IT1185964B - PROCEDURE AND RELATED EQUIPMENT TO MAKE OHMIC METAL-SEMICONDUCTOR CONTACTS - Google Patents
PROCEDURE AND RELATED EQUIPMENT TO MAKE OHMIC METAL-SEMICONDUCTOR CONTACTSInfo
- Publication number
- IT1185964B IT1185964B IT22325/85A IT2232585A IT1185964B IT 1185964 B IT1185964 B IT 1185964B IT 22325/85 A IT22325/85 A IT 22325/85A IT 2232585 A IT2232585 A IT 2232585A IT 1185964 B IT1185964 B IT 1185964B
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- related equipment
- ohmic metal
- make ohmic
- semiconductor contacts
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT22325/85A IT1185964B (en) | 1985-10-01 | 1985-10-01 | PROCEDURE AND RELATED EQUIPMENT TO MAKE OHMIC METAL-SEMICONDUCTOR CONTACTS |
GB8620131A GB2181297B (en) | 1985-10-01 | 1986-08-19 | Process and relative apparatus for making ohmic type contacts between metal and semiconductor |
NL8602453A NL8602453A (en) | 1985-10-01 | 1986-09-29 | METHOD AND APPARATUS FOR MAKING CONTACTS OF THE OHMSE TYPE BETWEEN METAL AND SEMICONDUCTOR |
JP61234265A JPS6286716A (en) | 1985-10-01 | 1986-09-30 | Formation of ohmic contact between metal and semiconductor and apparatus for the same |
FR8613608A FR2588120A1 (en) | 1985-10-01 | 1986-09-30 | CORRESPONDING METHOD AND APPARATUS FOR ESTABLISHING OHMIC-TYPE CONTACTS BETWEEN A METAL AND A SEMICONDUCTOR |
DE19863633472 DE3633472A1 (en) | 1985-10-01 | 1986-10-01 | METHOD AND DEVICE FOR PRODUCING OHMS CONTACTS BETWEEN METALS AND SEMICONDUCTORS |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT22325/85A IT1185964B (en) | 1985-10-01 | 1985-10-01 | PROCEDURE AND RELATED EQUIPMENT TO MAKE OHMIC METAL-SEMICONDUCTOR CONTACTS |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8522325A0 IT8522325A0 (en) | 1985-10-01 |
IT1185964B true IT1185964B (en) | 1987-11-18 |
Family
ID=11194694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT22325/85A IT1185964B (en) | 1985-10-01 | 1985-10-01 | PROCEDURE AND RELATED EQUIPMENT TO MAKE OHMIC METAL-SEMICONDUCTOR CONTACTS |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS6286716A (en) |
DE (1) | DE3633472A1 (en) |
FR (1) | FR2588120A1 (en) |
GB (1) | GB2181297B (en) |
IT (1) | IT1185964B (en) |
NL (1) | NL8602453A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5043299B1 (en) * | 1989-12-01 | 1997-02-25 | Applied Materials Inc | Process for selective deposition of tungsten on semiconductor wafer |
EP0448763A1 (en) * | 1990-03-30 | 1991-10-02 | Siemens Aktiengesellschaft | Process and apparatus for manufacturing conductive layers or structures for highly integrated circuits |
US5478780A (en) * | 1990-03-30 | 1995-12-26 | Siemens Aktiengesellschaft | Method and apparatus for producing conductive layers or structures for VLSI circuits |
DE69121451T2 (en) * | 1990-04-16 | 1997-02-20 | Applied Materials Inc | Method for producing a titanium silicide layer on a semiconductor layer |
DE4339465C2 (en) * | 1993-11-19 | 1997-05-28 | Gold Star Electronics | Process for treating the surface of a silicon substrate exposed to dry etching |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1177382A (en) * | 1966-02-24 | 1970-01-14 | Rca Corp Formerly Known As Rad | Method of Making Ohmic Contact to a Semiconductor Body |
BE758321A (en) * | 1969-11-03 | 1971-04-01 | Rca Corp | PROCESS FOR METALLIZING SEMICONDUCTOR DEVICES |
CA965189A (en) * | 1972-01-03 | 1975-03-25 | Signetics Corporation | Semiconductor structure using platinel silicide as a schottky barrier diode and method |
