IT1136746B - Metodo di fabbricazione di circuiti cmos in substrati di silicio massiccio - Google Patents
Metodo di fabbricazione di circuiti cmos in substrati di silicio massiccioInfo
- Publication number
- IT1136746B IT1136746B IT22294/81A IT2229481A IT1136746B IT 1136746 B IT1136746 B IT 1136746B IT 22294/81 A IT22294/81 A IT 22294/81A IT 2229481 A IT2229481 A IT 2229481A IT 1136746 B IT1136746 B IT 1136746B
- Authority
- IT
- Italy
- Prior art keywords
- manufacture
- silicon substrates
- cmos circuits
- solid silicon
- cmos
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
- H01L21/76205—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO in a region being recessed from the surface, e.g. in a recess, groove, tub or trench region
- H01L21/76208—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO in a region being recessed from the surface, e.g. in a recess, groove, tub or trench region using auxiliary pillars in the recessed region, e.g. to form LOCOS over extended areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/914—Doping
- Y10S438/92—Controlling diffusion profile by oxidation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Local Oxidation Of Silicon (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/164,681 US4295266A (en) | 1980-06-30 | 1980-06-30 | Method of manufacturing bulk CMOS integrated circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8122294A0 IT8122294A0 (it) | 1981-06-12 |
IT1136746B true IT1136746B (it) | 1986-09-03 |
Family
ID=22595588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT22294/81A IT1136746B (it) | 1980-06-30 | 1981-06-12 | Metodo di fabbricazione di circuiti cmos in substrati di silicio massiccio |
Country Status (5)
Country | Link |
---|---|
US (1) | US4295266A (it) |
JP (1) | JPS5743469A (it) |
DE (1) | DE3125064A1 (it) |
IT (1) | IT1136746B (it) |
SE (1) | SE8103495L (it) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4409726A (en) * | 1982-04-08 | 1983-10-18 | Philip Shiota | Method of making well regions for CMOS devices |
DE3272436D1 (en) * | 1982-05-06 | 1986-09-11 | Itt Ind Gmbh Deutsche | Method of making a monolithic integrated circuit with at least one isolated gate field effect transistor and one bipolar transistor |
US4480375A (en) * | 1982-12-09 | 1984-11-06 | International Business Machines Corporation | Simple process for making complementary transistors |
US4476621A (en) * | 1983-02-01 | 1984-10-16 | Gte Communications Products Corporation | Process for making transistors with doped oxide densification |
US4516316A (en) * | 1984-03-27 | 1985-05-14 | Advanced Micro Devices, Inc. | Method of making improved twin wells for CMOS devices by controlling spatial separation |
US4567640A (en) * | 1984-05-22 | 1986-02-04 | Data General Corporation | Method of fabricating high density CMOS devices |
US4749662A (en) * | 1984-12-14 | 1988-06-07 | Rockwell International Corporation | Diffused field CMOS-bulk process |
US4713329A (en) * | 1985-07-22 | 1987-12-15 | Data General Corporation | Well mask for CMOS process |
US4866002A (en) * | 1985-11-26 | 1989-09-12 | Fuji Photo Film Co., Ltd. | Complementary insulated-gate field effect transistor integrated circuit and manufacturing method thereof |
US4889825A (en) * | 1986-03-04 | 1989-12-26 | Motorola, Inc. | High/low doping profile for twin well process |
US4929565A (en) * | 1986-03-04 | 1990-05-29 | Motorola, Inc. | High/low doping profile for twin well process |
US4717683A (en) * | 1986-09-23 | 1988-01-05 | Motorola Inc. | CMOS process |
US4925806A (en) * | 1988-03-17 | 1990-05-15 | Northern Telecom Limited | Method for making a doped well in a semiconductor substrate |
US5151381A (en) * | 1989-11-15 | 1992-09-29 | Advanced Micro Devices, Inc. | Method for local oxidation of silicon employing two oxidation steps |
WO1993016494A1 (en) * | 1992-01-31 | 1993-08-19 | Analog Devices, Inc. | Complementary bipolar polysilicon emitter devices |
JPH07169759A (ja) * | 1993-12-14 | 1995-07-04 | Fujitsu Ltd | 半導体装置の製造方法と半導体装置 |
US5446302A (en) * | 1993-12-14 | 1995-08-29 | Analog Devices, Incorporated | Integrated circuit with diode-connected transistor for reducing ESD damage |
DE102006041424A1 (de) * | 2006-09-04 | 2008-03-20 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur simultanen Dotierung und Oxidation von Halbleitersubstraten und dessen Verwendung |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL170348C (nl) * | 1970-07-10 | 1982-10-18 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting, waarbij op een oppervlak van een halfgeleiderlichaam een tegen dotering en tegen thermische oxydatie maskerend masker wordt aangebracht, de door de vensters in het masker vrijgelaten delen van het oppervlak worden onderworpen aan een etsbehandeling voor het vormen van verdiepingen en het halfgeleiderlichaam met het masker wordt onderworpen aan een thermische oxydatiebehandeling voor het vormen van een oxydepatroon dat de verdiepingen althans ten dele opvult. |
US3751722A (en) * | 1971-04-30 | 1973-08-07 | Standard Microsyst Smc | Mos integrated circuit with substrate containing selectively formed resistivity regions |
US3853633A (en) * | 1972-12-04 | 1974-12-10 | Motorola Inc | Method of making a semi planar insulated gate field-effect transistor device with implanted field |
US4027380A (en) * | 1974-06-03 | 1977-06-07 | Fairchild Camera And Instrument Corporation | Complementary insulated gate field effect transistor structure and process for fabricating the structure |
US4013484A (en) * | 1976-02-25 | 1977-03-22 | Intel Corporation | High density CMOS process |
US4135955A (en) * | 1977-09-21 | 1979-01-23 | Harris Corporation | Process for fabricating high voltage cmos with self-aligned guard rings utilizing selective diffusion and local oxidation |
US4221045A (en) * | 1978-06-06 | 1980-09-09 | Rockwell International Corporation | Self-aligned contacts in an ion implanted VLSI circuit |
-
1980
- 1980-06-30 US US06/164,681 patent/US4295266A/en not_active Expired - Lifetime
-
1981
- 1981-06-03 SE SE8103495A patent/SE8103495L/xx not_active Application Discontinuation
- 1981-06-12 IT IT22294/81A patent/IT1136746B/it active
- 1981-06-26 DE DE19813125064 patent/DE3125064A1/de not_active Withdrawn
- 1981-06-26 JP JP56100391A patent/JPS5743469A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPS5743469A (en) | 1982-03-11 |
US4295266A (en) | 1981-10-20 |
SE8103495L (sv) | 1981-12-31 |
DE3125064A1 (de) | 1982-03-18 |
IT8122294A0 (it) | 1981-06-12 |
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