IT8026856A0 - Metodo e dispositivo per il montaggio in posizione di componenti elettronici su basette per circuiti. - Google Patents
Metodo e dispositivo per il montaggio in posizione di componenti elettronici su basette per circuiti.Info
- Publication number
- IT8026856A0 IT8026856A0 IT8026856A IT2685680A IT8026856A0 IT 8026856 A0 IT8026856 A0 IT 8026856A0 IT 8026856 A IT8026856 A IT 8026856A IT 2685680 A IT2685680 A IT 2685680A IT 8026856 A0 IT8026856 A0 IT 8026856A0
- Authority
- IT
- Italy
- Prior art keywords
- electronic components
- mounting electronic
- circuit base
- circuit
- base
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0478—Simultaneously mounting of different components
- H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Branching, Merging, And Special Transfer Between Conveyors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17251779A JPS5694800A (en) | 1979-12-28 | 1979-12-28 | Method and device for mounting electronic part |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8026856A0 true IT8026856A0 (it) | 1980-12-22 |
IT1134845B IT1134845B (it) | 1986-08-20 |
Family
ID=15943415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT26856/80A IT1134845B (it) | 1979-12-28 | 1980-12-22 | Metodo e dispositivo per il montaggio in posizione di componenti elettronici su basette per circuiti |
Country Status (5)
Country | Link |
---|---|
US (1) | US4386464A (it) |
JP (1) | JPS5694800A (it) |
DE (1) | DE3048780A1 (it) |
IT (1) | IT1134845B (it) |
NL (1) | NL8006989A (it) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58112387A (ja) * | 1981-12-26 | 1983-07-04 | 池上通信機株式会社 | 電子部品のプリント基板への自動***装置 |
US4528747A (en) * | 1982-12-02 | 1985-07-16 | At&T Technologies, Inc. | Method and apparatus for mounting multilead components on a circuit board |
JPS61299U (ja) * | 1984-06-07 | 1986-01-06 | 日東工業株式会社 | 自動チツプマウント機の治具盤 |
US4571826A (en) * | 1984-11-19 | 1986-02-25 | At&T Teletype Corporation | Method of manufacturing a thermal print head |
EP0225957A1 (en) * | 1985-12-18 | 1987-06-24 | ELCIT ELETTRONICA CIVILE S.p.A | Apparatus for positioning components on printed-circuit boards |
US4670981A (en) * | 1986-03-17 | 1987-06-09 | Nitto Kogyo Kabushiki Kaisha | Method of mounting electronic parts on the predetermined positions of a printed circuit board |
JPH01295500A (ja) * | 1988-05-24 | 1989-11-29 | Taiyo Yuden Co Ltd | チップ状電子部品マウント方法及びその装置 |
DE3838173A1 (de) * | 1988-11-10 | 1990-05-17 | Nixdorf Computer Ag | Verfahren und einrichtung zum bestuecken von leiterplatten |
US4885841A (en) * | 1989-02-21 | 1989-12-12 | Micron Technology, Inc. | Vibrational method of aligning the leads of surface-mount electronic components with the mounting pads of printed circuit boards during the molten solder mounting process |
US4965927A (en) * | 1989-09-21 | 1990-10-30 | Eli Holzman | Apparatus for applying surface-mounted electronic components to printed circuit boards |
JP2713621B2 (ja) * | 1989-11-10 | 1998-02-16 | コーア株式会社 | チップ部品の実装方法 |
IT1240530B (it) * | 1990-08-06 | 1993-12-17 | Axis Spa | Apparecchiatura per predisporre ed inserire terminali in un componente elettrico. |
US5117555A (en) * | 1991-01-17 | 1992-06-02 | International Business Machines Corporation | Modular system and method for populating circuit boards |
US5386626A (en) * | 1993-09-10 | 1995-02-07 | Cen Tronic Co., Ltd. | Method for manufacturing a circuit board with a plurality of conductive terminal pins |
US5670009A (en) * | 1995-02-28 | 1997-09-23 | Eastman Kodak Company | Assembly technique for an image sensor array |
CN1074381C (zh) * | 1996-03-26 | 2001-11-07 | 摩托罗拉公司 | 用于向捡起位置提供电子元件的改进的馈料机 |
DE19618227A1 (de) * | 1996-05-07 | 1997-11-13 | Herbert Streckfus Gmbh | Verfahren und Vorrichtung zum Verlöten von elektronischen Bauelementen auf einer Leiterplatte |
