JP1706320S - - Google Patents
Info
- Publication number
- JP1706320S JP1706320S JP2021014030F JP2021014030F JP1706320S JP 1706320 S JP1706320 S JP 1706320S JP 2021014030 F JP2021014030 F JP 2021014030F JP 2021014030 F JP2021014030 F JP 2021014030F JP 1706320 S JP1706320 S JP 1706320S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021014030F JP1706320S (zh) | 2021-06-28 | 2021-06-28 | |
| TW110306502F TWD225633S (zh) | 2021-06-28 | 2021-11-30 | 半導體製造裝置用隔熱組件外罩 |
| US29/820,708 USD1003834S1 (en) | 2021-06-28 | 2021-12-23 | Heat insulator cover of semiconductor manufacturing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021014030F JP1706320S (zh) | 2021-06-28 | 2021-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1706320S true JP1706320S (zh) | 2022-01-31 |
Family
ID=80218922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021014030F Active JP1706320S (zh) | 2021-06-28 | 2021-06-28 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD1003834S1 (zh) |
| JP (1) | JP1706320S (zh) |
| TW (1) | TWD225633S (zh) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD413659S (en) * | 1996-09-09 | 1999-09-07 | Swartz Mitchell R | Immersion apparatus to heat a solution |
| USD404369S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Manifold cover for use in a semiconductor wafer heat processing apparatus |
| USD407696S (en) * | 1997-08-20 | 1999-04-06 | Tokyo Electron Limited | Inner tube for use in a semiconductor wafer heat processing apparatus |
| USD615936S1 (en) * | 2009-03-06 | 2010-05-18 | Tokyo Electron Limited | Pedestal of heat insulating cylinder for manufacturing semiconductor wafers |
| JP5645718B2 (ja) * | 2011-03-07 | 2014-12-24 | 東京エレクトロン株式会社 | 熱処理装置 |
| USD655801S1 (en) * | 2011-06-28 | 2012-03-13 | Cps Products, Inc. | Portable submersible condenser/heat exchanger |
| USD694711S1 (en) * | 2012-03-23 | 2013-12-03 | Mitsubishi Electric Corporation | Insulator for vacuum circuit breaker |
| JP1564810S (zh) * | 2016-02-10 | 2016-12-05 | ||
| JP1565116S (zh) | 2016-02-10 | 2016-12-12 | ||
| TWD210787S (zh) | 2020-05-28 | 2021-04-01 | 曾仁安 | 插銷 |
-
2021
- 2021-06-28 JP JP2021014030F patent/JP1706320S/ja active Active
- 2021-11-30 TW TW110306502F patent/TWD225633S/zh unknown
- 2021-12-23 US US29/820,708 patent/USD1003834S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWD225633S (zh) | 2023-06-01 |
| USD1003834S1 (en) | 2023-11-07 |