IT8224333A0 - Scheda di identificazione con modulo a circuito integrato (ic) a piu' strati laminati a caldo. - Google Patents

Scheda di identificazione con modulo a circuito integrato (ic) a piu' strati laminati a caldo.

Info

Publication number
IT8224333A0
IT8224333A0 IT8224333A IT2433382A IT8224333A0 IT 8224333 A0 IT8224333 A0 IT 8224333A0 IT 8224333 A IT8224333 A IT 8224333A IT 2433382 A IT2433382 A IT 2433382A IT 8224333 A0 IT8224333 A0 IT 8224333A0
Authority
IT
Italy
Prior art keywords
hot
module
integrated circuit
identification card
layer integrated
Prior art date
Application number
IT8224333A
Other languages
English (en)
Other versions
IT1153085B (it
IT8224333A1 (it
Inventor
Joachim Hoppe
Yahya Haghiri-Tehrani
Original Assignee
Gao Ges Automation Org
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gao Ges Automation Org filed Critical Gao Ges Automation Org
Publication of IT8224333A0 publication Critical patent/IT8224333A0/it
Publication of IT8224333A1 publication Critical patent/IT8224333A1/it
Application granted granted Critical
Publication of IT1153085B publication Critical patent/IT1153085B/it

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
    • G01S7/523—Details of pulse systems
    • G01S7/526—Receivers
    • G01S7/529—Gain of receiver varied automatically during pulse-recurrence period
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S283/00—Printed matter
    • Y10S283/904—Credit card

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Financial Or Insurance-Related Operations Such As Payment And Settlement (AREA)
  • Structure Of Printed Boards (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
IT24333/82A 1981-12-24 1982-11-19 Scheda di identificazione con modulo a circuito integrato (ic) a piu' strati laminati a caldo IT1153085B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3151408A DE3151408C1 (de) 1981-12-24 1981-12-24 Ausweiskarte mit einem IC-Baustein

Publications (3)

Publication Number Publication Date
IT8224333A0 true IT8224333A0 (it) 1982-11-19
IT8224333A1 IT8224333A1 (it) 1984-05-19
IT1153085B IT1153085B (it) 1987-01-14

Family

ID=6149744

Family Applications (1)

Application Number Title Priority Date Filing Date
IT24333/82A IT1153085B (it) 1981-12-24 1982-11-19 Scheda di identificazione con modulo a circuito integrato (ic) a piu' strati laminati a caldo

Country Status (10)

Country Link
US (2) US4552383A (it)
JP (1) JPS58125892A (it)
BE (1) BE895353A (it)
CH (2) CH659333A5 (it)
DE (1) DE3151408C1 (it)
FR (1) FR2519166B1 (it)
GB (2) GB2112324B (it)
IT (1) IT1153085B (it)
NL (1) NL188275C (it)
SE (1) SE455899B (it)

Families Citing this family (98)

* Cited by examiner, † Cited by third party
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FR2548409B1 (fr) * 1983-06-29 1985-11-15 Sligos Procede pour la fabrication de cartes a memoire, installation et cartes a memoire obtenues
FR2552252B1 (fr) * 1983-09-21 1987-07-31 Dassault Electronique Lecteur mixte pour cartes a piste magnetique et/ou a puce electronique
JPS60142489A (ja) * 1983-12-28 1985-07-27 Dainippon Printing Co Ltd Ｉｃカ−ド
US5140517A (en) * 1984-03-19 1992-08-18 Omron Tateisi Electronics Co. IC card with keyboard for prestoring transaction data
US4876441A (en) * 1984-03-27 1989-10-24 Casio Computer Co., Ltd. Card-like electronic apparatus
US4754418A (en) * 1984-03-27 1988-06-28 Casio Computer Co., Ltd. Combined electronic calculator and credit card
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JPS61123990A (ja) * 1984-11-05 1986-06-11 Casio Comput Co Ltd Ｉｃカ−ド
JPS61133489A (ja) * 1984-12-03 1986-06-20 Mitsubishi Plastics Ind Ltd メモリ−カ−ド
JPH0752461B2 (ja) * 1985-03-04 1995-06-05 カシオ計算機株式会社 Ｉｃカ−ド
FR2581480A1 (fr) * 1985-04-10 1986-11-07 Ebauches Electroniques Sa Unite electronique notamment pour carte a microcircuits et carte comprenant une telle unite
FR2580416B1 (fr) * 1985-04-12 1987-06-05 Radiotechnique Compelec Procede et dispositif pour fabriquer une carte d'identification electronique
JPS61265126A (ja) * 1985-05-20 1986-11-22 浜松ホトニクス株式会社 眼底カメラ装置
FR2584235B1 (fr) * 1985-06-26 1988-04-22 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
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DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
JPS63141790A (ja) * 1986-12-03 1988-06-14 菱電化成株式会社 識別カ−ド
JPH0696357B2 (ja) * 1986-12-11 1994-11-30 三菱電機株式会社 Ｉｃカードの製造方法
JPH08479B2 (ja) * 1986-12-11 1996-01-10 三菱電機株式会社 Ｉｃカードの製造方法
US5304513A (en) * 1987-07-16 1994-04-19 Gao Gesellschaft Fur Automation Und Organisation Mbh Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame
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FR2625350B1 (fr) * 1987-12-29 1991-05-24 Bull Cp8 Carte a microcircuits electroniques et procede de fabrication de cette carte
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FR2629236B1 (fr) * 1988-03-22 1991-09-27 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede
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US5155068A (en) * 1989-08-31 1992-10-13 Sharp Kabushiki Kaisha Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal
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JP2687661B2 (ja) * 1990-03-26 1997-12-08 三菱電機株式会社 Ｉｃカードの製造方法
DE4040770C2 (de) * 1990-12-19 1999-11-11 Gao Ges Automation Org Datenträger mit integriertem Schaltkreis
US5272596A (en) * 1991-06-24 1993-12-21 At&T Bell Laboratories Personal data card fabricated from a polymer thick-film circuit
DE4122049A1 (de) * 1991-07-03 1993-01-07 Gao Ges Automation Org Verfahren zum einbau eines traegerelements
DE9113601U1 (de) * 1991-10-31 1993-03-04 Schneider, Edgar, 8057 Günzenhausen Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-Karten
US5374818A (en) * 1992-03-09 1994-12-20 Control Module Inc. Identification means with integral memory device
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DE4234158A1 (de) * 1992-10-10 1994-04-14 Walter Holzer Duale Datenträgerkarte
US5689136A (en) * 1993-08-04 1997-11-18 Hitachi, Ltd. Semiconductor device and fabrication method
DE4337921C2 (de) * 1993-11-06 1998-09-03 Ods Gmbh & Co Kg Kontaktlose Chipkarte mit Antennenspule
DE4343206A1 (de) * 1993-12-17 1995-06-22 Bayer Ag Verfahren zur Herstellung von Rohlingen für Ausweiskarten
DE4403753C1 (de) * 1994-02-08 1995-07-20 Angewandte Digital Elektronik Kombinierte Chipkarte
US5661336A (en) * 1994-05-03 1997-08-26 Phelps, Jr.; Douglas Wallace Tape application platform and processes therefor
DE4424396C2 (de) * 1994-07-11 1996-12-12 Ibm Trägerelement zum Einbau in Chipkarten oder anderen Datenträgerkarten
USD379006S (en) * 1995-05-30 1997-04-29 Solaic (Societe Anonyme) Smart card with m-shaped isolation region
DE19528730A1 (de) * 1995-08-04 1997-02-06 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Datenträgers
US6072698A (en) * 1995-09-27 2000-06-06 Siemens Aktiengesellschaft Chip module with heat insulation for incorporation into a chip card
EP0845755B1 (fr) * 1996-12-02 2004-03-10 Swisscom Mobile AG Carte à puce et programme pour cartes à puces
JPH1134553A (ja) * 1997-07-18 1999-02-09 Rohm Co Ltd Ｉｃモジュール、およびその製造方法、ならびにこれを備えたｉｃカード
FR2778769B1 (fr) * 1998-05-15 2001-11-02 Gemplus Sca Carte a circuit integre comportant un bornier d'interface et procede de fabrication d'une telle carte
FR2788882A1 (fr) * 1999-01-27 2000-07-28 Schlumberger Systems & Service Dispositif a circuits integres, module electronique pour carte a puce utilisant le dispositif et procede de fabrication dudit dispositif
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US20050165683A1 (en) * 2004-01-13 2005-07-28 Acquenetta Taylor System and method for using a universal payment card for transportation vehicles for hire
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EP2332738B1 (en) 2009-12-10 2012-07-04 Agfa-Gevaert Security document with security feature on edge
PL2335937T3 (pl) 2009-12-18 2013-06-28 Agfa Gevaert Znakowalna laserowo folia zabezpieczająca
EP2335938B1 (en) 2009-12-18 2013-02-20 Agfa-Gevaert Laser markable security film
DE102010011517A1 (de) * 2010-03-15 2011-09-15 Smartrac Ip B.V. Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD707682S1 (en) * 2012-12-05 2014-06-24 Logomotion, S.R.O. Memory card
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
USD759022S1 (en) 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
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JPS522640A (en) * 1975-06-24 1977-01-10 Reiko Sakuma Fat abdominal suit and method of producing same
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FR2337381A1 (fr) * 1975-12-31 1977-07-29 Honeywell Bull Soc Ind Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte
DE2920012C2 (de) * 1979-05-17 1988-09-29 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte
FR2486685B1 (fr) * 1980-07-09 1985-10-31 Labo Electronique Physique Carte de paiement electronique et procede de realisation
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
NL191959B (nl) * 1981-03-24 1996-07-01 Gao Ges Automation Org Identificatiekaart met IC-bouwsteen en dragerelement voor een IC-bouwsteen.
DE3130206A1 (de) * 1981-07-30 1983-02-17 Siemens AG, 1000 Berlin und 8000 München Tragbare karte zur informationsverarbeitung

Also Published As

Publication number Publication date
NL188275B (nl) 1991-12-16
SE8206753D0 (sv) 1982-11-26
CH670008A5 (en) 1989-04-28
GB2112324A (en) 1983-07-20
DE3151408C1 (de) 1983-06-01
NL8204485A (nl) 1983-07-18
JPS58125892A (ja) 1983-07-27
GB2150496A (en) 1985-07-03
SE455899B (sv) 1988-08-15
NL188275C (nl) 1992-05-18
IT1153085B (it) 1987-01-14
US4552383A (en) 1985-11-12
BE895353A (fr) 1983-03-31
GB8500067D0 (en) 1985-02-13
GB2150496B (en) 1986-02-12
FR2519166B1 (fr) 1989-03-03
IT8224333A1 (it) 1984-05-19
CH659333A5 (en) 1987-01-15
GB2112324B (en) 1986-01-02
JPH0130149B2 (it) 1989-06-16
FR2519166A1 (fr) 1983-07-01
US4603249A (en) 1986-07-29
SE8206753L (sv) 1983-06-25

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Effective date: 19971127