FR2402379A1 - Perfectionnements apportes aux circuits imprimes - Google Patents
Perfectionnements apportes aux circuits imprimesInfo
- Publication number
- FR2402379A1 FR2402379A1 FR7727152A FR7727152A FR2402379A1 FR 2402379 A1 FR2402379 A1 FR 2402379A1 FR 7727152 A FR7727152 A FR 7727152A FR 7727152 A FR7727152 A FR 7727152A FR 2402379 A1 FR2402379 A1 FR 2402379A1
- Authority
- FR
- France
- Prior art keywords
- printed circuit
- connections
- printed circuits
- coated
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/092—Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
- Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
- Y10T29/49142—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal including metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24851—Intermediate layer is discontinuous or differential
- Y10T428/24868—Translucent outer layer
- Y10T428/24876—Intermediate layer contains particulate material [e.g., pigment, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
- Y10T428/24909—Free metal or mineral containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
La présente invention a pour objet un procédé de fabrication d'un circuit imprimé dans lequel on munit le circuit imprimé de trous conducteurs. Selon l'invention, on forme des connexions 6 ou 8 reliant certains de ces trous 2, sur au moins l'une des faces du circuit imprimé 1, à l'aide d'une résine synthétique conductrice qu'on dépose en cordon sur ladite face et qu'on cuit ensuite, on revêt ces connexions à l'aide d'un enduit isolant 7 ou 9 et on forme éventuellement de nouvelles connexions sur les précédentes revêtues de l'enduit et donc isolées.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7727152A FR2402379A1 (fr) | 1977-08-31 | 1977-08-31 | Perfectionnements apportes aux circuits imprimes |
DE19782836561 DE2836561A1 (de) | 1977-08-31 | 1978-08-21 | Verfahren zur herstellung einer gedruckten schaltung |
US05/938,104 US4187339A (en) | 1977-08-31 | 1978-08-30 | Printed circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7727152A FR2402379A1 (fr) | 1977-08-31 | 1977-08-31 | Perfectionnements apportes aux circuits imprimes |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2402379A1 true FR2402379A1 (fr) | 1979-03-30 |
FR2402379B1 FR2402379B1 (fr) | 1980-12-19 |
Family
ID=9195151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7727152A Granted FR2402379A1 (fr) | 1977-08-31 | 1977-08-31 | Perfectionnements apportes aux circuits imprimes |
Country Status (3)
Country | Link |
---|---|
US (1) | US4187339A (fr) |
DE (1) | DE2836561A1 (fr) |
FR (1) | FR2402379A1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2490059A1 (fr) * | 1980-09-09 | 1982-03-12 | Serras Paulet Edouard | Circuit imprime et son procede de fabrication |
EP0208087A2 (fr) * | 1985-05-25 | 1987-01-14 | Bayer Ag | Elément de plastique avec voies conductrices |
EP0613330A1 (fr) * | 1992-11-09 | 1994-08-31 | Siemens Aktiengesellschaft | Méthode de câblage discret pour plaques de circuits imprimés et/ou assemblages de composants électroniques |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2067845B (en) * | 1980-01-23 | 1984-04-26 | Int Computers Ltd | Manufacture of printed circuit boards |
JPS5826308A (ja) * | 1981-08-07 | 1983-02-16 | Matsushita Electric Ind Co Ltd | 薄膜素子部品 |
FR2512990B1 (fr) * | 1981-09-11 | 1987-06-19 | Radiotechnique Compelec | Procede pour fabriquer une carte de paiement electronique, et carte realisee selon ce procede |
US4816717A (en) * | 1984-02-06 | 1989-03-28 | Rogers Corporation | Electroluminescent lamp having a polymer phosphor layer formed in substantially a non-crossed linked state |
JPS6276600A (ja) * | 1985-09-29 | 1987-04-08 | 株式会社 アサヒ化学研究所 | 基板に導電回路を形成する方法 |
DE3704498A1 (de) * | 1987-02-13 | 1988-08-25 | Aristo Graphic Systeme | Verfahren zur herstellung eines digitalisiertabletts |
US4854040A (en) * | 1987-04-03 | 1989-08-08 | Poly Circuits, Inc. | Method of making multilayer pc board using polymer thick films |
US4775573A (en) * | 1987-04-03 | 1988-10-04 | West-Tronics, Inc. | Multilayer PC board using polymer thick films |
EP0418313A4 (en) * | 1988-05-11 | 1992-01-15 | Ariel Electronics, Inc. | Circuit writer |
US5156772A (en) * | 1988-05-11 | 1992-10-20 | Ariel Electronics, Inc. | Circuit writer materials |
US5099090A (en) * | 1988-05-11 | 1992-03-24 | Ariel Electronics, Inc. | Circuit writer |
USRE35064E (en) * | 1988-08-01 | 1995-10-17 | Circuit Components, Incorporated | Multilayer printed wiring board |
US4853594A (en) * | 1988-08-10 | 1989-08-01 | Rogers Corporation | Electroluminescent lamp |
US5155655A (en) * | 1989-08-23 | 1992-10-13 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
US5079069A (en) * | 1989-08-23 | 1992-01-07 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
US5800575A (en) * | 1992-04-06 | 1998-09-01 | Zycon Corporation | In situ method of forming a bypass capacitor element internally within a capacitive PCB |
US5261153A (en) * | 1992-04-06 | 1993-11-16 | Zycon Corporation | In situ method for forming a capacitive PCB |
US5308926A (en) * | 1992-12-08 | 1994-05-03 | Premisys Communications, Inc. | Compact isolating backplane for routing electronic signals |
US5564182A (en) * | 1994-04-21 | 1996-10-15 | Nassimi; Shary | Method for installing axial multiple |
US5668702A (en) * | 1994-04-21 | 1997-09-16 | Nassimi; Shary | Combination axial and surface mount cylindrical package containing one or more electronic components |
US11304310B1 (en) | 2020-10-13 | 2022-04-12 | Macronix International Co., Ltd. | Method of fabricating circuit board |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2607825A (en) * | 1948-10-20 | 1952-08-19 | Eisler Paul | Electric capacitor and method of making it |
US2866764A (en) * | 1954-03-05 | 1958-12-30 | Minnesota Mining & Mfg | Ink for printing electrical circuits, process for printing a polymer surface therewith, and resulting article |
US2893150A (en) * | 1955-12-22 | 1959-07-07 | Tann David | Wiring board and method of construction |
US3031344A (en) * | 1957-08-08 | 1962-04-24 | Radio Ind Inc | Production of electrical printed circuits |
DE1616732B1 (de) * | 1962-05-11 | 1970-08-20 | Ibm | In Mikromodultechnik ausgefuehrte elektrische Schaltung |
US3330695A (en) * | 1962-05-21 | 1967-07-11 | First Safe Deposit Nat Bank Of | Method of manufacturing electric circuit structures |
DE1267738B (de) * | 1962-10-29 | 1968-05-09 | Intellux Inc | Verfahren zur Herstellung von elektrischen Verbindungen zwischen den Stromkreisen von mehrlagigen gedruckten elektrischen Schaltungen |
US3798059A (en) * | 1970-04-20 | 1974-03-19 | Rca Corp | Thick film inductor with ferromagnetic core |
US3714709A (en) * | 1970-07-06 | 1973-02-06 | Rca Corp | Method of manufacturing thick-film hybrid integrated circuits |
US3818279A (en) * | 1973-02-08 | 1974-06-18 | Chromerics Inc | Electrical interconnection and contacting system |
DE2316176C3 (de) * | 1973-03-31 | 1975-09-04 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur Herstellung mehrlagiger Leiterbahnenstrukturen auf einem Substrat mittels eines programmgesteuerten, für die Leiterbahnenherstellung herangezogenen Werkzeuges |
US3982941A (en) * | 1973-05-07 | 1976-09-28 | E. I. Du Pont De Nemours & Company | Photopolymerizable paste compositions and their use |
US3988647A (en) * | 1974-09-27 | 1976-10-26 | General Electric Company | Method for making a circuit board and article made thereby |
US4049844A (en) * | 1974-09-27 | 1977-09-20 | General Electric Company | Method for making a circuit board and article made thereby |
JPS5819129B2 (ja) * | 1975-12-10 | 1983-04-16 | 株式会社東芝 | ハンドウタイソウチノ セイゾウホウホウ |
US4050756A (en) * | 1975-12-22 | 1977-09-27 | International Telephone And Telegraph Corporation | Conductive elastomer connector and method of making same |
US4141055A (en) * | 1977-04-27 | 1979-02-20 | Bell Telephone Laboratories, Incorporated | Crossover structure for microelectronic circuits |
US4118595A (en) * | 1977-06-06 | 1978-10-03 | Bell Telephone Laboratories, Incorporated | Crossovers and method of fabrication |
-
1977
- 1977-08-31 FR FR7727152A patent/FR2402379A1/fr active Granted
-
1978
- 1978-08-21 DE DE19782836561 patent/DE2836561A1/de not_active Ceased
- 1978-08-30 US US05/938,104 patent/US4187339A/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2490059A1 (fr) * | 1980-09-09 | 1982-03-12 | Serras Paulet Edouard | Circuit imprime et son procede de fabrication |
WO1982000938A1 (fr) * | 1980-09-09 | 1982-03-18 | Paulet E Serras | Circuit imprime et son procede de fabrication |
EP0208087A2 (fr) * | 1985-05-25 | 1987-01-14 | Bayer Ag | Elément de plastique avec voies conductrices |
EP0208087A3 (en) * | 1985-05-25 | 1987-05-27 | Bayer Ag | Plastic element with conductive tracks |
EP0613330A1 (fr) * | 1992-11-09 | 1994-08-31 | Siemens Aktiengesellschaft | Méthode de câblage discret pour plaques de circuits imprimés et/ou assemblages de composants électroniques |
Also Published As
Publication number | Publication date |
---|---|
DE2836561A1 (de) | 1979-03-15 |
FR2402379B1 (fr) | 1980-12-19 |
US4187339A (en) | 1980-02-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |