０μｍ程度である。The insulating layer 1 is usually used in the form of a film. The thickness of the film is usually about 10 to 80 μm, preferably about 15 to 30 μm.
【００１２】導体層３と絶縁層１とは、直接積層するこ
ともできるが、接着層２を介して積層することもでき
る。接着層２を介して積層する場合、接着層２として使
用できるのは、熱硬化性接着剤（例えば、エポキシゴム
系接着剤など）、熱可塑性接着剤（例えば、合成ゴム系
接着剤など）、粘着剤（例えば、アクリル系粘着剤な
ど）などが挙げられる。好ましくは、接着力、耐熱性、
耐湿熱性、作業性、耐久性などの特性に優れる熱硬化性
接着剤である。接着層２の厚さは、５〜５０μｍ程度、
好ましくは１０〜３０μｍ程度である。The conductor layer 3 and the insulating layer 1 can be directly laminated, but can also be laminated via the adhesive layer 2. When laminating via the adhesive layer 2, the adhesive layer 2 can be used with a thermosetting adhesive (for example, an epoxy rubber adhesive), a thermoplastic adhesive (for example, a synthetic rubber adhesive), An adhesive (for example, an acrylic adhesive) is used. Preferably, adhesive strength, heat resistance,
It is a thermosetting adhesive with excellent properties such as wet heat resistance, workability, and durability. The thickness of the adhesive layer 2 is about 5 to 50 μm,
Preferably it is about 10 to 30 μm.
【００１３】導体層３と絶縁層１との積層は、導体層３
と絶縁層１とが積層できるものであれば、方法は問わな
いが、通常熱圧着法により行う。この場合に、熱圧着の
条件としては、温度８０〜１５０℃、圧力２０〜１００
Ｋｇ／ｃｍ2 、時間３０〜６０分程度である。また、絶
縁層１の外形寸法が、縦２０ｃｍ、横１００ｃｍを越え
る程大きい場合は、ロール法により行う。The lamination of the conductor layer 3 and the insulating layer 1 is performed by the conductor layer 3
The method is not particularly limited as long as it can be laminated with the insulating layer 1, and is usually performed by a thermocompression bonding method. In this case, the conditions of the thermocompression bonding are a temperature of 80 to 150 ° C. and a pressure of 20 to 100.
Kg / cm 2 , and the time is about 30 to 60 minutes. When the outer dimensions of the insulating layer 1 exceed 20 cm in length and 100 cm in width, it is performed by a roll method.
【００１４】本発明の回路基板形成部材は、少なくとも
導体層３の電気接点用突起加工部３−３の厚さに対し
て、導体層３の配線パターン形成部３−２の厚さが薄い
ことを特徴としている。このような厚さの異なる導体層
３の形状としては、例えば、図７に示すように、導体層
の配線パターン形成部に相当する長手方向上面が削られ
ているもの（１）、導体層の配線パターン形成部に相当
する長手方向下面が削られているもの（２）、導体層の
配線パターン形成部に相当する長手方向両面が削られて
いるもの（３）などが挙げられる。また、導体層３の電
気接続端子接続部３−１および電気接点用突起加工部３
−３の厚さに対して、導体層３の配線パターン形成部３
−２の厚さが薄い構造であってもよい。例えば、導体層
の配線パターン形成部が長手方向上面に凹設されている
形状のもの、導体層の配線パターン形成部が長手方向下
面に凹設されている形状のもの、導体層の配線パターン
形成部の長手方向両面が凹状に陥没している形状のもの
などである。In the circuit board forming member of the present invention, the thickness of the wiring pattern forming portion 3-2 of the conductor layer 3 is at least smaller than the thickness of the electrical contact projection processing portion 3-3 of the conductor layer 3. It is characterized by. As the shape of the conductor layer 3 having such a different thickness, for example, as shown in FIG. 7, an upper surface in the longitudinal direction corresponding to a wiring pattern forming portion of the conductor layer is shaved (1), Examples are those in which the lower surface in the longitudinal direction corresponding to the wiring pattern forming portion is shaved (2) and those in which both surfaces in the longitudinal direction corresponding to the wiring pattern forming portion of the conductor layer are shaved (3). In addition, the electrical connection terminal connection part 3-1 of the conductor layer 3 and the projection part 3 for electrical contact
-3, the wiring pattern forming portion 3 of the conductor layer 3
-2 may be a thin structure. For example, the wiring pattern forming portion of the conductor layer is recessed on the upper surface in the longitudinal direction, the wiring pattern forming portion of the conductor layer is recessed on the lower surface in the longitudinal direction, the wiring pattern forming portion of the conductor layer is formed. For example, a shape in which both sides in the longitudinal direction of the portion are depressed in a concave shape.
