JP1541874S - - Google Patents
Info
- Publication number
- JP1541874S JP1541874S JPD2015-5626F JP2015005626F JP1541874S JP 1541874 S JP1541874 S JP 1541874S JP 2015005626 F JP2015005626 F JP 2015005626F JP 1541874 S JP1541874 S JP 1541874S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2015-5626F JP1541874S (en) | 2015-03-16 | 2015-03-16 | |
| US29/539,509 USD797690S1 (en) | 2015-03-16 | 2015-09-15 | Heater for semiconductor manufacturing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2015-5626F JP1541874S (en) | 2015-03-16 | 2015-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1541874S true JP1541874S (en) | 2016-01-18 |
Family
ID=55133697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2015-5626F Active JP1541874S (en) | 2015-03-16 | 2015-03-16 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD797690S1 (en) |
| JP (1) | JP1541874S (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD846513S1 (en) * | 2016-04-27 | 2019-04-23 | Ngk Insulators, Ltd. | Sheet heater for electrostatic chuck |
| JP1581406S (en) * | 2016-10-14 | 2017-07-18 | ||
| USD832229S1 (en) * | 2017-05-26 | 2018-10-30 | TinyPCB, Inc. | Modular circuit board |
| USD839221S1 (en) * | 2017-05-30 | 2019-01-29 | TinyPCB, Inc. | Modular circuit board |
| USD839223S1 (en) * | 2017-05-30 | 2019-01-29 | TinyPCB, Inc. | Modular circuit board |
| USD842260S1 (en) * | 2017-05-30 | 2019-03-05 | TinyPCB, Inc. | Modular circuit board |
| USD841605S1 (en) * | 2017-05-30 | 2019-02-26 | TinyPCB, Inc. | Modular circuit board |
| USD839222S1 (en) * | 2017-05-30 | 2019-01-29 | TinyPCB, Inc. | Modular circuit board |
| USD841606S1 (en) * | 2017-05-30 | 2019-02-26 | TinyPCB, Inc. | Modular circuit board |
| USD887358S1 (en) * | 2018-12-06 | 2020-06-16 | Lofelt Gmbh | Motor membrane |
| JP1646292S (en) * | 2019-04-24 | 2019-11-25 | ||
| JP1651167S (en) * | 2019-04-24 | 2020-01-27 | ||
| JP1651619S (en) * | 2019-07-11 | 2020-01-27 | ||
| JP1651618S (en) * | 2019-07-11 | 2020-01-27 | ||
| JP1651623S (en) * | 2019-07-18 | 2020-01-27 | ||
| USD936187S1 (en) * | 2020-02-12 | 2021-11-16 | Applied Materials, Inc. | Gas distribution assembly lid |
| JP1684469S (en) * | 2020-09-24 | 2021-05-10 | Ceiling heater for substrate processing equipment |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1258760A (en) * | 1915-07-19 | 1918-03-12 | Thomas Bates | Stove-lid. |
| USD313072S (en) * | 1988-02-10 | 1990-12-18 | Redring Electric Limited | Electric heater element for use in a radiant heater for a glass ceramic hob |
| GB8924936D0 (en) * | 1989-11-04 | 1989-12-28 | Ceramaspeed Ltd | Radiant electric heaters |
| DE19638640C2 (en) * | 1996-09-21 | 2000-11-30 | Diehl Ako Stiftung Gmbh & Co | Radiant heater with a metal foil heating conductor |
| US6037574A (en) * | 1997-11-06 | 2000-03-14 | Watlow Electric Manufacturing | Quartz substrate heater |
| JP3477062B2 (en) * | 1997-12-26 | 2003-12-10 | 京セラ株式会社 | Wafer heating device |
| US6433317B1 (en) * | 2000-04-07 | 2002-08-13 | Watlow Polymer Technologies | Molded assembly with heating element captured therein |
| KR100798179B1 (en) * | 2001-04-27 | 2008-01-24 | 교세라 가부시키가이샤 | Wafer heating apparatus |
| US6506994B2 (en) * | 2001-06-15 | 2003-01-14 | Applied Materials, Inc. | Low profile thick film heaters in multi-slot bake chamber |
| US20030121898A1 (en) * | 2001-11-26 | 2003-07-03 | Tom Kane | Heated vacuum support apparatus |
| JP2003317906A (en) * | 2002-04-24 | 2003-11-07 | Sumitomo Electric Ind Ltd | Ceramic heater |
| WO2006060134A2 (en) * | 2004-11-15 | 2006-06-08 | Cree, Inc. | Restricted radiated heating assembly for high temperature processing |
| KR100811389B1 (en) * | 2006-03-24 | 2008-03-07 | 가부시키가이샤 뉴플레어 테크놀로지 | Semiconductor manufacturing equipment and heater |
| USD589471S1 (en) * | 2006-09-28 | 2009-03-31 | Tokyo Electron Limited | Heater for manufacturing semiconductor |
| US7777160B2 (en) * | 2007-12-17 | 2010-08-17 | Momentive Performance Materials Inc. | Electrode tuning method and apparatus for a layered heater structure |
| JP2010080909A (en) * | 2008-08-26 | 2010-04-08 | Nuflare Technology Inc | Heater, manufacturing apparatus for semiconductor device, and manufacturing method for semiconductor device |
| USD616389S1 (en) * | 2008-10-20 | 2010-05-25 | Ebara Corporation | Vacuum contact pad |
| JP5443096B2 (en) * | 2009-08-12 | 2014-03-19 | 株式会社ニューフレアテクノロジー | Semiconductor manufacturing apparatus and semiconductor manufacturing method |
| JP2013065792A (en) * | 2011-09-20 | 2013-04-11 | Nuflare Technology Inc | Heater and deposition apparatus |
| USD716774S1 (en) * | 2014-04-04 | 2014-11-04 | Avery Dennison Corporation | RFID inlay |
| CN105957820B (en) * | 2015-03-09 | 2019-12-20 | 纽富来科技股份有限公司 | Heater and semiconductor device manufacturing apparatus using same |
-
2015
- 2015-03-16 JP JPD2015-5626F patent/JP1541874S/ja active Active
- 2015-09-15 US US29/539,509 patent/USD797690S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD797690S1 (en) | 2017-09-19 |