IT1226701B - Procedimento per la deposizione di organosilani su substrati di silicio o di ossido di silicio per dispositivi del tipo eos o chemfet. - Google Patents

Procedimento per la deposizione di organosilani su substrati di silicio o di ossido di silicio per dispositivi del tipo eos o chemfet.

Info

Publication number
IT1226701B
IT1226701B IT8821550A IT2155088A IT1226701B IT 1226701 B IT1226701 B IT 1226701B IT 8821550 A IT8821550 A IT 8821550A IT 2155088 A IT2155088 A IT 2155088A IT 1226701 B IT1226701 B IT 1226701B
Authority
IT
Italy
Prior art keywords
silicon
organosilans
eos
deposition
procedure
Prior art date
Application number
IT8821550A
Other languages
English (en)
Other versions
IT8821550A0 (it
Inventor
Vincenzo Barbarossa
Original Assignee
Eniricerche Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eniricerche Spa filed Critical Eniricerche Spa
Priority to IT8821550A priority Critical patent/IT1226701B/it
Publication of IT8821550A0 publication Critical patent/IT8821550A0/it
Priority to EP89201965A priority patent/EP0353818A1/en
Priority to JP1194431A priority patent/JPH0278225A/ja
Application granted granted Critical
Publication of IT1226701B publication Critical patent/IT1226701B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403—Cells and electrode assemblies
    • G01N27/414—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Molecular Biology (AREA)
  • Electrochemistry (AREA)
  • Silicon Polymers (AREA)
  • Chemical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
IT8821550A 1988-07-29 1988-07-29 Procedimento per la deposizione di organosilani su substrati di silicio o di ossido di silicio per dispositivi del tipo eos o chemfet. IT1226701B (it)

Priority Applications (3)

Application Number Priority Date Filing Date Title
IT8821550A IT1226701B (it) 1988-07-29 1988-07-29 Procedimento per la deposizione di organosilani su substrati di silicio o di ossido di silicio per dispositivi del tipo eos o chemfet.
EP89201965A EP0353818A1 (en) 1988-07-29 1989-07-26 Process for depositing organosilanes on substrates of silicon or silicon oxide for devices of EOS or CHEMFET type
JP1194431A JPH0278225A (ja) 1988-07-29 1989-07-28 オルガノシランの析出法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8821550A IT1226701B (it) 1988-07-29 1988-07-29 Procedimento per la deposizione di organosilani su substrati di silicio o di ossido di silicio per dispositivi del tipo eos o chemfet.

Publications (2)

Publication Number Publication Date
IT8821550A0 IT8821550A0 (it) 1988-07-29
IT1226701B true IT1226701B (it) 1991-02-05

Family

ID=11183468

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8821550A IT1226701B (it) 1988-07-29 1988-07-29 Procedimento per la deposizione di organosilani su substrati di silicio o di ossido di silicio per dispositivi del tipo eos o chemfet.

Country Status (3)

Country Link
EP (1) EP0353818A1 (it)
JP (1) JPH0278225A (it)
IT (1) IT1226701B (it)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5314724A (en) * 1991-01-08 1994-05-24 Fujitsu Limited Process for forming silicon oxide film
CA2112467A1 (en) * 1991-06-28 1993-01-07 Orville M. Wiste Flexible, transparent film for electrostatic shielding and method of making such film
CA2137928C (en) 1992-07-04 2002-01-29 Christopher David Dobson A method of treating a semiconductor wafer
JPH06161707A (ja) * 1992-11-20 1994-06-10 Pfu Ltd 文字コード切換処理方式
US5858880A (en) * 1994-05-14 1999-01-12 Trikon Equipment Limited Method of treating a semi-conductor wafer
DE19781956B4 (de) 1996-08-24 2006-06-14 Trikon Equipments Ltd., Newport Verfahren zum Aufbringen einer planarisierten dielektrischen Schicht auf einem Halbleitersubstrat
US6974766B1 (en) * 1998-10-01 2005-12-13 Applied Materials, Inc. In situ deposition of a low κ dielectric layer, barrier layer, etch stop, and anti-reflective coating for damascene application

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5825221B2 (ja) * 1977-12-12 1983-05-26 株式会社クラレ Ｆｅｔ比較電極
CA1204527A (en) * 1982-08-13 1986-05-13 Theodore F. Retajczyk, Jr. Polymeric films for electronic circuits
DE3526348A1 (de) * 1985-07-23 1987-02-05 Fraunhofer Ges Forschung Sensoren fuer die selektive bestimmung von komponenten in fluessiger oder gasfoermiger phase

Also Published As

Publication number Publication date
EP0353818A1 (en) 1990-02-07
IT8821550A0 (it) 1988-07-29
JPH0278225A (ja) 1990-03-19

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Legal Events

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TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19960717