【００１５】厚さの異なる導体層３の製造は、特に制限
されず、物理的方法、化学的方法いずれであってもよ
い。具体的には、導体層３の厚みを薄くしたい部分を機
械的にグラインダーなどを用いて研磨する方法、化学的
研磨方法、金属箔を圧延法で製造する場合に圧延ロール
形状を凸状にすることによる方法などが挙げられる。The production of the conductor layers 3 having different thicknesses is not particularly limited, and may be a physical method or a chemical method. Specifically, a method of mechanically polishing a portion of the conductor layer 3 where the thickness is desired to be reduced using a grinder or the like, a chemical polishing method, and forming a rolling roll in a convex shape when a metal foil is manufactured by a rolling method. And other methods.
【００１６】化学的研磨法による場合、好ましい方法
は、湿式エッチング法である。湿式エッチング法では、
導体部の厚さを保持したい部分に、エッチング用保護レ
ジスト膜を設け、導体層の厚みを薄くしたい部分は開口
しておく。導体をエッチング液の中に浸漬する、または
スプレー等を用いてエッチング液を噴霧することによ
り、開口している部分のみを所望の厚さまで研磨でき
る。開口している部分が所望の厚さに達した後に、エッ
チング用保護レジスト膜を除去することで、厚さの異な
る導体層３が得られる。In the case of using the chemical polishing method, a preferable method is a wet etching method. In the wet etching method,
A protective resist film for etching is provided in a portion where the thickness of the conductor is desired to be maintained, and an opening is provided in a portion where the thickness of the conductor layer is desired to be reduced. By immersing the conductor in the etchant or spraying the etchant with a spray or the like, only the opening portion can be polished to a desired thickness. After the opening has reached a desired thickness, the protective resist film for etching is removed to obtain conductor layers 3 having different thicknesses.
【００１７】エッチング液は、通常の湿式エッチング法
に使用できるものであれば、特に制限されず、具体的に
は過硫酸ナトリウム、過硫酸アンモニウム、塩化第二
鉄、塩化第二銅などの溶液が挙げられる。The etchant is not particularly limited as long as it can be used in a usual wet etching method, and specific examples thereof include solutions of sodium persulfate, ammonium persulfate, ferric chloride, cupric chloride and the like. Can be
【００１８】厚さの異なる導体層は、導体層の厚みを薄
くしたい部分を研磨する以外に、導体層の厚みを厚くし
たい部分に該当する部分に、電気メッキや無電解メッキ
のようなメッキや気相分解法などによって、上記導体層
を構成する金属材料を積層することにより行うこともで
きる。The conductor layers having different thicknesses are not only polished on the portions where the thickness of the conductor layer is desired to be reduced, but also on the portions corresponding to the portions where the thickness of the conductor layer is desired to be increased by plating such as electroplating or electroless plating. It can also be performed by laminating a metal material constituting the above-mentioned conductor layer by a vapor phase decomposition method or the like.
【００１９】厚さの異なる導体層を得る方法としては、
配線パターン形成部を機械的、化学的に研磨する方法
や、圧延法が好ましい。このような方法で製造すると、
少なくとも導体層の電気接点用突起加工部３−３と配線
パターン形成部３−２とが一体成形されるので、電気的
導通特性に優れる。また、電気接続端子形成部３−１に
ついても一体成形するとさらに電気的導通特性に優れ
る。A method for obtaining conductor layers having different thicknesses is as follows.
A method of mechanically and chemically polishing the wiring pattern forming portion or a rolling method is preferable. When manufactured in this way,
Since at least the electrical contact protruding portion 3-3 of the conductor layer and the wiring pattern forming portion 3-2 are integrally formed, the electrical conduction characteristics are excellent. Also, when the electric connection terminal forming portion 3-1 is integrally molded, the electric conduction characteristics are further improved.
