IT1395561B1 - Apparato di collaudo e relativo procedimento - Google Patents
Apparato di collaudo e relativo procedimentoInfo
- Publication number
- IT1395561B1 IT1395561B1 ITUD2009A000146A ITUD20090146A IT1395561B1 IT 1395561 B1 IT1395561 B1 IT 1395561B1 IT UD2009A000146 A ITUD2009A000146 A IT UD2009A000146A IT UD20090146 A ITUD20090146 A IT UD20090146A IT 1395561 B1 IT1395561 B1 IT 1395561B1
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- test system
- test
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S50/00—Monitoring or testing of PV systems, e.g. load balancing or fault identification
- H02S50/10—Testing of PV devices, e.g. of PV modules or single PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Photovoltaic Devices (AREA)
- Maintenance And Management Of Digital Transmission (AREA)
- Hardware Redundancy (AREA)
Priority Applications (13)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUD2009A000146A IT1395561B1 (it) | 2009-09-03 | 2009-09-03 | Apparato di collaudo e relativo procedimento |
PCT/EP2010/062831 WO2011026875A1 (en) | 2009-09-03 | 2010-09-02 | Testing apparatus and relative method |
DE202010018086U DE202010018086U1 (de) | 2009-09-03 | 2010-09-02 | Testvorrichtung |
KR1020127008522A KR101862245B1 (ko) | 2009-09-03 | 2010-09-02 | 시험 장치 및 관련 방법 |
DE202010018088.0U DE202010018088U1 (de) | 2009-09-03 | 2010-09-02 | Testvorrichtung |
DE202010018093.7U DE202010018093U1 (de) | 2009-09-03 | 2010-09-02 | Testvorrichtung |
TW103126444A TWI550290B (zh) | 2009-09-03 | 2010-09-02 | 用於電子裝置的測試設備 |
TW099129742A TWI451103B (zh) | 2009-09-03 | 2010-09-02 | 測試設備與相關方法 |
CN201410411864.2A CN104181449B (zh) | 2009-09-03 | 2010-09-02 | 测试设备与相关方法 |
EP10752540.4A EP2473862B1 (en) | 2009-09-03 | 2010-09-02 | Testing apparatus and relative method |
JP2012527310A JP2013504050A (ja) | 2009-09-03 | 2010-09-02 | 試験装置および関連方法 |
US13/394,127 US9412898B2 (en) | 2009-09-03 | 2010-09-02 | Apparatus and method of testing a substrate using a supporting nest and testing probes |
CN201080039570.1A CN102483437B (zh) | 2009-09-03 | 2010-09-02 | 测试设备与相关方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUD2009A000146A IT1395561B1 (it) | 2009-09-03 | 2009-09-03 | Apparato di collaudo e relativo procedimento |
Publications (2)
Publication Number | Publication Date |
---|---|
ITUD20090146A1 ITUD20090146A1 (it) | 2011-03-04 |
IT1395561B1 true IT1395561B1 (it) | 2012-09-28 |
Family
ID=42355406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITUD2009A000146A IT1395561B1 (it) | 2009-09-03 | 2009-09-03 | Apparato di collaudo e relativo procedimento |
Country Status (9)
Country | Link |
---|---|
US (1) | US9412898B2 (it) |
EP (1) | EP2473862B1 (it) |
JP (1) | JP2013504050A (it) |
KR (1) | KR101862245B1 (it) |
CN (2) | CN102483437B (it) |
DE (3) | DE202010018088U1 (it) |
IT (1) | IT1395561B1 (it) |
TW (2) | TWI550290B (it) |
WO (1) | WO2011026875A1 (it) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101685461B1 (ko) * | 2011-09-05 | 2016-12-20 | 가부시키가이샤 니혼 마이크로닉스 | 시트상 이차전지의 평가장치 및 평가방법 |
ITUD20110166A1 (it) * | 2011-10-18 | 2013-04-19 | Applied Materials Italia Srl | Dispositivo di test per collaudare piastre per circuiti elettronici e relativo procedimento |
