JP2000006031A - Grinding wheel and manufacture thereof - Google Patents

Grinding wheel and manufacture thereof

Info

Publication number
JP2000006031A
JP2000006031A JP17358898A JP17358898A JP2000006031A JP 2000006031 A JP2000006031 A JP 2000006031A JP 17358898 A JP17358898 A JP 17358898A JP 17358898 A JP17358898 A JP 17358898A JP 2000006031 A JP2000006031 A JP 2000006031A
Authority
JP
Japan
Prior art keywords
manganese dioxide
curable resin
resin
grinding wheel
hardening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17358898A
Other languages
Japanese (ja)
Inventor
Kenzo Hanawa
健三 塙
Kenji Suzuoka
健司 鈴岡
Izumi Hayakawa
泉 早川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to JP17358898A priority Critical patent/JP2000006031A/en
Publication of JP2000006031A publication Critical patent/JP2000006031A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To make grinding capability excellent and prevent abrasive grain from being left on a grinding surface by making granular manganese dioxide producing granules by adding water and silicic acid after manganese dioxide is sintered at a high temperature and moisture in micro pores is removed, molding the producing granules after a curable resin is mixed and hardening the curable resin. SOLUTION: This grinding wheel is made of granular manganese dioxide producing granules and a cured resin. The cured resin is obtained by hardening curable resin. The mixture of granular manganese dioxide producing granules and curable resin is molded, and the curable resin is hardened and becomes a grinding wheel. As molding means, there are hot press, cold press and molding. As means for hardening curable resin, there are available ordinary temperature hardening and heating hardening. When thermosetting epoxy resin is used as curable resin and molding is performed, mixture is poured into a mold, is sintered in an oven at 100 to 150 deg.C for 1 to 3 hours and the grinding wheel is obtained by being removed from the mold. According to manufacturing methods, the grinding wheel can be industrially manufactured.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は二酸化マンガンを固
定砥粒とし、タングステン、アルミニウム、銅等の金属
の研磨に用いられる砥石及びその製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grindstone used for polishing metals such as tungsten, aluminum and copper using manganese dioxide as fixed abrasive grains and a method for producing the same.

【0002】[0002]

【従来の技術】従来、タングステン等の金属の研磨に
は、α−アルミナよりなる遊離砥粒と過酸化水素水等か
らなる酸化剤との混合物よりなる研磨剤が用いられてお
り、ウレタン樹脂等の研磨布上において研磨が行われて
いる。かかる研磨においては、上記酸化剤が金属を酸化
させ、形成された酸化物が上記遊離砥粒により研削、除
去されている。
2. Description of the Related Art Conventionally, for polishing metals such as tungsten, a polishing agent composed of a mixture of free abrasive grains composed of α-alumina and an oxidizing agent composed of hydrogen peroxide, etc. has been used. Is polished on the polishing cloth. In such polishing, the oxidizing agent oxidizes the metal, and the formed oxide is ground and removed by the free abrasive grains.

【0003】しかし、このようなα−アルミナを遊離砥
粒とする研磨剤においては、研磨速度が遅い、研磨面に
残留砥粒が残存するといった問題が生じる。
[0003] However, such abrasives using α-alumina as free abrasive grains have problems such as a low polishing rate and residual abrasive grains remaining on the polished surface.

【0004】このような問題を解決する方法として、二
酸化マンガンを遊離砥粒とする研磨剤が提案されてい
る。この研磨剤は研磨速度が速く、研磨面に残留砥粒が
残存しないという利点を有する。しかし、この研磨剤も
上記α−アルミナを遊離砥粒とする研磨剤と同様にスラ
リーとして用いるものであり、二酸化マンガンは上記の
ように遊離砥粒として用いられるものである。
As a method for solving such a problem, an abrasive using manganese dioxide as free abrasive grains has been proposed. This abrasive has the advantage that the polishing rate is high and no residual abrasive grains remain on the polished surface. However, this abrasive is used as a slurry similarly to the above-mentioned abrasive using α-alumina as free abrasive grains, and manganese dioxide is used as free abrasive grains as described above.

