IT1125656B - Metodo di fabbricazione di un sistema di cablaggio,sistema di cablaggio fabbricato in accordo con tale metodo e dispositivo semiconduttore dotato di tale sistema di cablaggio - Google Patents
Metodo di fabbricazione di un sistema di cablaggio,sistema di cablaggio fabbricato in accordo con tale metodo e dispositivo semiconduttore dotato di tale sistema di cablaggioInfo
- Publication number
- IT1125656B IT1125656B IT27193/79A IT2719379A IT1125656B IT 1125656 B IT1125656 B IT 1125656B IT 27193/79 A IT27193/79 A IT 27193/79A IT 2719379 A IT2719379 A IT 2719379A IT 1125656 B IT1125656 B IT 1125656B
- Authority
- IT
- Italy
- Prior art keywords
- wiring system
- manufacture
- accordance
- device equipped
- semiconductive device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/7682—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing the dielectric comprising air gaps
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/945—Special, e.g. metal
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NLAANVRAGE7811227,A NL181611C (nl) | 1978-11-14 | 1978-11-14 | Werkwijze ter vervaardiging van een bedradingssysteem, alsmede een halfgeleiderinrichting voorzien van een dergelijk bedradingssysteem. |
Publications (2)
Publication Number | Publication Date |
---|---|
IT7927193A0 IT7927193A0 (it) | 1979-11-09 |
IT1125656B true IT1125656B (it) | 1986-05-14 |
Family
ID=19831888
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT27193/79A IT1125656B (it) | 1978-11-14 | 1979-11-09 | Metodo di fabbricazione di un sistema di cablaggio,sistema di cablaggio fabbricato in accordo con tale metodo e dispositivo semiconduttore dotato di tale sistema di cablaggio |
Country Status (9)
Country | Link |
---|---|
US (1) | US4561173A (it) |
JP (1) | JPS5847858B2 (it) |
AU (1) | AU5266079A (it) |
CA (1) | CA1150851A (it) |
DE (1) | DE2945533C2 (it) |
FR (1) | FR2441923A1 (it) |
GB (1) | GB2036427B (it) |
IT (1) | IT1125656B (it) |
NL (1) | NL181611C (it) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8002634A (nl) * | 1980-05-08 | 1981-12-01 | Philips Nv | Programmeerbare halfgeleiderinrichting en werkwijze ter vervaardiging daarvan. |
NL8002635A (nl) * | 1980-05-08 | 1981-12-01 | Philips Nv | Programmeerbare halfgeleiderinrichting en werkwijze ter vervaardiging daarvan. |
JPS57190331A (en) * | 1981-05-20 | 1982-11-22 | Toshiba Corp | Semiconductor device and manufacture thereof |
JPS6143448A (ja) * | 1984-08-08 | 1986-03-03 | Agency Of Ind Science & Technol | 空間配線 |
JPS6260953U (it) * | 1985-10-04 | 1987-04-15 | ||
JPS62118249U (it) * | 1986-01-20 | 1987-07-27 | ||
JPH077757B2 (ja) * | 1987-09-28 | 1995-01-30 | 三菱電機株式会社 | クロム膜のパターニング方法 |
JPH01189939A (ja) * | 1988-01-26 | 1989-07-31 | Nec Corp | 半導体集積回路 |
JPH02100341A (ja) * | 1988-10-06 | 1990-04-12 | Toshiba Corp | 半導体装置のパターン形成方法 |
SE468575B (sv) * | 1991-06-14 | 1993-02-08 | Ericsson Telefon Ab L M | Anordning med laminaera ledningsmoenster och valbara dielektrika |
US5270574A (en) * | 1991-08-01 | 1993-12-14 | Texas Instruments Incorporated | Vacuum micro-chamber for encapsulating a microelectronics device |
US5199578A (en) * | 1991-12-10 | 1993-04-06 | The Stanley Works | Clip strip for supporting multiple packages and display assembly using same |
JP3318457B2 (ja) * | 1994-12-26 | 2002-08-26 | アルプス電気株式会社 | カール矯正装置およびこれを備えたプリンタ |
US6057224A (en) * | 1996-03-29 | 2000-05-02 | Vlsi Technology, Inc. | Methods for making semiconductor devices having air dielectric interconnect structures |
