JP2000001598A - Phenol resin composition - Google Patents
Phenol resin compositionInfo
- Publication number
- JP2000001598A JP2000001598A JP16645298A JP16645298A JP2000001598A JP 2000001598 A JP2000001598 A JP 2000001598A JP 16645298 A JP16645298 A JP 16645298A JP 16645298 A JP16645298 A JP 16645298A JP 2000001598 A JP2000001598 A JP 2000001598A
- Authority
- JP
- Japan
- Prior art keywords
- phenol resin
- phenolic resin
- weight
- cured product
- powdery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フェノール樹脂組
成物に関する。更に詳しくは、熱伝導率を低下せしめた
フェノール樹脂組成物に関する。[0001] The present invention relates to a phenolic resin composition. More specifically, the present invention relates to a phenol resin composition having reduced thermal conductivity.
【０００２】[0002]
【従来の技術】従来、熱硬化性樹脂であるフェノール樹
脂硬化物(スプルー等)は再利用する手段がないため、産
業廃棄物として埋立て処理等によって廃棄されている。
しかるに、このような廃棄処理方法は、環境問題にとっ
て好ましくないことは明らかである。2. Description of the Related Art Conventionally, a phenol resin cured product (such as a sprue), which is a thermosetting resin, has been discarded as an industrial waste by landfilling or the like because there is no means for reuse.
However, it is clear that such a disposal method is not preferable for environmental problems.
【０００３】[0003]
【発明が解決しようとする課題】本発明者は、粉末状フ
ェノール樹脂硬化物の充填材としての再利用方法を検討
した段階において、フェノール樹脂単体の材料よりもフ
ェノール樹脂硬化物を充填した材料の方が、約100℃以
上の高温条件下での熱伝導率が低いことを見出し、本発
明を完成するに至った。SUMMARY OF THE INVENTION The present inventor, at the stage of studying a method of reusing a powdered phenolic resin cured product as a filler, has found that a material filled with a phenolic resin cured product rather than a phenolic resin alone material is used. The present inventors have found that the thermal conductivity under high temperature conditions of about 100 ° C. or higher is lower, and have completed the present invention.
【０００４】従って、本発明の目的は、フェノール樹脂
単体の硬化物が本来有する曲げ強さ等の機械的強度を実
質的に低下させることなく、約100℃以上の高温条件下
における熱伝導率を低下せしめたフェノール樹脂組成物
を提供することにある。Accordingly, an object of the present invention is to reduce the thermal conductivity under a high temperature condition of about 100 ° C. or higher without substantially lowering the mechanical strength such as the bending strength inherent in a cured product of a phenol resin alone. It is an object of the present invention to provide a reduced phenol resin composition.
【０００５】[0005]
【課題を解決するための手段】かかる本発明の目的は、
フェノール樹脂40〜97重量%および平均粒径が約500μm
以下の粉末状フェノール樹脂硬化物60〜3重量%よりなる
フェノール樹脂組成物によって達成される。SUMMARY OF THE INVENTION The object of the present invention is as follows.
Phenol resin 40-97% by weight and average particle size about 500μm
This is achieved by a phenol resin composition comprising the following powdered phenol resin cured product of 60 to 3% by weight.
【０００６】[0006]
【発明の実施の形態】粉末状フェノール樹脂硬化物とし
ては、ノボラック型、レゾール型の種類を問わないフェ
ノール樹脂の硬化物であって、それをフェノール樹脂に
添加したとき圧縮成形、トランスファー成形等を可能に
する約500μm以下、好ましくは約100μm以下の平均粒径
を有する粉末状物が用いられる。一方、これ以上の平均
粒径を有するものを用いた場合には、それから得られる
成形品の強度を著しく低下させる。これらの粉末状フェ
ノール樹脂硬化物は、予めアミノシラン等による表面処
理を施した上で用いることもできる。BEST MODE FOR CARRYING OUT THE INVENTION The powdered phenolic resin cured product is a cured product of a phenolic resin regardless of the type of novolak type or resol type, and when it is added to the phenolic resin, compression molding, transfer molding, etc. Powders having an average particle size of less than about 500 μm, preferably less than about 100 μm are used. On the other hand, when a material having an average particle size larger than this is used, the strength of a molded product obtained therefrom is significantly reduced. These powdered phenol resin cured products can be used after being subjected to a surface treatment with aminosilane or the like in advance.