【００２０】本発明の導体層の電気接点用突起加工部３
−３の厚さは、１５〜８０μｍ、好ましくは２０〜４０
μｍ程度であり、かつ、導体層の配線パターン形成部３
−２の厚さは、５〜６０μｍ、好ましくは１０〜３０μ
ｍ程度である。このように、少なくとも導体層の電気接
点用突起加工部３−３の厚さが、導体層の配線パターン
形成部３−２の厚さよりも厚くなっているので、電気接
点用突起の形成と微細な回路配線部分の形成とを容易に
行うことができる。また、導体層の電気接続端子形成部
３−１の厚さが電気接点用突起加工部３−３の厚さと同
じであれば、電気接続端子の形成が容易となる。[0020] Protrusion processed part 3 for electric contact of conductor layer of the present invention
-3 is 15 to 80 μm, preferably 20 to 40 μm.
μm and the wiring pattern forming portion 3 of the conductor layer
-2 is 5 to 60 μm, preferably 10 to 30 μm
m. As described above, at least the thickness of the electrical contact projection processing portion 3-3 of the conductor layer is larger than the thickness of the wiring pattern formation portion 3-2 of the conductor layer. It is possible to easily form a simple circuit wiring portion. In addition, if the thickness of the electrical connection terminal forming portion 3-1 of the conductor layer is the same as the thickness of the electrical contact projection forming portion 3-3, the formation of the electrical connection terminal becomes easy.
【００２１】少なくとも上記導体層の電気接点用突起加
工部３−３の厚さは、上記導体層の配線パターン形成部
３−２の厚さよりも５μｍ以上厚くなっていることが好
ましい。両者の厚さに５μｍ以上の差があれば、突起部
の形成と微細な回路配線部分の形成とを更に容易に行う
ことができる。It is preferable that the thickness of at least the electrical contact projection portion 3-3 of the conductor layer is at least 5 μm thicker than the thickness of the wiring pattern formation portion 3-2 of the conductor layer. If there is a difference of 5 μm or more between the thicknesses, the formation of the projection and the formation of the fine circuit wiring portion can be performed more easily.
【００２２】このような導体層３を作製するのは、導体
層３を絶縁層１に積層する前であっても、後であっても
よい。導体層３を絶縁層１に積層する前であれば、図７
（２）、（３）の形状の導体層３が得られる。The production of the conductor layer 3 may be before or after the conductor layer 3 is laminated on the insulating layer 1. Before the conductor layer 3 is laminated on the insulating layer 1, FIG.
The conductor layer 3 having the shapes (2) and (3) is obtained.
【００２３】上記回路基板形成部材を用いた回路基板
は、例えば、以下のようにして作製する。図８（１）に
示すように、導体層３の電気接続端子形成部３−１およ
び電気接点用突起加工部３−３の厚さに対して、導体層
３の配線パターン形成部３−２の厚さが薄い導体層３を
絶縁層１に積層した回路基板形成部材の配線パターン形
成部３−２に導体回路配線を形成する（図８（２））。
導体回路配線６の形成は、通常、化学的研磨法、好まし
くは湿式エッチング法、さらに好ましくはサブトラクテ
ィブ法により行う。湿式エッチング法で導体回路配線６
を形成する場合は、上記の湿式エッチング法と実質的に
同一である。なお、図８（２）は、長手方向の断面図で
あるので、配線パターンが明らかでないが、実際には、
図３のＤ部のように配線パターンが形成されている。A circuit board using the circuit board forming member is manufactured, for example, as follows. As shown in FIG. 8A, the wiring pattern forming portion 3-2 of the conductor layer 3 is different from the thickness of the electric connection terminal forming portion 3-1 and the electric contact projection forming portion 3-3 of the conductor layer 3. The conductor circuit wiring is formed in the wiring pattern forming portion 3-2 of the circuit board forming member in which the conductor layer 3 having a small thickness is laminated on the insulating layer 1 (FIG. 8 (2)).
The formation of the conductive circuit wiring 6 is generally performed by a chemical polishing method, preferably a wet etching method, and more preferably a subtractive method. Conductive circuit wiring 6 by wet etching
Is substantially the same as the above-mentioned wet etching method. FIG. 8B is a cross-sectional view in the longitudinal direction, and the wiring pattern is not clear.
A wiring pattern is formed as in a D part in FIG.
