IT1395368B1 - Schermatura elettromagnetica per il collaudo di circuiti integrati - Google Patents
Schermatura elettromagnetica per il collaudo di circuiti integratiInfo
- Publication number
- IT1395368B1 IT1395368B1 ITMI2009A001511A ITMI20091511A IT1395368B1 IT 1395368 B1 IT1395368 B1 IT 1395368B1 IT MI2009A001511 A ITMI2009A001511 A IT MI2009A001511A IT MI20091511 A ITMI20091511 A IT MI20091511A IT 1395368 B1 IT1395368 B1 IT 1395368B1
- Authority
- IT
- Italy
- Prior art keywords
- testing
- integrated circuits
- electromagnetic shield
- shield
- electromagnetic
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI2009A001511A IT1395368B1 (it) | 2009-08-28 | 2009-08-28 | Schermatura elettromagnetica per il collaudo di circuiti integrati |
US12/851,680 US8907693B2 (en) | 2009-08-28 | 2010-08-06 | Electromagnetic shield for testing integrated circuits |
US14/533,526 US9874586B2 (en) | 2009-08-28 | 2014-11-05 | Electromagnetic shield for testing integrated circuits |
US15/838,550 US10677816B2 (en) | 2009-08-28 | 2017-12-12 | Electromagnetic shield for testing integrated circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI2009A001511A IT1395368B1 (it) | 2009-08-28 | 2009-08-28 | Schermatura elettromagnetica per il collaudo di circuiti integrati |
Publications (2)
Publication Number | Publication Date |
---|---|
ITMI20091511A1 ITMI20091511A1 (it) | 2011-02-28 |
IT1395368B1 true IT1395368B1 (it) | 2012-09-14 |
Family
ID=42040543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITMI2009A001511A IT1395368B1 (it) | 2009-08-28 | 2009-08-28 | Schermatura elettromagnetica per il collaudo di circuiti integrati |
Country Status (2)
Country | Link |
---|---|
US (3) | US8907693B2 (it) |
IT (1) | IT1395368B1 (it) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011043377A (ja) * | 2009-08-20 | 2011-03-03 | Tokyo Electron Ltd | 検査用接触構造体 |
IT1395368B1 (it) * | 2009-08-28 | 2012-09-14 | St Microelectronics Srl | Schermatura elettromagnetica per il collaudo di circuiti integrati |
CN102693962A (zh) * | 2011-03-22 | 2012-09-26 | 精材科技股份有限公司 | 具有电磁屏蔽作用的集成电路晶圆及其制造方法 |
US8912809B2 (en) * | 2012-06-12 | 2014-12-16 | Apple Inc. | Methods and apparatus for performing wafer-level testing on antenna tuning elements |
CN103792483B (zh) * | 2014-01-24 | 2016-04-06 | 苏州高新区世纪福科技有限公司 | 手机pcb板测试装置 |
CN103792484B (zh) * | 2014-01-24 | 2016-09-28 | 苏州高新区世纪福科技有限公司 | 手机pcb板测试装置 |
US9891266B2 (en) * | 2014-02-25 | 2018-02-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Test circuit and method |
US9995770B2 (en) * | 2014-03-21 | 2018-06-12 | Taiwan Semiconductor Manufacturing Company Limited | Multidirectional semiconductor arrangement testing |
US9343377B1 (en) * | 2015-01-08 | 2016-05-17 | Google Inc. | Test then destroy technique for security-focused semiconductor integrated circuits |
US9952255B2 (en) | 2015-10-30 | 2018-04-24 | Texas Instruments Incorporated | Magnetically shielded probe card |
US10180454B2 (en) * | 2015-12-01 | 2019-01-15 | Texas Instruments Incorporated | Systems and methods of testing multiple dies |
JP2020504309A (ja) | 2017-01-12 | 2020-02-06 | フォームファクター, インコーポレイテッド | 垂直プローブヘッドのシールド |
TWM569114U (zh) * | 2018-05-25 | 2018-10-21 | 匯宏科技股份有限公司 | 射頻測試設備及其移動式測試裝置與機殼模組 |
US11726112B2 (en) * | 2019-09-16 | 2023-08-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Electromagnetic shielding during wafer stage testing |
US11467207B2 (en) | 2020-12-23 | 2022-10-11 | Industrial Technology Research Institute | Massive testing of micro integrated circuit |
CN113691230B (zh) * | 2021-08-25 | 2023-11-28 | 北京超材信息科技有限公司 | 声学装置封装结构 |
KR20240021416A (ko) | 2022-08-10 | 2024-02-19 | 조경철 | O2o 기반 해양 액티비티 정보 제공 시스템 및 방법 |