US4056642A (en) * | 1976-05-14 | 1977-11-01 | Data General Corporation | Method of fabricating metal-semiconductor interfaces |
US4107835A (en) * | 1977-02-11 | 1978-08-22 | Bell Telephone Laboratories, Incorporated | Fabrication of semiconductive devices |
DE3103615A1 (en) * | 1981-02-03 | 1982-09-09 | Siemens AG, 1000 Berlin und 8000 München | METHOD FOR GENERATING EXTREME FINE STRUCTURES |
JPS57157525A (en) * | 1981-03-23 | 1982-09-29 | Fujitsu Ltd | Surface treating method |
JPS6077429A (en) * | 1983-10-04 | 1985-05-02 | Asahi Glass Co Ltd | Dry etching method |
US4693777A (en) * | 1984-11-30 | 1987-09-15 | Kabushiki Kaisha Toshiba | Apparatus for producing semiconductor devices |
US4824518A (en) * | 1985-03-29 | 1989-04-25 | Sharp Kabushiki Kaisha | Method for the production of semiconductor devices |
US4605479A (en) * | 1985-06-24 | 1986-08-12 | Rca Corporation | In-situ cleaned ohmic contacts |
-
1985
- 1985-10-01 IT IT22325/85A patent/IT1185964B/en active
-
1986
- 1986-08-19 GB GB8620131A patent/GB2181297B/en not_active Expired
- 1986-09-29 NL NL8602453A patent/NL8602453A/en not_active Application Discontinuation
- 1986-09-30 FR FR8613608A patent/FR2588120A1/en not_active Withdrawn
- 1986-09-30 JP JP61234265A patent/JPS6286716A/en active Pending
- 1986-10-01 DE DE19863633472 patent/DE3633472A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
JPS6286716A (en) | 1987-04-21 |
NL8602453A (en) | 1987-05-04 |
DE3633472A1 (en) | 1987-04-02 |
IT8522325A0 (en) | 1985-10-01 |
GB2181297A (en) | 1987-04-15 |
FR2588120A1 (en) | 1987-04-03 |
GB8620131D0 (en) | 1986-10-01 |
GB2181297B (en) | 1989-06-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3788791D1 (en) | Electrically conductive single-use earthing strap. | |
DK316187D0 (en) | ELECTRICAL TERMINAL | |
DK452187A (en) | ELECTRICAL CONTACT DEVICE WITH CONTACT PROTECTION | |
IT1200785B (en) | IMPROVED PLASMA ATTACK PROCEDURE (RIE) TO MAKE OHMIC METAL-SEMICONDUCTOR CONTACTS | |
DK446887A (en) | ELECTRICAL CONTACT DEVICE WITH CONTACT PROTECTION | |
DK78186A (en) | ELECTROCARDIOGRAPHICAL ELECTRODE | |
IT1164957B (en) | CIRCUIT CONNECTION FOR PROTECTION AGAINST CURRENT FOR DIRECT CURRENT AND / OR ALTERNATING CURRENT | |
IT1185964B (en) | PROCEDURE AND RELATED EQUIPMENT TO MAKE OHMIC METAL-SEMICONDUCTOR CONTACTS | |
DK32387D0 (en) | POWER CURRENT TERMINAL | |
DK163696C (en) | CONTACTS WITH WORKING CONTACTS | |
IT1209700B (en) | ELECTRIC CONNECTOR AND CLOSING ELEMENT. | |
ATA186986A (en) | SWITCH DISCONNECTOR | |
PT8573T (en) | ELECTRICAL CONNECTION AND ELECTRICAL TERMINAL DEVICE | |
IT1201840B (en) | METHOD-SEMICONDUCTOR OHMIC CONTACTS PROCEDURE | |
BR8506009A (en) | ELECTRIC INSULATOR | |
KR870005659U (en) | And current type indicator | |
IT1213394B (en) | DEVICE TO SURVEILL LOSTATE OF SLIDING ELEMENTS. | |
DK399279A (en) | SWITCHING OFF AND CURRENT PROTECTION TO AN INTERMEDIATE CONVERTER OR SELF-CONTROLLING INCH | |
KR870004405U (en) | Terminal attachment structure | |
KR890700176A (en) | Selective plating device and anode assembly used therein | |
KR870008156U (en) | Small Electric Ripper (RIPPER) | |
BR8505684A (en) | PLOW AND PLOW EQUIPMENT EQUIPMENT | |
PT7670U (en) | FOGAREIRO-PORTATIL AND DISMANTLABLE GRILL | |
BR8502493A (en) | ELECTRIC CONTACT | |
DK49785D0 (en) | MILITARY BIRDS AND PRIVATE USE |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19971030 |