【００２４】形成された導体回路配線６は、導体層３の
配線パターン形成部３−２の厚さが薄いので、回路幅が
２５〜７５μｍ程度、回路間隔が２５〜７５μｍ程度、
ピッチが５０〜１５０μｍ程度の微細な回路が形成でき
る。導体層の電気接続端子形成部３−１では、回路幅が
０．５〜１．２ｍｍ程度、回路間隔が０．２〜０．３ｍ
ｍ程度、ピッチが０．８〜１．５ｍｍ程度の粗い回路が
形成され、電気接続端子７となる。この例では、導体層
３の電気接続端子形成部３−１の厚さが、電気接点用突
起加工部３−３の厚さと同じものを使用したが、電気接
続端子形成部３−１の厚さが、配線パターン形成部３−
２の厚さと同じものを使用した場合には、別途電気接続
端子を取り付けてもよい。また、回路基板の両端に電気
接点用端子を設けてもよい。The formed conductor circuit wiring 6 has a circuit width of about 25 to 75 μm, a circuit interval of about 25 to 75 μm, since the thickness of the wiring pattern forming portion 3-2 of the conductor layer 3 is small.
A fine circuit having a pitch of about 50 to 150 μm can be formed. In the electrical connection terminal forming portion 3-1 of the conductor layer, the circuit width is about 0.5 to 1.2 mm, and the circuit interval is 0.2 to 0.3 m.
A coarse circuit having a length of about m and a pitch of about 0.8 to 1.5 mm is formed, and the electrical connection terminal 7 is formed. In this example, the thickness of the electrical connection terminal forming portion 3-1 of the conductor layer 3 is the same as the thickness of the electrical contact projection forming portion 3-3, but the thickness of the electrical connection terminal forming portion 3-1 is used. Saga, wiring pattern forming part 3-
In the case where the same thickness as that of No. 2 is used, an electric connection terminal may be separately attached. Further, terminals for electrical contacts may be provided at both ends of the circuit board.
【００２５】回路部分の上面は電気的絶縁性が必要とさ
れるので、図８（２）のような絶縁層４を設ける。絶縁
層４を設ける方法は、特に制限されないが、一般に、接
着層５を介して絶縁層４（カバーレイフィルム）を設け
る方法などが挙げられる。導体層３の両端は、外部の電
子部品と電気的接続が必要であるため、絶縁層４を設け
ない。Since the upper surface of the circuit portion needs to be electrically insulated, an insulating layer 4 as shown in FIG. 8B is provided. The method for providing the insulating layer 4 is not particularly limited, but generally includes a method for providing the insulating layer 4 (coverlay film) via the adhesive layer 5. Since both ends of the conductor layer 3 need to be electrically connected to external electronic components, the insulating layer 4 is not provided.
【００２６】カバーレイフィルムとして使用できるもの
としては、例えばポリイミド樹脂、ＰＥＴ、ＰＥＮなど
の不飽和ポリエステル樹脂などが挙げられる。Examples of the coverlay film that can be used include polyimide resins, unsaturated polyester resins such as PET and PEN, and the like.
【００２７】接着層５を介して絶縁層４を設ける場合
は、接着層５の厚さは、１０〜８０μｍ程度、好ましく
は１５〜３０μｍ程度、絶縁層４の厚さは、５〜５０μ
ｍ程度、好ましくは１０〜３０μｍ程度である。When the insulating layer 4 is provided via the adhesive layer 5, the thickness of the adhesive layer 5 is about 10 to 80 μm, preferably about 15 to 30 μm, and the thickness of the insulating layer 4 is 5 to 50 μm.
m, preferably about 10 to 30 μm.
【００２８】導体層３の電気接点用突起加工部３−３に
電気接点用突起８を設ける。電気接点用突起８は、機械
的な加工や、メッキなどにより突起を付加する化学的な
加工によることが可能である。好ましくは、基板下面か
らポンチを用いてプレス成形する張出形成法などの機械
的な加工である。An electric contact projection 8 is provided on the electric contact projection processed portion 3-3 of the conductor layer 3. The electrical contact projection 8 can be formed by mechanical processing or chemical processing of adding a projection by plating or the like. Preferably, it is a mechanical processing such as an overhang forming method in which a punch is pressed from the lower surface of the substrate using a punch.
【００２９】このようにして得られた電気接点用突起８
は、その突起の頭部の厚さが、１５〜２５μｍ、好まし
くは１５〜２０μｍである。この程度の厚さであれば、
電気接点として耐えうる強度を有する。The electrical contact projections 8 thus obtained
Has a projection with a head thickness of 15 to 25 μm, preferably 15 to 20 μm. With this thickness,
It has enough strength to withstand electrical contacts.
