IT8521796A0 - PROCEDURE FOR ENGRAVING COPPER FILM ON CIRCUIT PLATES WITH ELECTROLYTIC RECOVERY OF COPPER FROM THE ENGRAVING SOLUTION. - Google Patents

PROCEDURE FOR ENGRAVING COPPER FILM ON CIRCUIT PLATES WITH ELECTROLYTIC RECOVERY OF COPPER FROM THE ENGRAVING SOLUTION.

Info

Publication number
IT8521796A0
IT8521796A0 IT8521796A IT2179685A IT8521796A0 IT 8521796 A0 IT8521796 A0 IT 8521796A0 IT 8521796 A IT8521796 A IT 8521796A IT 2179685 A IT2179685 A IT 2179685A IT 8521796 A0 IT8521796 A0 IT 8521796A0
Authority
IT
Italy
Prior art keywords
engraving
copper
procedure
circuit plates
solution
Prior art date
Application number
IT8521796A
Other languages
Italian (it)
Other versions
IT1185341B (en
Inventor
Willi Beyer
Rainer Haas
Original Assignee
Hoellmueller Maschbau H
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoellmueller Maschbau H filed Critical Hoellmueller Maschbau H
Publication of IT8521796A0 publication Critical patent/IT8521796A0/en
Application granted granted Critical
Publication of IT1185341B publication Critical patent/IT1185341B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/46Regeneration of etching compositions
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions
    • C23F1/32Alkaline compositions
    • C23F1/34Alkaline compositions for etching copper or alloys thereof
IT21796/85A 1984-08-14 1985-07-31 PROCEDURE FOR ENGRAVING COPPER FILMS ON CIRCUIT PLATES WITH ELECTROLYTIC COPPER RECOVERY FROM THE ENGRAVING SOLUTION IT1185341B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843429902 DE3429902A1 (en) 1984-08-14 1984-08-14 METHOD FOR ETCHING COPPER FILMS ON BOARDS UNDER ELECTROLYTIC RECOVERY OF COPPER FROM THE ACET SOLUTION

Publications (2)

Publication Number Publication Date
IT8521796A0 true IT8521796A0 (en) 1985-07-31
IT1185341B IT1185341B (en) 1987-11-12

Family

ID=6243027

Family Applications (1)

Application Number Title Priority Date Filing Date
IT21796/85A IT1185341B (en) 1984-08-14 1985-07-31 PROCEDURE FOR ENGRAVING COPPER FILMS ON CIRCUIT PLATES WITH ELECTROLYTIC COPPER RECOVERY FROM THE ENGRAVING SOLUTION

Country Status (10)

Country Link
JP (1) JPS61106782A (en)
AT (1) AT387590B (en)
BE (1) BE903054A (en)
BR (1) BR8503833A (en)
DE (1) DE3429902A1 (en)
FR (1) FR2569205A1 (en)
GB (1) GB2163101A (en)
IT (1) IT1185341B (en)
NL (1) NL8502245A (en)
SE (1) SE8503594L (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT395177B (en) * 1990-07-05 1992-10-12 Provera Gmbh RESOLUTION
US5431776A (en) * 1993-09-08 1995-07-11 Phibro-Tech, Inc. Copper etchant solution additives
CH689018A5 (en) * 1994-09-08 1998-07-31 Ecochem Ag A method of electrowinning of heavy metals.
DE102006036888A1 (en) * 2005-11-10 2007-05-16 Eve Recycling Sarl Regenerable etching solution
WO2012171209A1 (en) * 2011-06-17 2012-12-20 Empire Technology Development Llc Reclaiming metal from articles

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3324450A1 (en) * 1983-07-07 1985-01-17 ELO-CHEM Ätztechnik GmbH, 7758 Meersburg AMMONIUM SULFATE-CONTAINING ETCH SOLUTION AND METHOD FOR REGENERATING THE ETCH SOLUTION
DE3340342A1 (en) * 1983-11-08 1985-05-15 ELO-CHEM Ätztechnik GmbH, 7758 Meersburg METHOD AND PLANT FOR REGENERATING AN AMMONIA ACID SOLUTION

Also Published As

Publication number Publication date
AT387590B (en) 1989-02-10
SE8503594D0 (en) 1985-07-25
BE903054A (en) 1985-12-02
GB8518145D0 (en) 1985-08-21
GB2163101A (en) 1986-02-19
DE3429902A1 (en) 1986-02-27
FR2569205A1 (en) 1986-02-21
NL8502245A (en) 1986-03-03
ATA235785A (en) 1988-07-15
JPS61106782A (en) 1986-05-24
IT1185341B (en) 1987-11-12
BR8503833A (en) 1986-05-27
SE8503594L (en) 1986-02-15

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