IT1134845B - Metodo e dispositivo per il montaggio in posizione di componenti elettronici su basette per circuiti - Google Patents

Metodo e dispositivo per il montaggio in posizione di componenti elettronici su basette per circuiti

Info

Publication number
IT1134845B
IT1134845B IT26856/80A IT2685680A IT1134845B IT 1134845 B IT1134845 B IT 1134845B IT 26856/80 A IT26856/80 A IT 26856/80A IT 2685680 A IT2685680 A IT 2685680A IT 1134845 B IT1134845 B IT 1134845B
Authority
IT
Italy
Prior art keywords
bases
circuits
installation
electronic components
electronic
Prior art date
Application number
IT26856/80A
Other languages
English (en)
Other versions
IT8026856A0 (it
Inventor
Yanai Seiji
Shirouchi Hideo
Original Assignee
Taiyo Yuden Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Kk filed Critical Taiyo Yuden Kk
Publication of IT8026856A0 publication Critical patent/IT8026856A0/it
Application granted granted Critical
Publication of IT1134845B publication Critical patent/IT1134845B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Branching, Merging, And Special Transfer Between Conveyors (AREA)
IT26856/80A 1979-12-28 1980-12-22 Metodo e dispositivo per il montaggio in posizione di componenti elettronici su basette per circuiti IT1134845B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17251779A JPS5694800A (en) 1979-12-28 1979-12-28 Method and device for mounting electronic part

Publications (2)

Publication Number Publication Date
IT8026856A0 IT8026856A0 (it) 1980-12-22
IT1134845B true IT1134845B (it) 1986-08-20

Family

ID=15943415

Family Applications (1)

Application Number Title Priority Date Filing Date
IT26856/80A IT1134845B (it) 1979-12-28 1980-12-22 Metodo e dispositivo per il montaggio in posizione di componenti elettronici su basette per circuiti

Country Status (5)

Country Link
US (1) US4386464A (it)
JP (1) JPS5694800A (it)
DE (1) DE3048780A1 (it)
IT (1) IT1134845B (it)
NL (1) NL8006989A (it)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108857315A (zh) * 2018-07-23 2018-11-23 遂宁市盛川视觉科技有限公司 一种手机镜头自动盖镜片装置