【００３０】電気接点用突起８や電気接続端子７には、
金（Ａｕ）などの貴金属でメッキを施してもよい。この
ようにメッキを施すことで、電気的導通を向上させた
り、露出した導体部の酸化を防止することができる。ま
た、貴金属でメッキを施す前にニッケル（Ｎｉ）などで
メッキをしておくと、電気的接触がよくなる。The projections 8 for electrical contacts and the electrical connection terminals 7 include
The plating may be performed with a noble metal such as gold (Au). By performing plating in this manner, electrical conduction can be improved, and oxidation of the exposed conductor can be prevented. Further, if plating is performed with nickel (Ni) or the like before plating with a noble metal, electrical contact is improved.
【００３１】[0031]
【実施例】以下本発明を実施例に基づいて具体的に説明
するが、本発明はこれらの実施例に限定されるものでは
ない。EXAMPLES The present invention will be specifically described below based on examples, but the present invention is not limited to these examples.
【００３２】実施例１ 縦３０ｍｍ、横４００ｍｍ、厚さ３５μｍの銅箔を平板
に固定し、銅箔の上面の配線パターン形成部になる部分
を、グラインダーで機械的に研磨した。得られた銅箔の
厚さは、厚い部分が３５μｍで、薄い部分が１８μｍの
導体層の配線パターン形成部が長手方向上面に凹設され
ている形状であった。Example 1 A copper foil having a length of 30 mm, a width of 400 mm and a thickness of 35 μm was fixed on a flat plate, and a portion of the upper surface of the copper foil to be a wiring pattern forming portion was mechanically polished with a grinder. The thickness of the obtained copper foil was 35 μm in the thick portion and 18 μm in the thin portion, and the wiring pattern forming portion of the conductor layer was recessed on the upper surface in the longitudinal direction.
【００３３】このようにして得られた異なる厚さを有す
る銅箔を、熱硬化性接着剤（エポキシゴム系接着剤）を
介して、絶縁層であるポリイミドフィルム（厚さ３５μ
ｍ、外形寸法は銅箔と同じ）に、熱圧着（温度１２０
℃、圧力８０Ｋｇ／ｃｍ2 、時間４５分）で積層し、３
層の回路基板形成部材を得た。この回路基板形成部材
に、湿式エッチング法により、回路を形成した。エッチ
ング液は、過硫酸ナトリウム溶液を用いた。銅箔の薄い
部分は、回路幅５０μｍ、間隔３０μｍ、回路ピッチ８
０μｍの微細な回路配線を形成することができた。また
銅箔の厚い部分は、回路幅１００μｍ、間隔５０μｍ、
回路ピッチ１５０μｍの粗い回路配線を形成することが
できた。製品の良品率は、１００％であった。The copper foils having different thicknesses obtained as described above are applied to a polyimide film (35 μm thick) as an insulating layer via a thermosetting adhesive (epoxy rubber adhesive).
m, external dimensions are the same as copper foil), thermocompression bonding (temperature 120
At a pressure of 80 Kg / cm 2 for 45 minutes).
A layered circuit board forming member was obtained. A circuit was formed on the circuit board forming member by a wet etching method. As an etching solution, a sodium persulfate solution was used. The thin portion of the copper foil has a circuit width of 50 μm, an interval of 30 μm, and a circuit pitch of 8 μm.
Fine circuit wiring of 0 μm could be formed. The thick part of the copper foil has a circuit width of 100 μm, an interval of 50 μm,
A coarse circuit wiring with a circuit pitch of 150 μm could be formed. The non-defective rate of the product was 100%.
【００３４】比較例１ 縦３０ｍｍ、横４００ｍｍ、厚さ３５μｍの均一厚みを
有する銅箔を使用した以外は、実施例１と同様に回路基
板形成部材を形成し、回路を形成した。回路幅５０μ
ｍ、間隔３０μｍ、回路ピッチ８０μｍの微細な回路配
線はできず、製品の良品率は１０％であった。Comparative Example 1 A circuit board forming member was formed in the same manner as in Example 1, except that a copper foil having a uniform thickness of 30 mm in length, 400 mm in width and 35 μm in thickness was used. Circuit width 50μ
m, an interval of 30 μm, and a fine circuit wiring of a circuit pitch of 80 μm could not be formed, and the non-defective product rate was 10%.