【0005】このため、二酸化マンガンを砥石等の固定
砥粒とすることが求められている。しかし、二酸化マン
ガンを砥石等の固定砥粒とする場合に、二酸化マンガン
はそのマイクロポアに水分を含有するため樹脂と混練で
きず、二酸化マンガンを固定砥粒とする砥石は実現でき
ていなかった。
[0005] For this reason, it is required that manganese dioxide be used as fixed abrasive grains such as a grindstone. However, when manganese dioxide is used as a fixed abrasive such as a grindstone, manganese dioxide cannot be kneaded with a resin because its micropore contains water, and a whetstone using manganese dioxide as a fixed abrasive has not been realized.

【0006】従って、本発明の目的は、研磨能力に優
れ、しかも研磨面に砥粒が残存しない、二酸化マンガン
を固定砥粒とする砥石及びその製造方法を提供すること
にある。
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a grindstone using manganese dioxide as fixed abrasive grains, which has excellent polishing ability and does not leave abrasive grains on a polished surface, and a method of manufacturing the same.

【0007】[0007]

【課題を解決するための手段】本発明者らは、検討の結
果、二酸化マンガンを高温で焼成し、マイクロポア中の
水分を除去した後、水又はケイ酸を加えて顆粒状二酸化
マンガン造粒物とし、これと硬化性樹脂とを混練した
後、成形し、該硬化性樹脂を硬化することにより、上記
目的が達成されることが知見した。
As a result of the study, the present inventors have found that manganese dioxide is calcined at a high temperature to remove water in the micropores, and then water or silicic acid is added to granulate manganese dioxide. It has been found that the above object can be achieved by kneading the mixture with a curable resin, molding the mixture, and curing the curable resin.

【0008】本発明は、上記知見に基づきなされたもの
で、顆粒状二酸化マンガン造粒物と硬化樹脂とからなる
ことを特徴とする砥石を提供するものである。
The present invention has been made based on the above findings, and provides a grindstone comprising a granulated manganese dioxide granule and a cured resin.

【0009】また、本発明は、本発明の砥石の好ましい
製造方法として、二酸化マンガンを300〜450℃の
温度で加熱後、水又はケイ酸を加えて顆粒状二酸化マン
ガン造粒物となし、該顆粒状二酸化マンガン造粒物と硬
化性樹脂とを混練した後、成形し、該硬化性樹脂を硬化
することを特徴とする砥石の製造方法を提供するもので
ある。
The present invention also provides, as a preferred method for producing the grindstone of the present invention, a method of heating manganese dioxide at a temperature of 300 to 450 ° C. and adding water or silicic acid to form a granular manganese dioxide granulated product. An object of the present invention is to provide a method for producing a grindstone, which comprises kneading a granulated manganese dioxide granule and a curable resin, molding the mixture, and curing the curable resin.

【0010】[0010]

【発明の実施の形態】以下、本発明を詳細に説明する。
本発明の砥石は、顆粒状二酸化マンガン造粒物と硬化樹
脂とからなる。顆粒状二酸化マンガン造粒物は、水分を
除去した二酸化マンガンに、少量の水又はケイ酸を加
え、ミキサー等で乾式混合することにより得られる。こ
の顆粒状二酸化マンガン造粒物の粒径は0.1〜2m
m、好ましくは0.2〜0.8mm程度である。
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.
The grindstone of the present invention comprises a granulated manganese dioxide granule and a cured resin. Granular manganese dioxide granules can be obtained by adding a small amount of water or silicic acid to manganese dioxide from which water has been removed, and dry-mixing with a mixer or the like. The particle size of the granulated manganese dioxide granules is 0.1 to 2 m.
m, preferably about 0.2 to 0.8 mm.

【0011】硬化樹脂とは、硬化性樹脂を硬化したもの
で、具体的には硬化エポキシ樹脂、硬化フェノール樹
脂、硬化ポリイミド等が挙げられる。
The cured resin is obtained by curing a curable resin, and specific examples thereof include a cured epoxy resin, a cured phenol resin, and a cured polyimide.

