USD367879S
(en)
*
|
1995-05-30 |
1996-03-12 |
Rubber Stampede |
Stamp pad container
|
USD437798S1
(en)
*
|
1999-11-18 |
2001-02-20 |
Sharp Kabushiki Kaisha |
Light emitting diode
|
USD477580S1
(en)
*
|
2002-01-30 |
2003-07-22 |
Nichia Corporation |
Light emitting diode
|
USD476961S1
(en)
*
|
2002-04-12 |
2003-07-08 |
Citizen Electronics Co., Ltd. |
Light-emitting diode
|
USD497350S1
(en)
*
|
2002-07-19 |
2004-10-19 |
Micro Mobio Corp. |
Power amplifier module
|
USD489338S1
(en)
*
|
2003-07-28 |
2004-05-04 |
Semiconductor Components Industries, L.L.C. |
Packaged semiconductor device
|
USD521463S1
(en)
*
|
2004-10-19 |
2006-05-23 |
Rohm Co., Ltd. |
Light emitting diode
|
USD536308S1
(en)
*
|
2004-10-19 |
2007-02-06 |
Rohm Co., Ltd. |
Light emitting diode
|
USD534503S1
(en)
*
|
2005-03-31 |
2007-01-02 |
Seoul Semiconductor Co. Ltd. |
Light emitting diode (LED)
|
USD573554S1
(en)
*
|
2007-03-30 |
2008-07-22 |
Rohm Co., Ltd. |
Light emitting diode module
|
USD583338S1
(en)
*
|
2007-09-07 |
2008-12-23 |
Cree, Inc. |
LED chip
|
USD582866S1
(en)
*
|
2007-09-07 |
2008-12-16 |
Cree, Inc. |
LED chip
|
USD635525S1
(en)
*
|
2009-04-22 |
2011-04-05 |
Cree, Inc. |
LED chip
|
USD615505S1
(en)
*
|
2009-07-27 |
2010-05-11 |
Koninklijke Philips Electronics N.V. |
LED package
|
USD691569S1
(en)
*
|
2011-03-25 |
2013-10-15 |
Cree, Inc. |
LED chip
|
KR20120133264A
(ko)
*
|
2011-05-31 |
2012-12-10 |
삼성전자주식회사 |
발광소자 렌즈, 이를 포함하는 발광소자 모듈 및 이를 이용한 발광소자 모듈의 제조방법
|
USD691973S1
(en)
*
|
2011-07-08 |
2013-10-22 |
Cree, Inc. |
Lamp packages
|
USD673126S1
(en)
*
|
2011-07-08 |
2012-12-25 |
Cree, Inc. |
LED chip
|
TWD147577S
(zh)
*
|
2011-10-21 |
2012-06-11 |
億光電子工業股份有限公司 |
發光二極體封裝
|
USD693317S1
(en)
*
|
2012-05-29 |
2013-11-12 |
Kabushiki Kaisha Toshiba |
Light-emitting diode
|
US20130328074A1
(en)
*
|
2012-06-11 |
2013-12-12 |
Cree, Inc. |
Led package with multiple element light source and encapsulant having planar surfaces
|
US10424702B2
(en)
*
|
2012-06-11 |
2019-09-24 |
Cree, Inc. |
Compact LED package with reflectivity layer
|
USD703348S1
(en)
*
|
2012-07-09 |
2014-04-22 |
Cree, Inc. |
Lamp package
|
USD718258S1
(en)
*
|
2012-09-02 |
2014-11-25 |
Cree, Inc. |
LED package
|
KR102100936B1
(ko)
*
|
2013-07-10 |
2020-04-16 |
서울바이오시스 주식회사 |
정전방전 보호 기능을 갖는 발광 다이오드 칩
|
USD730303S1
(en)
*
|
2014-06-10 |
2015-05-26 |
High Power Opto, Inc. |
LED chip
|
USD729752S1
(en)
*
|
2014-06-10 |
2015-05-19 |
High Power Opto, Inc. |
LED chip
|
USD762184S1
(en)
*
|
2014-11-13 |
2016-07-26 |
Mitsubishi Electric Corporation |
Light emitting diode
|
USD778847S1
(en)
*
|
2014-12-15 |
2017-02-14 |
Kingbright Electronics Co. Ltd. |
LED component
|
KR102305234B1
(ko)
*
|
2015-01-28 |
2021-09-29 |
쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 |
광원 유닛
|
USD794582S1
(en)
*
|
2016-07-29 |
2017-08-15 |
Enraytek Optoelectronics Co., Ltd. |
LED chip
|
USD795822S1
(en)
*
|
2016-07-29 |
2017-08-29 |
Enraytek Optoelectronics Co., Ltd. |
LED chip
|
DE112018003278B4
(de)
*
|
2017-06-27 |
2022-08-04 |
Rohm Co., Ltd. |
Terahertz-element und halbleitervorrichtung
|
DE102018104382A1
(de)
*
|
2018-02-27 |
2019-08-29 |
Osram Opto Semiconductors Gmbh |
Optoelektronisches bauelement und herstellungsverfahren
|
WO2020240907A1
(ja)
*
|
2019-05-30 |
2020-12-03 |
株式会社村田製作所 |
電子デバイス及びその製造方法
|