DE69011920D1 - Verfahren und Gerät, das die Isolierungen einer Mehrebenenschaltung mit der Masse verbindet, insbesondere für räumliche Strukturen. - Google Patents

Verfahren und Gerät, das die Isolierungen einer Mehrebenenschaltung mit der Masse verbindet, insbesondere für räumliche Strukturen.

Info

Publication number
DE69011920D1
DE69011920D1 DE69011920T DE69011920T DE69011920D1 DE 69011920 D1 DE69011920 D1 DE 69011920D1 DE 69011920 T DE69011920 T DE 69011920T DE 69011920 T DE69011920 T DE 69011920T DE 69011920 D1 DE69011920 D1 DE 69011920D1
Authority
DE
Germany
Prior art keywords
layer
layers
insulation
attachment system
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69011920T
Other languages
English (en)
Other versions
DE69011920T2 (de
Inventor
Danilo Marzi
Roger A Stonier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alenia Spazio SpA
Original Assignee
Selenia Spazio SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Selenia Spazio SpA filed Critical Selenia Spazio SpA
Publication of DE69011920D1 publication Critical patent/DE69011920D1/de
Application granted granted Critical
Publication of DE69011920T2 publication Critical patent/DE69011920T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Building Environments (AREA)
  • Laminated Bodies (AREA)
  • Aiming, Guidance, Guns With A Light Source, Armor, Camouflage, And Targets (AREA)
  • Insulating Bodies (AREA)
  • Paper (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE69011920T 1989-04-03 1990-04-03 Verfahren und Gerät, das die Isolierungen einer Mehrebenenschaltung mit der Masse verbindet, insbesondere für räumliche Strukturen. Expired - Fee Related DE69011920T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8947808A IT1231457B (it) 1989-04-03 1989-04-03 Procedimento per la realizzazione della messa a massa di isolamenti multistrato (coperte termiche) per applicazioni spaziali

Publications (2)

Publication Number Publication Date
DE69011920D1 true DE69011920D1 (de) 1994-10-06
DE69011920T2 DE69011920T2 (de) 1995-05-04

Family

ID=11262645

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69011920T Expired - Fee Related DE69011920T2 (de) 1989-04-03 1990-04-03 Verfahren und Gerät, das die Isolierungen einer Mehrebenenschaltung mit der Masse verbindet, insbesondere für räumliche Strukturen.

Country Status (6)

Country Link
US (1) US5111354A (de)
EP (1) EP0391327B1 (de)
AT (1) ATE110925T1 (de)
CA (1) CA2013682A1 (de)
DE (1) DE69011920T2 (de)
IT (1) IT1231457B (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4228665C1 (de) * 1992-08-28 1994-04-21 Dornier Gmbh Clip
FR2695290A1 (fr) * 1992-09-02 1994-03-04 Philips Electronics Nv Circuit pour des fréquences élevées, et procédé pour le réaliser.
US5457610A (en) * 1993-06-01 1995-10-10 Motorola, Inc. Low profile mechanical interconnect system having metalized loop and hoop area
US5494755A (en) * 1994-06-08 1996-02-27 Lockheed Missiles & Space Co., Inc. Passive intermodulation products (PIM) free tape
US6981671B1 (en) * 2001-03-28 2006-01-03 The United States Of America As Represented By The Secretary Of The Air Force Airframe structure-integrated capacitor
US7014143B2 (en) * 2002-10-11 2006-03-21 The Boeing Company Aircraft lightning strike protection and grounding technique
US9944445B2 (en) * 2015-05-14 2018-04-17 Gerald C Altomare Apparatus and method of embedding articles within reclosable fastener systems
EP3339189B1 (de) * 2016-12-23 2020-06-17 Airbus Defence and Space GmbH Elektrische verbindung mehrschichtiger isoliermatten

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3857994A (en) * 1973-04-09 1974-12-31 Nat Telephone Supply Co Non-corrosive cable shield bond
DE7705759U1 (de) * 1977-02-25 1977-06-02 Robert Bosch Gmbh, 7000 Stuttgart Gehäuse für elektronische Geräte
DE2833480C3 (de) * 1978-07-31 1982-02-18 Siemens AG, 1000 Berlin und 8000 München Schaltungsplatte für die elektrische Nachrichtentechnik
US4329731A (en) * 1980-04-30 1982-05-11 Communications Satellite Corporation Discharge suppressing dielectric film for use on spacecraft surfaces
US4623951A (en) * 1982-05-24 1986-11-18 Hughes Aircraft Company Electrically conductive composite structure
JPH0627995Y2 (ja) * 1986-03-20 1994-07-27 株式会社東芝 シ−ルド構造
US4768286A (en) * 1986-10-01 1988-09-06 Eastman Christensen Co. Printed circuit packaging for high vibration and temperature environments

Also Published As

Publication number Publication date
CA2013682A1 (en) 1990-10-03
IT1231457B (it) 1991-12-07
EP0391327A1 (de) 1990-10-10
US5111354A (en) 1992-05-05
DE69011920T2 (de) 1995-05-04
EP0391327B1 (de) 1994-08-31
IT8947808A0 (it) 1989-04-03
ATE110925T1 (de) 1994-09-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee