IT8422846A1 - Dispositivo a semiconduttore e procedimento per la sua fabbricazione - Google Patents

Dispositivo a semiconduttore e procedimento per la sua fabbricazione

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Publication number
IT8422846A1
IT8422846A1 IT1984A22846A IT2284684A IT8422846A1 IT 8422846 A1 IT8422846 A1 IT 8422846A1 IT 1984A22846 A IT1984A22846 A IT 1984A22846A IT 2284684 A IT2284684 A IT 2284684A IT 8422846 A1 IT8422846 A1 IT 8422846A1
Authority
IT
Italy
Prior art keywords
procedure
manufacturing
semiconductor device
semiconductor
Prior art date
Application number
IT1984A22846A
Other languages
English (en)
Other versions
IT1176815B (it
IT8422846A0 (it
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP58177945A external-priority patent/JPS6070751A/ja
Priority claimed from JP58177944A external-priority patent/JPS6070750A/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of IT8422846A0 publication Critical patent/IT8422846A0/it
Publication of IT8422846A1 publication Critical patent/IT8422846A1/it
Application granted granted Critical
Publication of IT1176815B publication Critical patent/IT1176815B/it

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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
IT22846/84A 1983-09-28 1984-09-26 Dispositivo a semiconduttore e procedimento per la sua fabbricazione IT1176815B (it)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP58177945A JPS6070751A (ja) 1983-09-28 1983-09-28 半導体装置
JP58177944A JPS6070750A (ja) 1983-09-28 1983-09-28 半導体装置

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IT8422846A0 IT8422846A0 (it) 1984-09-26
IT8422846A1 true IT8422846A1 (it) 1986-03-26
IT1176815B IT1176815B (it) 1987-08-18

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DE (1) DE3435489A1 (it)
FR (1) FR2555813B1 (it)
GB (1) GB2146937B (it)
HK (1) HK22389A (it)
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IT1183375B (it) * 1984-02-24 1987-10-22 Hitachi Ltd Dispositivo a semiconduttori comprendente una pallina, fili conduttori e porzioni conduttrici esterneche sono collegate alla pallina mediante tali fili conduttori
JPS60223149A (ja) * 1984-04-19 1985-11-07 Hitachi Ltd 半導体装置
US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
US4976393A (en) * 1986-12-26 1990-12-11 Hitachi, Ltd. Semiconductor device and production process thereof, as well as wire bonding device used therefor
DE69004452T2 (de) * 1989-02-13 1994-03-10 Bayer Agrochem Kk Nitroverbindungen als Insektizide.
US5437405A (en) * 1994-08-22 1995-08-01 National Semiconductor Corporation Method and apparatus for stitch bonding of wires to integrated circuit bonding pads
DE102007025658B4 (de) * 2007-06-01 2009-04-09 Infineon Technologies Ag Bonddrahtanordnung und Verfahren zur Herstellung einer Bonddrahtanordnung
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HK22389A (en) 1989-03-24
IT1176815B (it) 1987-08-18
GB8424394D0 (en) 1984-10-31
FR2555813A1 (fr) 1985-05-31
GB2146937A (en) 1985-05-01
IT8422846A0 (it) 1984-09-26
FR2555813B1 (fr) 1986-06-20
KR850002668A (ko) 1985-05-15
SG77288G (en) 1989-03-23
KR920008252B1 (ko) 1992-09-25
DE3435489A1 (de) 1985-05-02
GB2146937B (en) 1987-04-23

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