US6429120B1 (en) | 2000-01-18 | 2002-08-06 | Micron Technology, Inc. | Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals |
DE19713173C2 (de) * | 1997-03-27 | 2001-02-15 | Siemens Ag | ROM-Speicher |
US6251470B1 (en) | 1997-10-09 | 2001-06-26 | Micron Technology, Inc. | Methods of forming insulating materials, and methods of forming insulating materials around a conductive component |
US6333556B1 (en) * | 1997-10-09 | 2001-12-25 | Micron Technology, Inc. | Insulating materials |
US6858526B2 (en) | 1998-07-14 | 2005-02-22 | Micron Technology, Inc. | Methods of forming materials between conductive electrical components, and insulating materials |
US5891797A (en) * | 1997-10-20 | 1999-04-06 | Micron Technology, Inc. | Method of forming a support structure for air bridge wiring of an integrated circuit |
US6509590B1 (en) | 1998-07-20 | 2003-01-21 | Micron Technology, Inc. | Aluminum-beryllium alloys for air bridges |
US6217783B1 (en) * | 1998-12-01 | 2001-04-17 | Visteon Global Technologies, Inc. | Method for strengthening air bridge circuits |
WO2000035000A1 (en) * | 1998-12-08 | 2000-06-15 | Cvc Products, Inc. | Ultra high-speed semiconductor integrated circuit interconnect structure and fabrication method using free-space dielectric |
US6111204A (en) * | 1999-02-08 | 2000-08-29 | Ford Motor Company | Bond pads for fine-pitch applications on air bridge circuit boards |
KR100555479B1 (ko) * | 1999-07-13 | 2006-03-03 | 삼성전자주식회사 | 미세 패턴 사이의 좁은 갭를 갖는 반도체 소자의 층간 절연막형성 방법 |
US6350679B1 (en) | 1999-08-03 | 2002-02-26 | Micron Technology, Inc. | Methods of providing an interlevel dielectric layer intermediate different elevation conductive metal layers in the fabrication of integrated circuitry |
US6670719B2 (en) | 1999-08-25 | 2003-12-30 | Micron Technology, Inc. | Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture |
US6709968B1 (en) | 2000-08-16 | 2004-03-23 | Micron Technology, Inc. | Microelectronic device with package with conductive elements and associated method of manufacture |
US7335965B2 (en) | 1999-08-25 | 2008-02-26 | Micron Technology, Inc. | Packaging of electronic chips with air-bridge structures |
US7276788B1 (en) | 1999-08-25 | 2007-10-02 | Micron Technology, Inc. | Hydrophobic foamed insulators for high density circuits |
US7211512B1 (en) | 2000-01-18 | 2007-05-01 | Micron Technology, Inc. | Selective electroless-plated copper metallization |
US6420262B1 (en) | 2000-01-18 | 2002-07-16 | Micron Technology, Inc. | Structures and methods to enhance copper metallization |
US7262130B1 (en) | 2000-01-18 | 2007-08-28 | Micron Technology, Inc. | Methods for making integrated-circuit wiring from copper, silver, gold, and other metals |
US6677209B2 (en) | 2000-02-14 | 2004-01-13 | Micron Technology, Inc. | Low dielectric constant STI with SOI devices |
US6413827B2 (en) | 2000-02-14 | 2002-07-02 | Paul A. Farrar | Low dielectric constant shallow trench isolation |
US6890847B1 (en) | 2000-02-22 | 2005-05-10 | Micron Technology, Inc. | Polynorbornene foam insulation for integrated circuits |
US6423629B1 (en) | 2000-05-31 | 2002-07-23 | Kie Y. Ahn | Multilevel copper interconnects with low-k dielectrics and air gaps |
US6674167B1 (en) | 2000-05-31 | 2004-01-06 | Micron Technology, Inc. | Multilevel copper interconnect with double passivation |
US6449839B1 (en) * | 2000-09-06 | 2002-09-17 | Visteon Global Tech., Inc. | Electrical circuit board and a method for making the same |
US6433413B1 (en) | 2001-08-17 | 2002-08-13 | Micron Technology, Inc. | Three-dimensional multichip module |
