IT7926086A0 - Metodo per la saldatura di fili metallici a conduttori di microcircuiti su chip passivati. - Google Patents

Metodo per la saldatura di fili metallici a conduttori di microcircuiti su chip passivati.

Info

Publication number
IT7926086A0
IT7926086A0 IT7926086A IT2608679A IT7926086A0 IT 7926086 A0 IT7926086 A0 IT 7926086A0 IT 7926086 A IT7926086 A IT 7926086A IT 2608679 A IT2608679 A IT 2608679A IT 7926086 A0 IT7926086 A0 IT 7926086A0
Authority
IT
Italy
Prior art keywords
microcircuit
leaders
metal wires
soldering metal
passivated
Prior art date
Application number
IT7926086A
Other languages
English (en)
Other versions
IT1165447B (it
Inventor
Praveen Chaudhari
John Bradford Kiessling
David Jacob Perlman
Eugene Edward Tynan
Robert Jacob Von Gutfeld
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of IT7926086A0 publication Critical patent/IT7926086A0/it
Application granted granted Critical
Publication of IT1165447B publication Critical patent/IT1165447B/it

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/22—Spot welding
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/05617—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laser Beam Processing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
IT26086/79A 1978-10-31 1979-09-28 Metodo per la saldatura di fili metallici a conduttori di microcircuiti su chip passivati IT1165447B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US95615878A 1978-10-31 1978-10-31

Publications (2)

Publication Number Publication Date
IT7926086A0 true IT7926086A0 (it) 1979-09-28
IT1165447B IT1165447B (it) 1987-04-22

Family

ID=25497833

Family Applications (1)

Application Number Title Priority Date Filing Date
IT26086/79A IT1165447B (it) 1978-10-31 1979-09-28 Metodo per la saldatura di fili metallici a conduttori di microcircuiti su chip passivati

Country Status (5)

Country Link
EP (1) EP0010610B1 (it)
JP (1) JPS5562680A (it)
CA (1) CA1135871A (it)
DE (1) DE2965205D1 (it)
IT (1) IT1165447B (it)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3370240D1 (en) * 1982-12-06 1987-04-16 Welding Inst Bonding leads to semiconductor devices
DE3390451C2 (de) * 1983-01-24 1989-05-11 Ford Werke Ag Verfahren zum Laser-L¦ten
IT1195117B (it) * 1986-08-01 1988-10-12 Vallko Srl Tettuccio apribile di autoveicolo
US4928384A (en) * 1987-03-24 1990-05-29 Cooper Industries, Inc. Method of making a wire bonded microfuse
US5093988A (en) * 1991-01-24 1992-03-10 Kohler Co. Method for attaching a flexible connector
DE69430151T2 (de) * 1993-05-21 2002-08-22 Toyota Jidosha K.K., Toyota Laserschweissverfahren
US6501043B1 (en) * 1999-10-22 2002-12-31 Medtronic, Inc. Apparatus and method for laser welding of ribbons
DE102018213639A1 (de) * 2018-08-14 2020-02-20 Te Connectivity Germany Gmbh Verfahren zum Anbringen wenigstens eines insbesondere stiftförmigen Kontaktelements auf einer Leiterbahn einer Leiterplatte, Stiftleiste zur Anbringung auf einer Leiterplatte, Verbindungsanordnung

Also Published As

Publication number Publication date
DE2965205D1 (en) 1983-05-19
IT1165447B (it) 1987-04-22
JPS5562680A (en) 1980-05-12
EP0010610B1 (fr) 1983-04-13
EP0010610A1 (fr) 1980-05-14
CA1135871A (en) 1982-11-16
JPS5642114B2 (it) 1981-10-02

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