【0012】本発明の砥石における顆粒状二酸化マンガ
ン造粒物と硬化樹脂の含有割合は、顆粒状二酸化マンガ
ン造粒物30〜90重量%、好ましくは50〜85重量
%、硬化樹脂70〜10重量%、好ましくは50〜15
重量%である。顆粒状二酸化マンガン造粒物の含有割合
が30重量%未満では研磨特性が発揮できず、また90
重量%を超えると砥石としての形状維持が困難となり好
ましくない。
The content of the granulated manganese dioxide granules and the cured resin in the grindstone of the present invention is 30 to 90% by weight, preferably 50 to 85% by weight, and the cured resin is 70 to 10% by weight. %, Preferably 50 to 15
% By weight. If the content of the granulated manganese dioxide granules is less than 30% by weight, the polishing characteristics cannot be exhibited, and
If the content exceeds% by weight, it becomes difficult to maintain the shape as a grindstone, which is not preferable.

【0013】次に、本発明の砥石の製造方法について説
明する。本発明では、二酸化マンガンを300〜450
℃の温度で加熱する。二酸化マンガンは、マイクロポア
中に水分を含有し、300〜450℃の温度で加熱する
ことによって、マイクロポア中の水分を除去する。加熱
温度が300℃未満では水分を充分に除去することがで
きず、加熱温度が450℃を超えるとMn2 3となっ
てしまう。ここで用いられる二酸化マンガンは、電解二
酸化マンガンが一般的であり、その粒径は0.2〜2μ
m、好ましくは0.5〜1μm程度である。
Next, a method for manufacturing a grindstone of the present invention will be described. In the present invention, manganese dioxide is added in an amount of 300 to 450.
Heat at a temperature of ° C. Manganese dioxide contains water in the micropores and removes the water in the micropores by heating at a temperature of 300 to 450 ° C. If the heating temperature is lower than 300 ° C., water cannot be sufficiently removed, and if the heating temperature exceeds 450 ° C., Mn 2 O 3 is formed. The manganese dioxide used here is generally electrolytic manganese dioxide, and its particle size is 0.2 to 2 μm.
m, preferably about 0.5 to 1 μm.

【0014】次いで、この水分が除去された二酸化マン
ガンに少量の水又はケイ酸を加え、ミキサー等で乾式混
合して顆粒状二酸化マンガン造粒物を得る。水又はケイ
酸の添加量は、二酸化マンガン100重量部に対して1
〜10重量部が好ましい。この顆粒状二酸化マンガン造
粒物の粒径は、上記のように、0.1〜2mm、好まし
くは0.2〜0.8mm程度である。
Next, a small amount of water or silicic acid is added to the manganese dioxide from which water has been removed, and the mixture is dry-mixed with a mixer or the like to obtain a granular manganese dioxide granule. The amount of water or silicic acid added is 1 to 100 parts by weight of manganese dioxide.
-10 parts by weight is preferred. The particle size of the granular manganese dioxide granules is, as described above, about 0.1 to 2 mm, preferably about 0.2 to 0.8 mm.

【0015】このようにして得られた顆粒状二酸化マン
ガン造粒物と硬化性樹脂を混練する。混練手段としては
ミキサー等の混練機が用いられ、その混練時間は0.5
〜1時間である。また、配合比率は、顆粒状二酸化マン
ガン造粒物30〜90重量%、好ましくは50〜85重
量%、硬化樹脂70〜10重量%、好ましくは50〜1
5重量%である。
[0015] The granulated manganese dioxide granules thus obtained are kneaded with a curable resin. A kneader such as a mixer is used as a kneading means, and the kneading time is 0.5.
~ 1 hour. The mixing ratio of the granular manganese dioxide granules is 30 to 90% by weight, preferably 50 to 85% by weight, and the cured resin is 70 to 10% by weight, preferably 50 to 1%.
5% by weight.

【0016】また、硬化性樹脂としては、熱硬化性エポ
キシ樹脂、常温硬化型エポキシ樹脂、フェノール樹脂、
ポリイミド等が挙げられる。
The curable resin includes a thermosetting epoxy resin, a room temperature curable epoxy resin, a phenol resin,
Examples include polyimide.