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58112387A (ja) * 1981-12-26 1983-07-04 池上通信機株式会社 電子部品のプリント基板への自動***装置
US4528747A (en) * 1982-12-02 1985-07-16 At&T Technologies, Inc. Method and apparatus for mounting multilead components on a circuit board
JPS61299U (ja) * 1984-06-07 1986-01-06 日東工業株式会社 自動チツプマウント機の治具盤
US4571826A (en) * 1984-11-19 1986-02-25 At&T Teletype Corporation Method of manufacturing a thermal print head
EP0225957A1 (en) * 1985-12-18 1987-06-24 ELCIT ELETTRONICA CIVILE S.p.A Apparatus for positioning components on printed-circuit boards
US4670981A (en) * 1986-03-17 1987-06-09 Nitto Kogyo Kabushiki Kaisha Method of mounting electronic parts on the predetermined positions of a printed circuit board
JPH01295500A (ja) * 1988-05-24 1989-11-29 Taiyo Yuden Co Ltd チップ状電子部品マウント方法及びその装置
DE3838173A1 (de) * 1988-11-10 1990-05-17 Nixdorf Computer Ag Verfahren und einrichtung zum bestuecken von leiterplatten
US4885841A (en) * 1989-02-21 1989-12-12 Micron Technology, Inc. Vibrational method of aligning the leads of surface-mount electronic components with the mounting pads of printed circuit boards during the molten solder mounting process
US4965927A (en) * 1989-09-21 1990-10-30 Eli Holzman Apparatus for applying surface-mounted electronic components to printed circuit boards
JP2713621B2 (ja) * 1989-11-10 1998-02-16 コーア株式会社 チップ部品の実装方法
IT1240530B (it) * 1990-08-06 1993-12-17 Axis Spa Apparecchiatura per predisporre ed inserire terminali in un componente elettrico.
US5117555A (en) * 1991-01-17 1992-06-02 International Business Machines Corporation Modular system and method for populating circuit boards
US5386626A (en) * 1993-09-10 1995-02-07 Cen Tronic Co., Ltd. Method for manufacturing a circuit board with a plurality of conductive terminal pins
US5670009A (en) * 1995-02-28 1997-09-23 Eastman Kodak Company Assembly technique for an image sensor array
CN1074381C (zh) * 1996-03-26 2001-11-07 摩托罗拉公司 用于向捡起位置提供电子元件的改进的馈料机
DE19618227A1 (de) * 1996-05-07 1997-11-13 Herbert Streckfus Gmbh Verfahren und Vorrichtung zum Verlöten von elektronischen Bauelementen auf einer Leiterplatte
US5743001A (en) * 1996-08-16 1998-04-28 Amistar Corporation Surface mount placement system with single step, multiple place carriage
EP0990281B1 (en) * 1997-06-19 2003-03-19 Fci Device for pre-positioning components in a row for subsequent processing as well as such a method
JP3512598B2 (ja) * 1997-07-01 2004-03-29 アルプス電気株式会社 チップ部品装着装置
US6877219B1 (en) * 1999-10-26 2005-04-12 Air Liquide America, L.P. Apparatus for placing components on printed circuit boards
DE10004649A1 (de) * 2000-02-03 2001-08-09 Infineon Technologies Ag Verfahren und Vorrichtung zur Anpassung/Abstimmung von Signallaufzeiten auf Leitungssystemen oder Netzen zwischen integrierten Schaltungen
SE517944C2 (sv) * 2000-04-06 2002-08-06 Ericsson Telefon Ab L M Förfarande och styrelement för fastsättning av ett mönsterkort på ett element
SE518778C2 (sv) * 2000-04-19 2002-11-19 Ericsson Telefon Ab L M Förfarande och anordning för montering av en elektronisk eller mekanisk komponent på ett mönsterkort samt ett styrelement anordnat att ytmonteras på ett mönsterkort
JP2001313493A (ja) * 2000-04-27 2001-11-09 Sony Corp 電子部品の実装システム
FR2808410B1 (fr) * 2000-04-28 2002-09-27 Sagem Procede de montage, sur une carte de circuit imprime, d'un moteur d'entrainement d'un arbre support
JP3588444B2 (ja) * 2000-10-26 2004-11-10 松下電器産業株式会社 電子部品、部品実装装置及び部品実装方法
US7080444B1 (en) * 2002-02-28 2006-07-25 Alien Technology Corporation Apparatus for forming an electronic assembly
US7886430B2 (en) * 2002-12-13 2011-02-15 Hewlett-Packard Development Company, L.P. Method of installing circuit board component

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT242218B (de) * 1962-01-04 1965-09-10 Elettronica Metal Lux S P A Verfahren zur Herstellung von Schaltungsanordnungen mit gedruckter Verdrahtung
DE2111502A1 (de) * 1971-03-10 1972-09-21 Siemens Ag Verfahren zum Bestuecken von Bauplatten mit vorzugsweise elektrischen Bauteilen
NL165906C (nl) * 1971-04-09 1981-05-15 Philips Nv Werkwijze voor het monteren van een aantal elektrische onderdelen op een montagepaneel, alsmede elektrisch on- derdeel geschikt voor het uitvoeren van de werkwijze.
JPS5537879B2 (it) * 1973-10-15 1980-09-30
US3859723A (en) * 1973-11-05 1975-01-14 Microsystems Int Ltd Bonding method for multiple chip arrays
US3907008A (en) * 1974-08-29 1975-09-23 Universal Instruments Corp Insertion apparatus
JPS52124168A (en) * 1976-04-12 1977-10-18 Matsushita Electric Ind Co Ltd Method of assembling electronic device circuit
JPS54105774A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming pattern on thin film hybrid integrated circuit
US4142286A (en) * 1978-03-15 1979-03-06 Burroughs Corporation Apparatus and method for inserting solder preforms on selected circuit board back plane pins
US4292116A (en) * 1978-04-18 1981-09-29 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on a printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108857315A (zh) * 2018-07-23 2018-11-23 遂宁市盛川视觉科技有限公司 一种手机镜头自动盖镜片装置
CN108857315B (zh) * 2018-07-23 2019-12-31 遂宁市维美电子科技有限公司 一种手机镜头自动盖镜片装置

Also Published As

Publication number Publication date
NL8006989A (nl) 1981-07-16
JPS5694800A (en) 1981-07-31
US4386464A (en) 1983-06-07
DE3048780C2 (it) 1990-04-05
DE3048780A1 (de) 1981-09-24
IT8026856A0 (it) 1980-12-22

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TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19971027