CN103063996B (zh) * | 2012-12-14 | 2015-08-05 | 浙江晶科能源有限公司 | 一种背接触太阳能电池片测试装置 |
MY174175A (en) * | 2013-07-11 | 2020-03-12 | Johnstech Int Corporation | Testing apparatus and method for microcircuit and wafer level ic testing |
JP2015049137A (ja) * | 2013-09-02 | 2015-03-16 | 三菱電機株式会社 | 半導体チップ試験装置及び方法 |
CN104702207B (zh) * | 2013-12-03 | 2017-06-06 | Lg电子株式会社 | 太阳能电池测量设备 |
CN103956973A (zh) * | 2014-05-20 | 2014-07-30 | 常州亿晶光电科技有限公司 | 一种片状材料耐老化测试用支架 |
CN112018013A (zh) * | 2014-12-02 | 2020-12-01 | 应用材料意大利有限公司 | 在生产太阳能电池基板上印刷的装置及传输该基板的方法 |
WO2018077423A1 (en) * | 2016-10-28 | 2018-05-03 | Applied Materials Italia S.R.L. | Apparatus for testing solar cells, system for production of solar cells, and method for controlling an irradiation device for simulating a spectrum of solar radiation |
TWI627400B (zh) * | 2017-04-11 | 2018-06-21 | Defective rejection method for passive component batch detection and rejection system thereof | |
CN112014600B (zh) * | 2019-05-31 | 2023-11-24 | 三赢科技(深圳)有限公司 | 测试治具及测试机台 |
IL296241A (en) | 2020-03-10 | 2022-11-01 | Massachusetts Inst Technology | Compositions and methods for immunotherapy for npm1c-positive cancer |
DE102020114669A1 (de) * | 2020-06-02 | 2021-12-02 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Elektrische vorrichtung |
Family Cites Families (29)
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US4491173A (en) * | 1982-05-28 | 1985-01-01 | Temptronic Corporation | Rotatable inspection table |
US4561541A (en) * | 1983-09-26 | 1985-12-31 | Spectrolab, Incorporated | Carrier system for photovoltaic cells |
US4771234A (en) * | 1986-11-20 | 1988-09-13 | Hewlett-Packard Company | Vacuum actuated test fixture |
JPH073833B2 (ja) * | 1987-03-30 | 1995-01-18 | 東京エレクトロン株式会社 | プローブ装置 |
US4814698A (en) * | 1987-10-14 | 1989-03-21 | Everett/Charles Contact Products, Inc. | Technique for elimination of static in printed circuit board test fixtures |
US4841231A (en) * | 1987-10-30 | 1989-06-20 | Unisys Corporation | Test probe accessibility method and tool |
US5027063A (en) * | 1990-04-24 | 1991-06-25 | John Fluke Mfg. Co., Inc. | Vacuum-actuated test fixture for testing electronic components |
JPH07263526A (ja) | 1994-03-17 | 1995-10-13 | Hitachi Ltd | ウェハチャックおよび半導体素子の冷却方法 |
WO1996029607A1 (fr) * | 1995-03-18 | 1996-09-26 | Tokyo Electron Limited | Procede et appareil de controle d'un substrat |
JPH0829499A (ja) | 1994-07-15 | 1996-02-02 | Nec Corp | 回路基板の検査装置 |
US5708222A (en) * | 1994-08-01 | 1998-01-13 | Tokyo Electron Limited | Inspection apparatus, transportation apparatus, and temperature control apparatus |
DE4428797C2 (de) * | 1994-08-13 | 1997-04-17 | Kommunikations Elektronik | Vorrichtung zum Prüfen von Leiterkarten und/oder Flachbaugruppen |
JPH08236594A (ja) * | 1995-02-28 | 1996-09-13 | Hitachi Ltd | 半導体装置の検査装置 |
JP3320706B2 (ja) | 1999-08-18 | 2002-09-03 | イビデン株式会社 | ウエハプローバ、ウエハプローバに使用されるセラミック基板およびウエハプローバ装置 |
JP3735556B2 (ja) * | 2001-10-23 | 2006-01-18 | 株式会社ルネサステクノロジ | 半導体装置の製造方法及び半導体装置 |
JP4483795B2 (ja) * | 2001-12-25 | 2010-06-16 | 東京エレクトロン株式会社 | 受け渡し機構及び処理装置 |
