IT1231457B - Procedimento per la realizzazione della messa a massa di isolamenti multistrato (coperte termiche) per applicazioni spaziali - Google Patents
Procedimento per la realizzazione della messa a massa di isolamenti multistrato (coperte termiche) per applicazioni spazialiInfo
- Publication number
- IT1231457B IT1231457B IT8947808A IT4780889A IT1231457B IT 1231457 B IT1231457 B IT 1231457B IT 8947808 A IT8947808 A IT 8947808A IT 4780889 A IT4780889 A IT 4780889A IT 1231457 B IT1231457 B IT 1231457B
- Authority
- IT
- Italy
- Prior art keywords
- layer
- insulations
- layers
- procedure
- massing
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 4
- 238000009413 insulation Methods 0.000 abstract 4
- 238000010276 construction Methods 0.000 abstract 1
- 230000004224 protection Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Building Environments (AREA)
- Laminated Bodies (AREA)
- Aiming, Guidance, Guns With A Light Source, Armor, Camouflage, And Targets (AREA)
- Insulating Bodies (AREA)
- Paper (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT8947808A IT1231457B (it) | 1989-04-03 | 1989-04-03 | Procedimento per la realizzazione della messa a massa di isolamenti multistrato (coperte termiche) per applicazioni spaziali |
US07/502,434 US5111354A (en) | 1989-04-03 | 1990-03-30 | Process for the perfecting of the grounding of multi-layer insulations (thermal blankets) for space applications |
EP90106327A EP0391327B1 (en) | 1989-04-03 | 1990-04-03 | Method and apparatus for grounding multi-layer insulations, especially for space structures |
AT90106327T ATE110925T1 (de) | 1989-04-03 | 1990-04-03 | Verfahren und gerät, das die isolierungen einer mehrebenenschaltung mit der masse verbindet, insbesondere für räumliche strukturen. |
CA002013682A CA2013682A1 (en) | 1989-04-03 | 1990-04-03 | Process for the perfecting of the grounding of multi-layer insulations (thermal blankets) |
DE69011920T DE69011920T2 (de) | 1989-04-03 | 1990-04-03 | Verfahren und Gerät, das die Isolierungen einer Mehrebenenschaltung mit der Masse verbindet, insbesondere für räumliche Strukturen. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT8947808A IT1231457B (it) | 1989-04-03 | 1989-04-03 | Procedimento per la realizzazione della messa a massa di isolamenti multistrato (coperte termiche) per applicazioni spaziali |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8947808A0 IT8947808A0 (it) | 1989-04-03 |
IT1231457B true IT1231457B (it) | 1991-12-07 |
Family
ID=11262645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT8947808A IT1231457B (it) | 1989-04-03 | 1989-04-03 | Procedimento per la realizzazione della messa a massa di isolamenti multistrato (coperte termiche) per applicazioni spaziali |
Country Status (6)
Country | Link |
---|---|
US (1) | US5111354A (it) |
EP (1) | EP0391327B1 (it) |
AT (1) | ATE110925T1 (it) |
CA (1) | CA2013682A1 (it) |
DE (1) | DE69011920T2 (it) |
IT (1) | IT1231457B (it) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4228665C1 (de) * | 1992-08-28 | 1994-04-21 | Dornier Gmbh | Clip |
FR2695290A1 (fr) * | 1992-09-02 | 1994-03-04 | Philips Electronics Nv | Circuit pour des fréquences élevées, et procédé pour le réaliser. |
US5457610A (en) * | 1993-06-01 | 1995-10-10 | Motorola, Inc. | Low profile mechanical interconnect system having metalized loop and hoop area |
US5494755A (en) * | 1994-06-08 | 1996-02-27 | Lockheed Missiles & Space Co., Inc. | Passive intermodulation products (PIM) free tape |
US6981671B1 (en) * | 2001-03-28 | 2006-01-03 | The United States Of America As Represented By The Secretary Of The Air Force | Airframe structure-integrated capacitor |
US7014143B2 (en) * | 2002-10-11 | 2006-03-21 | The Boeing Company | Aircraft lightning strike protection and grounding technique |
US9944445B2 (en) * | 2015-05-14 | 2018-04-17 | Gerald C Altomare | Apparatus and method of embedding articles within reclosable fastener systems |
EP3339189B1 (en) * | 2016-12-23 | 2020-06-17 | Airbus Defence and Space GmbH | Electrically connecting multi-layer insulation blankets |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3857994A (en) * | 1973-04-09 | 1974-12-31 | Nat Telephone Supply Co | Non-corrosive cable shield bond |
DE7705759U1 (de) * | 1977-02-25 | 1977-06-02 | Robert Bosch Gmbh, 7000 Stuttgart | Gehäuse für elektronische Geräte |
DE2833480C3 (de) * | 1978-07-31 | 1982-02-18 | Siemens AG, 1000 Berlin und 8000 München | Schaltungsplatte für die elektrische Nachrichtentechnik |
US4329731A (en) * | 1980-04-30 | 1982-05-11 | Communications Satellite Corporation | Discharge suppressing dielectric film for use on spacecraft surfaces |
US4623951A (en) * | 1982-05-24 | 1986-11-18 | Hughes Aircraft Company | Electrically conductive composite structure |
JPH0627995Y2 (ja) * | 1986-03-20 | 1994-07-27 | 株式会社東芝 | シ−ルド構造 |
US4768286A (en) * | 1986-10-01 | 1988-09-06 | Eastman Christensen Co. | Printed circuit packaging for high vibration and temperature environments |
-
1989
- 1989-04-03 IT IT8947808A patent/IT1231457B/it active
-
1990
- 1990-03-30 US US07/502,434 patent/US5111354A/en not_active Expired - Fee Related
- 1990-04-03 EP EP90106327A patent/EP0391327B1/en not_active Expired - Lifetime
- 1990-04-03 DE DE69011920T patent/DE69011920T2/de not_active Expired - Fee Related
- 1990-04-03 AT AT90106327T patent/ATE110925T1/de not_active IP Right Cessation
- 1990-04-03 CA CA002013682A patent/CA2013682A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CA2013682A1 (en) | 1990-10-03 |
EP0391327A1 (en) | 1990-10-10 |
DE69011920D1 (de) | 1994-10-06 |
US5111354A (en) | 1992-05-05 |
DE69011920T2 (de) | 1995-05-04 |
EP0391327B1 (en) | 1994-08-31 |
IT8947808A0 (it) | 1989-04-03 |
ATE110925T1 (de) | 1994-09-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19940428 |