IT8720210A0 - Contenitore per dispositivi integrati, per il fissaggio su piastre di supporto, in particolare su circuiti stampati. - Google Patents

Contenitore per dispositivi integrati, per il fissaggio su piastre di supporto, in particolare su circuiti stampati.

Info

Publication number
IT8720210A0
IT8720210A0 IT8720210A IT2021087A IT8720210A0 IT 8720210 A0 IT8720210 A0 IT 8720210A0 IT 8720210 A IT8720210 A IT 8720210A IT 2021087 A IT2021087 A IT 2021087A IT 8720210 A0 IT8720210 A0 IT 8720210A0
Authority
IT
Italy
Prior art keywords
container
fixing
support plates
printed circuits
integrated devices
Prior art date
Application number
IT8720210A
Other languages
English (en)
Other versions
IT1215437B (it
Inventor
Angelo Massironi
Original Assignee
Sgs Microelettronica Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Microelettronica Spa filed Critical Sgs Microelettronica Spa
Priority to IT8720210A priority Critical patent/IT1215437B/it
Publication of IT8720210A0 publication Critical patent/IT8720210A0/it
Priority to EP88105164A priority patent/EP0287870B1/en
Priority to DE3855949T priority patent/DE3855949T2/de
Application granted granted Critical
Publication of IT1215437B publication Critical patent/IT1215437B/it
Priority to US08/165,043 priority patent/US5367192A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10696—Single-in-line [SIL] package
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10871—Leads having an integral insert stop
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
IT8720210A 1987-04-22 1987-04-22 Contenitore per dispositivi integrati, per il fissaggio su piastre di supporto, in particolare su circuiti stampati. IT1215437B (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
IT8720210A IT1215437B (it) 1987-04-22 1987-04-22 Contenitore per dispositivi integrati, per il fissaggio su piastre di supporto, in particolare su circuiti stampati.
EP88105164A EP0287870B1 (en) 1987-04-22 1988-03-30 Package for integrated devices
DE3855949T DE3855949T2 (de) 1987-04-22 1988-03-30 Gehäuse für integrierte Schaltungen
US08/165,043 US5367192A (en) 1987-04-22 1993-12-06 Package for integrated devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8720210A IT1215437B (it) 1987-04-22 1987-04-22 Contenitore per dispositivi integrati, per il fissaggio su piastre di supporto, in particolare su circuiti stampati.

Publications (2)

Publication Number Publication Date
IT8720210A0 true IT8720210A0 (it) 1987-04-22
IT1215437B IT1215437B (it) 1990-02-14

Family

ID=11164785

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8720210A IT1215437B (it) 1987-04-22 1987-04-22 Contenitore per dispositivi integrati, per il fissaggio su piastre di supporto, in particolare su circuiti stampati.

Country Status (4)

Country Link
US (1) US5367192A (it)
EP (1) EP0287870B1 (it)
DE (1) DE3855949T2 (it)
IT (1) IT1215437B (it)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE164706T1 (de) * 1994-09-21 1998-04-15 Siemens Ag Schichtschaltung mit anschlussklemmen
DE10154878B4 (de) * 2001-11-06 2006-01-26 e-motion Gesellschaft für Antriebstechnik mbH Halteelement zur Fixierung eines elektronischen Leistungsbauteils an einem Kühlkörper
JP2004063150A (ja) * 2002-07-25 2004-02-26 Tokai Rika Co Ltd コネクタ
US6805277B1 (en) * 2003-04-16 2004-10-19 Lotes Co., Ltd. Process for soldering electric connector onto circuit board
US20060192273A1 (en) * 2005-02-25 2006-08-31 Texas Instruments Incorporated Integrated circuit package and method of manufacture thereof
US20060279127A1 (en) * 2005-06-09 2006-12-14 Cronin John E Apparatus including a selective interface system between two sub-components