【0017】得られた顆粒状二酸化マンガン造粒物と硬
化性樹脂の混練物は、成形され、硬化性樹脂は硬化さ
れ、砥石とされる。成形手段としては、ホットプレス、
コールドプレス、鋳込み成形等が挙げられる。また、硬
化性樹脂を硬化する手段としては、常温硬化、加熱硬化
(焼成)が採用される。
The kneaded product of the obtained granulated manganese dioxide granules and the curable resin is molded, and the curable resin is cured to form a grindstone. Hot press,
Cold press, cast molding and the like can be mentioned. As a means for curing the curable resin, room temperature curing and heat curing (firing) are employed.

【0018】具体的な成形、硬化条件は、例えば硬化性
樹脂として熱硬化性エポキシ樹脂を用い、鋳込み成形し
た場合には、混練物を鋳型に流し込み、オーブンで10
0〜150℃、1〜3時間焼成し、脱型して砥石が得ら
れる。
Specific molding and curing conditions are as follows. For example, when a thermosetting epoxy resin is used as the curable resin, and the mixture is cast, the kneaded material is poured into a mold, and the mixture is heated in an oven.
Baking is performed at 0 to 150 ° C. for 1 to 3 hours, and the mold is removed to obtain a grindstone.

【0019】硬化性樹脂として常温硬化型エポキシ樹脂
を用い、鋳込み成形した場合には、混練物を鋳型に流し
込み、室温(20℃)で10〜24時間焼成し、脱型し
て砥石が得られる。
When a room-temperature-curable epoxy resin is used as the curable resin and cast-molded, the kneaded material is poured into a mold, baked at room temperature (20 ° C.) for 10 to 24 hours, and removed from the mold to obtain a grindstone. .

【0020】硬化性樹脂としてフェノール樹脂を用い、
ホットプレスした場合には、混練物を160〜200
℃、好ましくは160〜180℃、圧力50〜200k
g/cm2 、好ましくは100kg/cm2 、0.5〜
2時間、好ましくは1時間ホットプレスすることによっ
て砥石が得られる。
A phenol resin is used as a curable resin,
When hot pressing, the kneaded material is 160-200
° C, preferably 160-180 ° C, pressure 50-200k
g / cm 2 , preferably 100 kg / cm 2 , 0.5 to
The grindstone is obtained by hot pressing for 2 hours, preferably 1 hour.

【0021】硬化性樹脂としてフェノール樹脂を用い、
コールドプレスした場合には、混練物を圧力50〜20
0kg/cm2 、好ましくは100kg/cm2 、0.
5〜2時間、好ましくは1時間コールドプレスした後、
160〜200℃、好ましくは180℃、1〜5時間、
好ましくは4時間焼成することによって砥石が得られ
る。
A phenol resin is used as a curable resin,
When cold pressing is performed, the kneaded material is subjected to a pressure of 50 to 20.
0 kg / cm 2 , preferably 100 kg / cm 2 , 0.
After cold pressing for 5 to 2 hours, preferably 1 hour,
160-200 ° C, preferably 180 ° C, 1-5 hours,
Preferably, the stone is obtained by baking for 4 hours.

【0022】硬化性樹脂としてポリイミドを用い、ホッ
トプレスした場合には、混練物を200〜250℃、好
ましくは230℃、圧力200〜500kg/cm2
好ましくは300kg/cm2 、1〜2時間、好ましく
は1時間ホットプレスすることによって砥石が得られ
る。
When polyimide is used as the curable resin and hot pressing is performed, the kneaded material is heated at 200 to 250 ° C., preferably 230 ° C., at a pressure of 200 to 500 kg / cm 2 ,
The grindstone is obtained by hot pressing preferably at 300 kg / cm 2 for 1 to 2 hours, preferably for 1 hour.

【0023】このようにして得られた本発明の砥石は、
半導体関連の研磨用から汎用(包丁研磨)まで幅広く用
いられる。
The thus-obtained grinding wheel of the present invention
Widely used from semiconductor related polishing to general purpose (knife polishing).

【0024】[0024]

【実施例】以下、実施例等に基づき本発明を具体的に説
明する。
EXAMPLES Hereinafter, the present invention will be specifically described based on examples and the like.