US6747347B2 (en) | 2001-08-30 | 2004-06-08 | Micron Technology, Inc. | Multi-chip electronic package and cooling system |
US6686654B2 (en) | 2001-08-31 | 2004-02-03 | Micron Technology, Inc. | Multiple chip stack structure and cooling system |
US20030183916A1 (en) * | 2002-03-27 | 2003-10-02 | John Heck | Packaging microelectromechanical systems |
US6620638B1 (en) | 2002-06-05 | 2003-09-16 | Micron Technology, Inc. | Testing of multi-chip electronic modules |
JP3793143B2 (ja) * | 2002-11-28 | 2006-07-05 | 株式会社シマノ | 自転車用電子制御装置 |
US20050137882A1 (en) * | 2003-12-17 | 2005-06-23 | Cameron Don T. | Method for authenticating goods |
US7300821B2 (en) * | 2004-08-31 | 2007-11-27 | Micron Technology, Inc. | Integrated circuit cooling and insulating device and method |
US7560375B2 (en) * | 2004-09-30 | 2009-07-14 | International Business Machines Corporation | Gas dielectric structure forming methods |
US7927948B2 (en) | 2005-07-20 | 2011-04-19 | Micron Technology, Inc. | Devices with nanocrystals and methods of formation |
JP5491077B2 (ja) * | 2009-06-08 | 2014-05-14 | キヤノン株式会社 | 半導体装置、及び半導体装置の製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3461524A (en) * | 1966-11-02 | 1969-08-19 | Bell Telephone Labor Inc | Method for making closely spaced conductive layers |
US3647585A (en) * | 1969-05-23 | 1972-03-07 | Bell Telephone Labor Inc | Method of eliminating pinhole shorts in an air-isolated crossover |
US3890177A (en) * | 1971-08-27 | 1975-06-17 | Bell Telephone Labor Inc | Technique for the fabrication of air-isolated crossovers |
JPS5146904B2 (it) * | 1971-09-30 | 1976-12-11 | ||
US3769108A (en) * | 1971-12-03 | 1973-10-30 | Bell Telephone Labor Inc | Manufacture of beam-crossovers for integrated circuits |
US3783056A (en) * | 1972-06-20 | 1974-01-01 | Bell Telephone Labor Inc | Technique for the fabrication of an air isolated crossover |
US3993515A (en) * | 1975-03-31 | 1976-11-23 | Rca Corporation | Method of forming raised electrical contacts on a semiconductor device |
NL7510103A (nl) * | 1975-08-27 | 1977-03-01 | Philips Nv | Elektrostatisch bestuurde beeldweergeefinrichting. |
NL7608901A (nl) * | 1976-08-11 | 1978-02-14 | Philips Nv | Werkwijze ter vervaardiging van een halfge- leiderinrichting en halfgeleiderinrichting vervaardigd door middel van een dergelijke werkwijze. |
-
1978
- 1978-11-14 NL NLAANVRAGE7811227,A patent/NL181611C/xx not_active IP Right Cessation
-
1979
- 1979-11-08 CA CA000339441A patent/CA1150851A/en not_active Expired
- 1979-11-09 AU AU52660/79A patent/AU5266079A/en not_active Abandoned
- 1979-11-09 IT IT27193/79A patent/IT1125656B/it active
- 1979-11-09 GB GB7938976A patent/GB2036427B/en not_active Expired
- 1979-11-10 DE DE2945533A patent/DE2945533C2/de not_active Expired
- 1979-11-14 FR FR7928112A patent/FR2441923A1/fr active Granted
- 1979-11-14 JP JP54146637A patent/JPS5847858B2/ja not_active Expired
-
1983
- 1983-06-07 US US06/500,791 patent/US4561173A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
NL181611C (nl) | 1987-09-16 |
GB2036427A (en) | 1980-06-25 |
GB2036427B (en) | 1983-02-09 |
DE2945533C2 (de) | 1983-11-03 |
NL181611B (nl) | 1987-04-16 |
AU5266079A (en) | 1980-05-22 |
JPS5847858B2 (ja) | 1983-10-25 |
US4561173A (en) | 1985-12-31 |
JPS5568700A (en) | 1980-05-23 |
FR2441923B1 (it) | 1983-07-08 |
IT7927193A0 (it) | 1979-11-09 |
DE2945533A1 (de) | 1980-05-29 |
FR2441923A1 (fr) | 1980-06-13 |
NL7811227A (nl) | 1980-05-19 |
CA1150851A (en) | 1983-07-26 |
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