【００３５】実施例２ 実施例１で得られた回路基板の上面に接着剤層（厚さ１
０μｍ、エポキシゴム系接着剤）を介してカバーレイフ
ィルム（厚さ２５μｍ、ポリイミドフィルム）を施し
た。回路部分の両端には、接着層は設けられていない。
次に、電気接点用突起加工部の機械的加工をした。電気
接点用突起加工部の基板下部から、寸法が直径０．７５
ｍｍ、高さ０．１５ｍｍの突起を５０個得るように、ポ
ンチを用いてプレス成形した。全ての突起は破れず、良
好に加工できた。また、突起の頭部の厚さは１８μｍで
あった。突起部に下地として、ニッケルを３μｍ、表面
に金を１μｍの厚さで電気メッキし、最終製品を得た。Example 2 An adhesive layer (thickness 1) was formed on the upper surface of the circuit board obtained in Example 1.
A coverlay film (thickness: 25 μm, polyimide film) was applied via an epoxy rubber-based adhesive (0 μm). No adhesive layers are provided at both ends of the circuit portion.
Next, mechanical processing was performed on the protruded portion for the electrical contact. From the lower part of the substrate at the processing part for electrical contact, the size is 0.75 in diameter
It was press-formed using a punch so as to obtain 50 protrusions having a height of 0.15 mm and a height of 50 mm. All protrusions were not broken and could be processed well. The thickness of the projection head was 18 μm. The protrusions were electroplated with a thickness of 3 μm as a base and gold with a thickness of 1 μm on the surface to obtain a final product.
【００３６】比較例２ 導体層の厚さが１８μｍの回路基板を使用した以外は、
実施例２と同様にし、電気接点用突起加工部の機械的加
工をした。突起部の頭部の５％は正常であったが、残り
９５％は破れ不具合を生じた。Comparative Example 2 Except for using a circuit board having a conductor layer thickness of 18 μm,
In the same manner as in Example 2, the electrical contact projection was mechanically processed. 5% of the heads of the projections were normal, but the remaining 95% had tears and failed.
【００３７】実施例３ 縦３０ｍｍ、横４００ｍｍ、厚さ３５μｍの銅箔を熱硬
化性接着剤（エポキシゴム系接着剤）を介して、絶縁層
であるポリイミドフィルム（厚さ３５μｍ、外形寸法は
銅箔と同じ）に、熱圧着（温度１２０℃、圧力８０Ｋｇ
／ｃｍ2 、時間４５分）で積層した。Example 3 A copper foil having a length of 30 mm, a width of 400 mm and a thickness of 35 μm was placed on a polyimide film (thickness 35 μm, external dimensions of copper) as an insulating layer via a thermosetting adhesive (epoxy rubber adhesive). Thermocompression bonding (temperature 120 ° C, pressure 80Kg)
/ Cm 2 , time 45 minutes).
【００３８】この積層体の電気接続端子形成部と電気接
点用突起加工部とに、エッチング用保護レジスト膜を印
刷した。開口部を、過硫酸ナトリウム溶液を用いて、１
８μｍの厚さになるまで、エッチングし、その後、エッ
チング用保護レジスト膜を剥離して、３層の回路基板形
成部材を得た。A protective resist film for etching was printed on the electrical connection terminal forming portion and the electrical contact projection processed portion of the laminate. Open the opening with sodium persulfate solution
Etching was performed until the thickness became 8 μm, and then the protective resist film for etching was peeled off to obtain a three-layer circuit board forming member.
【００３９】この回路基板形成部材に、湿式エッチング
法により、回路を形成した。エッチング液は、過硫酸ナ
トリウム溶液を用いた。銅箔の薄い部分は、回路幅５０
μｍ、間隔３０μｍ、回路ピッチ８０μｍの微細な回路
配線を形成することができた。また銅箔の厚い部分は、
回路幅１００μｍ、間隔５０μｍ、回路ピッチ１５０μ
ｍの粗い回路配線を形成することができた。製品の良品
率は、１００％であった。A circuit was formed on the circuit board forming member by a wet etching method. As an etching solution, a sodium persulfate solution was used. The thin part of the copper foil has a circuit width of 50
A fine circuit wiring having a size of 30 μm, an interval of 30 μm, and a circuit pitch of 80 μm could be formed. Also, the thick part of the copper foil
Circuit width 100μm, spacing 50μm, circuit pitch 150μ
A circuit wiring with a coarse m was formed. The non-defective rate of the product was 100%.
