JP1603175S - - Google Patents
Info
- Publication number
- JP1603175S JP1603175S JPD2017-23165F JP2017023165F JP1603175S JP 1603175 S JP1603175 S JP 1603175S JP 2017023165 F JP2017023165 F JP 2017023165F JP 1603175 S JP1603175 S JP 1603175S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2017-23165F JP1603175S (en) | 2017-10-19 | 2017-10-19 | |
| US29/644,401 USD856947S1 (en) | 2017-10-19 | 2018-04-17 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2017-23165F JP1603175S (en) | 2017-10-19 | 2017-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1603175S true JP1603175S (en) | 2018-05-07 |
Family
ID=62066955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2017-23165F Active JP1603175S (en) | 2017-10-19 | 2017-10-19 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD856947S1 (en) |
| JP (1) | JP1603175S (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1593817S (en) * | 2017-03-28 | 2017-12-25 | ||
| USD906271S1 (en) * | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
| USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
| USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
| USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
| USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
| JP1680788S (en) * | 2020-07-31 | 2021-03-08 | ||
| JP1682283S (en) * | 2020-07-31 | 2021-03-29 | ||
| JP1699856S (en) * | 2020-12-15 | 2021-11-15 | semiconductor element | |
| JP1711418S (en) * | 2021-10-13 | 2022-03-31 | Semiconductor element | |
| USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
| JP1727399S (en) * | 2022-01-28 | 2022-10-14 | semiconductor element |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3602846A (en) * | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line |
| US3825876A (en) * | 1971-08-12 | 1974-07-23 | Augat Inc | Electrical component mounting |
| US3762039A (en) * | 1971-09-10 | 1973-10-02 | Mos Technology Inc | Plastic encapsulation of microcircuits |
| US3846734A (en) * | 1973-02-06 | 1974-11-05 | Amp Inc | Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates |
| USD259559S (en) * | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
| JPS60239043A (en) * | 1984-05-14 | 1985-11-27 | Oki Electric Ind Co Ltd | Manufacture of package for semiconductor device |
| JP3420057B2 (en) * | 1998-04-28 | 2003-06-23 | 株式会社東芝 | Resin-sealed semiconductor device |
| KR100369393B1 (en) * | 2001-03-27 | 2003-02-05 | 앰코 테크놀로지 코리아 주식회사 | Lead frame and semiconductor package using it and its manufacturing method |
| JP2003077939A (en) * | 2001-09-05 | 2003-03-14 | Mitsubishi Electric Corp | Semiconductor device and method of manufacturing same |
| USD480371S1 (en) * | 2001-11-30 | 2003-10-07 | Kabushiki Kaisha Toshiba | Semiconductor device |
| USD473199S1 (en) * | 2001-11-30 | 2003-04-15 | Kabushiki Kaisha Toshiba | Portion of semiconductor device |
| USD489338S1 (en) * | 2003-07-28 | 2004-05-04 | Semiconductor Components Industries, L.L.C. | Packaged semiconductor device |
| USD508682S1 (en) * | 2004-02-23 | 2005-08-23 | Kabushiki Kaisha Toshiba | Semiconductor device |
| USD521952S1 (en) * | 2004-02-23 | 2006-05-30 | Kabushiki Kaisha Toshiba | Semiconductor device |
| USD548202S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD548203S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD539761S1 (en) * | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD674760S1 (en) * | 2011-04-01 | 2013-01-22 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD721047S1 (en) * | 2013-03-07 | 2015-01-13 | Vlt, Inc. | Semiconductor device |
| USD772182S1 (en) * | 2014-04-02 | 2016-11-22 | Mitsubishi Electric Corporation | Power semiconductor device |
| JP1577498S (en) * | 2016-09-30 | 2017-05-29 | ||
| JP1584651S (en) * | 2017-01-31 | 2017-08-28 | ||
| JP1584883S (en) * | 2017-01-31 | 2017-08-28 |
-
2017
- 2017-10-19 JP JPD2017-23165F patent/JP1603175S/ja active Active
-
2018
- 2018-04-17 US US29/644,401 patent/USD856947S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD856947S1 (en) | 2019-08-20 |