【0025】〔実施例1〕粒径0.3μmの電解二酸化
マンガンを400℃、5分加熱して電解二酸化マンガン
中の水分を除去した。この水分を除去した二酸化マンガ
ン100重量部に対して水を2.5重量部加え、ミキサ
ーで乾式混合して粒径1mmの顆粒状二酸化マンガン造
粒物を得た。この顆粒状二酸化マンガン造粒物のタップ
密度は1.73g/mlであった。
Example 1 Electrolytic manganese dioxide having a particle size of 0.3 μm was heated at 400 ° C. for 5 minutes to remove water in the electrolytic manganese dioxide. 2.5 parts by weight of water was added to 100 parts by weight of the manganese dioxide from which the water had been removed, and the mixture was dry-mixed with a mixer to obtain a granular manganese dioxide granule having a particle size of 1 mm. The tap density of the granulated manganese dioxide granules was 1.73 g / ml.

【0026】この顆粒状二酸化マンガン77重量部と熱
硬化性エポキシ樹脂(商品名EP171、セメダイン社
製)23重量部とを混練機で1時間混練し、得られた混
練物をφ200mm×10mmtの金型に流し込み、1
00℃、1時間焼成した後、脱型し、φ200mm×1
0mmtの砥石を得た。
77 parts by weight of the granular manganese dioxide and 23 parts by weight of a thermosetting epoxy resin (trade name: EP171, manufactured by Cemedine Co.) are kneaded for 1 hour by a kneader, and the obtained kneaded material is φ200 mm × 10 mmt gold. Pour into mold, 1
After firing at 00 ° C for 1 hour, the mold was removed and φ200mm x 1
A 0 mmt whetstone was obtained.

【0027】〔実施例2〕実施例1で得られた顆粒状二
酸化マンガン70重量部と熱硬化性エポキシ樹脂(商品
名EP170、セメダイン社製)30重量部とを混練機
で1時間混練し、得られた混練物をφ200mm×10
mmtの金型に流し込み、130℃、0.5時間焼成し
た後、脱型し、φ200mm×10mmtの砥石を得
た。
Example 2 70 parts by weight of the granular manganese dioxide obtained in Example 1 and 30 parts by weight of a thermosetting epoxy resin (trade name: EP170, manufactured by Cemedine Co.) were kneaded for 1 hour by a kneader. The obtained kneaded material is φ200 mm × 10
It was poured into a mold of mmt, baked at 130 ° C. for 0.5 hour, and then demolded to obtain a grindstone of φ200 mm × 10 mmt.

【0028】〔実施例3〕実施例1で得られた顆粒状二
酸化マンガン30重量部とフェノール樹脂14重量部と
を混練機で1時間混練し、得られた混練物をφ70mm
×4.5mmtの金型に送入し、圧力100kg/cm
2 、1時間コールドプレスした後、160℃、4時間焼
成することによって、φ70mm×4.5mmtの砥石
を得た。
Example 3 30 parts by weight of the granular manganese dioxide obtained in Example 1 and 14 parts by weight of a phenol resin were kneaded for 1 hour with a kneader, and the obtained kneaded product was φ70 mm.
× 4.5mmt into mold, pressure 100kg / cm
2. After cold pressing for 1 hour, baking was performed at 160 ° C. for 4 hours to obtain a grindstone of φ70 mm × 4.5 mmt.

【0029】〔実施例4〕顆粒状二酸化マンガン27重
量部、フェノール樹脂18重量部を用いた以外は実施例
3と同様にして砥石を得た。
Example 4 A grindstone was obtained in the same manner as in Example 3, except that 27 parts by weight of granular manganese dioxide and 18 parts by weight of phenol resin were used.

【0030】〔実施例5〕実施例1で得られた顆粒状二
酸化マンガン30重量部とポリイミド14重量部とを混
練機で1時間混練し、得られた混練物をφ70mm×
4.5mmtの金型に送入し、圧力300kg/c
2 、1時間コールドプレスした後、250℃、4時間
焼成することによって、φ70mm×4.5mmtの砥
石を得た。
Example 5 30 parts by weight of the granular manganese dioxide obtained in Example 1 and 14 parts by weight of polyimide were kneaded for 1 hour with a kneader, and the obtained kneaded product was φ70 mm ×
It is sent to a 4.5 mmt mold and the pressure is 300 kg / c.
After being cold-pressed at m 2 for 1 hour, it was baked at 250 ° C. for 4 hours to obtain a grindstone of φ70 mm × 4.5 mmt.