【００４０】比較例３ 縦３０ｍｍ、横４００ｍｍ、厚さ３５μｍの均一厚みを
有する銅箔を使用し、銅箔のエッチングをしなかった以
外は、実施例３と同様に回路基板形成部材を形成し、回
路を形成した。回路幅５０μｍ、間隔３０μｍ、回路ピ
ッチ８０μｍの微細な回路配線はできず、製品の良品率
は１０％であった。Comparative Example 3 A circuit board forming member was formed in the same manner as in Example 3 except that a copper foil having a uniform thickness of 30 mm in length, 400 mm in width and 35 μm in thickness was used, and the copper foil was not etched. A circuit was formed. Fine circuit wiring having a circuit width of 50 μm, an interval of 30 μm, and a circuit pitch of 80 μm could not be formed, and the non-defective product rate was 10%.
【００４１】実施例４ 実施例３で得られた回路基板の上面に接着層（厚さ１０
μｍ、エポキシゴム系接着剤）を介してカバーレイフィ
ルム（厚さ２５μｍ、ポリイミドフィルム）を施した。
回路部分の両端には、接着層は設けられていない。次
に、電気接点用突起加工部の機械的加工をした。電気接
点用突起加工部の基板下部から、寸法が直径０．７５ｍ
ｍ、高さ０．１５ｍｍの突起を５０個得るように、ポン
チを用いてプレス成形した。全ての突起は破れず、良好
に加工できた。また、突起の頭部の厚さは１８μｍであ
った。突起部に下地として、ニッケルを３μｍ、表面に
金を１μｍの厚さで電気メッキし、最終製品を得た。Example 4 An adhesive layer (with a thickness of 10) was formed on the upper surface of the circuit board obtained in Example 3.
A coverlay film (thickness: 25 μm, polyimide film) was applied via a μm epoxy resin adhesive.
No adhesive layers are provided at both ends of the circuit portion. Next, mechanical processing was performed on the protruded portion for the electrical contact. Dimension 0.75m in diameter from the lower part of the substrate at the protruding part for electrical contact
Press molding was performed using a punch so as to obtain 50 projections having a height of 0.15 mm and a height of 0.15 mm. All protrusions were not broken and could be processed well. The thickness of the head of the projection was 18 μm. The protrusions were electroplated with a thickness of 3 μm as a base and gold with a thickness of 1 μm on the surface to obtain a final product.
【００４２】比較例４ 導体層の厚さが１８μｍの回路基板を使用した以外は、
実施例４と同様にし、電気接点用突起加工部の機械的加
工をした。突起部の頭部の５％は正常であったが、残り
９５％は破れ、不具合を生じた。Comparative Example 4 A circuit board having a conductor layer thickness of 18 μm was used.
In the same manner as in Example 4, the electrical contact projection was mechanically worked. 5% of the head of the protrusion was normal, but the remaining 95% was torn and failed.
【００４３】実施例では、同一基板内で、良好に微細な
回路が形成でき、電気接点用突起も頭部が破れたり、開
口することなく全て形成できたが、比較例では、できな
かった。In the example, a fine circuit could be formed satisfactorily on the same substrate, and all the projections for electrical contacts could be formed without breaking or opening the head, but the comparative example could not.
【００４４】[0044]
【発明の効果】本発明の回路基板形成部材およびそれを
用いた回路基板は、少なくとも導体層の電気接点用突起
の形成が必要な部分を厚く、微細な回路配線部分の形成
が必要な部分を薄くしたので、同一基板上で電気接点用
突起の形成と微細な回路配線部分の形成とを容易に行う
ことができる。According to the circuit board forming member of the present invention and the circuit board using the same, at least the portion of the conductor layer where the electrical contact projection is required to be formed is thick, and the portion where the fine circuit wiring portion is required to be formed. Since the thickness is reduced, the formation of the electrical contact projection and the formation of the fine circuit wiring portion can be easily performed on the same substrate.
【図１】本発明による回路基板形成部材の一例を示す模
式図である。FIG. 1 is a schematic view showing an example of a circuit board forming member according to the present invention.
【図２】従来の回路基板の例を示す模式図である。FIG. 2 is a schematic diagram showing an example of a conventional circuit board.