CN117572045B (zh) * | 2024-01-12 | 2024-04-12 | 南京燧锐科技有限公司 | 射频芯片的测试座 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4697143A (en) * | 1984-04-30 | 1987-09-29 | Cascade Microtech, Inc. | Wafer probe |
US5373231A (en) * | 1993-06-10 | 1994-12-13 | G. G. B. Industries, Inc. | Integrated circuit probing apparatus including a capacitor bypass structure |
JPH1130630A (ja) * | 1997-07-10 | 1999-02-02 | Tokyo Kasoode Kenkyusho:Kk | 探針用プローブ及びプローブカード |
US6917525B2 (en) * | 2001-11-27 | 2005-07-12 | Nanonexus, Inc. | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
US7173444B2 (en) * | 2000-04-04 | 2007-02-06 | Ali Pourkeramati | Structure and method for parallel testing of dies on a semiconductor wafer |
US6323639B1 (en) * | 2000-04-04 | 2001-11-27 | Azalea Microelectronics Corporation | Powering dies on a semiconductor wafer through wafer scribe line areas |
US7026646B2 (en) * | 2002-06-20 | 2006-04-11 | Micron Technology, Inc. | Isolation circuit |
US6902416B2 (en) * | 2002-08-29 | 2005-06-07 | 3M Innovative Properties Company | High density probe device |
US6727716B1 (en) * | 2002-12-16 | 2004-04-27 | Newport Fab, Llc | Probe card and probe needle for high frequency testing |
US6815973B1 (en) * | 2003-06-13 | 2004-11-09 | Xilinx, Inc. | Optical testing port and wafer level testing without probe cards |
KR101218011B1 (ko) * | 2003-11-08 | 2013-01-02 | 스태츠 칩팩, 엘티디. | 플립 칩 인터커넥션 패드 레이아웃 반도체 패키지 및 그 생산 방법 |
TWI228597B (en) * | 2004-02-25 | 2005-03-01 | Nat Applied Res Laboratories | Device monitor for RF and DC measurements |
JP4519571B2 (ja) * | 2004-08-26 | 2010-08-04 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその検査方法と検査装置並びに半導体装置の製造方法 |
WO2007069789A1 (ja) * | 2005-12-16 | 2007-06-21 | Ibiden Co., Ltd. | 多層プリント配線板およびその製造方法 |
JP2008021848A (ja) * | 2006-07-13 | 2008-01-31 | Sharp Corp | ウェハおよび半導体装置のテスト方法 |
US7652491B2 (en) * | 2006-11-17 | 2010-01-26 | Suss Microtec Test Systems Gmbh | Probe support with shield for the examination of test substrates under use of probe supports |
US7651889B2 (en) * | 2007-09-13 | 2010-01-26 | Freescale Semiconductor, Inc. | Electromagnetic shield formation for integrated circuit die package |
US8089295B2 (en) * | 2007-12-31 | 2012-01-03 | Hitachi Global Storage Technologies Netherlands B.V. | Wafer level balanced capacitance design for magnetic heads |
RU2551644C2 (ru) * | 2009-01-06 | 2015-05-27 | Лаксим Корпорейшн | Безэлектродная плазменная лампа (варианты) |
IT1395368B1 (it) * | 2009-08-28 | 2012-09-14 | St Microelectronics Srl | Schermatura elettromagnetica per il collaudo di circuiti integrati |
US20130015870A1 (en) * | 2011-07-14 | 2013-01-17 | Nickel Joshua G | Test system with contact test probes |
US8614105B2 (en) * | 2011-09-28 | 2013-12-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Production flow and reusable testing method |
US9252593B2 (en) * | 2012-12-17 | 2016-02-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Three dimensional integrated circuit electrostatic discharge protection and prevention test interface |
-
2009
- 2009-08-28 IT ITMI2009A001511A patent/IT1395368B1/it active
-
2010
- 2010-08-06 US US12/851,680 patent/US8907693B2/en active Active
-
2014
- 2014-11-05 US US14/533,526 patent/US9874586B2/en active Active
-
2017
- 2017-12-12 US US15/838,550 patent/US10677816B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
ITMI20091511A1 (it) | 2011-02-28 |
US20180100876A1 (en) | 2018-04-12 |
US10677816B2 (en) | 2020-06-09 |
US8907693B2 (en) | 2014-12-09 |
US9874586B2 (en) | 2018-01-23 |
US20110050267A1 (en) | 2011-03-03 |
US20150054538A1 (en) | 2015-02-26 |
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