US6894479B2 (en) * | 2002-08-26 | 2005-05-17 | Agilent Technologies, Inc. | Connector cable and method for probing vacuum-sealable electronic nodes of an electrical testing device |
DE10331565A1 (de) * | 2003-05-28 | 2004-12-30 | Osram Opto Semiconductors Gmbh | Vorrichtung zum Haltern von Wafern, Messvorrichtung zum Vermessen von Wafern sowie Verfahren zum Vermessen von Wafern |
JP2005156317A (ja) * | 2003-11-25 | 2005-06-16 | Sony Corp | 電子部品測定装置及び電子部品測定方法 |
US7355418B2 (en) * | 2004-02-12 | 2008-04-08 | Applied Materials, Inc. | Configurable prober for TFT LCD array test |
US20060038554A1 (en) * | 2004-02-12 | 2006-02-23 | Applied Materials, Inc. | Electron beam test system stage |
US20060000806A1 (en) * | 2004-06-30 | 2006-01-05 | Golzarian Reza M | Substrate carrier for surface planarization |
DE102004050463B3 (de) * | 2004-10-16 | 2006-04-20 | Manz Automation Ag | Testsystem für Solarzellen |
JP4600655B2 (ja) * | 2004-12-15 | 2010-12-15 | セイコーエプソン株式会社 | 基板保持方法 |
CN100395879C (zh) | 2005-12-05 | 2008-06-18 | 深圳市矽电半导体设备有限公司 | 一种半导体晶圆片多路测试方法和多路测试探针台 |
CN101212016A (zh) * | 2006-12-31 | 2008-07-02 | 中国科学院半导体研究所 | 一种互补式金属氧化层半导体磁传感器 |
JP4991495B2 (ja) * | 2007-11-26 | 2012-08-01 | 東京エレクトロン株式会社 | 検査用保持部材及び検査用保持部材の製造方法 |
JP5088167B2 (ja) * | 2008-02-22 | 2012-12-05 | 東京エレクトロン株式会社 | プローブ装置、プロービング方法及び記憶媒体 |
CN201233434Y (zh) * | 2008-04-14 | 2009-05-06 | 无锡市易控***工程有限公司 | 全自动晶圆测试平台装置 |
-
2009
- 2009-09-03 IT ITUD2009A000146A patent/IT1395561B1/it active
-
2010
- 2010-09-02 DE DE202010018088.0U patent/DE202010018088U1/de not_active Expired - Lifetime
- 2010-09-02 CN CN201080039570.1A patent/CN102483437B/zh active Active
- 2010-09-02 DE DE202010018086U patent/DE202010018086U1/de not_active Expired - Lifetime
- 2010-09-02 EP EP10752540.4A patent/EP2473862B1/en not_active Not-in-force
- 2010-09-02 WO PCT/EP2010/062831 patent/WO2011026875A1/en active Application Filing
- 2010-09-02 JP JP2012527310A patent/JP2013504050A/ja active Pending
- 2010-09-02 DE DE202010018093.7U patent/DE202010018093U1/de not_active Expired - Lifetime
- 2010-09-02 US US13/394,127 patent/US9412898B2/en not_active Expired - Fee Related
- 2010-09-02 CN CN201410411864.2A patent/CN104181449B/zh active Active
- 2010-09-02 KR KR1020127008522A patent/KR101862245B1/ko active IP Right Grant
- 2010-09-02 TW TW103126444A patent/TWI550290B/zh not_active IP Right Cessation
- 2010-09-02 TW TW099129742A patent/TWI451103B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW201126183A (en) | 2011-08-01 |
DE202010018093U1 (de) | 2014-01-09 |
DE202010018086U1 (de) | 2013-12-16 |
US9412898B2 (en) | 2016-08-09 |
TWI451103B (zh) | 2014-09-01 |
US20120229156A1 (en) | 2012-09-13 |
KR20120058604A (ko) | 2012-06-07 |
CN104181449B (zh) | 2017-08-04 |
TW201443459A (zh) | 2014-11-16 |
ITUD20090146A1 (it) | 2011-03-04 |
CN104181449A (zh) | 2014-12-03 |
KR101862245B1 (ko) | 2018-05-29 |
CN102483437A (zh) | 2012-05-30 |
CN102483437B (zh) | 2015-06-17 |
WO2011026875A1 (en) | 2011-03-10 |
TWI550290B (zh) | 2016-09-21 |
JP2013504050A (ja) | 2013-02-04 |
EP2473862A1 (en) | 2012-07-11 |
EP2473862B1 (en) | 2018-06-20 |
DE202010018088U1 (de) | 2014-01-08 |
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