IT969828B - Struttura semiconduttride perfezionata - Google Patents

Struttura semiconduttride perfezionata

Info

Publication number
IT969828B
IT969828B IT30834/72A IT3083472A IT969828B IT 969828 B IT969828 B IT 969828B IT 30834/72 A IT30834/72 A IT 30834/72A IT 3083472 A IT3083472 A IT 3083472A IT 969828 B IT969828 B IT 969828B
Authority
IT
Italy
Prior art keywords
perfected
semiconductive structure
semiconductive
perfected semiconductive
Prior art date
Application number
IT30834/72A
Other languages
English (en)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of IT969828B publication Critical patent/IT969828B/it

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/761PN junctions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/037Diffusion-deposition
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/085Isolated-integrated
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/151Simultaneous diffusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Bipolar Transistors (AREA)
  • Element Separation (AREA)
  • Bipolar Integrated Circuits (AREA)
IT30834/72A 1971-12-17 1972-10-24 Struttura semiconduttride perfezionata IT969828B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20923771A 1971-12-17 1971-12-17

Publications (1)

Publication Number Publication Date
IT969828B true IT969828B (it) 1974-04-10

Family

ID=22777928

Family Applications (1)

Application Number Title Priority Date Filing Date
IT30834/72A IT969828B (it) 1971-12-17 1972-10-24 Struttura semiconduttride perfezionata

Country Status (7)

Country Link
US (1) US3787253A (it)
JP (1) JPS5113629B2 (it)
CA (1) CA993569A (it)
DE (1) DE2256447A1 (it)
FR (1) FR2163773B1 (it)
GB (1) GB1372607A (it)
IT (1) IT969828B (it)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2241600A1 (de) * 1971-08-26 1973-03-01 Dionics Inc Hochspannungs-p-n-uebergang und seine anwendung in halbleiterschaltelementen, sowie verfahren zu seiner herstellung
US3971059A (en) * 1974-09-23 1976-07-20 National Semiconductor Corporation Complementary bipolar transistors having collector diffused isolation
JPS5317081A (en) * 1976-07-30 1978-02-16 Sharp Corp Production of i2l device
US5087579A (en) * 1987-05-28 1992-02-11 Texas Instruments Incorporated Method for fabricating an integrated bipolar-CMOS circuit isolation for providing different backgate and substrate bias
US5156989A (en) * 1988-11-08 1992-10-20 Siliconix, Incorporated Complementary, isolated DMOS IC technology
JPH05102175A (ja) * 1991-10-07 1993-04-23 Sharp Corp 半導体装置の製造方法
JPH05226347A (ja) * 1991-11-12 1993-09-03 Nec Corp 半導体装置
JPH09330936A (ja) * 1996-06-07 1997-12-22 Mitsubishi Electric Corp バイポーラ半導体装置及びその製造方法
KR0171128B1 (ko) * 1995-04-21 1999-02-01 김우중 수직형 바이폴라 트랜지스터
KR100331296B1 (ko) * 1995-12-20 2002-06-20 클라크 3세 존 엠. 에피택셜 핀치 저항기 및 그 형성 방법
US7027893B2 (en) * 2003-08-25 2006-04-11 Ati Industrial Automation, Inc. Robotic tool coupler rapid-connect bus
US9048104B2 (en) * 2010-07-12 2015-06-02 Microchip Technology Inc. Multi-chip package module and a doped polysilicon trench for isolation and connection

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3524113A (en) * 1967-06-15 1970-08-11 Ibm Complementary pnp-npn transistors and fabrication method therefor
US3596149A (en) * 1967-08-16 1971-07-27 Hitachi Ltd Semiconductor integrated circuit with reduced minority carrier storage effect
US3575741A (en) * 1968-02-05 1971-04-20 Bell Telephone Labor Inc Method for producing semiconductor integrated circuit device and product produced thereby
GB1226899A (it) * 1968-07-17 1971-03-31

Also Published As

Publication number Publication date
DE2256447A1 (de) 1973-06-20
FR2163773A1 (it) 1973-07-27
GB1372607A (en) 1974-10-30
FR2163773B1 (it) 1976-06-04
US3787253A (en) 1974-01-22
JPS5113629B2 (it) 1976-05-01
CA993569A (en) 1976-07-20
JPS4868187A (it) 1973-09-17

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