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1690304A1 (de) * 1967-09-08 1971-05-13 Telefunken Patent Elektrisches Bauelement mit wenigstens zwei nach einer Seite herausgefuehrten Anschlusselementen
DE1916410B2 (en) * 1969-03-31 1975-03-06 Siemens Ag, 1000 Berlin Und 8000 Muenchen Electrical component with springy contact connectors - uses springy contact strips for mechanical fixing of component in recess
US4171855A (en) * 1977-06-06 1979-10-23 Jef Raskin Multi-position electronic component mounting
US4215361A (en) * 1978-09-12 1980-07-29 Aavid Engineering, Inc. Winged self-fastened heat sinks for semiconductor devices
US4247981A (en) * 1979-06-18 1981-02-03 Western Electric Company, Inc. Methods of assembling interconnect members with printed circuit boards
JPS59159550A (ja) * 1983-03-01 1984-09-10 Toshiba Corp 半導体装置
JPS59208863A (ja) * 1983-05-13 1984-11-27 Yamagata Nippon Denki Kk 半導体装置
JPS6047448A (ja) * 1983-08-25 1985-03-14 Nec Ic Microcomput Syst Ltd 半導体集積回路装置
US4642670A (en) * 1983-12-02 1987-02-10 At&T Bell Laboratories Chip carrier package
JPS61144047A (ja) * 1984-12-17 1986-07-01 Mitsubishi Electric Corp 半導体装置
JPS62252157A (ja) * 1986-04-24 1987-11-02 Elco- Kk 半導体装置

Also Published As

Publication number Publication date
IT1215437B (it) 1990-02-14
US5367192A (en) 1994-11-22
DE3855949D1 (de) 1997-07-31
DE3855949T2 (de) 1997-12-18
EP0287870A3 (en) 1989-08-30
EP0287870A2 (en) 1988-10-26
EP0287870B1 (en) 1997-06-25

Similar Documents

Publication Publication Date Title
DE3881348D1 (de) Befoerderungsvorrichtung fuer gedruckte leiterplatten.
IT8322389A0 (it) Supporto per pannelli di circuiti stampati.
NO881934D0 (no) Baerer for trykte kretskort.
DE3765740D1 (de) Befestigungssystem fuer eine gedruckte schaltung.
DE3775625D1 (de) Gedruckte leiterplatte.
DE3786844D1 (de) Packung fuer integrierte schaltung.
DE3771707D1 (de) Gedruckte leiterplatte.
DE68906129D1 (de) Fuehrung fuer gedruckte schaltungsplatten.
DK161268C (da) Arrangement til informationsoverfoerende kommunikation mellem elektrisike komponenter eller kredse.
ITTO930022A0 (it) Zoccolo per supporto di circuiti integrati.
DE3789990D1 (de) Elektronisches Druckverfahren.
DE3780069D1 (de) Vorsensibilisierte druckplatte.
DE3777031D1 (de) Druckgeraet.
IT8720210A0 (it) Contenitore per dispositivi integrati, per il fissaggio su piastre di supporto, in particolare su circuiti stampati.
NO911588D0 (no) Kantlaasanordning for trykte kretskort.
DE3773969D1 (de) Ladungstransfer-einrichtung.
IT8721382A0 (it) Dispositivo di serraggio per lastre da stampa.
DE68908760D1 (de) Blattfördergerät für Druckvorrichtungen.
IT8467676A1 (it) Blocco funzionale per il montaggio di almeno una piastra di circuito stampato su un sopporto, e suoi elementi costitutivi.
DE3773751D1 (de) Druckvorrichtung fuer sonderzeichen.
DE3883902D1 (de) Druckgerät.
IT8921748A0 (it) Sostegno per lastre ibride con componenti elettronici.
DE3763295D1 (de) Druckgeraet.
EP0203623A3 (en) Wavesoldering device, particularly for printed circuits
DE3775120D1 (de) Druckvorrichtung.

Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970429