US5743001A (en) * | 1996-08-16 | 1998-04-28 | Amistar Corporation | Surface mount placement system with single step, multiple place carriage |
EP0990281B1 (en) * | 1997-06-19 | 2003-03-19 | Fci | Device for pre-positioning components in a row for subsequent processing as well as such a method |
JP3512598B2 (ja) * | 1997-07-01 | 2004-03-29 | アルプス電気株式会社 | チップ部品装着装置 |
US6877219B1 (en) * | 1999-10-26 | 2005-04-12 | Air Liquide America, L.P. | Apparatus for placing components on printed circuit boards |
DE10004649A1 (de) * | 2000-02-03 | 2001-08-09 | Infineon Technologies Ag | Verfahren und Vorrichtung zur Anpassung/Abstimmung von Signallaufzeiten auf Leitungssystemen oder Netzen zwischen integrierten Schaltungen |
SE517944C2 (sv) * | 2000-04-06 | 2002-08-06 | Ericsson Telefon Ab L M | Förfarande och styrelement för fastsättning av ett mönsterkort på ett element |
SE518778C2 (sv) * | 2000-04-19 | 2002-11-19 | Ericsson Telefon Ab L M | Förfarande och anordning för montering av en elektronisk eller mekanisk komponent på ett mönsterkort samt ett styrelement anordnat att ytmonteras på ett mönsterkort |
JP2001313493A (ja) * | 2000-04-27 | 2001-11-09 | Sony Corp | 電子部品の実装システム |
FR2808410B1 (fr) * | 2000-04-28 | 2002-09-27 | Sagem | Procede de montage, sur une carte de circuit imprime, d'un moteur d'entrainement d'un arbre support |
JP3588444B2 (ja) * | 2000-10-26 | 2004-11-10 | 松下電器産業株式会社 | 電子部品、部品実装装置及び部品実装方法 |
US7080444B1 (en) * | 2002-02-28 | 2006-07-25 | Alien Technology Corporation | Apparatus for forming an electronic assembly |
US7886430B2 (en) * | 2002-12-13 | 2011-02-15 | Hewlett-Packard Development Company, L.P. | Method of installing circuit board component |
CN108857315B (zh) * | 2018-07-23 | 2019-12-31 | 遂宁市维美电子科技有限公司 | 一种手机镜头自动盖镜片装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT242218B (de) * | 1962-01-04 | 1965-09-10 | Elettronica Metal Lux S P A | Verfahren zur Herstellung von Schaltungsanordnungen mit gedruckter Verdrahtung |
DE2111502A1 (de) * | 1971-03-10 | 1972-09-21 | Siemens Ag | Verfahren zum Bestuecken von Bauplatten mit vorzugsweise elektrischen Bauteilen |
NL165906C (nl) * | 1971-04-09 | 1981-05-15 | Philips Nv | Werkwijze voor het monteren van een aantal elektrische onderdelen op een montagepaneel, alsmede elektrisch on- derdeel geschikt voor het uitvoeren van de werkwijze. |
JPS5537879B2 (it) * | 1973-10-15 | 1980-09-30 | ||
US3859723A (en) * | 1973-11-05 | 1975-01-14 | Microsystems Int Ltd | Bonding method for multiple chip arrays |
US3907008A (en) * | 1974-08-29 | 1975-09-23 | Universal Instruments Corp | Insertion apparatus |
JPS52124168A (en) * | 1976-04-12 | 1977-10-18 | Matsushita Electric Ind Co Ltd | Method of assembling electronic device circuit |
JPS54105774A (en) * | 1978-02-08 | 1979-08-20 | Hitachi Ltd | Method of forming pattern on thin film hybrid integrated circuit |
US4142286A (en) * | 1978-03-15 | 1979-03-06 | Burroughs Corporation | Apparatus and method for inserting solder preforms on selected circuit board back plane pins |
US4292116A (en) * | 1978-04-18 | 1981-09-29 | Tokyo Denki Kagaku Kogyo Kabushiki Kaisha | Apparatus for mounting chip type circuit elements on a printed circuit board |
-
1979
- 1979-12-28 JP JP17251779A patent/JPS5694800A/ja active Pending
-
1980
- 1980-12-11 US US06/215,518 patent/US4386464A/en not_active Expired - Lifetime
- 1980-12-22 IT IT26856/80A patent/IT1134845B/it active
- 1980-12-22 NL NL8006989A patent/NL8006989A/nl not_active Application Discontinuation
- 1980-12-23 DE DE19803048780 patent/DE3048780A1/de active Granted
Also Published As
Publication number | Publication date |
---|---|
NL8006989A (nl) | 1981-07-16 |
JPS5694800A (en) | 1981-07-31 |
US4386464A (en) | 1983-06-07 |
DE3048780C2 (it) | 1990-04-05 |
DE3048780A1 (de) | 1981-09-24 |
IT1134845B (it) | 1986-08-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19971027 |