【0031】〔実施例6〕顆粒状二酸化マンガン27重
量部、ポリイミド18重量部を用いた以外は実施例5と
同様にして砥石を得た。
Example 6 A grindstone was obtained in the same manner as in Example 5 except that 27 parts by weight of granular manganese dioxide and 18 parts by weight of polyimide were used.

【0032】[0032]

【発明の効果】以上説明したように、二酸化マンガンを
固定砥粒とする本発明の砥石は、研磨能力に優れ、しか
も研磨面に砥粒が残存しない。また、本発明の製造方法
によって、上記砥石が工業的に製造することができる。
As described above, the grindstone of the present invention using manganese dioxide as a fixed abrasive has excellent polishing ability and no abrasive remains on the polished surface. Further, the grinding method can be industrially manufactured by the manufacturing method of the present invention.

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Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 顆粒状二酸化マンガン造粒物と硬化樹脂
とからなることを特徴とする砥石。
1. A grindstone comprising a granulated manganese dioxide granule and a cured resin.
【請求項2】 上記顆粒状二酸化マンガン造粒物30〜
90重量%、上記硬化樹脂70〜10重量%を含有する
請求項1記載の砥石。
2. The granulated manganese dioxide granules 30 to
The grindstone according to claim 1, comprising 90% by weight and 70 to 10% by weight of the cured resin.
【請求項3】 上記硬化樹脂が硬化エポキシ樹脂、硬化
フェノール樹脂、硬化ポリイミドから選択される請求項
1又は2に記載の砥石。
3. The grinding wheel according to claim 1, wherein the cured resin is selected from a cured epoxy resin, a cured phenol resin, and a cured polyimide.
【請求項4】 二酸化マンガンを300〜450℃の温
度で加熱後、水又はケイ酸を加えて顆粒状二酸化マンガ
ン造粒物となし、該顆粒状二酸化マンガン造粒物と硬化
性樹脂とを混練した後、成形し、該硬化性樹脂を硬化す
ることを特徴とする砥石の製造方法。
4. After heating manganese dioxide at a temperature of 300 to 450 ° C., water or silicic acid is added to form granulated manganese dioxide granules, and the granulated manganese dioxide granules are kneaded with a curable resin. And then molding and curing the curable resin.
【請求項5】 上記硬化性樹脂がエポキシ樹脂、フェノ
ール樹脂、ポリイミドから選択される請求項4に記載の
砥石の製造方法。
5. The method according to claim 4, wherein the curable resin is selected from an epoxy resin, a phenol resin, and a polyimide.
JP17358898A 1998-06-19 1998-06-19 Grinding wheel and manufacture thereof Pending JP2000006031A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17358898A JP2000006031A (en) 1998-06-19 1998-06-19 Grinding wheel and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17358898A JP2000006031A (en) 1998-06-19 1998-06-19 Grinding wheel and manufacture thereof

Publications (1)

Publication Number Publication Date
JP2000006031A true JP2000006031A (en) 2000-01-11

Family

ID=15963375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17358898A Pending JP2000006031A (en) 1998-06-19 1998-06-19 Grinding wheel and manufacture thereof

Country Status (1)

Country Link
JP (1) JP2000006031A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7637270B2 (en) 2002-05-21 2009-12-29 Fujitsu Limited Method of washing a polished object
CN109048691A (en) * 2018-07-18 2018-12-21 佛山市鼎和超硬材料制品有限公司 A kind of edging wheel and its preparation process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7637270B2 (en) 2002-05-21 2009-12-29 Fujitsu Limited Method of washing a polished object
CN109048691A (en) * 2018-07-18 2018-12-21 佛山市鼎和超硬材料制品有限公司 A kind of edging wheel and its preparation process

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