【０００７】かかる粉末状フェノール樹脂硬化物は、フ
ェノール樹脂との合計量中60〜3重量%、好ましくは30〜
5重量%の割合で用いられる。これ以上の割合で用いられ
ると、混練性および成形性が損なわれるようになり、一
方これ以下の割合では、良好な熱伝導率低減効果が得ら
れなくなる。The powdered phenolic resin cured product is 60 to 3% by weight, preferably 30 to 3% by weight, based on the total amount of the phenolic resin and the phenolic resin.
Used at a rate of 5% by weight. If it is used at a higher ratio, the kneadability and moldability will be impaired, while at a lower ratio, a good effect of reducing the thermal conductivity will not be obtained.
【０００８】粉末状フェノール樹脂硬化物中には、無機
系または有機系の繊維状または粉末状充填材(粉末状フ
ェノール樹脂硬化物を除く)、例えばガラス繊維、炭素
繊維、ポリテトラフルオロエチレン粉末等を予め充填し
た上で用いることもできる。その充填割合は、粉末状物
全体の約5〜80重量%、好ましくは約40〜60重量%であっ
て、このような充填材含有フェノール樹脂硬化物が組成
物中60〜3重量%占めるような割合で用いられる。In the powdered phenol resin cured product, an inorganic or organic fibrous or powdered filler (excluding the powdered phenol resin cured product), for example, glass fiber, carbon fiber, polytetrafluoroethylene powder, etc. Can be used after being filled in advance. The filling ratio is about 5 to 80% by weight, preferably about 40 to 60% by weight of the whole powder, and such a filler-containing phenol resin cured product occupies 60 to 3% by weight in the composition. It is used at an appropriate ratio.
【０００９】充填材含有フェノール樹脂硬化物が用いら
れない場合には、フェノール樹脂および粉末状フェノー
ル樹脂硬化物よりなる組成物中に、更に上記の如き無機
系または有機系の繊維状または粉末状充填剤を添加する
こともできる。その添加割合は、粉末状フェノール樹脂
硬化物との合計量中約5〜80重量%、好ましくは約40〜60
重量%となるような量である。When the filler-containing cured phenolic resin is not used, the above-mentioned inorganic or organic fibrous or powdered filler is further added to the composition comprising the phenolic resin and the powdered cured phenolic resin. Agents can also be added. The addition ratio is about 5 to 80% by weight, preferably about 40 to 60% by weight in the total amount with the powdered phenol resin cured product.
The amount is such that the weight% is obtained.
【００１０】組成物の調製は、各成分を所定配合比で混
合し、混合した原料を約90〜120℃でロール混練し、得
られたシートを粉砕することによって行われ、それを用
いての成形は、圧縮成形法、トランスファー成形法等に
よって行われる。The preparation of the composition is carried out by mixing the respective components at a predetermined blending ratio, kneading the mixed raw materials at about 90 to 120 ° C. with a roll, and pulverizing the obtained sheet. The molding is performed by a compression molding method, a transfer molding method, or the like.
【００１１】[0011]
【発明の効果】本発明によって、フェノール樹脂単体の
硬化物が本来有する機械的強度を実質的に低下させるこ
となく、約100℃以上の高温条件下における熱伝導率を
低下せしめたフェノール樹脂組成物が提供される。この
熱伝導率低下に有効な粉末状フェノール樹脂硬化物は、
従来は廃棄されていたものが有効利用されるばかりでは
なく、環境問題の一つの命題を解決させている。According to the present invention, a phenolic resin composition having reduced thermal conductivity under a high temperature condition of about 100 ° C. or more without substantially lowering the mechanical strength inherent in a cured product of a phenolic resin alone. Is provided. The powdered phenolic resin cured product that is effective in reducing this thermal conductivity is
What has been discarded in the past is not only used effectively, but also solves one proposition of environmental problems.
【００１２】本発明のフェノール樹脂組成物は、熱伝導
率(断熱性)が要求されるインシュレータ、インマニガス
ケット、プーリ、電気・電子部品等の成形材料として有
効に用いることができる。The phenolic resin composition of the present invention can be effectively used as a molding material for insulators, mani-gaskets, pulleys, electric / electronic parts, etc., which require thermal conductivity (heat insulation).
【００１３】[0013]
【実施例】次に、実施例について本発明を説明する。Next, the present invention will be described with reference to examples.