【図３】本発明による回路基板の一例を示す模式図であ
る。FIG. 3 is a schematic view showing an example of a circuit board according to the present invention.
【図４】図３の回路基板のＡ−Ａ’断面の部分的拡大図
である。4 is a partially enlarged view of an AA 'section of the circuit board of FIG. 3;
【図５】図３の回路基板のＢ−Ｂ’断面の部分的拡大図
である。FIG. 5 is a partially enlarged view of a cross section BB ′ of the circuit board of FIG. 3;
【図６】図３の回路基板のＣ−Ｃ’断面の部分的拡大図
である。FIG. 6 is a partially enlarged view of a cross section taken along line CC ′ of the circuit board of FIG. 3;
【図７】本発明の回路基板形成部材およびそれを用いた
回路基板に使用する異なる厚さの導体層の断面形状の例
を示す模式図である。FIG. 7 is a schematic view showing an example of a cross-sectional shape of conductor layers having different thicknesses used for a circuit board forming member of the present invention and a circuit board using the same.
【図８】本発明の回路基板の製造方法の一例を示す模式
図である。FIG. 8 is a schematic view illustrating an example of a method for manufacturing a circuit board according to the present invention.
１ 絶縁層 ２ 接着層 ３ 導体層 ３−１ 電気接続端子形成部 ３−２ 配線パターン形成部 ３−３ 電気接点用突起加工部 ４ 絶縁層 ５ 接着層 ６ 導体回路配線 ７ 電気接続端子 ８ 電気接点用突起 DESCRIPTION OF SYMBOLS 1 Insulating layer 2 Adhesive layer 3 Conductive layer 3-1 Electric connection terminal forming part 3-2 Wiring pattern forming part 3-3 Protrusion processing part for electric contact 4 Insulating layer 5 Adhesive layer 6 Conductor circuit wiring 7 Electric connecting terminal 8 Electric contact Projection
Claims (7)
基板形成部材であって、少なくとも導体層の電気接点用
突起加工部の厚さが、導体層の配線パターン形成部の厚
さよりも厚いことを特徴とする回路基板形成部材。1. A circuit board forming member in which a conductor layer and an insulating layer are laminated, wherein the thickness of at least the electrical contact projection processed portion of the conductor layer is larger than the thickness of the wiring pattern formed portion of the conductor layer. A circuit board forming member characterized by being thick.
加工部の厚さが１５〜８０μｍであり、上記導体層の配
線パターン形成部の厚さが５〜６０μｍである請求項１
に記載の回路基板形成部材。2. The semiconductor device according to claim 1, wherein the thickness of at least the electrical contact protruding portion of the conductive layer is 15 to 80 μm, and the thickness of the wiring pattern forming portion of the conductive layer is 5 to 60 μm.
The circuit board forming member according to 1.
加工部の厚さが、上記導体層の配線パターン形成部の厚
さよりも、５μｍ以上厚くなっている請求項１または２
に記載の回路基板形成部材。3. The thickness of at least the electrical contact protruding portion of the conductor layer is at least 5 μm thicker than the thickness of the wiring pattern forming portion of the conductor layer.
The circuit board forming member according to 1.
加工部と配線パターン形成部とが一体成形されている請
求項１〜３のいずれかに記載の回路基板形成部材。4. The circuit board forming member according to claim 1, wherein at least the electrical contact projection processed portion of the conductor layer and the wiring pattern forming portion are integrally formed.
路基板形成部材からなる回路基板。5. A circuit board comprising the circuit board forming member according to claim 1.
記載の回路基板。6. The circuit board according to claim 5, wherein said circuit board is flexible.
が、１５〜２５μｍである請求項５または６に記載の回
路基板。7. The circuit board according to claim 5, wherein the thickness of the conductor portion at the head of the electrical contact projection is 15 to 25 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10171409A JP2000012991A (en) | 1998-06-18 | 1998-06-18 | Circuit board forming member having variable thickness conductor layer and circuit board using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10171409A JP2000012991A (en) | 1998-06-18 | 1998-06-18 | Circuit board forming member having variable thickness conductor layer and circuit board using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000012991A true JP2000012991A (en) | 2000-01-14 |
Family
ID=15922618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10171409A Pending JP2000012991A (en) | 1998-06-18 | 1998-06-18 | Circuit board forming member having variable thickness conductor layer and circuit board using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000012991A (en) |
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