【００１４】実施例 平均粒径が20μmとなるようにふるい分けした粉末状フ
ェノール樹脂硬化物(ノボラック型フェノール樹脂40重
量%および繊維径13μm、繊維長さ3mmのガラス繊維60重
量%よりなるガラス繊維充填フェノール樹脂を射出成形
した際に発生したスプルーの粉砕粉末)15重量%、ノボラ
ック型フェノール樹脂(明和化成製品MW-8620)60重量%、
上記ガラス繊維15重量%およびその他の配合成分(硬化
剤、加工助剤等)10重量%をブレンダで混合し、混合した
原料を110℃でロール混練して得られたシートを粉砕し
て、熱伝導率測定用には30×100×2mmの試験片を射出成
形し、それ以外の項目の測定用にはJIS規定のものを圧
縮成形して試験片とした。EXAMPLE A powdered phenol resin cured product sieved so as to have an average particle size of 20 μm (glass fiber filling comprising 40% by weight of novolak type phenolic resin and 60% by weight of glass fiber having a fiber diameter of 13 μm and a fiber length of 3 mm) Pulverized powder of sprue generated during injection molding of phenolic resin) 15% by weight, novolak type phenolic resin (Meiwa Chemicals MW-8620) 60% by weight,
15% by weight of the above glass fiber and 10% by weight of other compounding components (hardener, processing aid, etc.) were mixed with a blender, and the mixed material was roll-kneaded at 110 ° C. to pulverize a sheet obtained. For the measurement of conductivity, a test piece of 30 × 100 × 2 mm was injection-molded, and for the measurement of other items, JIS-specified one was compression-molded to obtain a test piece.
【００１５】比較例 実施例において、粉末状フェノール樹脂硬化物を用いず
に、ノボラック型フェノール樹脂量を65重量%、ガラス
繊維量を25重量%、またその他の配合成分量を10重量%に
それぞれ変更した。Comparative Example In the examples, the amount of novolak type phenol resin was reduced to 65% by weight, the amount of glass fiber was reduced to 25% by weight, and the amounts of other components were reduced to 10% by weight without using the powdered phenol resin cured product. changed.
【００１６】以上の実施例および比較例における測定結
果は、次の表に示される。 表 測定項目 実施例 比較例 比重 1.50 1.50 引張強さ (MPa) 98 95 硬さ(ロックウェルM) 121 122 曲げ強さ (MPa) 138 155 曲げ弾性率 (GPa) 8.9 9.8 曲げ歪み (%) 2.8 2.9 シャルピー衝撃強度 (KJ/m2) 4.2 4.6 熱伝導率 50℃ (W/m・k) 0.28 0.28 100℃ (W/m・k) 0.31 0.36 150℃ (W/m・k) 0.22 0.26The measurement results in the above Examples and Comparative Examples are shown in the following table. Table Measurement items Examples Comparative examples Specific gravity 1.50 1.50 Tensile strength (MPa) 98 95 Hardness (Rockwell M) 121 122 Flexural strength (MPa) 138 155 Flexural modulus (GPa) 8.9 9.8 Flexural strain (%) 2.8 2.9 Charpy impact strength (KJ / m 2) 4.2 4.6 thermal conductivity 50 ℃ (W / m · k ) 0.28 0.28 100 ℃ (W / m · k) 0.31 0.36 150 ℃ (W / m · k) 0.22 0.26
Claims (2)
粒径が約500μm以下の粉末状フェノール樹脂硬化物60〜
3重量%よりなるフェノール樹脂組成物。1. A powdered phenolic resin cured product having a phenolic resin content of 40 to 97% by weight and an average particle size of about 500 μm or less.
A phenol resin composition comprising 3% by weight.
たは粉末状充填材(粉末状フェノール樹脂硬化物を除く)
含有物である請求項１記載の樹脂組成物。2. The powdered phenolic resin cured product is a fibrous or powdered filler (excluding the powdered phenolic resin cured product).
The resin composition according to claim 1, which is a substance contained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16645298A JP2000001598A (en) | 1998-06-15 | 1998-06-15 | Phenol resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16645298A JP2000001598A (en) | 1998-06-15 | 1998-06-15 | Phenol resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000001598A true JP2000001598A (en) | 2000-01-07 |
Family
ID=15831675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16645298A Pending JP2000001598A (en) | 1998-06-15 | 1998-06-15 | Phenol resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000001598A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10293551B2 (en) | 2011-11-08 | 2019-05-21 | Picosys Incorporated | Room temperature glass-to-glass, glass-to-plastic and glass-to-ceramic/semiconductor bonding |
-
1998
- 1998-06-15 JP JP16645298A patent/JP2000001598A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10293551B2 (en) | 2011-11-08 | 2019-05-21 | Picosys Incorporated | Room temperature glass-to-glass, glass-to-plastic and glass-to-ceramic/semiconductor bonding |
| US11571860B2 (en) | 2011-11-08 | 2023-02-07 | Corning Incorporated | Room temperature glass-to-glass, glass-to-plastic and glass-to-ceramic/semiconductor bonding |
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